CN205723489U - A kind of chuck for clamping wafer - Google Patents
A kind of chuck for clamping wafer Download PDFInfo
- Publication number
- CN205723489U CN205723489U CN201620734747.4U CN201620734747U CN205723489U CN 205723489 U CN205723489 U CN 205723489U CN 201620734747 U CN201620734747 U CN 201620734747U CN 205723489 U CN205723489 U CN 205723489U
- Authority
- CN
- China
- Prior art keywords
- wafer
- chuck body
- chuck
- compressed gas
- guiding gutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 20
- 238000005530 etching Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 51
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000000274 adsorptive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a kind of chuck for clamping wafer, including chuck body, chuck body end face is provided with vacuum slot, it is provided with compressed gas ejection section along chuck body top, compressed gas passage is offered in chuck body, and external Ignitable gas devices, compressed gas passage is connected with compressed gas ejection section.Being provided with guiding gutter between vacuum slot and the compressed gas ejection section at described chuck body top, offer the runner connected with guiding gutter in chuck body, the external liquid withdrawal system of chuck body is connected with runner.This chuck is possible not only to vac sorb wafer, clamps the wafer of plurality of specifications size, and in technical process, it is also possible to form a circle gas shield ring at wafer rear edge, it is to avoid liquid inflow wafer rear causes stains or etching problem.In chuck, the most also install guiding gutter additional, avoid liquid to flow into wafer rear further, and avoid equipment is caused damage by liquid inflow equipment.
Description
Technical field
This utility model relates to a kind of wafer clamping device, particularly relates to a kind of chuck.
Background technology
The clamping of wafer is an important step in production process of semiconductor, affects the quality of wafer largely
And reliability.
Being illustrated in figure 1 existing contact vacuum cup, wherein 101 is wafer (generally silicon chip, it is also possible to be glass
Sheet), 102 is contact vacuum cup, and 103 is vacuum pump, and 104 is nozzle, 105 for process liquid (can be chemical liquid, also
Can be deionized water).Under normal condition, wafer is in technical process, and the process liquid that front is sprayed will not be stained in its back side.
But sucker is for the wafer of compatible sizes sometimes, the wafer size of its size often reference minimum gauge sets
Meter, so placing large scale wafer when, just easily causes wafer rear absorbing process liquid, causes the wafer rear flaw in a piece of jade
The phenomenons such as dirt even corrosion, not only badly influence the quality of wafer, reduce production efficiency and the stock utilization of silicon processing,
And subsequent process equipment is caused and stains or damage, as shown in Figure 2.It addition, when needs carry out relatively thin wafer process, relatively thin
Wafer often there is warpage, this will also result in process liquid adsorb at wafer rear.Once wafer rear adsorptive liquid, not only
Can pollute wafer rear, partially liq also can flow in vacuum pump along vacuum pneumatic direction, and the pump housing is caused damage,
So that causing board fault, the great product line accident such as wafer loss.
Chuck based on bernoulli principle, although avoid wafer and contact with the direct of chuck, but for same board
When needing the wafer of compatible many kinds of specification, it is necessary to change corresponding chuck according to wafer size specification, waste time and energy.And,
The conversion of different size chuck, not only impacts stabilization of equipment performance, and will also result in the biggest to the stability of technique
Impact.Therefore, how to solve above-mentioned technical problem and become the direction that this skilled person makes great efforts.
Utility model content
The purpose of this utility model is just to provide a kind of chuck for clamping wafer, cannot be only used for clamping plurality of specifications
The wafer of size, and solve the back side that wafer occurs in technical process and stain or the problem such as corrosion, thus solve above-mentioned
The deficiencies in the prior art.
The purpose of this utility model is realized by following technical proposals:
A kind of chuck for clamping wafer, including chuck body, chuck body end face is provided with vacuum slot, and its feature exists
In: it is provided with compressed gas ejection section along chuck body top, in chuck body, offers compressed gas passage, and external pressure
Contracting gas device, compressed gas passage is connected with compressed gas ejection section.
