CN103515338B - 半导体模块 - Google Patents

半导体模块 Download PDF

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CN103515338B
CN103515338B CN201310056639.7A CN201310056639A CN103515338B CN 103515338 B CN103515338 B CN 103515338B CN 201310056639 A CN201310056639 A CN 201310056639A CN 103515338 B CN103515338 B CN 103515338B
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semiconductor module
elastic component
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CN103515338A (zh
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周磊杰
冈部浩之
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Mitsubishi Electric Corp
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Abstract

本发明涉及半导体模块。本发明的目的在于，提供一种能对夹持在半导体模块和散热器之间的导热脂的流出进行抑制的半导体模块。本发明的半导体模块（10）是能装配于散热器（5）的半导体模块（10），其特征在于，具备：壳体（2），收容半导体模块（10）的结构要素；以及弹性构件（1），一端嵌合于壳体（2），另一端抵接于散热器（5），利用弹性构件（1）在壳体（2）和散热器（5）之间设置有用于夹持导热脂的间隙（6）。

Description

半导体模块
技术领域
本发明涉及半导体模块，特别涉及能装配于散热器（heat sink）的半导体模块。
背景技术
关于半导体模块、特别是应对大功率的半导体模块，为了对工作时产生的热进行散热，一般装配于散热器来进行使用。此外，为了将半导体模块的热有效地传至散热器，在半导体模块和散热器之间涂敷有导热脂（grease）（例如，参照专利文献1）。
以往，在半导体模块的底面粘接地配置有弹性构件，利用粘接剂粘接该弹性构件和散热器，由此将半导体模块装配于散热器。
此外，通过在夹持于半导体模块和散热器之间的导热脂周围配置该弹性构件，从而还起到防止导热脂流出的作用。
现有技术文献
专利文献
专利文献1：日本特开2008–4745号公报。
发明要解决的课题
在上述的现有技术中，用粘接剂粘接弹性构件与半导体模块的底面以及散热器。因而，当粘接部分由于半导体模块的发热等的影响而劣化时，导热脂从劣化部位流出，无法妥当地进行半导体模块的散热，存在半导体模块的性能下降的问题。
此外，在粘接部分的劣化进一步加重的情况下，还存在半导体模块从散热器脱落的问题。
特别是在半导体模块的装配角度相对于地面不是水平的情况下容易产生以上的问题。
发明内容
本发明是为了解决以上的课题而完成的，其目的在于提供一种能对夹持在半导体模块和散热器之间的导热脂的流出进行抑制的半导体模块。
用于解决课题的方案
本发明的半导体模块是能装配于散热器的半导体模块，其特征在于，具备：壳体，收容半导体模块的结构要素；以及弹性构件，一端嵌合于壳体，另一端抵接于散热器，利用该弹性构件在壳体和散热器之间设置有用于夹持导热脂的间隙。
发明效果
根据本发明，由于弹性构件嵌合于壳体而被固定，所以在壳体和散热器之间的间隙夹持有导热脂的情况下，能抑制由弹性构件从壳体脱离造成的导热脂的流出。此外，能抑制由弹性构件从壳体脱离造成的半导体模块主体的脱落。因而，能实现半导体模块的长期使用。
附图说明
图1是实施方式1的半导体模块的截面图和底面图。
图2是实施方式2的半导体模块的截面图和底面图。
图3是实施方式3的半导体模块的截面图和底面图。
图4是实施方式4的半导体模块的底面图。
具体实施方式
<实施方式1>
<结构>
在图1（a）、（b）中分别示出本实施方式的半导体模块10的截面图和底面图。如图1（a）所示，将本实施方式的半导体模块10装配于散热器5来进行使用。再有，在半导体模块10和散热器5的间隙6夹持有导热脂。
在本实施方式中，考虑半导体模块10的装配角度相对于地面不是水平的情况，例如，考虑装配角度与地面垂直的情况。在图1（a）、（b）中将x方向设为下方向。
半导体模块10如以下那样构成。在金属基板4上，经由绝缘基板（未图示）配置有例如IGBT（Insulated Gate Bipolar Transister：绝缘栅双极晶体管）、续流二极管等半导体元件3a。在各半导体元件3a的电极和主电极3c之间用例如铝线3b等设置有布线。以上所述的半导体模块10的结构要素被收容于壳体2中。此外，为了密闭壳体2，在壳体2上部装配有盖子3d。
在壳体2的底面配置有弹性构件1。弹性构件1的一端与壳体2的底面嵌合，嵌合部分为H字形状。此外，弹性构件1的另一端抵接于散热器5。
