CN103547548A - 高介电常数复合材料和制造方法 - Google Patents
高介电常数复合材料和制造方法 Download PDFInfo
- Publication number
- CN103547548A CN103547548A CN201280024626.5A CN201280024626A CN103547548A CN 103547548 A CN103547548 A CN 103547548A CN 201280024626 A CN201280024626 A CN 201280024626A CN 103547548 A CN103547548 A CN 103547548A
- Authority
- CN
- China
- Prior art keywords
- composite material
- distribution
- diameter
- dielectric constant
- ceramic particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/6303—Inorganic additives
- C04B35/6316—Binders based on silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
- H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/362—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith for broadside radiating helical antennas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/02—Ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
- C04B2235/483—Si-containing organic compounds, e.g. silicone resins, (poly)silanes, (poly)siloxanes or (poly)silazanes
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5427—Particle size related information expressed by the size of the particles or aggregates thereof millimeter or submillimeter sized, i.e. larger than 0,1 mm
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5454—Particle size related information expressed by the size of the particles or aggregates thereof nanometer sized, i.e. below 100 nm
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5463—Particle size distributions
- C04B2235/5472—Bimodal, multi-modal or multi-fraction
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49227—Insulator making
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Structural Engineering (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Composite Materials (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Insulating Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161466604P | 2011-03-23 | 2011-03-23 | |
| US61/466,604 | 2011-03-23 | ||
| PCT/US2012/030379 WO2012145122A1 (en) | 2011-03-23 | 2012-03-23 | High dielectric constant composite materials and methods of manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103547548A true CN103547548A (zh) | 2014-01-29 |
Family
ID=46877826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280024626.5A Pending CN103547548A (zh) | 2011-03-23 | 2012-03-23 | 高介电常数复合材料和制造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8889776B2 (https=) |
| EP (1) | EP2694454A4 (https=) |
| JP (1) | JP6158784B2 (https=) |
| KR (1) | KR20140019808A (https=) |
| CN (1) | CN103547548A (https=) |
| CA (1) | CA2830269A1 (https=) |
| WO (1) | WO2012145122A1 (https=) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104985896A (zh) * | 2015-06-26 | 2015-10-21 | 广东工业大学 | 高介电常数的陶瓷-聚合物复合材料及其制备方法 |
| CN107428620A (zh) * | 2015-03-27 | 2017-12-01 | 株式会社村田制作所 | 电介质材料的制造方法 |
| CN108546415A (zh) * | 2018-04-03 | 2018-09-18 | 西南科技大学 | 一种高储能密度聚合物复合电介质材料的制备方法 |
| CN111149228A (zh) * | 2017-09-29 | 2020-05-12 | 皇家飞利浦有限公司 | 致动器构件以及用于形成该致动器构件的方法 |
| CN111342184A (zh) * | 2020-02-24 | 2020-06-26 | 西安交通大学 | 一种可调的柔性微波器件及其制备方法 |
| CN112979305A (zh) * | 2019-12-18 | 2021-06-18 | 三星电机株式会社 | 介电陶瓷组合物的制造方法及由其制造的介电陶瓷组合物 |
| CN113645917A (zh) * | 2019-03-29 | 2021-11-12 | 康曼德公司 | 高介电常数电外科电极涂层 |
| CN115206683A (zh) * | 2022-07-27 | 2022-10-18 | 北京八度阳光科技有限公司 | 一种电子线路板用电容复合隔膜制作方法 |
