CN103688355B - 使用硅穿孔的集成电路设计 - Google Patents

使用硅穿孔的集成电路设计 Download PDF

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Publication number
CN103688355B
CN103688355B CN201280032257.4A CN201280032257A CN103688355B CN 103688355 B CN103688355 B CN 103688355B CN 201280032257 A CN201280032257 A CN 201280032257A CN 103688355 B CN103688355 B CN 103688355B
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tsv
tsvs
circuit element
die
active circuit
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CN103688355A (zh
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阿利弗·瑞曼
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Xilinx Inc
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Xilinx Inc
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WO2013002844A1 (en) 2013-01-03
US20120331435A1 (en) 2012-12-27
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