如图1（b）所示，弹性构件1沿着壳体2底面的下方向侧的边和与下方向侧的边相向的边进行配置。特别是沿着壳体2底面的下方向侧的边配置弹性构件1，由此能抑制导热脂由于重力而流出。
再有，弹性构件1例如是橡胶类树脂。此外，散热器5的材质是铝、铜等。此外，为了效率良好地进行散热，也可以在散热器5形成有散热片（fin）。
在将半导体模块10固定于散热器5的情况下，利用粘接剂将弹性构件1的另一端和散热器5粘接来进行固定。或者，也可以对壳体2和散热器5进行螺丝固定，由此将弹性构件1压接于散热器5来进行固定。在该情况下，因为弹性构件1预先被嵌合于壳体2，所以容易进行螺丝固定的操作。
通过经由弹性构件1将壳体2固定于散热器5，从而在半导体模块10和散热器5之间设置有间隙6。为了将由半导体模块10产生的热有效地传至散热器5，在该间隙6夹持有导热脂。在此，导热脂是一般的导热脂，例如是以硅为主要成分的导热脂。
<效果>
本实施方式的半导体模块10是能装配于散热器5的半导体模块10，其特征在于，具备：壳体2，收容半导体模块10的结构要素；以及弹性构件1，一端嵌合于壳体2，另一端抵接于散热器5，利用弹性构件1在壳体2和散热器5之间设置有用于夹持导热脂的间隙6。
因此，由于弹性构件1与壳体2嵌合而被固定，所以在壳体2和散热器5之间的间隙6夹持有导热脂的情况下，能抑制由弹性构件1从壳体2脱离造成的导热脂的流出。此外，能抑制由弹性构件1从壳体2脱离造成的半导体模块10主体的脱落。因而，能实现半导体模块10的长期使用。
此外，本实施方式的半导体模块10所具备的弹性构件1的特征在于，与壳体2嵌合的部分为H字形状。
因此，通过使弹性构件的嵌合部分为H字形状，从而能将弹性构件1可靠地固定于壳体2。进而，通过使嵌合部分为H字形状，从而能较大地获得弹性构件1的与散热器5抵接的部分的面积，在将半导体模块10装配于散热器5时，能更可靠地将弹性构件1与散热器5粘接或压接。因而，能抑制导热脂从壳体2和散热器5之间的间隙6流出。
<实施方式2>
在图2（a）、（b）中分别示出本实施方式的半导体模块10的截面图和底面图。在本实施方式的半导体模块10中，弹性构件1的嵌合部为T字形状。由于其它结构与实施方式1（图1（a）、（b））相同，所以省略说明。再有，在图2（a）、（b）中也与图1（a）、（b）同样地将x方向设为下方向。
<效果>
本实施方式的半导体模块10所具备的弹性构件1的特征在于，与壳体2嵌合的部分为T字形状。
因此，与实施方式1同样地，能抑制导热脂从壳体2与弹性构件1的连接部分流出。此外，能抑制由弹性构件1从壳体2脱离造成的半导体模块10主体从散热器的脱落。
进而，通过使弹性构件1的嵌合部为T字形状，从而与实施方式1比较，能实现弹性构件1的小型化。因而，能削减弹性构件1的材料使用量，因此能减少制造成本。
<实施方式3>
在图3（a）、（b）中分别示出本实施方式的半导体模块10的截面图和底面图。在图3（a）、（b）中，将x方向设为下方向。
如图3（b）所示，在本实施方式的半导体模块10中，仅在壳体2的底面的x方向侧的一边配置有弹性构件1。由于其它结构与实施方式2（图2（a）、（b））相同，所以省略说明。
即使在夹持于半导体模块10和散热器5之间的间隙6的导热脂由于重力而向下方向流动的情况下，只要至少在下方向侧即x方向侧的一边配置弹性构件1，就会对防止导热脂的流出是有效的。此外，能利用弹性构件1将半导体模块10固定于散热器5。
<效果>
本实施方式的半导体模块10所具备的弹性构件1的特征在于，仅配置在壳体2的一边。
因此，只要仅在壳体2的下方向侧的一边配置弹性构件1，就能得到与实施方式2相同的效果并且进一步削减弹性构件1的使用量、实现制造成本的进一步削减。
<实施方式4>
在图4中示出本实施方式的半导体模块10的底面图。截面图与实施方式2（图2（a））相同。如图4所示，本实施方式的半导体模块10所具备的弹性构件1沿着壳体2的底面的周围进行配置。由于除此之外的结构与实施方式2相同，所以省略说明。
<效果>
本实施方式的半导体模块10所具备的弹性构件1的特征在于，沿着壳体2的周围进行配置。
因此，在将半导体模块10装配于散热器5的情况下，夹持在半导体模块10和散热器5之间的间隙6的导热脂被弹性构件1包围，因此本实施方式的半导体模块10能更可靠地防止导热脂的流出。
再有，本发明能在其发明范围内对各实施方式自由地进行组合、或者对各实施方式适当地进行变形、省略。
附图标记的说明：
1 弹性构件、2 壳体、3a 半导体元件、3b 铝线、3c 主电极、3d 盖子、4 金属基板、5 散热器、6 间隙、10 半导体模块。

Claims (4)

1.一种半导体模块，能装配于散热器，其特征在于，具备：
壳体，收容所述半导体模块的结构要素；以及
弹性构件，一端埋入所述壳体的底面，另一端抵接于所述散热器，
利用所述弹性构件在所述壳体和所述散热器之间设置有用于夹持导热脂的间隙，
所述弹性构件仅配置在所述壳体的重力方向侧的一边。
2.根据权利要求1所述的半导体模块，其特征在于，
在所述弹性构件中，所述一端为H字形状。
3.根据权利要求1所述的半导体模块，其特征在于，
在所述弹性构件中，所述一端为T字形状。
4.根据权利要求1～3的任一项所述的半导体模块，其特征在于，
所述弹性构件沿着所述壳体的周围进行配置。
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