CN103506333A - Silicone wafer degumming pre-washing device - Google Patents
Silicone wafer degumming pre-washing device Download PDFInfo
- Publication number
- CN103506333A CN103506333A CN201310448760.4A CN201310448760A CN103506333A CN 103506333 A CN103506333 A CN 103506333A CN 201310448760 A CN201310448760 A CN 201310448760A CN 103506333 A CN103506333 A CN 103506333A
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- Prior art keywords
- heat exchanger
- cooling water
- silicone wafer
- plate type
- type heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention provides a silicone wafer degumming pre-washing device. The silicone wafer degumming pre-washing device comprises a plate heat exchanger (3), wherein a first inlet (2) and a second inlet (4) are formed in the two sides of the upper end of the plate heat exchanger (3) respectively, the first inlet (2) is connected with an outlet (7) of ingot furnace cooling water, the second inlet (4) is a cold water injection port, a plate heat exchanger outlet (5) is formed in the lower end of the plate heat exchanger (3) and connected with a silicone wafer pre-washing pipeline (8), and a pre-washing port (6) is formed in the other end of the silicone wafer pre-washing pipeline (8). By means of the silicone wafer degumming pre-washing device, the inlet water temperature for silicone wafer pre-washing can be kept at 20-25 DEG C to adapt to the temperature after a silicone wafer is cut, the problem that glue contracts due to the temperature is relieved, the qualification rate is improved, and edge breakage rate is lowered. Meanwhile, energy consumption of a cooling water machine is reduced, and therefore the energy consumed in cooling with cooling water of ingots and single crystal is lowered.
Description
Technical field
The invention belongs to photovoltaic preparation field, be specifically related to the pre-flusher of a kind of silicon wafer stripping.
Background technology
Collapse limit and be that polysilicon chip produces in slicing processes and the process of coming unstuck is one of great abnormal, and variability is stronger.
Polycrystalline silicon rod need to carry out bonding with glass to a side silicon rod in when cutting, and the glue adopting is substantially all AB glue.This glue expanded size under different temperatures is different.
Summer and winter temperature differ greatly, polysilicon chip cutting afterwards general temperature all at 25-30 degree.And summer pre-rinse water temperature generally in about 18-23 degree, generally only have 5-9 degree winter, this just causes the coefficient of expansion of glue different, thereby it is more higher more more than summer to cause collapsing winter limit quantity.Collapse limit ratio summer generally in 1% left and right, collapse limit ratio winter in 4% left and right.There is this kind of problem in basic each silicon chip factory commercial city, cannot solve.
Summary of the invention
The invention provides the pre-flusher of silicon wafer stripping, can effectively solve the problem that silicon chip collapses limit.
The invention provides the pre-flusher of a kind of silicon wafer stripping, the pre-flusher of described silicon wafer stripping comprises plate type heat exchanger (3), described plate type heat exchanger (3) both sides, upper end are respectively equipped with the first entrance (2) and the second entrance (4), the first entrance (2) is connected with the outlet (7) of ingot furnace cooling water (1), the second entrance (4) is cold water inlet, the lower end of plate type heat exchanger (3) is provided with plate type heat exchanger outlet (5), be connected with the pre-flushing pipe of silicon chip (8), pre-rinse mouth (6) is located at the other end of the pre-flushing pipe 8 of silicon chip.
Preferably, in described plate type heat exchanger outlet (5), locate to be provided with thermometer; At described the second entrance (4), locate to be provided with the valve that can control current size.
Preferably, ingot furnace cooling water (1) is replaced with to the mixed liquor of single crystal furnace cooling water or single crystal furnace cooling water and ingot furnace cooling water.
Apply the pre-flusher of silicon wafer stripping of the present invention, can make silicon wafer stripping rinse in advance water inlet water temperature and be fixed on 20 ℃-25 ℃, the temperature of having cut to adapt to silicon chip, alleviates the problem of the cold and hot contraction of glue, has improved qualification rate and reduced to collapse limit ratio.Simultaneously, because the cooling water backwater of ingot furnace and/or single crystal growing furnace can fall part heat by band after by plate type heat exchanger, reduced the energy consumption of cooling water machine, thereby reduced ingot casting and the energy consumption of monocrystalline in water quench.
Accompanying drawing explanation
Fig. 1 is the pre-flusher schematic diagram of silicon wafer stripping of the present invention;
Wherein, 1 is ingot furnace cooling water, and 2 is the first entrance, and 3 is plate type heat exchanger, and 4 is the second entrance, and 5 is plate type heat exchanger outlet, and 6 is pre-rinse mouth, and 7 is outlet, and 8 is the pre-flushing pipe of silicon chip.
