CN211629049U

CN211629049U - Etching device for wafer and annular glass carrier plate

Info

Publication number: CN211629049U
Application number: CN202020669613.5U
Authority: CN
Inventors: 严立巍; 施放; 李景贤
Original assignee: Shaoxing Tongxincheng Integrated Circuit Co ltd
Current assignee: Shaoxing Tongxincheng Integrated Circuit Co ltd
Priority date: 2020-04-27
Filing date: 2020-04-27
Publication date: 2020-10-02
Anticipated expiration: 2030-04-27

Abstract

The utility model discloses an etching device for wafer and annular glass support plate belongs to the etching equipment field. An etching apparatus for a wafer and a ring-shaped glass carrier, comprising: a base; the supporting disc is horizontally arranged on the base, is rotatably connected with the base and is used for placing a workpiece; the clamp is fixedly arranged on the supporting disc and used for clamping the workpiece; the corrosive liquid nozzle is arranged above the workpiece and used for spraying corrosive liquid to the processing surface of the workpiece; a protective fluid spray head disposed above the workpiece for spraying fluid against an edge of the workpiece. Compared with the existing etching device, the etching device is specially used for etching the annular glass carrier plate and the wafer, protects the edge area by spraying fluid, and can control the width of the edge protection.

Description

Etching device for wafer and annular glass carrier plate

Technical Field

The utility model relates to an etching equipment field, concretely relates to etching device that is used for wafer and annular glass support plate.

Background

With the development of the IC chip process technology, the diameter of a wafer is gradually increased to 300mm, the thickness of the wafer before packaging is thinner and thinner, and in order to ensure the rigidity/strength of a processed object and reduce the risk of chipping, the subsequent processing after bonding the wafer and a glass carrier plate has become a common practice in the semiconductor industry.

When the central thinned glass carrier plate is used for carrying the wafer, the subsequent wafer processing technology can be optimized. In order to obtain a ring-shaped glass carrier plate with a thin center and a thick edge, an etching machine is required to etch the surface of the glass carrier plate, but currently, in the prior art, there is no etching apparatus dedicated for the ring-shaped glass carrier plate, and the size of an etching area cannot be controlled more accurately by the existing etching apparatus.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides an etching device for wafer and annular glass support plate is exclusively used in the annular glass support plate that processing central authorities are thin, the edge is thick to can control the technical problem of the size and the shape of annular glass support plate annular part.

The purpose of the utility model can be realized by the following technical scheme:

an etching apparatus for a wafer and a ring-shaped glass carrier, comprising:

a base;

the supporting disc is horizontally arranged on the base, is rotatably connected with the base and is used for placing a workpiece;

the clamp is fixedly arranged on the supporting disc and used for clamping the workpiece;

the corrosive liquid nozzle is arranged above the workpiece and used for spraying corrosive liquid to the processing surface of the workpiece;

a protective fluid spray head disposed above the workpiece for spraying fluid against an edge of the workpiece.

Further, the protective fluid nozzle comprises a liquid conveying pipeline and a plurality of nozzles, and the nozzles are fixedly installed on the liquid conveying pipe and arranged along the radial direction of the support plate.

Furthermore, a plurality of through holes are formed in the supporting disc.

Further, the cleaning device also comprises a cleaning nozzle which sprays fluid to clean and/or dry the workpiece.

Further, the fluid sprayed by the cleaning nozzle is pure water and/or nitrogen.

Further, the spray head is comb-shaped.

Further, the annular tray is arranged around the supporting disc, the inner ring portion of the annular tray is lower than the processing surface of the workpiece, and the outer edge of the annular tray is higher than the processing surface of the workpiece.

Further, the liquid sprayed by the etching liquid comprises hydrofluoric acid.

Further, the fluid sprayed by the protective fluid spray head is nitrogen or pure water.

Drawings

The present invention will be further described with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view of an etching apparatus according to the present application;

FIG. 2 is a schematic diagram of an etching solution overflow in an etching apparatus according to the present application;

FIG. 3 is a schematic view of protective fluid ejection head movement in one embodiment of the present application;

fig. 4 is a schematic view of a plurality of protective fluid ejection head arrangements according to yet another embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "open hole", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", and the like, indicate positional or positional relationships, are merely for convenience in describing the present invention and to simplify the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1 and 2, an etching apparatus for a wafer and a ring-shaped glass carrier includes: a base; the supporting disc 1 is horizontally arranged on the base, is rotatably connected with the base and is used for placing a workpiece 7; the clamp 2 is fixedly arranged on the supporting disc 1 and used for clamping the workpiece 7; the corrosive liquid 9 nozzle is arranged above the workpiece 7 and used for spraying the corrosive liquid 9 to the processing surface of the workpiece 7; and a protective fluid ejection head 3 arranged above the workpiece 7 for ejecting fluid to an edge of the workpiece 7; wherein the protective fluid ejection head 3 is movable in a radial direction of the support plate 1.

Before processing, the workpiece 7 can be placed on the supporting disc 1, and the workpiece 7 is fastened and fixed on the supporting disc 1 through the clamp 2. After the fixing is finished, the supporting disc 1 can be driven to rotate by taking the central shaft of the supporting disc as the axis. And then opening the corrosive liquid spray head 4, and spraying the corrosive liquid 9 to the surface to be processed of the workpiece 7, namely the upper end surface of the workpiece 7, wherein the corrosive liquid 9 comprises hydrofluoric acid or a mixed solution of hydrofluoric acid and other acids. At the same time, the protective fluid head 3 may be opened to spray a protective fluid, such as, but not limited to, nitrogen or pure water, against the edges of the workpiece 7.