Further, described compressed gas ejection section deviation certain angle in direction outside chuck body.
Further, it is provided with guiding gutter, chuck between vacuum slot and the compressed gas ejection section at described chuck body top
Basis is the most internal offers the runner connected with guiding gutter, and the external liquid withdrawal system of chuck body is connected with runner.
Further, described guiding gutter is the annular guiding gutter with chuck body end face center as the center of circle.
Compared with prior art, the beneficial effects of the utility model are: simple in construction, reasonable in design, use this chuck
It is possible not only to vac sorb wafer, clamps the wafer of plurality of specifications size, and in technical process, it is also possible at wafer rear
Edge forms a circle gas shield ring, it is to avoid liquid inflow wafer rear causes stains or etching problem.The most also in chuck
Install guiding gutter additional, avoid liquid to flow into wafer rear further, and avoid, in liquid inflow equipment, equipment being caused damage.
Accompanying drawing explanation
Fig. 1 is existing contact vacuum cup working state figure one.
Fig. 2 is existing contact vacuum cup working state figure two.
Fig. 3 is structural representation of the present utility model.
Fig. 4 is the top view of chuck body.
Fig. 5 is use state diagram of the present utility model.
Detailed description of the invention
Below in conjunction with specific embodiments and the drawings, this utility model is further described.
As shown in Figure 3 and Figure 4, a kind of chuck for clamping wafer, including chuck body 106, chuck body 106 end face
It is provided with criss-cross vacuum slot 14, this external vacuum pump of vacuum slot 14 103.It is provided with pressure along chuck body 106 top
Contracting gas ejection section 12, and the direction deviation certain angle that described compressed gas ejection section 12 is outside chuck body 106.At card
Offering compressed gas passage, and external Ignitable gas devices 107 in dish body 106, compressed gas passage sprays with compressed gas
Portion 12 connects, Ignitable gas devices 107 produce compressed gas, and compressed gas is sprayed from compressed gas by compressed gas passage
Portion 12 ejects.
It is provided with guiding gutter 11, institute between vacuum slot 14 and the compressed gas ejection section 12 at described chuck body 106 top
Stating guiding gutter 11 is the annular guiding gutter with chuck body 106 end face center as the center of circle, offers and water conservancy diversion in chuck body 106
The runner of groove 11 connection, the external liquid withdrawal system of chuck body 106 108 is connected with runner.
See Fig. 5, the operation principle of this chuck: this chuck can the wafer of compatible sizes, such as the 8 of current main flow
With 12 wafers.When utilizing one chip board to one chip techniques such as wafer 101 are carried out, etch or remove photoresist, utilize true
Wafer 101 is absorbed and fixed at chuck body 106 top by suction mouth 14, and each road process liquid 105 is ejected into crystalline substance by nozzle 104
Circle 101 surfaces, process liquid 105 being held in wafer 101 diffusion into the surface, so that covering the surface of whole wafer 101, thus protecting
The uniformity of card technique.Under normal circumstances or time rotating speed is the highest, due to the effect of centrifugal force, it is sprayed onto the liquid in wafer 101 front
Know from experience and be thrown out of at wafer 101 edge, do not have liquid and be flowed into wafer 101 back side situation.But when using large-size
Wafer 101 carry out technique (such as when the chuck adsorbing 8 wafers adsorb 12 wafers carry out technique time) or in order to reach work
The reasons such as skill uniformity, chuck rotating speed can not the highest time, the edge centrifugal force of chuck will reduce, and now process liquid 105 is just
Wafer 101 back side can be flowed to along wafer 101 edge.Compressed gas body 12 meeting when this occurs when, on chuck
Form a circle gas shield ring in outer ring, wafer 101 back side, thus stop that process liquid 105 spreads to center, wafer 101 back side.
