CN103496845A - Feeding system for processing substrate and substrate cutting machine - Google Patents
Feeding system for processing substrate and substrate cutting machine Download PDFInfo
- Publication number
- CN103496845A CN103496845A CN201310441730.0A CN201310441730A CN103496845A CN 103496845 A CN103496845 A CN 103496845A CN 201310441730 A CN201310441730 A CN 201310441730A CN 103496845 A CN103496845 A CN 103496845A
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- substrate
- vacuum pad
- feeding system
- lifting device
- take out
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- 239000000758 substrate Substances 0.000 title claims abstract description 71
- 238000005520 cutting process Methods 0.000 title abstract description 9
- 239000011148 porous material Substances 0.000 claims description 16
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 13
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000001179 sorption measurement Methods 0.000 abstract 1
- 230000035611 feeding Effects 0.000 description 28
- 239000011521 glass Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000009102 absorption Effects 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
The invention discloses a feeding system for processing a substrate and a substrate cutting machine. The feeding system comprises a taking device and also comprises a feeding device, wherein the taking device comprises a lifting device and a vacuum chuck arranged at one end of the lifting device; the lifting device pushes the vacuum chuck to the substrate at the feeding position; by adsorption of the vacuum chuck, the substrate is fixed on the vacuum chuck to take materials; the feeding device is connected with the taking device and is used for pushing the taking device and the adsorbed substrate to processing positions. The feeding system and the substrate cutting machine disclosed by the invention have the advantages that since the vacuum chuck adopts one surface of the adsorbed substrate to realize material taking, compared with the mode of using a clamping head to take the materials, the clamping distance of a clamping head does not need to be adjusted, so that the maintenance is simple; in addition, since no clamping head is arranged, the wear to gaskets can not be caused; the vacuum chuck can not cause failed grabbing due to the wear of the gaskets, so that the operating efficiency and the productivity of the equipment are improved; in addition, the gaskets on the clamping head are greatly saved, so that the cost is also greatly saved.
Description
Technical field
The present invention relates to display unit and manufacture field, in particular, relate to a kind of feeding system and substrate cut machine for substrate processing.
Background technology
The cutting of glass substrate is the critical processes of liquid crystal panel, at present, in the cutting process of glass substrate, as shown in Figure 1, the give material mode of glass substrate in cutting machine before cutting is by material chuck 11(Chuck) at the offal timber at feed entrance point gripping glass substrate 700 edges (between display screen or the glass at display screen edge be called offal timber), by cylinder 10 or motor driving cutting machine whole group to material chuck 11(Chuck) thereby driving full wafer glass substrate 700 passes and yearns for the Downstream processing positions, glass substrate 700 bottoms are provided with roller 15 makes glass substrate steadily deliver to Working position.
Because the thickness of current glass substrate is not unique, use above-mentioned will be for the glass substrate of different thickness through usually adjusting the clamping spacing of chuck to the words of material in the gripping mode to material chuck 11, process is more loaded down with trivial details.As shown in Figure 2, give on material chuck 11 and also be provided with buffering spacer simultaneously, along with board is more and more longer duration of service, wearing and tearing to the surperficial pad 13 that plays shock absorptions of material chuck 11 also can be day by day serious, can cause like this board to occur abnormal, thereby increase is adjusted the frequency of pad 13 to eliminate extremely, and the pad price is higher, board quantity of pad 13 altogether is more, and not only increase personnel replacing (loading) workload of working, also increased production cost and also caused production capacity to descend simultaneously.
Summary of the invention
It is high that technical problem to be solved by this invention is to provide a kind of efficiency, feeding system and substrate cut machine for substrate processing that cost is low.
The objective of the invention is to be achieved through the following technical solutions: a kind of feeding system for substrate processing comprises:
Take out device, the vacuum pad that it comprises lifting device and is arranged on described lifting device one end, described lifting device is for described vacuum pad being pushed to the substrate of feed entrance point, adsorbs described substrate by vacuum pad and it is fixed on described vacuum pad carry out feeding;
Pay-off, it is connected with described take out device, for the substrate by described take out device and absorption thereof, pushes to Working position.
Preferably, described vacuum pad comprises: a disk body and the suction vacuum unit that is arranged on disk body, and described disc surfaces is provided with a plurality of pores, and described pore is communicated with described suction vacuum unit.Pore directly is set on disk body, and is communicated with the suction vacuum unit, its structure is comparatively simple, does not need to arrange a plurality of suction vacuum heads, and cost is lower.
Preferably, described lifting device comprises a pusher cylinder, and described vacuum pad is arranged on the push rod of described pusher cylinder.The mode structure that the pusher cylinder pushes is comparatively simple, and cost is low.
Preferably, described pay-off comprises: screw rod, CD-ROM drive motor and a guide rail for driving described screw rod; Described take out device is provided with the nut be connected with described screw rod, and a slide block be arranged on described guide rail.The mode tolerance range that bolt and nut drives is higher, and the propelling movement process is more steady, and structure is also comparatively simple.
