CN103620877A - 电连接构造 - Google Patents
电连接构造 Download PDFInfo
- Publication number
- CN103620877A CN103620877A CN201280032136.XA CN201280032136A CN103620877A CN 103620877 A CN103620877 A CN 103620877A CN 201280032136 A CN201280032136 A CN 201280032136A CN 103620877 A CN103620877 A CN 103620877A
- Authority
- CN
- China
- Prior art keywords
- substrate
- connector
- conductive
- contact
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 170
- 239000000463 material Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 6
- 238000012856 packing Methods 0.000 claims 5
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 238000013316 zoning Methods 0.000 claims 1
- 238000005192 partition Methods 0.000 abstract description 18
- 238000007747 plating Methods 0.000 description 14
- 239000000945 filler Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 231100000989 no adverse effect Toxicity 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7047—Locking or fixing a connector to a PCB with a fastener through a screw hole in the coupling device
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011144699A JP5845006B2 (ja) | 2011-06-29 | 2011-06-29 | 電気接続構造 |
| JP2011-144699 | 2011-06-29 | ||
| PCT/JP2012/003993 WO2013001745A1 (ja) | 2011-06-29 | 2012-06-19 | 電気接続構造 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103620877A true CN103620877A (zh) | 2014-03-05 |
Family
ID=47423677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280032136.XA Pending CN103620877A (zh) | 2011-06-29 | 2012-06-19 | 电连接构造 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5845006B2 (https=) |
| CN (1) | CN103620877A (https=) |
| WO (1) | WO2013001745A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492751A (zh) * | 2019-09-12 | 2021-03-12 | 庆鼎精密电子(淮安)有限公司 | 连接器及其制作方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014082094A (ja) * | 2012-10-16 | 2014-05-08 | Tyco Electronics Japan Kk | コネクタ |
| JP6208935B2 (ja) * | 2012-10-31 | 2017-10-04 | タイコエレクトロニクスジャパン合同会社 | コネクタ |
| JP6635605B2 (ja) * | 2017-10-11 | 2020-01-29 | 国立研究開発法人理化学研究所 | 電流導入端子並びにそれを備えた圧力保持装置及びx線撮像装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631082U (ja) * | 1992-09-22 | 1994-04-22 | 日本航空電子工業株式会社 | ワイヤボンド接点 |
| CN1253415A (zh) * | 1998-10-30 | 2000-05-17 | 汤姆斯-无线电报总公司 | 叠置在同一外壳内的组件单元 |
| JP2003229649A (ja) * | 2002-02-04 | 2003-08-15 | Yazaki Corp | 配線基板及び基板用コネクタ並びにそれらを有するコネクタユニット |
| JP2003255017A (ja) * | 2002-02-28 | 2003-09-10 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシート |
| CN1574466A (zh) * | 2003-05-21 | 2005-02-02 | 安普泰科电子有限公司 | 电连接结构、连接器及电连接系统 |
| CN101373866A (zh) * | 2007-08-24 | 2009-02-25 | 泰科电子公司 | 带有弹性元件的电连接器 |
-
2011
- 2011-06-29 JP JP2011144699A patent/JP5845006B2/ja not_active Expired - Fee Related
-
2012
- 2012-06-19 CN CN201280032136.XA patent/CN103620877A/zh active Pending
- 2012-06-19 WO PCT/JP2012/003993 patent/WO2013001745A1/ja not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631082U (ja) * | 1992-09-22 | 1994-04-22 | 日本航空電子工業株式会社 | ワイヤボンド接点 |
| CN1253415A (zh) * | 1998-10-30 | 2000-05-17 | 汤姆斯-无线电报总公司 | 叠置在同一外壳内的组件单元 |
| JP2003229649A (ja) * | 2002-02-04 | 2003-08-15 | Yazaki Corp | 配線基板及び基板用コネクタ並びにそれらを有するコネクタユニット |
| JP2003255017A (ja) * | 2002-02-28 | 2003-09-10 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシート |
| CN1574466A (zh) * | 2003-05-21 | 2005-02-02 | 安普泰科电子有限公司 | 电连接结构、连接器及电连接系统 |
| CN101373866A (zh) * | 2007-08-24 | 2009-02-25 | 泰科电子公司 | 带有弹性元件的电连接器 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492751A (zh) * | 2019-09-12 | 2021-03-12 | 庆鼎精密电子(淮安)有限公司 | 连接器及其制作方法 |
| CN112492751B (zh) * | 2019-09-12 | 2021-09-28 | 庆鼎精密电子(淮安)有限公司 | 连接器及其制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013012408A (ja) | 2013-01-17 |
| JP5845006B2 (ja) | 2016-01-20 |
| WO2013001745A1 (ja) | 2013-01-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101533972B (zh) | 压配合式连接器 | |
| WO2007125849A1 (ja) | 基板接合部材ならびにそれを用いた三次元接続構造体 | |
| CN103378042A (zh) | 半导体封装模块 | |
| KR101434039B1 (ko) | 전력 반도체 모듈 및 전력 반도체 제조 방법 | |
| CN103620877A (zh) | 电连接构造 | |
| CN103687303A (zh) | 功率半导体器件和pcb 的联接组件及其制造方法 | |
| CN104112720B (zh) | 功率半导体组件和模块 | |
| JP2005045237A (ja) | 等級分け可能な構造技術によるパワー半導体モジュール | |
| CN104769781A (zh) | 连接器 | |
| CN100420096C (zh) | 电连接结构、连接器及电连接系统 | |
| CN102595293A (zh) | 一种mems麦克风及其封装方法 | |
| JP2002009217A (ja) | 樹脂封止型半導体装置 | |
| CN104704680A (zh) | 连接器 | |
| CN107622954B (zh) | 功率型半导体器件封装方法及封装结构 | |
| CN105185749A (zh) | 一种用于平行缝焊的双面封装外壳 | |
| CN203205400U (zh) | 一种表面贴装用气密性金属外壳 | |
| CN205692826U (zh) | 芯片封装用垂直过渡连接器、基板结构 | |
| CN103280424A (zh) | 一种高集成度功率厚膜混合集成电路的集成方法 | |
| CN107275295A (zh) | 一种功率集成器件、封装方法及电源装置 | |
| CN208581397U (zh) | 电路板和充电桩 | |
| CN107785478A (zh) | 传感器芯片连接机构、传感器及其总成 | |
| CN110446369A (zh) | 键合结构、键合方法及包含该键合结构的封装盒体 | |
| US20210013148A1 (en) | Busbar, method for manufacturing the same and power module comprising the same | |
| CN101834144B (zh) | 功率模块绝缘方法及功率模块组件 | |
| CN105848415B (zh) | 侧边具有表面黏着型接脚的电路模块以及电路板与系统 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |