CN103617982A - Plastic package lead frame with pits - Google Patents
Plastic package lead frame with pits Download PDFInfo
- Publication number
- CN103617982A CN103617982A CN201310550084.1A CN201310550084A CN103617982A CN 103617982 A CN103617982 A CN 103617982A CN 201310550084 A CN201310550084 A CN 201310550084A CN 103617982 A CN103617982 A CN 103617982A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- pits
- lead
- plastic package
- pit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a plastic package lead frame with pits. The plastic package lead frame is composed of multiple lead frame units in a single-row mode. All the lead frame units are mutually connected through connection ribs. Each lead frame unit comprises a base body and a lead pin, wherein the joint of the base body and the lead pin is bent, the base body is provided with a cooling fin and a piece sticking area, the piece sticking area is provided with 200-250 pits which are evenly distributed, and the thickness of the cooling pin is 0.4mm. Positioning holes are formed between the lead frame units. The cooling fins of the lead frames are designed to be thickened, the heat dissipation effect is better, and therefore the lead frame can be applied to high-temperature electric equipment which works for a long time with high power. Design of the pits of the piece sticking areas can enhance the welding strength of a chip.
Description
Technical field
The present invention relates to a kind of plastic packaging lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of plastic packaging lead frame with pit.
In order to solve the problems of the technologies described above, the invention provides a kind of plastic packaging lead frame with pit, by a plurality of lead frames unit single composition, between each lead frame unit, by dowel, interconnect, described lead frame unit comprises matrix and terminal pin, bend in matrix and terminal pin junction, described matrix is provided with fin and bonding die district.
As a further improvement on the present invention, described bonding die district is provided with 200-250 equally distributed pit.
As a further improvement on the present invention, described fin thickness is 0.4mm.
As a further improvement on the present invention, between described lead frame unit, be provided with location hole.
Adopt said structure, its beneficial effect is: this lead frame heat sink design thickening, radiating effect is better, makes pit design that lead frame can be applied to work long hours, high power high-temperature electric equipment Zhong， bonding die district can increase the weld strength of chip.
Accompanying drawing explanation
Fig. 1 is the structural representation of plastic packaging lead frame of the present invention.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-fin ，5-bonding die district, 6-pit, 7-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Figure 1, a kind of plastic packaging lead frame with pit, by 1 single composition of a plurality of lead frames unit, between each lead frame unit 1, by dowel, interconnect, the width of lead frame unit 1 is 17 ± 0.02mm, described lead frame unit 1 comprises matrix 2 and terminal pin 3, matrix 2 thickness are 1.2mm, terminal pin 3 thickness are 0.5mm, bend in matrix 2 and terminal pin 3 junctions, make matrix 2 and terminal pin 3 at a distance of 2.5 ± 0.05mm, described matrix 2 is provided with fin 4 and bonding die district 5, described bonding die district 5 is provided with 200-250 equally distributed pit 6, described pit 6 is of a size of 0.1*0.1*0.1mm, described fin 4 thickness are 0.4mm, between described lead frame unit 1, be provided with location hole 7, the diameter of location hole 7 is 2 ± 0.05mm.
This lead frame heat sink design thickening, radiating effect is better, makes pit design that lead frame can be applied to work long hours, high power high-temperature electric equipment Zhong， bonding die district can increase the weld strength of chip.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (4)
1. the plastic packaging lead frame with pit, by a plurality of lead frames unit (1) single composition, between each lead frame unit (1), by dowel, interconnect, it is characterized in that: described lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in matrix (2) and terminal pin (3) junction, described matrix (2) is provided with fin (4) and bonding die district (5).
2. a kind of plastic packaging lead frame with pit according to claim 1, is characterized in that: described bonding die district (5) is provided with 200-250 equally distributed pit (6).
3. a kind of plastic packaging lead frame with pit according to claim 1, is characterized in that: described fin (4) thickness is 0.4mm.
4. a kind of plastic packaging lead frame with pit according to claim 1, is characterized in that: between described lead frame unit (1), be provided with location hole (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310550084.1A CN103617982A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with pits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310550084.1A CN103617982A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with pits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617982A true CN103617982A (en) | 2014-03-05 |
Family
ID=50168686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310550084.1A Pending CN103617982A (en) | 2013-11-08 | 2013-11-08 | Plastic package lead frame with pits |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617982A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2893922Y (en) * | 2006-04-19 | 2007-04-25 | 宁波康强电子股份有限公司 | Improved large-power lead wire frame |
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN203277358U (en) * | 2013-04-16 | 2013-11-06 | 泰州东田电子有限公司 | Leading wire frame for MOS semiconductor device |
| CN203617290U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame with pits |
-
2013
- 2013-11-08 CN CN201310550084.1A patent/CN103617982A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2893922Y (en) * | 2006-04-19 | 2007-04-25 | 宁波康强电子股份有限公司 | Improved large-power lead wire frame |
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN203277358U (en) * | 2013-04-16 | 2013-11-06 | 泰州东田电子有限公司 | Leading wire frame for MOS semiconductor device |
| CN203617290U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame with pits |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203617290U (en) | Lead frame with pits | |
| CN103617983A (en) | Low-power plastic packaged lead frame | |
| CN203850280U (en) | Double-chip plastic-sealed lead frame | |
| CN103633055A (en) | Plastic package lead frame provided with U-shaped grooves | |
| CN103617982A (en) | Plastic package lead frame with pits | |
| CN203850287U (en) | Plastic-sealed lead frame in full packaging manner | |
| CN103617979A (en) | Plastic package lead frame convenient to package | |
| CN103617980A (en) | Plastic package lead frame with sawtooth indentations | |
| CN203589012U (en) | Thickened lead frame | |
| CN203850290U (en) | Plastic-sealed lead frame suitable for high-temperature electrical appliances | |
| CN203850283U (en) | Plastic-sealed lead frame with pressing marks | |
| CN203850289U (en) | Plastic-sealed lead frame for low-power electrical appliances | |
| CN203850286U (en) | Plastic-sealed lead frame suitable for high-temperature environment | |
| CN203617281U (en) | Lead frame convenient for packaging | |
| CN203850279U (en) | Plastic-sealed lead frame suitable for high-power electrical appliances | |
| CN203850276U (en) | A plastic package lead wire framework | |
| CN203617282U (en) | Lead frame applied to low-power electrical appliance | |
| CN103943596A (en) | Fully packaged type lead frame | |
| CN103617986A (en) | Plastic-packaged lead frame capable of performing heat dissipation rapidly | |
| CN203617285U (en) | Lead frame capable of radiating heat quickly | |
| CN204130522U (en) | A kind of lead frame of local silver-plating | |
| CN204045577U (en) | A kind of lead frame for integrated circuit | |
| CN203850274U (en) | A thin plastic packaging lead wire framework | |
| CN216213422U (en) | Novel lead frame | |
| CN203617284U (en) | Lead frame with U-shaped groove |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |