CN103785638A - Spraying device for cleaning backs of wafers - Google Patents
Spraying device for cleaning backs of wafers Download PDFInfo
- Publication number
- CN103785638A CN103785638A CN201210430638.XA CN201210430638A CN103785638A CN 103785638 A CN103785638 A CN 103785638A CN 201210430638 A CN201210430638 A CN 201210430638A CN 103785638 A CN103785638 A CN 103785638A
- Authority
- CN
- China
- Prior art keywords
- blowoff
- wafer
- nozzle
- back side
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/28—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of spray; with integral means for catching drips or collecting surplus liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the technical field of glue uniformizing on wafers in the semiconductor industry, and particularly relates to a spraying device for cleaning backs of wafers. The spraying device is arranged in a cavity below a wafer in a glue uniformizing device and comprises a nozzle and a spraying device main body, wherein one end of the nozzle is connected with the spraying device main body; a spraying hole is formed in the other end of the nozzle and corresponds to the back of the wafer; the other end, which corresponds to the back of the wafer, of the nozzle is a conical surface; the spraying hole is formed in the conical surface; and residual liquid at the nozzle can voluntarily flow downwards from the conical surface. By using the spraying device, the problem that residual liquid cannot spray easily due to an over-thin nozzle is solved; and the spraying device is convenient to mount, replace and clean.
Description
Technical field
The invention belongs to the even glue technical field of semicon industry wafer, be specially the blowoff at a kind of cleaning wafer back side.
Background technology
At present, wafer spin processes generally adopts device for cleaning back surface of wafer to protect the back side of wafer not polluted by photoresist.2 inches and 4 inches of small size wafers generally adopt the nozzle that opening is thinner, prevent that liquid is too much splashed to crystal column surface, and thinner nozzle is easily sealed impact ejection next time by residual liquid.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide the blowoff at a kind of cleaning wafer back side.The blowoff at this cleaning wafer back side has solved the situation and having realized that has liquid residue to be difficult for ejection because nozzle is meticulous and has been convenient to install, change and cleaning.
To achieve these goals, the present invention is by the following technical solutions:
The blowoff at the cleaning wafer back side, is arranged on the cavity of wafer below in even adhesive dispenser, comprises nozzle and blowoff main body, and wherein one end of nozzle is connected with blowoff main body, and the other end is provided with spray orifice corresponding with the back side of wafer.
The described nozzle other end corresponding with the back side of wafer is taper seat, and spray orifice is arranged on this taper seat, and the residual liquid at nozzle place flows down from taper seat voluntarily.One end of described nozzle is connected with blowoff main body screw.
Described blowoff main body is arranged at the below of cavity, and the other end that described nozzle is provided with spray orifice inserts in chamber and is fixed on cavity by the clamp nut being connected with nozzle threads from the below of cavity.
Described even adhesive dispenser comprises base, exhaust hood, splash guard and wafer-supporting platform, wherein base along axis be provided with central through hole, and an end face be provided with annular groove, described annular groove bottom is provided with leakage fluid dram, described exhaust hood is arranged in the inner port of base annular groove and limit extends downwardly in annular groove, described wafer-supporting platform is arranged in the central through hole of base and one end passes exhaust hood and is placed in chamber, be used for carrying wafer, described splash guard is arranged at base top and is connected with the annular groove external diameter port on base.
Described blowoff main body is arranged on exhaust hood.Described base, exhaust hood and splash guard enclose described chamber.
Advantage of the present invention and beneficial effect are:
1. the present invention has better solved residual after because of break-make liquid of nozzle and obstruction that liquid sputter brings.
Structure of the present invention be convenient to install, change and to the cleaning after photoresist sputter.
3. the present invention has the features such as simple in structure, easy for installation.
Accompanying drawing explanation
Fig. 1 is that the present invention is arranged on the generalized section in even adhesive dispenser;
Fig. 2 is axonometric drawing of the present invention;
Fig. 3 is the top view of Fig. 1.
