CN103712191A - Heat radiation structure for ballast - Google Patents
Heat radiation structure for ballast Download PDFInfo
- Publication number
- CN103712191A CN103712191A CN201210378659.1A CN201210378659A CN103712191A CN 103712191 A CN103712191 A CN 103712191A CN 201210378659 A CN201210378659 A CN 201210378659A CN 103712191 A CN103712191 A CN 103712191A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- oxide
- metal
- insulation spacer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat radiation structure of a ballast. The heat radiation structure of the ballast comprises a PCB board, a MOS pipe, an insulating spacer and a heat dissipation bottom plate. The PCB board is provided with a front surface and a back surface, an electron component is arranged at the front of the PCB board, the MOS pipe is arranged at the back of the PCB board, the insulating spacer is the same with the PCB board in shape, and a gap is formed at the MOS pipe on the PCB board corresponding to the insulating spacer; the PCB board, the insulating spacer and the heat dissipation bottom plate are abutted against each other sequentially and are arranged in one shell. The back surface of the PCB board faces the insulating spacer and the MOS pipe of the PCB board is accommodated at the gap of the insulating spacer. The heat radiation structure of the ballast is simple in structure, is capable of increasing heat dissipation effect of the MOS pipe, and prolonging service life.
Description
Technical field
The present invention relates to a kind of ballast radiator structure.
Background technology
Current ballast used, the metal-oxide-semiconductor on it and electronic devices and components are located on a side of pcb board jointly, are then placed in a housing, like this, metal-oxide-semiconductor is as main heat dissipation element, and the heat on it can not distribute in time, easily cause and burn out, reduce service life.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of ballast radiator structure, this radiator structure is simple, can effectively improve the radiating effect of metal-oxide-semiconductor, improves service life.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of ballast radiator structure, comprise pcb board, metal-oxide-semiconductor, insulation spacer and radiating bottom plate, described pcb board has front and back, the front of this pcb board is provided with electronic devices and components, and described metal-oxide-semiconductor is located at the back side of described pcb board; Described insulation spacer is consistent with described pcb board shape, and the metal-oxide-semiconductor place on the corresponding described pcb board of this insulation spacer forms breach; Described pcb board, insulation spacer and radiating bottom plate are successively against being also jointly placed in a housing, and the back side of described pcb board is placed in the indentation, there of described insulation spacer over against the metal-oxide-semiconductor on described insulation spacer and this pcb board.
As a further improvement on the present invention, described pcb board, insulation spacer and bottom are all rounded, and described metal-oxide-semiconductor is four, and these four metal-oxide-semiconductors are symmetrically distributed in the back side of described pcb board.
As a further improvement on the present invention, described radiating bottom plate is aluminium sheet.
The invention has the beneficial effects as follows: the back side of metal-oxide-semiconductor being located to pcb board, then add an insulation spacer, and the corresponding metal-oxide-semiconductor of insulation spacer place has breach, in radiating bottom plate, directly contact again, like this, its heat of metal-oxide-semiconductor as main heat dissipation element can directly be derived through radiating bottom plate, greatly improves radiating effect, improves service life.
Accompanying drawing explanation
Fig. 1 is decomposition texture schematic diagram of the present invention.
By reference to the accompanying drawings, make the following instructions:
1---pcb board 2---metal-oxide-semiconductor
3---insulation spacer 4---radiating bottom plate
11---electronic devices and components 31---breach
The specific embodiment
By reference to the accompanying drawings, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiment, the simple equivalence of in every case being done with the present patent application the scope of the claims and description changes and modifies, within all still belonging to patent covering scope of the present invention.
As shown in Figure 1, a kind of ballast radiator structure, comprises pcb board 1, metal-oxide-semiconductor 2, insulation spacer 3 and radiating bottom plate 4, and described pcb board has front and back, and the front of this pcb board is provided with electronic devices and components 11, and described metal-oxide-semiconductor is located at the back side of described pcb board; Described insulation spacer is consistent with described pcb board shape, and the metal-oxide-semiconductor place on the corresponding described pcb board of this insulation spacer forms breach 21; Described pcb board, insulation spacer and radiating bottom plate are successively against being also jointly placed in a housing, and the back side of described pcb board is placed in the indentation, there of described insulation spacer over against the metal-oxide-semiconductor on described insulation spacer and this pcb board.Like this, as its heat of metal-oxide-semiconductor of main heat dissipation element, by radiating bottom plate, directly export on housing, thereby can better protect metal-oxide-semiconductor, improve its service life.
Preferably, described pcb board, insulation spacer and bottom are all rounded, and described metal-oxide-semiconductor is four, and these four metal-oxide-semiconductors are symmetrically distributed in the back side of described pcb board.
Preferably, stating radiating bottom plate is aluminium sheet.