The specific embodiment
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention.
As shown in Figure 1, plate type heat exchanger 3 both sides, upper end are respectively equipped with the first entrance 2 and the second entrance 4, the first entrance 2 is connected with the outlet 7 of ingot furnace cooling water 1, the second entrance 4 is cold water inlet, the lower end of plate type heat exchanger 3 is provided with plate type heat exchanger outlet 5, be connected with the pre-flushing pipe 8 of silicon chip, pre-rinse mouth 6 is located at the other end of the pre-flushing pipe 8 of silicon chip.
During use, the heat that ingot furnace is produced in heating process passes through cooling water, ingot furnace cooling water (temperature is 30 ℃) is passed to plate type heat exchanger by the first entrance 2, simultaneously, running water (is changed along with temperature, summer, pre-rinse water temperature was generally 18-23 ℃ of left and right, generally only have 5-9 ℃ winter) by the second entrance 4, be passed to plate type heat exchanger, two kinds of different water of temperature carry out heat exchange in plate type heat exchanger 3, from board-like heat exchanger exit 5, flow to afterwards in the pre-flushing pipe 8 of silicon chip, by 6 pairs of silicon wafer strippings of pre-rinse mouth, carry out pretreatment.
The present invention can also export 5 places at plate type heat exchanger one thermometer is set, and is used for measuring exit water temperature; Meanwhile, the valve (not indicating in figure) that can control current size is set at the second entrance 4 places, according to the temperature shown in thermometer, adjusts running water injection rate, the water temperature that plate type heat exchanger is exported to 5 places is controlled (20-25 ℃) within the specific limits.
Except using ingot furnace cooling water, the present invention can also use single crystal furnace cooling water, or the mixing of ingot furnace and single crystal furnace cooling water.
The present invention does not require the model of plate type heat exchanger, as long as can complete the object of the invention.
Finally it should be noted that: the foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although the present invention is had been described in detail with reference to previous embodiment, for a person skilled in the art, its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (3)
1. the pre-flusher of silicon wafer stripping, it is characterized in that: the pre-flusher of described silicon wafer stripping comprises plate type heat exchanger (3), described plate type heat exchanger (3) both sides, upper end are respectively equipped with the first entrance (2) and the second entrance (4), the first entrance (2) is connected with the outlet (7) of ingot furnace cooling water (1), the second entrance (4) is cold water inlet, the lower end of plate type heat exchanger (3) is provided with plate type heat exchanger outlet (5), be connected with the pre-flushing pipe of silicon chip (8), pre-rinse mouth (6) is located at the other end of the pre-flushing pipe 8 of silicon chip.
2. the pre-flusher of silicon wafer stripping according to claim 1, is characterized in that: in described plate type heat exchanger outlet (5), locate to be provided with thermometer; At described the second entrance (4), locate to be provided with the valve that can control current size.
3. the pre-flusher of silicon wafer stripping according to claim 1, is characterized in that: the mixed liquor that ingot furnace cooling water (1) is replaced with to single crystal furnace cooling water or single crystal furnace cooling water and ingot furnace cooling water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310448760.4A CN103506333A (en) | 2013-09-28 | 2013-09-28 | Silicone wafer degumming pre-washing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310448760.4A CN103506333A (en) | 2013-09-28 | 2013-09-28 | Silicone wafer degumming pre-washing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103506333A true CN103506333A (en) | 2014-01-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310448760.4A Pending CN103506333A (en) | 2013-09-28 | 2013-09-28 | Silicone wafer degumming pre-washing device |
Country Status (1)
