CN103633224A - 一种led光源模块及其生产工艺 - Google Patents

一种led光源模块及其生产工艺 Download PDF

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CN103633224A
CN103633224A CN201310594067.8A CN201310594067A CN103633224A CN 103633224 A CN103633224 A CN 103633224A CN 201310594067 A CN201310594067 A CN 201310594067A CN 103633224 A CN103633224 A CN 103633224A
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led
substrate
light source
source module
led light
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郑香奕
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DONGGUAN MEISHENG ELECTRICAL APPLIANCE PRODUCT Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Abstract

本发明涉及LED技术领域，特指一种LED光源模块及其生产工艺。LED光源模块包括基板、LED晶片以及封装料体，所述基板由与封装料体材质相同的透光材料成型，若干LED晶片固晶于所述基板上并通过金属线连接形成LED电路，且基板上还固定有两个与LED电路连接的电极片，所述封装料体将所述基板、LED晶片、金属线及部分电极片完全封装，部分电极片外露于封装料体。本发明的有益效果主要体现在：直接以封装用的透光材料来成型制作基板，因此，基板具有很好的透光性，当LED晶片固定并封装后，可以实现全角度出光。<b/>

Description

一种LED光源模块及其生产工艺
技术领域：
本发明涉及LED技术领域，特指一种LED光源模块及其生产工艺。
背景技术：
现有LED普遍是在铝基板或铝支架上固定LED晶片，LED晶片通过金属线与设置铝基板或铝支架上的铜电极连接，再用环氧树脂等材料进行封装制得。由于铝基板、铝支架都是无法透光的，因此，这些LED光源都只能从单面出光，无法实现全角度出光。
发明内容：
本发明的目的在于克服现有产品的不足之处，提供一种可全角度出光的LED光源模块。
本发明实现其目的采用的技术方案是：一种LED光源模块，包括基板、LED晶片以及封装料体，所述基板由与封装料体材质相同的透光材料成型，若干LED晶片固晶于所述基板上并通过金属线连接形成LED电路，且基板上还固定有两个与LED电路连接的电极片，所述封装料体将所述基板、LED晶片、金属线及部分电极片完全封装，部分电极片外露于封装料体。
上述LED光源模块中，所述基板表面附有印刷电路，所述LED晶片通过金属线与基板表面的印刷电路连接，所述电极片也与印刷电路连接。
于所述基板中还掺杂有荧光粉。
于所述基板上还成型有凹凸面。
本发明还提供上述LED光源模块的生产工艺，其包括如下步骤：
a.以封装用的透光材料成型制作出基板；
b.将若干LED晶片固定在基板表面，并用金属线将LED晶片连接形成LED电路；
c.在基板上固定与LED电路连接的两电极片；
d.将基板置入模具中，用封装材料进行灌封，灌封过程中保持两电极片的部分外露，固化后脱模即完成。
上述生产工艺中，步骤b可替换为：先在基板上形成印刷电路，然后将若干LED晶片固定在基板表面，用金属线将LED晶片与印刷电路连接形成LED电路。
所述印刷电路是有含ITO或ATO粉末的溶胶经烘烤后形成。
步骤a制作基板过程中还可掺杂荧光粉。
本发明的有益效果主要体现在：其一，直接以封装用的透光材料来成型制作基板，因此，基板具有很好的透光性，当LED晶片固定并封装后，可以实现全角度出光；其二，基板采用模具成型工艺制作，容易实现表面凹凸处理，使LED光源模块出光均匀；其三，LED晶片的固晶位置、密度以及LED光源模块的尺寸、规格以及造型可灵活控制，能获得需要的发光效果，满足大众化需求；其四，肉眼看LED光源如悬浮在封装料体中，产品的视觉效果极佳。
附图说明：
图1是本发明一种实施例LED光源模块的剖面示意图；
图2是本发明另一种实施例LED光源模块的俯视图；
图3是本发明第三种实施例的结构示意图。
具体实施方式：
下面结合具体实施例和附图对本发明进一步说明。
如图1、图2、图3所示，本发明所述的LED光源模块包括基板1、LED晶片2以及封装料体3，所述基板1由与封装料体3材质相同的透光材料成型，若干LED晶片2固晶于所述基板1上并通过金属线4连接形成LED电路，且基板1上还固定有两个与LED电路连接的电极片5，所述封装料体3将所述基板1、LED晶片2、金属线4及部分电极片5完全封装，部分电极片5外露于封装料体3。
封装用的透光材料例如可以是环氧树脂、橡胶、塑料等材料，这些材料中可以通过掺杂荧光粉来改变基板1颜色，从而改变出光颜色。基板1采用模具成型的方式制作，在其固晶的表面，可以成型出规则或不规则的锥状或者球状或其他形状的凹凸面10，以便破坏其全反射，使出光更为均匀。
上述LED光源模块中，所述基板1表面附有印刷电路6，所述LED晶片2通过金属线4与基板1表面的印刷电路6连接，所述电极片5也与印刷电路连接6。
于所述基板1中还掺杂有荧光粉11。荧光粉11颜色可根据需要选择，以制作出各种颜色的LED光源模块。
本发明LED光源模块采用以下生产工艺制作：
a.以封装用的透光材料用模具成型制作出基板；
b.将若干LED晶片固定在基板表面，并用金属线将LED晶片连接形成LED电路；
c.在基板上固定与LED电路连接的电极片；
d.将基板置入模具中，用封装材料进行灌封，灌封过程中保持电极片的部分外露，固化后脱模即完成。
上述生产工艺中，步骤b可替换为：先在基板上形成印刷电路，然后将若干LED晶片固定在基板表面，用金属线将LED晶片与印刷电路连接形成LED电路。
所述印刷电路是有含ITO(纳米铟锡金属氧化物)、ATO(氧化锡锑)粉末的溶胶经烘烤后形成。因为纳米铟锡金属氧化物和氧化锡锑所成型的导电膜具有很好的透明性，因此透光性好，不影响基板的透光性；采用印刷电路来实现LED晶片之间以及电极片的连接，便于根据需要形成各种连接关系的LED电路。
步骤a制作基板过程中还可掺杂荧光粉，以制作不同颜色的基板。
综上所述，本发明的有益效果主要体现在：其一，直接以封装用的透光材料来成型制作基板，因此，基板具有很好的透光性，当LED晶片固定并封装后，可以实现全角度出光；其二，基板采用模具成型工艺制作，容易实现表面凹凸处理，使LED光源模块出光均匀；其三，LED晶片的固晶位置、密度以及LED光源模块的尺寸、规格以及造型可灵活控制，能获得需要的发光效果，满足大众化需求；其四，肉眼看LED光源如悬浮在封装料体中，产品的视觉效果极佳。