| CN121410308A (zh) * | 2025-12-30 | 2026-01-27 | 安盈半导体技术(常州)有限公司 | 一种阻抗自适应高频探针、探针卡及测试方法 |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8441965B2 (en) * | 2010-08-05 | 2013-05-14 | Apple Inc. | Methods and apparatus for reducing data transmission overhead |
| CN103547548A (zh) | 2011-03-23 | 2014-01-29 | 密苏里大学学监 | 高介电常数复合材料和制造方法 |
| US8912460B2 (en) * | 2011-05-23 | 2014-12-16 | The Curators Of The University Of Missouri | Dielectric loaded fluids for high voltage switching |
| CA2843415C (en) | 2011-07-29 | 2019-12-31 | University Of Saskatchewan | Polymer-based resonator antennas |
| JP5970288B2 (ja) * | 2012-08-09 | 2016-08-17 | 株式会社豊田中央研究所 | 酸化物誘電体材料/ポリマー複合膜の製造方法 |
| WO2014117259A1 (en) | 2013-01-31 | 2014-08-07 | Tayfeh Aligodarz Mohammadreza | Meta-material resonator antennas |
| DE102013104621A1 (de) * | 2013-05-06 | 2014-11-06 | Epcos Ag | Elektronisches Bauelement und Verfahren zu dessen Passivierung |
| WO2015000057A1 (en) * | 2013-07-03 | 2015-01-08 | University Of Saskatchewan | Composite materials for dielectric-based microwave applications |
| US10784583B2 (en) | 2013-12-20 | 2020-09-22 | University Of Saskatchewan | Dielectric resonator antenna arrays |
| US9224412B2 (en) * | 2014-01-31 | 2015-12-29 | HGST Netherlands B.V. | Perpendicular magnetic recording disk with template layer formed of a blend of nanoparticles |
| WO2016089387A1 (en) * | 2014-12-03 | 2016-06-09 | Halliburton Energy Services, Inc. | Smart fracturing fluid |
| CA2982556C (en) * | 2015-05-14 | 2021-03-02 | Paul F. Rodney | Downhole fluids with high dielectric constant and high dielectric strength |
| MY189875A (en) * | 2015-05-14 | 2022-03-16 | Halliburton Energy Services Inc | Downhole fluids with a particular impedance |
| US10476164B2 (en) | 2015-10-28 | 2019-11-12 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| US10355361B2 (en) | 2015-10-28 | 2019-07-16 | Rogers Corporation | Dielectric resonator antenna and method of making the same |
| US10601137B2 (en) | 2015-10-28 | 2020-03-24 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| US10374315B2 (en) | 2015-10-28 | 2019-08-06 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| US11367959B2 (en) | 2015-10-28 | 2022-06-21 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| CN105529121B (zh) * | 2015-12-02 | 2017-03-22 | 泰州钰明新材料有限公司 | 柔性复合绝缘材料生产工艺流程 |
| US11431100B2 (en) * | 2016-03-25 | 2022-08-30 | Commscope Technologies Llc | Antennas having lenses formed of lightweight dielectric materials and related dielectric materials |
| US11283186B2 (en) * | 2016-03-25 | 2022-03-22 | Commscope Technologies Llc | Antennas having lenses formed of lightweight dielectric materials and related dielectric materials |
| US11283189B2 (en) | 2017-05-02 | 2022-03-22 | Rogers Corporation | Connected dielectric resonator antenna array and method of making the same |
| US11876295B2 (en) | 2017-05-02 | 2024-01-16 | Rogers Corporation | Electromagnetic reflector for use in a dielectric resonator antenna system |
| GB2575946B (en) | 2017-06-07 | 2022-12-14 | Rogers Corp | Dielectric resonator antenna system |
| WO2019055134A1 (en) | 2017-09-15 | 2019-03-21 | Commscope Technologies Llc | METHODS FOR PREPARING COMPOSITE DIELECTRIC MATERIAL |
| KR102469185B1 (ko) * | 2017-10-27 | 2022-11-18 | 삼성전자주식회사 | 세라믹 전자 부품 및 그 제조 방법과 전자장치 |
