CN103681229A - 粘合带粘贴方法和粘合带粘贴装置 - Google Patents
粘合带粘贴方法和粘合带粘贴装置 Download PDFInfo
- Publication number
- CN103681229A CN103681229A CN201310388691.2A CN201310388691A CN103681229A CN 103681229 A CN103681229 A CN 103681229A CN 201310388691 A CN201310388691 A CN 201310388691A CN 103681229 A CN103681229 A CN 103681229A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- mentioned
- tension force
- semiconductor crystal
- ring frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 212
- 238000005304 joining Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000004065 semiconductor Substances 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims description 44
- 239000013078 crystal Substances 0.000 claims description 34
- 238000005520 cutting process Methods 0.000 claims description 24
- 230000008569 process Effects 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 10
- 230000033228 biological regulation Effects 0.000 claims description 9
- 238000002372 labelling Methods 0.000 claims description 7
- 238000012423 maintenance Methods 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000002224 dissection Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-191758 | 2012-08-31 | ||
JP2012191758A JP6059921B2 (ja) | 2012-08-31 | 2012-08-31 | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103681229A true CN103681229A (zh) | 2014-03-26 |
Family
ID=50318444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310388691.2A Pending CN103681229A (zh) | 2012-08-31 | 2013-08-30 | 粘合带粘贴方法和粘合带粘贴装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6059921B2 (ko) |
KR (1) | KR20140029313A (ko) |
CN (1) | CN103681229A (ko) |
TW (1) | TW201419443A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106340483A (zh) * | 2015-07-06 | 2017-01-18 | 株式会社迪思科 | 卡盘工作台和清洗装置 |
CN110323157A (zh) * | 2018-03-29 | 2019-10-11 | 日东电工株式会社 | 粘合带粘贴方法和粘合带粘贴装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6636696B2 (ja) * | 2014-12-25 | 2020-01-29 | 日東電工株式会社 | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 |
JP6706979B2 (ja) * | 2016-06-27 | 2020-06-10 | 株式会社ディスコ | 拡張装置及び拡張方法 |
KR102499977B1 (ko) | 2016-07-13 | 2023-02-15 | 삼성전자주식회사 | 접착 테이프 부착 장치 및 이를 이용한 반도체 패키지의 제조 방법 |
KR101896384B1 (ko) * | 2016-10-04 | 2018-09-07 | 주식회사 대성엔지니어링 | 진공 라미네이터용 챔버장치 |
JP6848151B2 (ja) * | 2017-05-29 | 2021-03-24 | リンテック株式会社 | 離間装置および離間方法 |
US20210217644A1 (en) * | 2018-02-28 | 2021-07-15 | Mitsui Chemicals Tohcello, Inc. | Component producing method, holding film, and holding tool forming device |
JP7285133B2 (ja) * | 2019-05-17 | 2023-06-01 | 日東電工株式会社 | シート材貼付け方法およびシート材貼付け装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02142156A (ja) * | 1988-11-22 | 1990-05-31 | Takatori Haitetsuku:Kk | ウエハートレーのテープ貼着装置 |
US20010017547A1 (en) * | 2000-02-29 | 2001-08-30 | Mitsuhiro Furuta | Tape-like member transfer system |
CN101017767A (zh) * | 2006-02-09 | 2007-08-15 | 日东电工株式会社 | 工件粘贴支承方法和使用该方法的工件粘贴支承装置 |
CN102097294A (zh) * | 2009-11-20 | 2011-06-15 | 日东电工株式会社 | 粘合带粘贴装置及粘合带粘贴方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02182656A (ja) * | 1989-01-09 | 1990-07-17 | Konica Corp | ウェブの張力調整装置 |
JPH07263524A (ja) * | 1994-03-22 | 1995-10-13 | Teikoku Seiki Kk | 半導体製造装置におけるテープ展張装置及びこのテープ展張装置を備える半導体製造装置 |
JP2000019860A (ja) * | 1998-06-30 | 2000-01-21 | Ricoh Co Ltd | 画像形成装置 |
JP2002225020A (ja) * | 2001-01-30 | 2002-08-14 | Ishikawajima Harima Heavy Ind Co Ltd | グリーンセラミックス成型体の成型方法および成型装置 |
JP4698519B2 (ja) * | 2006-07-31 | 2011-06-08 | 日東電工株式会社 | 半導体ウエハマウント装置 |
JP5542582B2 (ja) * | 2010-08-26 | 2014-07-09 | リンテック株式会社 | シート貼付装置および貼付方法 |
-
2012
- 2012-08-31 JP JP2012191758A patent/JP6059921B2/ja not_active Expired - Fee Related
-
2013
- 2013-08-28 TW TW102130724A patent/TW201419443A/zh unknown
- 2013-08-30 CN CN201310388691.2A patent/CN103681229A/zh active Pending
- 2013-08-30 KR KR1020130103621A patent/KR20140029313A/ko not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02142156A (ja) * | 1988-11-22 | 1990-05-31 | Takatori Haitetsuku:Kk | ウエハートレーのテープ貼着装置 |
US20010017547A1 (en) * | 2000-02-29 | 2001-08-30 | Mitsuhiro Furuta | Tape-like member transfer system |
CN101017767A (zh) * | 2006-02-09 | 2007-08-15 | 日东电工株式会社 | 工件粘贴支承方法和使用该方法的工件粘贴支承装置 |
CN102097294A (zh) * | 2009-11-20 | 2011-06-15 | 日东电工株式会社 | 粘合带粘贴装置及粘合带粘贴方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106340483A (zh) * | 2015-07-06 | 2017-01-18 | 株式会社迪思科 | 卡盘工作台和清洗装置 |
CN106340483B (zh) * | 2015-07-06 | 2021-11-19 | 株式会社迪思科 | 卡盘工作台和清洗装置 |
CN110323157A (zh) * | 2018-03-29 | 2019-10-11 | 日东电工株式会社 | 粘合带粘贴方法和粘合带粘贴装置 |
CN110323157B (zh) * | 2018-03-29 | 2024-07-02 | 日东电工株式会社 | 粘合带粘贴方法和粘合带粘贴装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6059921B2 (ja) | 2017-01-11 |
JP2014049627A (ja) | 2014-03-17 |
KR20140029313A (ko) | 2014-03-10 |
TW201419443A (zh) | 2014-05-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140326 |