Wherein: 1 is Splashproof cover, 2 is exhaust hood, and 3 is base, and 4 is wafer, and 5 is wafer-supporting platform, and 6 is clamp nut, and 7 is nozzle, and 8 is blowoff main body, and 9 is locking nut, and M is ejection track, and N is leakage fluid dram.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is further described.
As Figure 1-3, the present invention is arranged on the cavity of wafer below in even adhesive dispenser, comprises nozzle 7 and blowoff 8, and wherein one end of nozzle 7 is threaded with blowoff main body 8, and the other end is provided with spray orifice corresponding with the back side of wafer.Nozzle 7 other end corresponding with the back side of wafer is taper seat, and spray orifice is arranged on this taper seat, and the residual liquid at nozzle place flows down from taper seat voluntarily.
Even adhesive dispenser comprises base 3, exhaust hood 2, splash guard 1 and wafer-supporting platform 5, wherein base 3 along axis be provided with central through hole, and an end face be provided with annular groove, described annular groove bottom is provided with leakage fluid dram N, and described exhaust hood 2 is arranged in the inner port of base 3 annular grooves and limit extends downwardly in annular groove.Wafer-supporting platform 5 is arranged in the central through hole of base 3 and one end passes exhaust hood 2 for carrying wafer, and splash guard 1 is arranged at base 3 tops and is connected with the annular groove external diameter port on base 3.Exhaust hood 2, splash guard 1 and base 3 enclose chamber.
Blowoff main body 8 is arranged at the below of exhaust hood 2, and the other end that nozzle 7 is provided with spray orifice inserts in chamber and by the clamp nut 6 being threaded with nozzle 7 and fixes from the below of exhaust hood 2.The flexible pipe plugging on blowoff main body 8 sidewalls is fastening by locking nut 9, and this structure is similar to micro connector.Blowoff main body 8 is prior art.
Operation principle of the present invention is:
When the present invention uses in even adhesive dispenser, carry out High Rotation Speed by wafer-supporting platform 5 vacuum suction small size wafers 4, blowoff is ejected into wafer rear and cleans to all positions of spray site to wafer limit according to ejection track M.Liquid waste after cleaning is flowed in the annular groove on base 3 and is discharged by leakage fluid dram N by the interior upper surface along exhaust hood 2 of chamber air-flow (being the air-flow of the direction of arrow in chamber) from top to bottom.When processing a wafer, blowoff can quit work and wait for operation next time at every turn, at this moment have the exit that is ejected into the cleaning fluid of wafer or glue and is trapped in nozzle 7, at this moment during the stand-by period of spin processes, drop can flow down voluntarily along the taper seat of nozzle 7, and next ejection work meeting normally moves.
The present invention adopts high-quality stainless steel to make, and is adapted at having in spin processes under the occasion of corrosion using.
Claims (7)
1. the blowoff at a cleaning wafer back side, it is characterized in that: be arranged on the cavity of wafer below in even adhesive dispenser, comprise nozzle (7) and blowoff main body (8), wherein one end of nozzle (7) is connected with blowoff main body (8), and the other end is provided with spray orifice corresponding with the back side of wafer.
2. by the blowoff at the cleaning wafer claimed in claim 1 back side, it is characterized in that: described nozzle (7) other end corresponding with the back side of wafer is taper seat, spray orifice is arranged on this taper seat, and the residual liquid at nozzle place flows down from taper seat voluntarily.
3. by the blowoff at the cleaning wafer back side described in claim 1 or 2, it is characterized in that: one end of described nozzle (7) is threaded with blowoff main body (8).
4. by the blowoff at the cleaning wafer back side described in claim 1 or 2, it is characterized in that: described blowoff main body (8) is arranged at the below of cavity, the other end that described nozzle (7) is provided with spray orifice inserts in chamber and is fixed on cavity by the clamp nut (6) being threaded with nozzle (7) from the below of cavity.