| US10892544B2 (en) | 2018-01-15 | 2021-01-12 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US10910722B2 (en) | 2018-01-15 | 2021-02-02 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US11616302B2 (en) | 2018-01-15 | 2023-03-28 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US11198263B2 (en) | 2018-03-22 | 2021-12-14 | Rogers Corporation | Melt processable thermoplastic composite comprising a multimodal dielectric filler |
| US12163005B2 (en) * | 2018-04-27 | 2024-12-10 | The Hong Kong Polytechnic University | Multilayer and flexible capacitors with metal-ion doped TIO2 colossal permittivity material/polymer composites |
| US11844881B2 (en) | 2018-05-17 | 2023-12-19 | The Curators Of The University Of Missouri | Composite material with high dielectric constant and use in biocompatible devices |
| US11552390B2 (en) | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
| CN109233263A (zh) * | 2018-10-15 | 2019-01-18 | 上海安费诺永亿通讯电子有限公司 | 陶瓷树脂复合材料及制备方法及提纯陶瓷粉体的方法 |
| US11031697B2 (en) | 2018-11-29 | 2021-06-08 | Rogers Corporation | Electromagnetic device |
| US11637377B2 (en) | 2018-12-04 | 2023-04-25 | Rogers Corporation | Dielectric electromagnetic structure and method of making the same |
| US11404976B2 (en) * | 2019-09-06 | 2022-08-02 | Wisconsin Alumni Research Foundation | Dielectric nano-fluid for electrostatic machines and actuators |
| WO2021060764A1 (ko) * | 2019-09-23 | 2021-04-01 | 주식회사 아모그린텍 | Rf 방열플라스틱 및 이를 포함하여 구현된 중계기 함체 |
| CN114787101B (zh) * | 2019-12-13 | 2024-04-09 | 奥卢大学 | 电陶瓷复合材料及其制造方法 |
| US11482790B2 (en) | 2020-04-08 | 2022-10-25 | Rogers Corporation | Dielectric lens and electromagnetic device with same |
| EP3926841A1 (en) | 2020-06-15 | 2021-12-22 | Nokia Technologies Oy | Tuning radio frequency elements |
| CN114070235A (zh) | 2020-08-06 | 2022-02-18 | 联华电子股份有限公司 | 半导体模块及其制造方法 |
| FI129896B (en) * | 2021-09-01 | 2022-10-31 | Oulun Yliopisto | Impregnation of ceramic composite material |
| JP2023087747A (ja) * | 2021-12-14 | 2023-06-26 | 国立研究開発法人物質・材料研究機構 | キャパシタ型蓄電デバイス |
| DE202021106863U1 (de) | 2021-12-16 | 2022-03-10 | Maheswar Panda | Ein System zur Entwicklung verbesserter ferroelektrischer Polymer-Dielektrika aus PVDF-Metall/PVDF-Keramik-Kompositen/Nanokompositen |
| CN117521421B (zh) * | 2024-01-04 | 2024-04-23 | 广东大湾区空天信息研究院 | 介电复合材料设计方法、装置、设备、计算系统及介质 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1693363A (zh) * | 2005-05-27 | 2005-11-09 | 东南大学 | 纳米钛酸钡/聚氨酯弹性体复合材料的合成方法 |
| CN1763134A (zh) * | 2005-10-24 | 2006-04-26 | 浙江大学 | 一种高介电常数聚酰亚胺/陶瓷复合膜及制备方法 |
| CN1908063A (zh) * | 2005-08-01 | 2007-02-07 | 财团法人工业技术研究院 | 具挠曲性、高耐热性的高介电有机/无机混成材料组成物及其硬化物 |
| US20070145453A1 (en) * | 2005-12-23 | 2007-06-28 | Xerox Corporation | Dielectric layer for electronic devices |
| US20090014333A1 (en) * | 2007-07-09 | 2009-01-15 | The Curators Of The University Of Missouri | Agarose nano-platinum composite |
| CN101472840A (zh) * | 2006-05-12 | 2009-07-01 | 电气化学工业株式会社 | 陶瓷粉末及其用途 |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388198A (en) * | 1977-01-13 | 1978-08-03 | Toshiba Corp | Complex dielectric for capacitor |
| US5320910A (en) * | 1991-12-09 | 1994-06-14 | Ngk Spark Plug Co., Ltd. | Piezoelectric composite material |
| JPH0660719A (ja) * | 1992-08-04 | 1994-03-04 | Murata Mfg Co Ltd | 複合誘電体 |
| EP0722920B9 (en) * | 1994-08-09 | 2002-06-12 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Composite material and production method therefor |
| US5702629A (en) | 1996-03-21 | 1997-12-30 | Alliedsignal Inc. | Piezeoelectric ceramic-polymer composites |