Claims (3)
1. a ballast radiator structure, comprise pcb board (1), metal-oxide-semiconductor (2), insulation spacer (3) and radiating bottom plate (4), described pcb board has front and back, the front of this pcb board is provided with electronic devices and components (11), it is characterized in that: described metal-oxide-semiconductor is located at the back side of described pcb board; Described insulation spacer is consistent with described pcb board shape, and the metal-oxide-semiconductor place on the corresponding described pcb board of this insulation spacer forms breach (21); Described pcb board, insulation spacer and radiating bottom plate are successively against being also jointly placed in a housing, and the back side of described pcb board is placed in the indentation, there of described insulation spacer over against the metal-oxide-semiconductor on described insulation spacer and this pcb board.
2. ballast radiator structure according to claim 1, is characterized in that: described pcb board, insulation spacer and bottom are all rounded, and described metal-oxide-semiconductor is four, and these four metal-oxide-semiconductors are symmetrically distributed in the back side of described pcb board.
3. ballast radiator structure according to claim 1 and 2, is characterized in that: described radiating bottom plate is aluminium sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210378659.1A CN103712191A (en) | 2012-10-09 | 2012-10-09 | Heat radiation structure for ballast |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210378659.1A CN103712191A (en) | 2012-10-09 | 2012-10-09 | Heat radiation structure for ballast |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103712191A true CN103712191A (en) | 2014-04-09 |
Family
ID=50405379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210378659.1A Pending CN103712191A (en) | 2012-10-09 | 2012-10-09 | Heat radiation structure for ballast |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103712191A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2266856Y (en) * | 1996-05-22 | 1997-11-05 | 李文霖 | Integral solidifying electronic ballast |
| CN101778517A (en) * | 2010-02-10 | 2010-07-14 | 海南世银能源科技有限公司 | Electronic ballast structure |
| CN201621664U (en) * | 2010-02-11 | 2010-11-03 | 常州市泽光照明有限公司 | Heat dissipation device for power component of electrodeless lamp ballast |
| CN201937933U (en) * | 2010-11-24 | 2011-08-17 | 蔡跃进 | Electrodeless lamp electronic ballast |
| CN202852761U (en) * | 2012-10-09 | 2013-04-03 | 昆山和光照明科技有限公司 | Heat radiation structure for ballast |
-
2012
- 2012-10-09 CN CN201210378659.1A patent/CN103712191A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2266856Y (en) * | 1996-05-22 | 1997-11-05 | 李文霖 | Integral solidifying electronic ballast |
| CN101778517A (en) * | 2010-02-10 | 2010-07-14 | 海南世银能源科技有限公司 | Electronic ballast structure |
| CN201621664U (en) * | 2010-02-11 | 2010-11-03 | 常州市泽光照明有限公司 | Heat dissipation device for power component of electrodeless lamp ballast |
| CN201937933U (en) * | 2010-11-24 | 2011-08-17 | 蔡跃进 | Electrodeless lamp electronic ballast |
| CN202852761U (en) * | 2012-10-09 | 2013-04-03 | 昆山和光照明科技有限公司 | Heat radiation structure for ballast |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2475236A3 (en) | Power Switching Circuitry | |
| CN108494048A (en) | Wireless charging device | |
| EP2706828A3 (en) | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same | |
| WO2014191893A3 (en) | Electrical machine | |
| CN205266006U (en) | Multi -layer PCB board | |
| CN202852761U (en) | Heat radiation structure for ballast | |
| CN204836781U (en) | Four layers PCB board subassembly in material saving and space | |
| CN103712191A (en) | Heat radiation structure for ballast | |
| CN203167497U (en) | Electric conduction and heat dissipation structure for electronic device housing | |
| CN103096616A (en) | Heat conduction structure of patch power component on circuit board | |
| CN105845647A (en) | Large power loaded MOS pipe heat radiation apparatus | |
| CN203057683U (en) | Circuit board radiating structure | |
| CN202818854U (en) | Anti-radiation plastic housing | |
| CN103747662A (en) | Fan controller | |
| CN204466036U (en) | A kind of aluminum-based circuit board | |
| CN204231682U (en) | The faradic PTC heater of a kind of elimination | |
| CN203167516U (en) | Electric conduction and heat conduction apparatus for electronic shielding cover | |
| CN203482488U (en) | Circuit board with good thermal conductivity | |
| CN204100190U (en) | A kind of high-power LED heat radiating device | |
| CN204793613U (en) | Laser instrument chip heat abstractor | |
| CN203039133U (en) | Terminal with heat dissipation function | |
| CN203884067U (en) | Multilayer printed circuit board (PCB) with novel insulation structure | |
| CN204028759U (en) | A kind of terminal server | |
| CN202135321U (en) | Power amplifier | |
| CN202871372U (en) | Anti-interference power supply connecting line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140409 |
|
| RJ01 | Rejection of invention patent application after publication |