CN103779366A - 用以减少图像记忆效应的带负电荷层 - Google Patents
用以减少图像记忆效应的带负电荷层 Download PDFInfo
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- CN103779366A CN103779366A CN201310340938.3A CN201310340938A CN103779366A CN 103779366 A CN103779366 A CN 103779366A CN 201310340938 A CN201310340938 A CN 201310340938A CN 103779366 A CN103779366 A CN 103779366A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/103—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN homojunction type
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (31)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610319934.0A CN105845699B (zh) | 2012-10-25 | 2013-08-07 | 用以减少图像记忆效应的带负电荷层 |
CN201610318158.2A CN105932033B (zh) | 2012-10-25 | 2013-08-07 | 用以减少图像记忆效应的带负电荷层 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/660,774 US8816462B2 (en) | 2012-10-25 | 2012-10-25 | Negatively charged layer to reduce image memory effect |
US13/660,774 | 2012-10-25 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610318158.2A Division CN105932033B (zh) | 2012-10-25 | 2013-08-07 | 用以减少图像记忆效应的带负电荷层 |
CN201610319934.0A Division CN105845699B (zh) | 2012-10-25 | 2013-08-07 | 用以减少图像记忆效应的带负电荷层 |
Publications (2)
Publication Number | Publication Date |
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CN103779366A true CN103779366A (zh) | 2014-05-07 |
CN103779366B CN103779366B (zh) | 2016-05-18 |
Family
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310340938.3A Active CN103779366B (zh) | 2012-10-25 | 2013-08-07 | 用以减少图像记忆效应的带负电荷层 |
CN201610318158.2A Active CN105932033B (zh) | 2012-10-25 | 2013-08-07 | 用以减少图像记忆效应的带负电荷层 |
CN201610319934.0A Active CN105845699B (zh) | 2012-10-25 | 2013-08-07 | 用以减少图像记忆效应的带负电荷层 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610318158.2A Active CN105932033B (zh) | 2012-10-25 | 2013-08-07 | 用以减少图像记忆效应的带负电荷层 |
CN201610319934.0A Active CN105845699B (zh) | 2012-10-25 | 2013-08-07 | 用以减少图像记忆效应的带负电荷层 |
Country Status (4)
Country | Link |
---|---|
US (3) | US8816462B2 (zh) |
CN (3) | CN103779366B (zh) |
HK (1) | HK1194856A1 (zh) |
TW (1) | TWI518888B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107155375A (zh) * | 2014-11-18 | 2017-09-12 | 索尼公司 | 固态摄像装置及其制造方法和电子设备 |
CN108428712A (zh) * | 2018-05-14 | 2018-08-21 | 德淮半导体有限公司 | 图像传感器及其制造方法 |
CN110444556A (zh) * | 2019-08-30 | 2019-11-12 | 上海华力微电子有限公司 | Cmos传感器及cmos传感器的形成方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8816462B2 (en) | 2012-10-25 | 2014-08-26 | Omnivision Technologies, Inc. | Negatively charged layer to reduce image memory effect |
US9224881B2 (en) * | 2013-04-04 | 2015-12-29 | Omnivision Technologies, Inc. | Layers for increasing performance in image sensors |
TWI753351B (zh) * | 2013-11-29 | 2022-01-21 | 日商索尼半導體解決方案公司 | 攝像元件及電子機器 |
JP6879919B2 (ja) * | 2015-09-17 | 2021-06-02 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、電子機器、及び、固体撮像素子の製造方法 |
JP2017139286A (ja) * | 2016-02-02 | 2017-08-10 | ソニー株式会社 | 撮像素子、及び、カメラシステム |
CN107994044A (zh) * | 2017-12-15 | 2018-05-04 | 上海华力微电子有限公司 | Cmos图像传感器及其制作方法 |
CN110473888A (zh) * | 2019-08-26 | 2019-11-19 | 上海华力集成电路制造有限公司 | Bsi结构图像传感器中氧化铝薄膜的形成方法及氧化铝薄膜 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101371361A (zh) * | 2006-01-09 | 2009-02-18 | 美光科技公司 | 具有改进的表面耗尽的图像传感器 |
US20090090988A1 (en) * | 2007-10-03 | 2009-04-09 | Sony Corporation | Solid state imaging device, method of manufacturing the same, and imaging apparatus |
US20090230496A1 (en) * | 2008-03-12 | 2009-09-17 | Sony Corporation | Solid-state imaging device |
Family Cites Families (16)