| US6268054B1 (en) * | 1997-02-18 | 2001-07-31 | Cabot Corporation | Dispersible, metal oxide-coated, barium titanate materials |
| US6891138B2 (en) | 1997-04-04 | 2005-05-10 | Robert C. Dalton | Electromagnetic susceptors with coatings for artificial dielectric systems and devices |
| US6265058B1 (en) | 1998-03-11 | 2001-07-24 | Tpl, Inc. | Polymer/paper capacitor film |
| US20020062924A1 (en) | 1998-05-04 | 2002-05-30 | Hartman William F. | Definable integrated passives for circuitry |
| US6608760B2 (en) | 1998-05-04 | 2003-08-19 | Tpl, Inc. | Dielectric material including particulate filler |
| US20040109298A1 (en) * | 1998-05-04 | 2004-06-10 | Hartman William F. | Dielectric material including particulate filler |
| US6616794B2 (en) | 1998-05-04 | 2003-09-09 | Tpl, Inc. | Integral capacitance for printed circuit board using dielectric nanopowders |
| WO2001089827A1 (en) | 2000-05-18 | 2001-11-29 | Georgia Tech Research Corporation | High dielectric constant nano-structure polymer-ceramic composite |
| AU2001268428A1 (en) | 2000-06-16 | 2002-01-02 | Paratek Microwave, Inc. | Electronically tunable dielectric composite thick films |
| US6864306B2 (en) | 2001-04-30 | 2005-03-08 | Georgia Tech Research Corporation | High dielectric polymer composites and methods of preparation thereof |
| US20030108664A1 (en) * | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
| US6600645B1 (en) | 2002-09-27 | 2003-07-29 | Ut-Battelle, Llc | Dielectric composite materials and method for preparing |
| KR100455890B1 (ko) * | 2002-12-24 | 2004-11-06 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
| JP4334247B2 (ja) * | 2003-03-07 | 2009-09-30 | ビットワレット株式会社 | 携帯端末装置および電子マネーサーバ |
| JP3680854B2 (ja) * | 2003-04-04 | 2005-08-10 | 東レ株式会社 | ペースト組成物およびこれを用いた誘電体組成物 |
| EP1612810A4 (en) * | 2003-04-04 | 2009-12-16 | Toray Industries | PULP COMPOSITION AND DIELECTRIC COMPOSITION CONTAINING SAME |
| TW200427809A (en) * | 2003-05-19 | 2004-12-16 | Hitachi Chemical Co Ltd | Insulating material, film, circuit board and method for manufacture thereof |
| EP1630834A1 (en) | 2003-05-30 | 2006-03-01 | Sanyo Electric Co., Ltd. | Electric double layer capacitor and electrolytic cell |
| KR20050019214A (ko) * | 2003-08-18 | 2005-03-03 | 한국과학기술원 | 내장형 커패시터용 폴리머/세라믹 복합 페이스트 및 이를이용한 커패시터 제조방법 |
| JP4491214B2 (ja) * | 2003-09-29 | 2010-06-30 | 富士通株式会社 | キャパシタ素子 |
| US20060074164A1 (en) | 2003-12-19 | 2006-04-06 | Tpl, Inc. | Structured composite dielectrics |
| US20060074166A1 (en) | 2003-12-19 | 2006-04-06 | Tpl, Inc. Title And Interest In An Application | Moldable high dielectric constant nano-composites |
| JP2006019621A (ja) * | 2004-07-05 | 2006-01-19 | Rikogaku Shinkokai | キャパシタ用ポリマーセラミックコンポジット材料、多層配線板及びモジュール基板 |
| US20060083694A1 (en) | 2004-08-07 | 2006-04-20 | Cabot Corporation | Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same |
| US7400490B2 (en) * | 2005-01-25 | 2008-07-15 | Naturalnano Research, Inc. | Ultracapacitors comprised of mineral microtubules |
| US7579397B2 (en) * | 2005-01-27 | 2009-08-25 | Rensselaer Polytechnic Institute | Nanostructured dielectric composite materials |
| KR100576882B1 (ko) | 2005-02-15 | 2006-05-10 | 삼성전기주식회사 | Tcc 특성이 우수한 커패시터용 수지 조성물 및 폴리머/세라믹 복합체 |
| US20060258327A1 (en) | 2005-05-11 | 2006-11-16 | Baik-Woo Lee | Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materials |
| CN101375644A (zh) | 2005-11-14 | 2009-02-25 | 劳伦斯利弗莫尔国家安全有限公司 | 铸造的电介质复合材料线性加速器 |
