CN103578949A - 栅极多晶硅和多晶硅电阻集成制作方法 - Google Patents
栅极多晶硅和多晶硅电阻集成制作方法 Download PDFInfo
- Publication number
- CN103578949A CN103578949A CN201210268972.XA CN201210268972A CN103578949A CN 103578949 A CN103578949 A CN 103578949A CN 201210268972 A CN201210268972 A CN 201210268972A CN 103578949 A CN103578949 A CN 103578949A
- Authority
- CN
- China
- Prior art keywords
- polysilicon
- layer
- grid
- silicon
- polycrystalline silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 162
- 229920005591 polysilicon Polymers 0.000 title claims abstract description 111
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 33
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 claims abstract description 33
- 238000005530 etching Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 12
- 239000010703 silicon Substances 0.000 claims abstract description 12
- 238000002513 implantation Methods 0.000 claims description 24
- 239000000377 silicon dioxide Substances 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000001259 photo etching Methods 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 8
- 238000001039 wet etching Methods 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- 230000012010 growth Effects 0.000 claims description 7
- 230000004224 protection Effects 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- 238000002955 isolation Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 abstract description 5
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 3
- 238000005468 ion implantation Methods 0.000 abstract 2
- 230000000717 retained effect Effects 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 1
- 230000034655 secondary growth Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02697—Forming conducting materials on a substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210268972.XA CN103578949B (zh) | 2012-07-30 | 2012-07-30 | 栅极多晶硅和多晶硅电阻集成制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210268972.XA CN103578949B (zh) | 2012-07-30 | 2012-07-30 | 栅极多晶硅和多晶硅电阻集成制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103578949A true CN103578949A (zh) | 2014-02-12 |
CN103578949B CN103578949B (zh) | 2016-11-02 |
Family
ID=50050473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210268972.XA Active CN103578949B (zh) | 2012-07-30 | 2012-07-30 | 栅极多晶硅和多晶硅电阻集成制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103578949B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107731674A (zh) * | 2017-08-23 | 2018-02-23 | 长江存储科技有限责任公司 | 一种金属硅化钨栅极制程中多晶硅电阻制作方法及多晶硅电阻 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6313516B1 (en) * | 1999-06-14 | 2001-11-06 | Taiwan Semiconductor Manufacturing Company | Method for making high-sheet-resistance polysilicon resistors for integrated circuits |
KR20050002034A (ko) * | 2003-06-30 | 2005-01-07 | 주식회사 하이닉스반도체 | 고집적 모스펫 소자의 제조방법 |
CN1901164A (zh) * | 2005-07-22 | 2007-01-24 | 三洋电机株式会社 | 半导体装置的制造方法 |
CN102087998A (zh) * | 2009-12-04 | 2011-06-08 | 无锡华润上华半导体有限公司 | 双多晶结构器件及其制造方法 |
JP2011204997A (ja) * | 2010-03-26 | 2011-10-13 | Asahi Kasei Electronics Co Ltd | 半導体装置の製造方法及び半導体装置 |
-
2012
- 2012-07-30 CN CN201210268972.XA patent/CN103578949B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6313516B1 (en) * | 1999-06-14 | 2001-11-06 | Taiwan Semiconductor Manufacturing Company | Method for making high-sheet-resistance polysilicon resistors for integrated circuits |
KR20050002034A (ko) * | 2003-06-30 | 2005-01-07 | 주식회사 하이닉스반도체 | 고집적 모스펫 소자의 제조방법 |
CN1901164A (zh) * | 2005-07-22 | 2007-01-24 | 三洋电机株式会社 | 半导体装置的制造方法 |
CN102087998A (zh) * | 2009-12-04 | 2011-06-08 | 无锡华润上华半导体有限公司 | 双多晶结构器件及其制造方法 |
JP2011204997A (ja) * | 2010-03-26 | 2011-10-13 | Asahi Kasei Electronics Co Ltd | 半導体装置の製造方法及び半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107731674A (zh) * | 2017-08-23 | 2018-02-23 | 长江存储科技有限责任公司 | 一种金属硅化钨栅极制程中多晶硅电阻制作方法及多晶硅电阻 |
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Publication number | Publication date |
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CN103578949B (zh) | 2016-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140114 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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TA01 | Transfer of patent application right |
Effective date of registration: 20140114 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |