CN103582306B - 印刷电路板的制造方法 - Google Patents

印刷电路板的制造方法 Download PDF

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Publication number
CN103582306B
CN103582306B CN201310007239.7A CN201310007239A CN103582306B CN 103582306 B CN103582306 B CN 103582306B CN 201310007239 A CN201310007239 A CN 201310007239A CN 103582306 B CN103582306 B CN 103582306B
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CN
China
Prior art keywords
double
piece
copper foil
button
dry film
Prior art date
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Active
Application number
CN201310007239.7A
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English (en)
Chinese (zh)
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CN103582306A (zh
Inventor
李宜洙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Si Is Simon Rex Co Ltd Not
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Si Is Simon Rex Co Ltd Not
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Publication date
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Publication of CN103582306A publication Critical patent/CN103582306A/zh
Application granted granted Critical
Publication of CN103582306B publication Critical patent/CN103582306B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN201310007239.7A 2012-08-06 2013-01-09 印刷电路板的制造方法 Active CN103582306B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120085597A KR101201948B1 (ko) 2012-08-06 2012-08-06 인쇄회로기판 제조방법
KR10-2012-0085597 2012-08-06

Publications (2)

Publication Number Publication Date
CN103582306A CN103582306A (zh) 2014-02-12
CN103582306B true CN103582306B (zh) 2016-08-10

Family

ID=47564790

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310007239.7A Active CN103582306B (zh) 2012-08-06 2013-01-09 印刷电路板的制造方法

Country Status (2)

Country Link
KR (1) KR101201948B1 (ko)
CN (1) CN103582306B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105714277B (zh) * 2014-12-03 2019-08-30 珠海方正科技多层电路板有限公司 干膜、电器元件的镀金属方法和电路板的线路制作方法
CN106211600B (zh) * 2016-07-28 2019-03-05 陈国富 可节省铜蚀刻面积的led印刷线路板的制作方法
CN114286526B (zh) * 2021-12-02 2023-08-25 宜兴硅谷电子科技有限公司 一种印制线路板的减铜工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1798484A (zh) * 2004-12-27 2006-07-05 淳华科技(昆山)有限公司 挠性多层印刷线路板导通孔选择性镀铜的工艺方法
CN100482046C (zh) * 2004-10-04 2009-04-22 株式会社丸和制作所 印刷线路板的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4099501B2 (ja) 2004-10-04 2008-06-11 株式会社丸和製作所 プリント基板の製造方法
KR100797719B1 (ko) * 2006-05-10 2008-01-23 삼성전기주식회사 빌드업 인쇄회로기판의 제조공정
KR20120007909A (ko) * 2010-07-15 2012-01-25 주식회사 에스아이 플렉스 프린트기판의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100482046C (zh) * 2004-10-04 2009-04-22 株式会社丸和制作所 印刷线路板的制造方法
CN1798484A (zh) * 2004-12-27 2006-07-05 淳华科技(昆山)有限公司 挠性多层印刷线路板导通孔选择性镀铜的工艺方法

Also Published As

Publication number Publication date
KR101201948B1 (ko) 2012-11-16
CN103582306A (zh) 2014-02-12

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