| KR100846998B1 (ko) * | 2006-09-19 | 2008-07-17 | 한국화학연구원 | 결정성 바륨티타네이트 나노입자를 함유한 고 유전율의무/유기 하이브리드 막의 제조방법 |
| US20080165472A1 (en) | 2006-12-19 | 2008-07-10 | Liang-Chy Chien | High dielectric composites as capacitive materials |
| US20090043398A1 (en) * | 2007-08-09 | 2009-02-12 | Zimmer, Inc. | Method of producing gradient articles by centrifugation molding or casting |
| JP5401805B2 (ja) * | 2008-02-29 | 2014-01-29 | 富士通株式会社 | 成膜方法 |
| US7989270B2 (en) * | 2009-03-13 | 2011-08-02 | Stats Chippac, Ltd. | Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors |
| US7911029B2 (en) * | 2009-07-11 | 2011-03-22 | Ji Cui | Multilayer electronic devices for imbedded capacitor |
| US8263515B2 (en) | 2009-08-29 | 2012-09-11 | Fatih Dogan | Nanostructured dielectric materials for high energy density multi layer ceramic capacitors |
| CN103547548A (zh) | 2011-03-23 | 2014-01-29 | 密苏里大学学监 | 高介电常数复合材料和制造方法 |
-
2012
- 2012-03-23 CN CN201280024626.5A patent/CN103547548A/zh active Pending
- 2012-03-23 WO PCT/US2012/030379 patent/WO2012145122A1/en not_active Ceased
- 2012-03-23 EP EP12774897.8A patent/EP2694454A4/en not_active Withdrawn
- 2012-03-23 CA CA2830269A patent/CA2830269A1/en not_active Abandoned
- 2012-03-23 US US13/428,950 patent/US8889776B2/en active Active
- 2012-03-23 KR KR1020137027770A patent/KR20140019808A/ko not_active Ceased
- 2012-03-23 JP JP2014501281A patent/JP6158784B2/ja not_active Expired - Fee Related
-
2014
- 2014-10-20 US US14/518,503 patent/US9556321B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1693363A (zh) * | 2005-05-27 | 2005-11-09 | 东南大学 | 纳米钛酸钡/聚氨酯弹性体复合材料的合成方法 |
| CN1908063A (zh) * | 2005-08-01 | 2007-02-07 | 财团法人工业技术研究院 | 具挠曲性、高耐热性的高介电有机/无机混成材料组成物及其硬化物 |
| CN1763134A (zh) * | 2005-10-24 | 2006-04-26 | 浙江大学 | 一种高介电常数聚酰亚胺/陶瓷复合膜及制备方法 |
| US20070145453A1 (en) * | 2005-12-23 | 2007-06-28 | Xerox Corporation | Dielectric layer for electronic devices |
| CN101472840A (zh) * | 2006-05-12 | 2009-07-01 | 电气化学工业株式会社 | 陶瓷粉末及其用途 |
| US20090014333A1 (en) * | 2007-07-09 | 2009-01-15 | The Curators Of The University Of Missouri | Agarose nano-platinum composite |
Non-Patent Citations (3)
| Title |
|---|
| 刘强 等: "《材料物理性能》", 31 July 2009, article "材料物理性能", pages: 175 * |
| 赵静月: "《变压器制造工艺》", 30 April 2009, article "变压器制造工艺", pages: 448 * |
| 陆厚根: "《粉体工程学》", 6 May 1988, article "《粉体工程学》", pages: 26-30 * |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107428620A (zh) * | 2015-03-27 | 2017-12-01 | 株式会社村田制作所 | 电介质材料的制造方法 |
| CN107428620B (zh) * | 2015-03-27 | 2020-09-18 | 株式会社村田制作所 | 电介质材料的制造方法 |
| CN104985896A (zh) * | 2015-06-26 | 2015-10-21 | 广东工业大学 | 高介电常数的陶瓷-聚合物复合材料及其制备方法 |
| CN111149228A (zh) * | 2017-09-29 | 2020-05-12 | 皇家飞利浦有限公司 | 致动器构件以及用于形成该致动器构件的方法 |
| CN108546415A (zh) * | 2018-04-03 | 2018-09-18 | 西南科技大学 | 一种高储能密度聚合物复合电介质材料的制备方法 |
| CN113645917A (zh) * | 2019-03-29 | 2021-11-12 | 康曼德公司 | 高介电常数电外科电极涂层 |
| CN112979305A (zh) * | 2019-12-18 | 2021-06-18 | 三星电机株式会社 | 介电陶瓷组合物的制造方法及由其制造的介电陶瓷组合物 |
| US11618716B2 (en) | 2019-12-18 | 2023-04-04 | Samsung Electro-Mechanics Co., Ltd. | Manufacturing method of dielectric ceramic composition and dielectric ceramic composition manufactured by the same |
| CN112979305B (zh) * | 2019-12-18 | 2023-11-17 | 三星电机株式会社 | 介电陶瓷组合物的制造方法及由其制造的介电陶瓷组合物 |
| CN111342184A (zh) * | 2020-02-24 | 2020-06-26 | 西安交通大学 | 一种可调的柔性微波器件及其制备方法 |
| CN115206683A (zh) * | 2022-07-27 | 2022-10-18 | 北京八度阳光科技有限公司 | 一种电子线路板用电容复合隔膜制作方法 |