When occurring that Ignitable gas devices 107 air pressure is too small, it is impossible to when situation about being intercepted by process liquid 105 in time occurs, or work occurs
Skill liquid 105 injection flow is the highest, plays the situation of thicker liquid film at the positive area of wafer 101, and this liquid film can flow to wafer 101
The back side, i.e. occurs that gas shield ring can not flow to the situation at center at wafer 101 back side by barrier liquid completely.Now this chuck is also
Have second protective measure, i.e. chuck built with guiding gutter 11.When liquid flows to the center at wafer 101 back side, liquid meeting
First flowing into guiding gutter 11 region on chuck, the liquid being flowed into this region can be flowed into liquid withdrawal system by guiding gutter 11
In 108, thus avoid liquid to pass through vacuum slot 14 and flow in vacuum pump 103, equipment is caused damage.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all at this
Any amendment, equivalent and the improvement etc. made within the spirit of utility model and principle, should be included in this utility model
Protection domain within.
Claims (2)
1., for clamping a chuck for wafer, including chuck body, chuck body end face is provided with vacuum slot, and its feature exists
In: it is provided with compressed gas ejection section along chuck body top, in chuck body, offers compressed gas passage, and external pressure
Contracting gas device, compressed gas passage is connected with compressed gas ejection section, the vacuum slot at described chuck body top and compression
Being provided with guiding gutter between gas ejection section, offer the runner connected with guiding gutter in chuck body, the external liquid of chuck body returns
Receiving apparatus is connected with runner.
Chuck for clamping wafer the most according to claim 1, it is characterised in that: described guiding gutter is with chuck body
End face center is the annular guiding gutter in the center of circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620734747.4U CN205723489U (en) | 2016-07-12 | 2016-07-12 | A kind of chuck for clamping wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620734747.4U CN205723489U (en) | 2016-07-12 | 2016-07-12 | A kind of chuck for clamping wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205723489U true CN205723489U (en) | 2016-11-23 |
Family
ID=57327523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620734747.4U Active CN205723489U (en) | 2016-07-12 | 2016-07-12 | A kind of chuck for clamping wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205723489U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047796A (en) * | 2018-01-16 | 2019-07-23 | 亿力鑫系统科技股份有限公司 | Carrier |
| CN112687606A (en) * | 2021-02-03 | 2021-04-20 | 天通控股股份有限公司 | Wafer sucking disc with back protection function |
| CN112967995A (en) * | 2021-02-01 | 2021-06-15 | 泉芯集成电路制造(济南)有限公司 | Chip clamp, chip cleaning device and chip etching device |
| CN114361094A (en) * | 2022-03-15 | 2022-04-15 | 三河建华高科有限责任公司 | Efficient feeding transmission device suitable for stacking wafers |
-
2016
- 2016-07-12 CN CN201620734747.4U patent/CN205723489U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047796A (en) * | 2018-01-16 | 2019-07-23 | 亿力鑫系统科技股份有限公司 | Carrier |
| CN110047796B (en) * | 2018-01-16 | 2021-10-01 | 亿力鑫系统科技股份有限公司 | Bearing plate |
| CN112967995A (en) * | 2021-02-01 | 2021-06-15 | 泉芯集成电路制造(济南)有限公司 | Chip clamp, chip cleaning device and chip etching device |
| CN112687606A (en) * | 2021-02-03 | 2021-04-20 | 天通控股股份有限公司 | Wafer sucking disc with back protection function |
| CN114361094A (en) * | 2022-03-15 | 2022-04-15 | 三河建华高科有限责任公司 | Efficient feeding transmission device suitable for stacking wafers |
| CN114361094B (en) * | 2022-03-15 | 2022-06-03 | 三河建华高科有限责任公司 | Efficient feeding transmission device suitable for stacking wafers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 1 Jingxiang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee after: Jimsi Semiconductor Technology (Wuxi) Co.,Ltd. Country or region after: China Address before: No. 209, Zhangjing east section, Xigang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Patentee before: GMC SEMITECH Co.,Ltd. Country or region before: China |