In the process that the protective fluid nozzle 3 and the corrosive liquid nozzle 4 are opened simultaneously, the corrosive liquid 9 corrodes the upper end face of the workpiece 7, and under the action of centrifugal force generated by rotation of the workpiece 7 along with the support plate 1, the corrosive liquid 9 tends to move towards the edge of the workpiece 7.

In the present embodiment, the protective fluid ejection head 3 ejects the protective liquid 8, and the edge of the workpiece 7 is covered with the protective liquid 8. As shown in fig. 2, when the etching liquid 9 flows to the edge of the workpiece 7, it overflows to the outside of the workpiece 7 along the upper part of the liquid surface of the protective liquid 8, and in the process, the etching liquid 9 and the protective liquid 8 can mutually permeate at the contact surface, that is, part of the etching liquid 9 can downwards permeate into the protective liquid 8, but the concentration of the etching liquid 9 in the protective liquid 8 at the edge is far less than that of the etching liquid 9 at the middle part of the workpiece 7, and the macroscopic flow tendency of the etching liquid 9 is to flow out from the upper part of the protective liquid at the edge of the workpiece 7 due to the action of centrifugal force. Therefore, the corrosive liquid 9 mainly corrodes the middle part of the workpiece 7, and due to the action of the protective liquid 8, the edge part of the workpiece 7 forms an annular protection area, so that a wafer or glass carrier plate with a thin center and a thick edge is formed.

In another embodiment, the protective fluid nozzle 3 sprays protective gas, such as nitrogen, and the etching solution 9 flowing to the edge of the workpiece 7 is flushed toward the middle of the workpiece 7 due to the gas flushing, so that the etching solution 9 is limited in a circular area in the middle of the upper surface of the workpiece 7, the edge part of the workpiece 7 cannot be corroded, and finally, a wafer or glass carrier plate with a thin center and a thick edge is obtained.

As shown in fig. 3, the size of the annular protection area can be changed by moving the protective fluid ejection head 3, and it can be understood that the width of the annular protection area becomes smaller when the protective fluid ejection head 3 is moved in a direction away from the center of the support plate 1; conversely, the width of the annular protection zone increases. A ramp-shaped edge of the workpiece 7 is also obtained when the protective fluid head 3 is moved outwards at a constant speed during the machining process. Therefore, the size and the shape of the annular area can be more flexibly controlled by the device.

In another embodiment of the present invention, as shown in fig. 4, the protective fluid nozzle 3 comprises a fluid pipe and a plurality of nozzles, the plurality of nozzles are fixedly mounted on the fluid pipe and arranged along the radial direction of the support plate 1, wherein the nozzles are comb-shaped. That is, when the protective gas nozzle is provided with a plurality of heads, the heads may be selectively turned on to control the width of the annular protective zone.

Furthermore, the device can also be provided with a film thickness meter above the supporting disc 1, the thickness of the processed workpiece 7 is monitored in real time through the film thickness meter, and the corrosion depth can be accurately controlled through the detection value of the film thickness meter.

A plurality of through holes are formed in the supporting disc 1, when the protective fluid spray head 3 sprays gas, the sprayed gas is blown to the lower surface of a processed object from bottom to top, and the gas flow radially overflows along the lower surface after being blocked to form positive pressure, so that the lower surface and the end surface of the outer edge of the supporting disc are protected from being contacted by corrosive liquid 9.

The device also comprises an annular tray 6, wherein the annular tray 6 is arranged around the supporting disc, the inner ring part of the annular tray is lower than the processing surface of the workpiece 7, and the outer edge of the annular tray is higher than the processing surface of the workpiece 7

In addition, the device also comprises a cleaning nozzle 4, and the cleaning nozzle 4 sprays fluid for cleaning and/or drying the surface of the workpiece 7. Further, the fluid sprayed by the cleaning nozzle 4 may be pure water or nitrogen gas, and when spraying pure water, the cleaning nozzle 4 is used for cleaning the residual corrosive liquid 9 on the surface of the workpiece 7; when the nitrogen gas is sprayed, the cleaning nozzle 4 is used for air-drying the workpiece 7, so that the subsequent process is conveniently carried out.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.

Claims

1. An etching apparatus for etching a wafer and a ring-shaped glass carrier, comprising:

a base;

and a protective fluid spray head arranged above the workpiece for spraying fluid to the edge of the workpiece;

wherein the protective fluid ejection head is movable in a radial direction of the support plate.

2. The etching apparatus according to claim 1, wherein the protective fluid nozzle comprises a fluid pipe and a plurality of nozzles, and the plurality of nozzles are fixedly mounted on the fluid pipe and arranged along a radial direction of the support plate.

3. An etching apparatus as claimed in claim 2, wherein the nozzles are comb-shaped.

4. The etching apparatus according to claim 1, wherein the support plate has a plurality of through holes.

5. An etching apparatus for wafer and ring glass carrier plates according to claim 1 further comprising cleaning nozzles ejecting fluid for cleaning and/or drying the workpiece surface.

6. An etching apparatus for wafer and ring shaped glass carrier plate according to claim 5, wherein the fluid sprayed by the cleaning nozzles comprises:

pure water for cleaning the surface of the workpiece; and/or

And the nitrogen is used for drying the surface of the workpiece.

7. An etching apparatus for wafer and annular glass carrier plates according to claim 1, further comprising an annular tray disposed around the support plate with an inner annular portion lower than the processing surface of the workpiece and an outer edge higher than the processing surface of the workpiece.

8. The etching apparatus of claim 1, wherein the liquid sprayed by the etching liquid comprises hydrofluoric acid.

9. An etching apparatus for wafer and ring glass carrier plates according to claim 1, wherein the fluid sprayed by the protective fluid sprayer is nitrogen or pure water.