CN103708130B - 面板搭载用支架 - Google Patents

面板搭载用支架 Download PDF

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Publication number
CN103708130B
CN103708130B CN201210567926.XA CN201210567926A CN103708130B CN 103708130 B CN103708130 B CN 103708130B CN 201210567926 A CN201210567926 A CN 201210567926A CN 103708130 B CN103708130 B CN 103708130B
Authority
CN
China
Prior art keywords
panel
limiting portion
movement limiting
circumference
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210567926.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN103708130A (zh
Inventor
后藤尚史
畠山照史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chugai Ro Co Ltd
Original Assignee
Chugai Ro Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chugai Ro Co Ltd filed Critical Chugai Ro Co Ltd
Publication of CN103708130A publication Critical patent/CN103708130A/zh
Application granted granted Critical
Publication of CN103708130B publication Critical patent/CN103708130B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Pallets (AREA)
  • Buffer Packaging (AREA)
  • Warehouses Or Storage Devices (AREA)
CN201210567926.XA 2012-10-02 2012-12-24 面板搭载用支架 Expired - Fee Related CN103708130B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012220055A JP5180403B1 (ja) 2012-10-02 2012-10-02 パネル搭載用ラック
JP2012-220055 2012-10-02

Publications (2)

Publication Number Publication Date
CN103708130A CN103708130A (zh) 2014-04-09
CN103708130B true CN103708130B (zh) 2016-01-06

Family

ID=48189461

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210567926.XA Expired - Fee Related CN103708130B (zh) 2012-10-02 2012-12-24 面板搭载用支架

Country Status (4)

Country Link
JP (1) JP5180403B1 (ja)
KR (1) KR101380993B1 (ja)
CN (1) CN103708130B (ja)
TW (1) TWI412476B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106032014A (zh) * 2015-03-13 2016-10-19 上海理想万里晖薄膜设备有限公司 一种机械手臂
JP7288857B2 (ja) * 2017-11-14 2023-06-08 株式会社瑞光 着用物品の製造設備の機器の交換

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5960960A (en) * 1996-10-15 1999-10-05 Nec Corporation Wafer carrier
CN101872732A (zh) * 2009-04-23 2010-10-27 东京毅力科创株式会社 基板保持部件、基板搬送臂和基板搬送装置
CN202219923U (zh) * 2011-08-24 2012-05-16 安徽鑫昊等离子显示器件有限公司 一种装玻璃基板的卡匣

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3203794B2 (ja) * 1992-09-02 2001-08-27 ソニー株式会社 円盤状部品の搬送方法及びその装置
JP3986027B2 (ja) * 1997-08-29 2007-10-03 大日本印刷株式会社 ガラス板搬送用カセット
TW563680U (en) * 2002-03-12 2003-11-21 Au Optronics Corp Cartridge and carrier structure for transmitting glass substrate
JP2004146578A (ja) * 2002-10-24 2004-05-20 Yodogawa Hu-Tech Kk カセット用基板支持部材および基板用カセット
JP2005340480A (ja) * 2004-05-26 2005-12-08 Nippon Oil Corp 基板カセット用サポートバー
US20090194456A1 (en) * 2006-07-07 2009-08-06 Entegris, Inc. Wafer cassette
KR20080049254A (ko) * 2006-11-30 2008-06-04 엘지디스플레이 주식회사 기판 이송용 카세트
CN201614104U (zh) * 2009-12-18 2010-10-27 台湾淀川化成股份有限公司 玻璃基板运送箱
KR101212021B1 (ko) * 2010-11-18 2012-12-13 (주) 청심이엔지 기판 수납용 카세트 및 그러한 기판 수납용 카세트를 구비한 기판 슬리밍 장치
TWM418901U (en) * 2011-08-11 2011-12-21 Joghon Technology Co Ltd Panel storage device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5960960A (en) * 1996-10-15 1999-10-05 Nec Corporation Wafer carrier
CN101872732A (zh) * 2009-04-23 2010-10-27 东京毅力科创株式会社 基板保持部件、基板搬送臂和基板搬送装置
CN202219923U (zh) * 2011-08-24 2012-05-16 安徽鑫昊等离子显示器件有限公司 一种装玻璃基板的卡匣

Also Published As

Publication number Publication date
JP5180403B1 (ja) 2013-04-10
TW201326008A (zh) 2013-07-01
CN103708130A (zh) 2014-04-09
JP2014069893A (ja) 2014-04-21
TWI412476B (zh) 2013-10-21
KR101380993B1 (ko) 2014-04-04

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160106

Termination date: 20191224