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Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299313A (en) * | 2001-04-04 | 2002-10-11 | Seiko Epson Corp | Manufacturing method and wet etching apparatus for semiconductor device |
| JP2006159003A (en) * | 2004-12-02 | 2006-06-22 | Mayekawa Mfg Co Ltd | Heating and cooling method and apparatus for ultrapure water |
| JP2009189905A (en) * | 2008-02-12 | 2009-08-27 | Kurita Water Ind Ltd | Heat recovery type cleaning equipment |
| CN101898391A (en) * | 2010-08-19 | 2010-12-01 | 英利能源（中国）有限公司 | Silicon briquette degumming system and degumming method |
| CN201678767U (en) * | 2010-04-04 | 2010-12-22 | 浙江硅宏电子科技有限公司 | Silicon slice degumming machine |
| CN202131390U (en) * | 2011-06-15 | 2012-02-01 | 湖南红太阳光电科技有限公司 | Recirculated cooling water energy saving device for polycrystal ingot casting production |
| CN202204172U (en) * | 2011-07-25 | 2012-04-25 | 佛山市顺德区燉煌五金塑料实业有限公司 | Water temperature automatic regulation device |
| CN102538479A (en) * | 2012-03-02 | 2012-07-04 | 重庆大全新能源有限公司 | Device and method for cooling circulating cooling water |
| CN202290635U (en) * | 2011-10-09 | 2012-07-04 | 镇江大成新能源有限公司 | On-line flusher |
| CN202373618U (en) * | 2011-12-26 | 2012-08-08 | 江西赛维Ldk太阳能高科技有限公司 | Degumming equipment |
| CN202601700U (en) * | 2012-04-26 | 2012-12-12 | 洛阳鸿泰半导体有限公司 | Automatic flushing and degumming mechanism for solar silicon wafers |
| CN202595795U (en) * | 2012-06-15 | 2012-12-12 | 苏州晶樱光电科技有限公司 | Water recycle device for solar silicon chip production |
| CN102983059A (en) * | 2011-09-06 | 2013-03-20 | 丁国发 | Silicon wafer washing debonding support |
| CN202845366U (en) * | 2012-10-23 | 2013-04-03 | 宿迁宇龙光电科技有限公司 | Swing type degumming water-spraying device for polycrystalline silicon chips |
| CN103017578A (en) * | 2011-09-21 | 2013-04-03 | 浚鑫科技股份有限公司 | Pure water heating system |
| CN203508436U (en) * | 2013-09-28 | 2014-04-02 | 无锡荣能半导体材料有限公司 | Silicon slice degumming pre-washing device |
-
2013
- 2013-09-28 CN CN201310448760.4A patent/CN103506333A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299313A (en) * | 2001-04-04 | 2002-10-11 | Seiko Epson Corp | Manufacturing method and wet etching apparatus for semiconductor device |
| JP2006159003A (en) * | 2004-12-02 | 2006-06-22 | Mayekawa Mfg Co Ltd | Heating and cooling method and apparatus for ultrapure water |
| JP2009189905A (en) * | 2008-02-12 | 2009-08-27 | Kurita Water Ind Ltd | Heat recovery type cleaning equipment |
| CN201678767U (en) * | 2010-04-04 | 2010-12-22 | 浙江硅宏电子科技有限公司 | Silicon slice degumming machine |
| CN101898391A (en) * | 2010-08-19 | 2010-12-01 | 英利能源（中国）有限公司 | Silicon briquette degumming system and degumming method |
| CN202131390U (en) * | 2011-06-15 | 2012-02-01 | 湖南红太阳光电科技有限公司 | Recirculated cooling water energy saving device for polycrystal ingot casting production |
| CN202204172U (en) * | 2011-07-25 | 2012-04-25 | 佛山市顺德区燉煌五金塑料实业有限公司 | Water temperature automatic regulation device |
| CN102983059A (en) * | 2011-09-06 | 2013-03-20 | 丁国发 | Silicon wafer washing debonding support |
| CN103017578A (en) * | 2011-09-21 | 2013-04-03 | 浚鑫科技股份有限公司 | Pure water heating system |
| CN202290635U (en) * | 2011-10-09 | 2012-07-04 | 镇江大成新能源有限公司 | On-line flusher |
| CN202373618U (en) * | 2011-12-26 | 2012-08-08 | 江西赛维Ldk太阳能高科技有限公司 | Degumming equipment |
| CN102538479A (en) * | 2012-03-02 | 2012-07-04 | 重庆大全新能源有限公司 | Device and method for cooling circulating cooling water |
| CN202601700U (en) * | 2012-04-26 | 2012-12-12 | 洛阳鸿泰半导体有限公司 | Automatic flushing and degumming mechanism for solar silicon wafers |
| CN202595795U (en) * | 2012-06-15 | 2012-12-12 | 苏州晶樱光电科技有限公司 | Water recycle device for solar silicon chip production |
| CN202845366U (en) * | 2012-10-23 | 2013-04-03 | 宿迁宇龙光电科技有限公司 | Swing type degumming water-spraying device for polycrystalline silicon chips |
| CN203508436U (en) * | 2013-09-28 | 2014-04-02 | 无锡荣能半导体材料有限公司 | Silicon slice degumming pre-washing device |
Non-Patent Citations (2)
| Title |
|---|
| TONGYLEE: "崩边原因 http://wenku.baidu.com/view/83aa8ded998fcc22bcd10d8a.html", 《百度文库》, 20 August 2012 (2012-08-20) * |
| 张峰 等: "硅片脱胶技术的现状及发展研究", 《电子工业专用设备》, no. 198, 20 July 2011 (2011-07-20) * |
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Application publication date: 20140115 |
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| RJ01 | Rejection of invention patent application after publication |