Preferably, described screw rod and described CD-ROM drive motor direct connection.
A kind of substrate cut machine, comprise feeding system, and described feeding system comprises:
Take out device, the vacuum pad that it comprises lifting device and is arranged on described lifting device one end, described lifting device is for described vacuum pad being pushed to the substrate of feed entrance point, adsorbs described substrate by vacuum pad and it is fixed on described vacuum pad carry out feeding;
Pay-off, it is connected with described take out device, for the substrate by described take out device and absorption thereof, pushes to Working position.
Preferably, described vacuum pad comprises: a disk body and the suction vacuum unit that is arranged on disk body, and described disc surfaces is provided with a plurality of pores, and described pore is communicated with described suction vacuum unit.Pore directly is set on disk body, and is communicated with the suction vacuum unit, its structure is comparatively simple, does not need to arrange a plurality of suction vacuum heads, and cost is lower.
Preferably, described lifting device comprises a pusher cylinder, and described vacuum pad is arranged on the push rod of described pusher cylinder.The mode structure that the pusher cylinder pushes is comparatively simple, and cost is low.
Preferably, described pay-off comprises: screw rod, CD-ROM drive motor and a guide rail for driving described screw rod; Described take out device is provided with the nut be connected with described screw rod, and a slide block be arranged on described guide rail.The mode tolerance range that bolt and nut drives is higher, and the propelling movement process is more steady, and structure is also comparatively simple.
Preferably, described screw rod and described CD-ROM drive motor direct connection.
The take out device that the present invention processes the feeding system of use by substrate has adopted vacuum pad to be adsorbed feeding, and push vacuum pad by lifting device and realize reclaiming process, due to the vacuum pad employing is that a face that adsorbs substrate is realized feeding, mode with respect to the chuck feeding, need to not differ and adjust the clamping spacing of chuck for substrate thickness, safeguard fairly simple, reduced staff's operating pressure, in addition, owing to there is no chuck, thereby there is no the abrasion of pad yet, that is to say, vacuum pad can not cause because of the abrasion of pad capturing unsuccessfully, operational efficiency and the production capacity of equipment have so just been improved, in addition, also saved a large amount of for the pad on chuck, therefore also saved a large amount of costs.
The accompanying drawing explanation
Fig. 1 is the feeding system structural representation had now for substrate processing,
Fig. 2 is the chuck structure schematic diagram had now for the feeding system of substrate processing,
Fig. 3 is the feeding system structural representation of the embodiment of the present invention for substrate processing,
Fig. 4 is the vacuum pad body structure schematic diagram of the embodiment of the present invention for the feeding system of substrate processing.
Wherein, in Fig. 1-4: 1, feeding system, 10, cylinder, 100, take out device, 110, lifting device, 11, give the material chuck, 13, pad, 111, pusher cylinder, 112, push rod, 120, vacuum pad, 121, disk body, 122, inhale vacuum unit, 123, pore; 130, nut, 15, roller; 150, slide block, 200, pay-off, 210, CD-ROM drive motor, 220, screw rod, 230, guide rail, 700, substrate.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, the invention will be further described.
As shown in Figure 3, the present embodiment provides the specific embodiment for the feeding system 1 of substrate processing, it comprises: take out device 100, this take out device 100 comprises lifting device 110 and is arranged on described lifting device 110 1 end vacuum pads 120, described lifting device 110, for described vacuum pad being pushed to substrate 700 bottoms of feed entrance point, is fixed on described vacuum pad 700 it by the described substrate 700 of vacuum pad 120 absorption and carries out feeding; This feeding system 1 also is provided with a pay-off 200 simultaneously, and it is connected with described take out device 100, in order to by described take out device 100 and on substrate 700 push to Working position.Due to vacuum pad 120 employings is that a face (being bottom surface) that adsorbs substrate 700 is realized feeding, with respect to the mode adopted as shown in Figure 1 or 2 to material chuck 11 feedings, need to not adjust the clamping spacing to material chuck 11 for substrate 700 variable thickness, safeguard fairly simple, reduce staff's operating pressure, also improved operational efficiency and the production capacity of equipment simultaneously, in addition, also saved in a large number for the pad on chuck, therefore also saved a large amount of costs.
As shown in Figure 3, vacuum pad 120 comprises: a disk body 121 and the suction vacuum unit 122 that is arranged on disk body 121 bottoms, shown in Fig. 4, disk body 121 surfaces are provided with a plurality of pores 123, described pore 123 is communicated with described suction vacuum unit 122, concrete, this suction vacuum unit 122 is equipped with vacuum-lines and is communicated with the pore on described disk body 121 in disk body 121.Vacuum pad can be also to rearrange by matrix-style by a plurality of little suckers (size is suitable with described pore), but its structure is comparatively complicated, and cost is relatively high.
