JPS5388198A - Complex dielectric for capacitor - Google Patents

Complex dielectric for capacitor

Info

Publication number
JPS5388198A
JPS5388198A JP194677A JP194677A JPS5388198A JP S5388198 A JPS5388198 A JP S5388198A JP 194677 A JP194677 A JP 194677A JP 194677 A JP194677 A JP 194677A JP S5388198 A JPS5388198 A JP S5388198A
Authority
JP
Japan
Prior art keywords
capacitor
complex dielectric
dust
dielectric
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP194677A
Other languages
Japanese (ja)
Inventor
Hiroshi Ohira
Masahiro Fukazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP194677A priority Critical patent/JPS5388198A/en
Publication of JPS5388198A publication Critical patent/JPS5388198A/en
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

PURPOSE: To improve the filling coefficient of dust in the resin as well as to raise up dielectric coefficient in complex dielectric substance for capacitor composed of ceramic dielectric dust and resin by using dusts of two or more particle size as ceramic dielectric dust.
COPYRIGHT: (C)1978,JPO&Japio
JP194677A 1977-01-13 1977-01-13 Complex dielectric for capacitor Pending JPS5388198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP194677A JPS5388198A (en) 1977-01-13 1977-01-13 Complex dielectric for capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP194677A JPS5388198A (en) 1977-01-13 1977-01-13 Complex dielectric for capacitor

Publications (1)

Publication Number Publication Date
JPS5388198A true JPS5388198A (en) 1978-08-03

Family

ID=11515769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP194677A Pending JPS5388198A (en) 1977-01-13 1977-01-13 Complex dielectric for capacitor

Country Status (1)

Country Link
JP (1) JPS5388198A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61128412A (en) * 1984-11-26 1986-06-16 株式会社村田製作所 Composite dielectric and manufacture thereof
US7700185B2 (en) 2003-05-19 2010-04-20 Hitachi Chemical Company, Ltd. Insulation material, film, circuit board and method of producing them
JP2014510416A (en) * 2011-03-23 2014-04-24 ザ・キュレーターズ・オブ・ザ・ユニバーシティ・オブ・ミズーリ High dielectric constant composite material and manufacturing method thereof
US9058912B2 (en) 2003-04-04 2015-06-16 Toray Industries, Inc. Paste composition and dielectric composition using the same
JP2018172632A (en) * 2017-03-31 2018-11-08 太陽インキ製造株式会社 Curable composition, dry film, cured material and print circuit board
CN114068066A (en) * 2021-12-23 2022-02-18 西安宏星电子浆料科技股份有限公司 High-weather-resistance encapsulation dielectric paste for thick film circuit
CN114591638A (en) * 2022-03-14 2022-06-07 广东剑鑫科技股份有限公司 UV double-curing circuit board three-proofing paint and preparation method thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61128412A (en) * 1984-11-26 1986-06-16 株式会社村田製作所 Composite dielectric and manufacture thereof
US9058912B2 (en) 2003-04-04 2015-06-16 Toray Industries, Inc. Paste composition and dielectric composition using the same
US7700185B2 (en) 2003-05-19 2010-04-20 Hitachi Chemical Company, Ltd. Insulation material, film, circuit board and method of producing them
JP2014510416A (en) * 2011-03-23 2014-04-24 ザ・キュレーターズ・オブ・ザ・ユニバーシティ・オブ・ミズーリ High dielectric constant composite material and manufacturing method thereof
US9556321B2 (en) 2011-03-23 2017-01-31 The Curators Of The University Of Missouri High dielectric constant composite materials and methods of manufacture
JP2018172632A (en) * 2017-03-31 2018-11-08 太陽インキ製造株式会社 Curable composition, dry film, cured material and print circuit board
TWI778022B (en) * 2017-03-31 2022-09-21 日商太陽油墨製造股份有限公司 Curable composition, dry film, cured product, and printed wiring board
CN114068066A (en) * 2021-12-23 2022-02-18 西安宏星电子浆料科技股份有限公司 High-weather-resistance encapsulation dielectric paste for thick film circuit
CN114068066B (en) * 2021-12-23 2022-04-19 西安宏星电子浆料科技股份有限公司 High-weather-resistance encapsulation dielectric paste for thick film circuit
CN114591638A (en) * 2022-03-14 2022-06-07 广东剑鑫科技股份有限公司 UV double-curing circuit board three-proofing paint and preparation method thereof

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