| CN115206683B (zh) * | 2022-07-27 | 2024-02-13 | 北京八度阳光科技有限公司 | 一种电子线路板用电容复合隔膜制作方法 |
| CN121410308A (zh) * | 2025-12-30 | 2026-01-27 | 安盈半导体技术(常州)有限公司 | 一种阻抗自适应高频探针、探针卡及测试方法 |
| CN121410308B (zh) * | 2025-12-30 | 2026-03-20 | 安盈半导体技术(常州)有限公司 | 一种阻抗自适应高频探针、探针卡及测试方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140019808A (ko) | 2014-02-17 |
| US20150047190A1 (en) | 2015-02-19 |
| US8889776B2 (en) | 2014-11-18 |
| US9556321B2 (en) | 2017-01-31 |
| JP6158784B2 (ja) | 2017-07-05 |
| WO2012145122A1 (en) | 2012-10-26 |
| EP2694454A1 (en) | 2014-02-12 |
| EP2694454A4 (en) | 2014-10-08 |
| JP2014510416A (ja) | 2014-04-24 |
| US20120245016A1 (en) | 2012-09-27 |
| CA2830269A1 (en) | 2012-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8889776B2 (en) | High dielectric constant composite materials and methods of manufacture | |
| Chiang et al. | Polymer composites with high dielectric constant | |
| Ren et al. | Silver nanoparticle-modified alumina microsphere hybrid composites for enhanced energy density and thermal conductivity | |
| US6616794B2 (en) | Integral capacitance for printed circuit board using dielectric nanopowders | |
| TW487932B (en) | Dielectric composite for integrally included in printed circuit boards and its preparation method | |
| Cao et al. | Obtaining greatly improved dielectric constant in BaTiO3–epoxy composites with low ceramic volume fraction by enhancing the connectivity of ceramic phase | |
| Rajesh et al. | Rutile filled PTFE composites for flexible microwave substrate applications | |
| JP2020532144A (ja) | ポリマーおよびセラミックの冷間焼結材料を含む基板 | |
| Zeng et al. | Structural, dielectric and mechanical behaviors of (La, Nb) Co-doped TiO2/Silicone rubber composites | |
| Xu et al. | Piezoelectric properties of a pioneering 3‐1 type PZT/epoxy composites based on freeze‐casting processing | |
| US20080128961A1 (en) | Moldable high dielectric constant nano-composites | |
| WO2006007248A2 (en) | Structured composite dielectrics | |
| Liu et al. | Preparation of porous lead zirconate titanate piezoelectric ceramics via vat photopolymerization combined with burnt polymer spheres technique | |
| Paredes-Olguin et al. | Electric stress grading on bushings of combined instrument transformers using high permittivity polymeric composites | |
| EP3978440A1 (en) | Impregnatable high-density, brittle material structure | |
| Wu et al. | Effect of surface modification of ferroelectric ceramic component on the properties of PZT-type/epoxy piezoelectric composite with spiral structure | |
| JP5342946B2 (ja) | セラミックス構造体及びその製造方法 | |
| Varlow et al. | Non-linear AC properties of filled resins | |
| Xiaojun et al. | Dependence of dielectric properties on BT particle size in EP/BT composites | |
| US20210407736A1 (en) | Matrix assembly having solid dielectric elements and a tailored bulk dielectric constant and method of manufacturing same | |
| Liu et al. | Fabrication of BaTiO3/epoxy composites exhibiting large dielectric constant, low dielectric loss and high flexural strength | |
| Sun et al. | Development of 2-2 piezoelectric ceramic/polymer composites by direct-write technique | |
| US20060074166A1 (en) | Moldable high dielectric constant nano-composites | |
| CN116583491A (zh) | 用废弃物电瓷制备复合物电瓷 | |
| Ibrhium et al. | Dielectric constant of nano-CCTO/epoxy composite |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140129 |
|
| RJ01 | Rejection of invention patent application after publication |