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US5840624A (en) | 1996-03-15 | 1998-11-24 | Taiwan Semiconductor Manufacturing Company, Ltd | Reduction of via over etching for borderless contacts |
US6083824A (en) | 1998-07-13 | 2000-07-04 | Taiwan Semiconductor Manufacturing Company | Borderless contact |
US6809359B2 (en) | 2001-05-16 | 2004-10-26 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device, method for manufacturing the same, and method for driving the same |
JP4075797B2 (ja) * | 2003-12-25 | 2008-04-16 | ソニー株式会社 | 固体撮像素子 |
US7271430B2 (en) * | 2004-06-04 | 2007-09-18 | Samsung Electronics Co., Ltd. | Image sensors for reducing dark current and methods of fabricating the same |
US7214974B2 (en) * | 2004-06-04 | 2007-05-08 | Samsung Electronics Co., Ltd. | Image sensors for reducing dark current and methods of manufacturing the same |
US8446508B2 (en) * | 2005-07-27 | 2013-05-21 | Sony Corporation | Solid state imaging device with optimized locations of internal electrical components |
KR101463609B1 (ko) | 2008-02-15 | 2014-11-21 | 삼성전자 주식회사 | 이미지 센서 및 그 제조 방법 |
JP5136110B2 (ja) * | 2008-02-19 | 2013-02-06 | ソニー株式会社 | 固体撮像装置の製造方法 |
JP4924634B2 (ja) * | 2009-03-04 | 2012-04-25 | ソニー株式会社 | 固体撮像素子及びその製造方法、撮像装置 |
JP5418049B2 (ja) * | 2009-08-03 | 2014-02-19 | ソニー株式会社 | 固体撮像素子及びその製造方法、撮像装置 |
JP5651976B2 (ja) * | 2010-03-26 | 2015-01-14 | ソニー株式会社 | 固体撮像素子およびその製造方法、並びに電子機器 |
JP2011228648A (ja) | 2010-03-31 | 2011-11-10 | Fujifilm Corp | 撮像素子 |
US8338856B2 (en) * | 2010-08-10 | 2012-12-25 | Omnivision Technologies, Inc. | Backside illuminated image sensor with stressed film |
JP2013012551A (ja) | 2011-06-28 | 2013-01-17 | Sony Corp | 固体撮像装置、固体撮像装置の製造方法、及び電子機器 |
US8816462B2 (en) * | 2012-10-25 | 2014-08-26 | Omnivision Technologies, Inc. | Negatively charged layer to reduce image memory effect |
-
2012
- 2012-10-25 US US13/660,774 patent/US8816462B2/en active Active
-
2013
- 2013-07-19 TW TW102125984A patent/TWI518888B/zh active
- 2013-08-07 CN CN201310340938.3A patent/CN103779366B/zh active Active
- 2013-08-07 CN CN201610318158.2A patent/CN105932033B/zh active Active
- 2013-08-07 CN CN201610319934.0A patent/CN105845699B/zh active Active
-
2014
- 2014-07-15 US US14/331,652 patent/US9105767B2/en active Active
- 2014-07-15 US US14/331,646 patent/US9147776B2/en active Active
- 2014-08-05 HK HK14107990.9A patent/HK1194856A1/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101371361A (zh) * | 2006-01-09 | 2009-02-18 | 美光科技公司 | 具有改进的表面耗尽的图像传感器 |
US20090090988A1 (en) * | 2007-10-03 | 2009-04-09 | Sony Corporation | Solid state imaging device, method of manufacturing the same, and imaging apparatus |
US20090230496A1 (en) * | 2008-03-12 | 2009-09-17 | Sony Corporation | Solid-state imaging device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107155375A (zh) * | 2014-11-18 | 2017-09-12 | 索尼公司 | 固态摄像装置及其制造方法和电子设备 |
CN107155375B (zh) * | 2014-11-18 | 2020-08-18 | 索尼公司 | 固态摄像装置及其制造方法和电子设备 |
CN108428712A (zh) * | 2018-05-14 | 2018-08-21 | 德淮半导体有限公司 | 图像传感器及其制造方法 |
CN110444556A (zh) * | 2019-08-30 | 2019-11-12 | 上海华力微电子有限公司 | Cmos传感器及cmos传感器的形成方法 |
Also Published As
Publication number | Publication date |
---|---|
US9147776B2 (en) | 2015-09-29 |
US20140117485A1 (en) | 2014-05-01 |
US20140327102A1 (en) | 2014-11-06 |
CN105845699B (zh) | 2018-11-02 |
TW201417252A (zh) | 2014-05-01 |
CN105932033B (zh) | 2018-02-16 |
TWI518888B (zh) | 2016-01-21 |
US8816462B2 (en) | 2014-08-26 |
CN105845699A (zh) | 2016-08-10 |
US20140319639A1 (en) | 2014-10-30 |
CN105932033A (zh) | 2016-09-07 |
HK1194856A1 (zh) | 2014-10-24 |
US9105767B2 (en) | 2015-08-11 |
CN103779366B (zh) | 2016-05-18 |
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