CN103511995A - 发光二极管灯条 - Google Patents
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Abstract
一种发光二极管灯条,包括基板以及设置在基板之上的发光二极管晶粒。基板具有第一表面和第二表面,第一表面设置有第一电极和第二电极。发光二极管晶粒设置在基板的第一表面之上且分别与第一电极和第二电极电连接。一封装材料层覆盖发光二极管晶粒。一保护层覆盖第一电极和第二电极。发光二极管灯条还包括第一盖体和第二盖体,其分别覆盖在基板的第一表面和第二表面之上以形成灯条结构。上述保护层可防止水气进入灯条的电路结构之中而影响第一电极和第二电极的导电性能。
Description
技术领域
本发明涉及一种发光二极管灯条。
背景技术
发光二极管(Light Emitting Diode,LED)是一种可将电流转换成特定波长范围的光电半导体元件。发光二极管以其亮度高、工作电压低、功耗小、易与集成电路匹配、驱动简单、寿命长等优点,从而可作为光源而广泛应用于照明领域。
发光二极管灯条通常包括基板以及设置在基板之上的发光二极管晶粒。基板上设置有导电结构,发光二极管晶粒与导电结构相连接。一上盖体和一下盖体覆盖在基板的两相反表面而形成灯条结构。然而,在上述灯条结构中,水气容易进入灯条结构的内部而对基板导电结构的电性能造成影响。
发明内容
有鉴于此,有必要提供密封性能较好的发光二极管灯条。
一种发光二极管灯条,包括:
基板,具有第一表面和第二表面,基板的第一表面设置有第一电极和第二电极;
发光二极管晶粒,设置在基板的第一表面之上且分别与第一电极和第二电极电连接;
封装材料层,覆盖所述发光二极管晶粒;
保护层,覆盖所述第一电极和第二电极;以及
第一盖体和第二盖体,分别覆盖在基板的第一表面和第二表面之上。
在上述发光二极管灯条中,由于第一电极和第二电极暴露在封装材料层之外的部分为保护层所覆盖,因此,即使水气通过基板与第一盖体或第二盖体之间的间隙进入到灯条的内部时,其亦不容易贴附在第一电极和第二电极之上而对第一电极和第二电极的导电性能造成影响。
附图说明
图1是本发明第一实施例所提供的发光二极管灯条的结构示意图。
图2是本发明第二实施例所提供的发光二极管灯条的结构示意图。
主要元件符号说明
发光二极管灯条 | 10、20 |
基板 | 110 |
第一表面 | 111 |
第二表面 | 112 |
第一电极 | 113 |
第二电极 | 114 |
发光二极管晶粒 | 120 |
封装材料层 | 130 |
保护层 | 140、240 |
第一盖体 | 150 |
第二盖体 | 160 |
驱动装置 | 170 |
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
以下参照图示,对本发明的发光二极管灯条进行进一步的说明。
请参见图1,本发明第一实施例提供的发光二极管灯条10包括基板110、设置在基板110上的发光二极管晶粒120、封装材料层130、保护层140、第一盖体150以及第二盖体160。
基板110具有第一表面111和第二表面112。第一表面111上设置有第一电极113和第二电极114。第一电极113与第二电极114之间相互绝缘。在本实施例中,基板110的第一表面111上设置有第一凹槽115和第二凹槽116。第一凹槽115用于容置第一电极113,第二凹槽116用于容置第二电极114,从而使第一电极113和第二电极114的上表面与第一表面相平齐。所述第一电极113和第二电极114的材料选自金、银、铝、镍、铜或者其合金。
发光二极管晶粒120设置在基板110的第一表面111之上。发光二极管晶粒120分别与第一电极113和第二电极114电连接。通过在第一电极113和第二电极114之间施加一驱动电压以驱动发光二极管晶粒120发光。所述发光二极管晶粒120的制作材料可以是氮化镓(GaN)、氮化铝镓(AlGaN)、氮化铟镓(InGaN)以及氮化铝镓铟(AlInGaN)等。
封装材料层130覆盖在发光二极管晶粒120之上,用于防止发光二极管晶粒120受外界水气或者灰尘的影响。根据需要,在封装材料层130中可以填充荧光粉粒子。所述荧光粉粒子吸收发光二极管晶粒120所发出的光线,并将其转换成另一波长的光线。所述荧光粉粒子的材料选自钇铝石榴石、硫化物、硅酸盐、氮化物和氮氧化物其中之一或其混合物。
保护层140覆盖在第一电极113和第二电极114之上,用于防止水气贴附在第一电极113和第二电极114之上而对第一电极113和第二电极114的导电性能造成影响。所述保护层140由透明材料制成。在本实施例中,保护层140的上表面为平面。保护层140的制作材料包括树脂(epoxy),硅胶(silicone),聚邻苯二甲酰胺(polyphthalamide,PPA),以及聚甲基丙烯酸甲酯(polymethyl methacrylate,PMMA)。
第一盖体150覆盖在基板110的第一表面111之上,第二盖体160覆盖在基板110的第二表面112之上。发光二极管晶粒120所发出的光线通过封装材料层130后,经由第一盖体150出射到外界。在本实施例中,第一盖体150和第二盖体160为圆弧状结构,第一盖体150和第二盖体160分别贴附在基板110的第一表面111和第二表面112之上而形成灯条结构。第一盖体150由透光材料制成,其制作材料包括玻璃、聚碳酸酯以及聚甲基丙烯酸甲酯。第二盖体160由金属材料制成,发光二极管晶粒120在发光过程中所产生的热量可有效通过基板110传递到第二盖体160上,然后通过第二盖体160散发到外界环境。
根据需要,所述发光二极管灯条10还可以进一步包括驱动装置170。所述驱动装置设置在基板110的第二表面112之上,用以将外界电压转换为适合于驱动发光二极管晶粒120发光的驱动电压。所述第二盖体覆盖所述驱动装置170。