5. by the blowoff at the cleaning wafer claimed in claim 1 back side, it is characterized in that: described even adhesive dispenser comprises base (3), exhaust hood (2), splash guard (1) and wafer-supporting platform (5), wherein base (3) is provided with central through hole along axis, and one end face be provided with annular groove, described annular groove bottom is provided with leakage fluid dram (N), described exhaust hood (2) is arranged in the inner port of base (3) annular groove, and limit extends downwardly in annular groove, described wafer-supporting platform (5) is arranged in the central through hole of base (3), and one end passes exhaust hood (2) and is placed in chamber, be used for carrying wafer, described splash guard (1) is arranged at base (3) top, and be connected with the annular groove external diameter port on base (3).
6. by the blowoff at the cleaning wafer claimed in claim 5 back side, it is characterized in that: described blowoff main body (8) is arranged on exhaust hood (2).
7. by the blowoff at the cleaning wafer claimed in claim 5 back side, it is characterized in that: described base (3), exhaust hood (2) and splash guard (1) enclose described chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210430638.XA CN103785638A (en) | 2012-11-01 | 2012-11-01 | Spraying device for cleaning backs of wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210430638.XA CN103785638A (en) | 2012-11-01 | 2012-11-01 | Spraying device for cleaning backs of wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103785638A true CN103785638A (en) | 2014-05-14 |
Family
ID=50661935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210430638.XA Pending CN103785638A (en) | 2012-11-01 | 2012-11-01 | Spraying device for cleaning backs of wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103785638A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384053A (en) * | 2014-10-11 | 2015-03-04 | 清华大学 | Anti-sputtering device used for washing trimmer |
| CN107275263A (en) * | 2017-06-08 | 2017-10-20 | 中国电子科技集团公司第四十四研究所 | The spin coating device of webbing effect can be eliminated |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1248058A (en) * | 1998-09-04 | 2000-03-22 | 日本电气株式会社 | Method for coating corrosion inhibitor film and coater for corrosion inhibitor |
| US6432199B1 (en) * | 1999-04-30 | 2002-08-13 | Tokyo Electron Limited | Apparatus and method for processing a substrate |
| US20020148916A1 (en) * | 1999-07-01 | 2002-10-17 | Lam Research Corporation | Spin, rinse, and dry station with adjustable nozzle assembly for semiconductor wafer backside rinsing |
| CN101826449A (en) * | 2009-03-04 | 2010-09-08 | 东京毅力科创株式会社 | Liquid handling device and method for treating liquids |
| CN102427047A (en) * | 2011-09-28 | 2012-04-25 | 上海华力微电子有限公司 | Wafer back cleaning device and wafer back cleaning method |
| US20120183693A1 (en) * | 2007-05-07 | 2012-07-19 | Tokyo Electron Limited | Coating Film Forming Apparatus, Use Of Coating Film Forming Apparatus, And Recording Medium |
-
2012
- 2012-11-01 CN CN201210430638.XA patent/CN103785638A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1248058A (en) * | 1998-09-04 | 2000-03-22 | 日本电气株式会社 | Method for coating corrosion inhibitor film and coater for corrosion inhibitor |
| US6432199B1 (en) * | 1999-04-30 | 2002-08-13 | Tokyo Electron Limited | Apparatus and method for processing a substrate |
| US20020148916A1 (en) * | 1999-07-01 | 2002-10-17 | Lam Research Corporation | Spin, rinse, and dry station with adjustable nozzle assembly for semiconductor wafer backside rinsing |
| US20120183693A1 (en) * | 2007-05-07 | 2012-07-19 | Tokyo Electron Limited | Coating Film Forming Apparatus, Use Of Coating Film Forming Apparatus, And Recording Medium |
| CN101826449A (en) * | 2009-03-04 | 2010-09-08 | 东京毅力科创株式会社 | Liquid handling device and method for treating liquids |
| CN102427047A (en) * | 2011-09-28 | 2012-04-25 | 上海华力微电子有限公司 | Wafer back cleaning device and wafer back cleaning method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384053A (en) * | 2014-10-11 | 2015-03-04 | 清华大学 | Anti-sputtering device used for washing trimmer |
| CN107275263A (en) * | 2017-06-08 | 2017-10-20 | 中国电子科技集团公司第四十四研究所 | The spin coating device of webbing effect can be eliminated |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140514 |