Claims (8)

1. 一种LED光源模块，包括基板、LED晶片以及封装料体，其特征在于：所述基板由与封装料体材质相同的透光材料成型，若干LED晶片固晶于所述基板上并通过金属线连接形成LED电路，且基板上还固定有两个与LED电路连接的电极片，所述封装料体将所述基板、LED晶片、金属线及部分电极片完全封装，部分电极片外露于封装料体。
2.根据权利要求1所述的LED光源模块，其特征在于：所述基板表面附有印刷电路，所述LED晶片通过金属线与基板表面的印刷电路连接，所述电极片也与印刷电路连接。
3.根据权利要求1所述的LED光源模块，其特征在于：于所述基板中还掺杂有荧光粉。
4.根据权利要求1所述的LED光源模块，其特征在于：于所述基板上还成型有凹凸面。
5.一种LED光源模块的生产工艺，其特征在于：该生产工艺包含如下步骤：
以封装用的透光材料成型制作出基板；
将若干LED晶片固定在基板表面，并用金属线将LED晶片连接形成LED电路；
在基板上固定与LED电路连接的两电极片；
将基板置入模具中，用封装材料进行灌封，灌封过程中保持两电极片的部分外露，固化后脱模即完成。
6.根据权利要求5所述的LED光源模块的生产工艺，其特征在于：步骤b替换为：先在基板上形成印刷电路，然后将若干LED晶片固定在基板表面，用金属线将LED晶片与印刷电路连接形成LED电路。
7.根据权利要求6所述的LED光源模块的生产工艺，其特征在于：所述印刷电路是有含ITO或者ATO粉末的溶胶经烘烤后形成。
8.根据权利要求5所述的LED光源模块的生产工艺，其特征在于：步骤a制作基板过程中掺杂荧光粉。
CN201310594067.8A 2013-11-21 2013-11-21 一种led光源模块及其生产工艺 Pending CN103633224A (zh)

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
CN105098047A (zh) * 2014-05-08 2015-11-25 罗冠傑 片式白光发光二极管及其制备方法以及封装胶材
CN105322072A (zh) * 2014-07-30 2016-02-10 高玉宇 萤光复合树脂基板白光发光二级管装置及其制造方法
CN107507900A (zh) * 2017-10-03 2017-12-22 浙江中宙光电股份有限公司 一种注塑封装的led灯珠及其制作方法

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CN102563557A (zh) * 2010-12-30 2012-07-11 欧司朗股份有限公司 用于灯条的封装方法
CN102913787A (zh) * 2012-09-26 2013-02-06 厦门华联电子有限公司 一种新型的led光源及采用此光源制造的灯泡

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CN102339927A (zh) * 2010-07-27 2012-02-01 展晶科技(深圳)有限公司 发光二极管
CN102563557A (zh) * 2010-12-30 2012-07-11 欧司朗股份有限公司 用于灯条的封装方法
CN102913787A (zh) * 2012-09-26 2013-02-06 厦门华联电子有限公司 一种新型的led光源及采用此光源制造的灯泡

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105098047A (zh) * 2014-05-08 2015-11-25 罗冠傑 片式白光发光二极管及其制备方法以及封装胶材
CN105895788A (zh) * 2014-05-08 2016-08-24 罗冠杰 片式白光发光二极管、制备片式白光发光二极管的方法及封装胶材
CN105322072A (zh) * 2014-07-30 2016-02-10 高玉宇 萤光复合树脂基板白光发光二级管装置及其制造方法
CN105322072B (zh) * 2014-07-30 2019-08-06 盛汉有限公司 萤光复合树脂基板白光发光二级管装置及其制造方法
CN107507900A (zh) * 2017-10-03 2017-12-22 浙江中宙光电股份有限公司 一种注塑封装的led灯珠及其制作方法

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