可以理解的是,所述保护层的形状和结构并不限于以上实施方式。请参阅图2,为本发明第二实施方式所提供的发光二极管灯条20。在本实施例中,所述保护层240的上表面为凸曲面,且保护层240的厚度沿远离封装材料层130的方向上逐渐减小。由于保护层240的上表面为凸曲面,发光二极管晶粒120所发出的光线在经过封装材料层130而进入保护层240时,所述凸曲面可以使光线朝向发光二极管晶粒120的光轴方向偏转,从而使发光二极管灯条20具有更好的光分布情况。
可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。
Claims (10)
1.一种发光二极管灯条,包括:
基板,具有第一表面和第二表面,基板的第一表面设置有第一电极和第二电极;
发光二极管晶粒,设置在基板的第一表面之上且分别与第一电极和第二电极电连接;
封装材料层,覆盖所述发光二极管晶粒;
保护层,覆盖所述第一电极和第二电极;以及
第一盖体和第二盖体,分别覆盖在基板的第一表面和第二表面之上。
2.如权利要求1所述的发光二极管灯条,其特征在于,所述保护层由透明材料制成。
3.如权利要求2所述的发光二极管灯条,其特征在于,所述保护层的制作材料选自树脂、硅胶、聚邻苯二甲酰胺以及聚甲基丙烯酸甲酯。
4.如权利要求1所述的发光二极管灯条,其特征在于,所述保护层的上表面为平面。
5.如权利要求1所述的发光二极管灯条,其特征在于,所述保护层的上表面为凸曲面。
6.如权利要求5所述的发光二极管灯条,其特征在于,所述保护层的厚度沿远离封装材料层的方向上逐渐减小。
7.如权利要求1所述的发光二极管灯条,其特征在于,所述发光二极管灯条进一步包括驱动装置,所述驱动装置设置在基板的第二表面之上,所述第二盖体覆盖所述驱动装置。
8.如权利要求1所述的发光二极管灯条,其特征在于,所述基板的第一表面上形成有第一凹槽和第二凹槽,第一电极设置在第一凹槽之中,第二电极设置在第二凹槽之中,且第一电极与第二电极的上表面与第一表面相平齐。
9.如权利要求1所述的发光二极管灯条,其特征在于,所述第一盖体的制作材料选自玻璃、聚碳酸酯以及聚甲基丙烯酸甲酯其中之一。
10.如权利要求1所述的发光二极管灯条,其特征在于,所述第二盖体由金属材料制成。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210221160.XA CN103511995B (zh) | 2012-06-29 | 2012-06-29 | 发光二极管灯条 |
TW101123948A TWI489055B (zh) | 2012-06-29 | 2012-07-03 | 發光二極體燈條 |
US13/895,371 US20140001500A1 (en) | 2012-06-29 | 2013-05-16 | Led light bar |
JP2013132439A JP2014011461A (ja) | 2012-06-29 | 2013-06-25 | 発光ダイオードライトバー |
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CN201210221160.XA CN103511995B (zh) | 2012-06-29 | 2012-06-29 | 发光二极管灯条 |
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CN203697831U (zh) | 2013-11-04 | 2014-07-09 | 宁波米德兰电子制造有限公司 | 一种新型圣诞老人像 |
JP6375140B2 (ja) * | 2014-04-30 | 2018-08-15 | 日東電工株式会社 | 熱伝導性ポリマー組成物及び熱伝導性成形体 |
KR20170001390A (ko) | 2015-06-26 | 2017-01-04 | 위-난 왕 | 스트립 조명 및 이를 응용한 조명 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101608743A (zh) * | 2008-06-20 | 2009-12-23 | 晶元光电股份有限公司 | 光源模块、其对应的光棒及其对应的液晶显示装置 |
CN201547563U (zh) * | 2009-10-15 | 2010-08-11 | 众光照明有限公司 | 新型led组合线条灯 |
CN102252210A (zh) * | 2010-05-03 | 2011-11-23 | 三星Led株式会社 | 使用发光器件封装的照明装置 |
CN102479786A (zh) * | 2010-11-23 | 2012-05-30 | 光芯科技股份有限公司 | 发光模块及交流发光装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19625622A1 (de) * | 1996-06-26 | 1998-01-02 | Siemens Ag | Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
DE19627856A1 (de) * | 1996-07-11 | 1998-01-15 | Happich Fahrzeug & Ind Teile | Beleuchtungsleiste und Verfahren zur Herstellung |
US6864513B2 (en) * | 2003-05-07 | 2005-03-08 | Kaylu Industrial Corporation | Light emitting diode bulb having high heat dissipating efficiency |
JP3841092B2 (ja) * | 2003-08-26 | 2006-11-01 | 住友電気工業株式会社 | 発光装置 |
