CN103596729B - 用于抛光的结构构件 - Google Patents

用于抛光的结构构件 Download PDF

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Publication number
CN103596729B
CN103596729B CN201280028637.0A CN201280028637A CN103596729B CN 103596729 B CN103596729 B CN 103596729B CN 201280028637 A CN201280028637 A CN 201280028637A CN 103596729 B CN103596729 B CN 103596729B
Authority
CN
China
Prior art keywords
polishing
monomer
adhesive layer
weight
structural elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280028637.0A
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English (en)
Chinese (zh)
Other versions
CN103596729A (zh
Inventor
藤田淳
斋藤裕辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN103596729A publication Critical patent/CN103596729A/zh
Application granted granted Critical
Publication of CN103596729B publication Critical patent/CN103596729B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN201280028637.0A 2011-06-13 2012-06-08 用于抛光的结构构件 Expired - Fee Related CN103596729B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-131587 2011-06-13
JP2011131587A JP5851124B2 (ja) 2011-06-13 2011-06-13 研磨用構造体
PCT/US2012/041535 WO2012173885A2 (en) 2011-06-13 2012-06-08 Structural member for polishing

Publications (2)

Publication Number Publication Date
CN103596729A CN103596729A (zh) 2014-02-19
CN103596729B true CN103596729B (zh) 2017-01-18

Family

ID=47357676

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280028637.0A Expired - Fee Related CN103596729B (zh) 2011-06-13 2012-06-08 用于抛光的结构构件

Country Status (5)

Country Link
JP (1) JP5851124B2 (enExample)
KR (1) KR20140051212A (enExample)
CN (1) CN103596729B (enExample)
TW (1) TW201307504A (enExample)
WO (1) WO2012173885A2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10058970B2 (en) 2014-05-02 2018-08-28 3M Innovative Properties Company Interrupted structured abrasive article and methods of polishing a workpiece
US10543582B2 (en) * 2014-07-07 2020-01-28 Bando Chemical Industries, Ltd. Abrasive film
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
JP6976048B2 (ja) * 2015-11-30 2021-12-01 日東電工株式会社 研磨パッド固定用粘着シート
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112171532A (zh) * 2020-08-26 2021-01-05 南京航空航天大学 一种自由曲面加工用弹性铣抛工具及其制造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1121330A (zh) * 1993-04-19 1996-04-24 美国3M公司 新的含有助磨剂的磨具
CN1249704A (zh) * 1997-03-07 2000-04-05 美国3M公司 用于在玻璃上得到透明表面光洁面的磨料制品
CN1308570A (zh) * 1998-05-01 2001-08-15 美国3M公司 涂敷磨料制品
US6616520B1 (en) * 1998-08-28 2003-09-09 Nitta Corporation Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate
CN1642692A (zh) * 2002-09-11 2005-07-20 皮斯洛奎斯特公司 改进抛光性能和耐久性的抛光垫片载体
US20070054600A1 (en) * 2005-09-08 2007-03-08 Nihon Micro Coating Co., Ltd. Polishing pad, method of producing same and method of polishing
JP2007138015A (ja) * 2005-11-18 2007-06-07 Toyo Ink Mfg Co Ltd 粘着剤及びそれを用いた粘着シート
JP2010150494A (ja) * 2008-11-21 2010-07-08 Sekisui Chem Co Ltd 粘着剤及び研磨布固定用両面粘着テープ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02220838A (ja) * 1989-02-22 1990-09-04 Rodeele Nitta Kk 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布
JP3354744B2 (ja) * 1995-04-25 2002-12-09 ニッタ株式会社 研磨布及びその研磨布の研磨機定盤への脱着方法
JP2000071170A (ja) * 1998-08-28 2000-03-07 Nitta Ind Corp 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法
WO2001045900A1 (en) * 1999-12-23 2001-06-28 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
US7169199B2 (en) * 2002-11-25 2007-01-30 3M Innovative Properties Company Curable emulsions and abrasive articles therefrom
JP4351007B2 (ja) * 2003-09-08 2009-10-28 東洋ゴム工業株式会社 研磨パッド
JP5656379B2 (ja) * 2009-03-03 2015-01-21 日立マクセル株式会社 ダイシング用粘着フィルム、及び半導体素子の製造方法
JP2011044461A (ja) * 2009-08-19 2011-03-03 Nitta Corp レーザーダイシング用粘着テープ
JP2011074308A (ja) * 2009-10-01 2011-04-14 Three M Innovative Properties Co 透明粘着シート及びそれを含む画像表示装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1121330A (zh) * 1993-04-19 1996-04-24 美国3M公司 新的含有助磨剂的磨具
CN1249704A (zh) * 1997-03-07 2000-04-05 美国3M公司 用于在玻璃上得到透明表面光洁面的磨料制品
CN1308570A (zh) * 1998-05-01 2001-08-15 美国3M公司 涂敷磨料制品
US6616520B1 (en) * 1998-08-28 2003-09-09 Nitta Corporation Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate
CN1642692A (zh) * 2002-09-11 2005-07-20 皮斯洛奎斯特公司 改进抛光性能和耐久性的抛光垫片载体
US20070054600A1 (en) * 2005-09-08 2007-03-08 Nihon Micro Coating Co., Ltd. Polishing pad, method of producing same and method of polishing
JP2007138015A (ja) * 2005-11-18 2007-06-07 Toyo Ink Mfg Co Ltd 粘着剤及びそれを用いた粘着シート
JP2010150494A (ja) * 2008-11-21 2010-07-08 Sekisui Chem Co Ltd 粘着剤及び研磨布固定用両面粘着テープ

Also Published As

Publication number Publication date
TW201307504A (zh) 2013-02-16
JP5851124B2 (ja) 2016-02-03
WO2012173885A2 (en) 2012-12-20
JP2013000809A (ja) 2013-01-07
KR20140051212A (ko) 2014-04-30
CN103596729A (zh) 2014-02-19
WO2012173885A3 (en) 2013-05-02

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Granted publication date: 20170118

Termination date: 20180608