JP4884956B2 (ja) * | 2005-12-27 | 2012-02-29 | 昭和電工株式会社 | 導光部材および面光源装置ならびに表示装置 |
JP4888280B2 (ja) * | 2007-08-28 | 2012-02-29 | パナソニック電工株式会社 | 発光装置 |
JP2009058768A (ja) * | 2007-08-31 | 2009-03-19 | Showa Denko Kk | 表示装置、発光装置 |
DE102008024776A1 (de) * | 2007-09-28 | 2009-11-26 | Osram Gesellschaft mit beschränkter Haftung | Leuchtmittel mit magnetischer Haftung |
US7806569B2 (en) * | 2007-09-28 | 2010-10-05 | Osram Sylvania Inc. | Lighting system with removable light modules |
KR100907310B1 (ko) * | 2008-06-16 | 2009-07-09 | 주식회사 엠에스엠텍 | 형광등형 엘이디 전등 |
US7611260B1 (en) * | 2008-07-02 | 2009-11-03 | Cpumate Inc. | Protecting cover and LED lamp tube having the same |
KR100993059B1 (ko) * | 2008-09-29 | 2010-11-08 | 엘지이노텍 주식회사 | 발광 장치 |
US8444292B2 (en) * | 2008-10-24 | 2013-05-21 | Ilumisys, Inc. | End cap substitute for LED-based tube replacement light |
CN101749640B (zh) * | 2008-12-05 | 2012-12-26 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US20100301728A1 (en) * | 2009-06-02 | 2010-12-02 | Bridgelux, Inc. | Light source having a refractive element |
TWM379006U (en) * | 2009-10-22 | 2010-04-21 | Jia-hao ZHANG | LED light bar |
TWM383680U (en) * | 2010-01-29 | 2010-07-01 | Chang Jia Hao | Covering lamp of bar lamp |
JP4909450B2 (ja) * | 2010-06-28 | 2012-04-04 | パナソニック株式会社 | 発光装置、バックライトユニット、液晶表示装置及び照明装置 |
JP2012069834A (ja) * | 2010-09-27 | 2012-04-05 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
TWM405519U (en) * | 2011-01-06 | 2011-06-11 | Wen-Jin Chen | LED strip lamp |
KR101812168B1 (ko) * | 2011-04-19 | 2017-12-26 | 엘지전자 주식회사 | 발광 소자 패키지 및 이를 이용한 발광 장치 |
-
2012
- 2012-06-29 CN CN201210221160.XA patent/CN103511995B/zh not_active Expired - Fee Related
- 2012-07-03 TW TW101123948A patent/TWI489055B/zh not_active IP Right Cessation
-
2013
- 2013-05-16 US US13/895,371 patent/US20140001500A1/en not_active Abandoned
- 2013-06-25 JP JP2013132439A patent/JP2014011461A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101608743A (zh) * | 2008-06-20 | 2009-12-23 | 晶元光电股份有限公司 | 光源模块、其对应的光棒及其对应的液晶显示装置 |
CN201547563U (zh) * | 2009-10-15 | 2010-08-11 | 众光照明有限公司 | 新型led组合线条灯 |
CN102252210A (zh) * | 2010-05-03 | 2011-11-23 | 三星Led株式会社 | 使用发光器件封装的照明装置 |
CN102479786A (zh) * | 2010-11-23 | 2012-05-30 | 光芯科技股份有限公司 | 发光模块及交流发光装置 |
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TW201400742A (zh) | 2014-01-01 |
CN103511995B (zh) | 2016-04-20 |
JP2014011461A (ja) | 2014-01-20 |
TWI489055B (zh) | 2015-06-21 |
US20140001500A1 (en) | 2014-01-02 |
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