Lifting device 110 comprises a pusher cylinder 111, and described vacuum pad 120 is arranged on the push rod 112 of described pusher cylinder 111.Certainly, the effect of pusher cylinder 111 is to push vacuum pad 120 to arrive feed entrance point, it is the motion of straight line, this kind of mode can be substituted by multiple driving mechanism, as modes such as crank block, cam, screw mandrels, its structure is not unique but the mode of employing cylinder, and its structure is comparatively simple, and cost is also relatively low.
Pay-off 200 comprises: screw rod 220, CD-ROM drive motor 210 and a guide rail 230 for driving described screw rod 220, and screw rod 220 gets final product with CD-ROM drive motor 210 direct connections; Described take out device 100 is provided with the nut 130 be connected with described screw rod 220, and a slide block 150 be arranged on described guide rail 230, by guide rail 230, is led and supports described take out device 100.Same, in the present embodiment, the pay-off feeding process is also translational motion, above-mentioned mechanism also can be replaced by alternate manner, as the most direct mode is to adopt cylinder to replace, still, the mode that bolt and nut drives, the relative smoothness of its moving process is higher, and structure is also fairly simple.
When cutting machine is worked, the pusher cylinder 111 that system is controlled lifting device 110 pushes to feed entrance point by vacuum pad 120, the surface label that disk body 121 is provided with described pore 123 invests a face (being bottom surface) of substrate 700, now inhale vacuum unit 122 in work, produce negative pressure, by glass substrate 700, after the surface that is adsorbed on disk body 121 tightly, lifting device 110 drives vacuum pads 120 to descend, system is controlled CD-ROM drive motor 210 work of pay-off 200, drive screw mandrel 220 rotations and then drive take out device 100 and move ahead along guide rail 230, substrate 700 and take out device 100 are delivered to Working position simultaneously, now inhaling vacuum unit 122 quits work, after vacuum pad 120 is decontroled glass substrate, pay-off 200 draws the meeting original position by take out device 100, carry out the action of feeding and feeding next time.
It is more than the feeding system 1 of the described substrate cut of the present embodiment, feeding system based on above-mentioned, the present embodiment can provide a kind of substrate cut machine simultaneously, it comprises above-mentioned feeding system 1, in the present embodiment, and the substrate cut machine, except glass substrate is thought, for some substrates for display unit that adopt other, as plastic construction, also can.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. the feeding system for substrate processing, is characterized in that, comprising:
Take out device (100), the vacuum pad (120) that it comprises lifting device (110) and is arranged on described lifting device (110) one ends, described lifting device (110) is for described vacuum pad being pushed to the substrate (700) of feed entrance point, adsorbs described substrate (700) by vacuum pad (120) and it is fixed on described vacuum pad (700) carry out feeding;
Pay-off (200), it is connected with described take out device (100), for the substrate (700) by described take out device (100) and absorption thereof, pushes to Working position.
2. the feeding system for substrate processing as claimed in claim 1, it is characterized in that, described vacuum pad (120) comprising: a disk body (121) and the suction vacuum unit (122) that is arranged on disk body (121), described disk body (121) surface is provided with a plurality of pores (123), and described pore (123) is communicated with described suction vacuum unit (122).
3. the feeding system for substrate processing as claimed in claim 1, is characterized in that, described lifting device (110) comprises a pusher cylinder (111), and described vacuum pad (120) is arranged on the push rod (112) of described pusher cylinder (111).
4. the feeding system for substrate processing as claimed in claim 1, is characterized in that, described pay-off (200) comprising: screw rod (220), CD-ROM drive motor (210) and a guide rail (230) for driving described screw rod (220); Described take out device (100) is provided with the nut (130) be connected with described screw rod (220), and a slide block (150) be arranged on described guide rail (230).
5. the feeding system for substrate processing as claimed in claim 4, is characterized in that, described screw rod (220) and described CD-ROM drive motor (210) direct connection.
6. a substrate cut machine, comprise feeding system (1), it is characterized in that, described feeding system (1) comprising:
Take out device (100), the vacuum pad (120) that it comprises lifting device (110) and is arranged on described lifting device one end, described lifting device (110) is for described vacuum pad being pushed to the substrate (700) of feed entrance point, adsorbs described substrate (700) by vacuum pad (120) and it is fixed on described vacuum pad (700) carry out feeding;
Pay-off (200), it is connected with described take out device (100), for the substrate (700) by described take out device (100) and absorption thereof, pushes to Working position.
7. substrate cut machine as claimed in claim 6, it is characterized in that, described vacuum pad (120) comprising: a disk body (121) and the suction vacuum unit (122) that is arranged on disk body (121), described disk body (121) surface is provided with a plurality of pores (123), and described pore (123) is communicated with described suction vacuum unit (122).
8. substrate cut machine as claimed in claim 6, is characterized in that, described lifting device (110) comprises a pusher cylinder (111), and described vacuum pad (120) is arranged on the push rod (112) of described pusher cylinder (111).
9. as claimed in claim 6ly for the substrate cut machine, it is characterized in that, described pay-off (200) comprising: screw rod (220), CD-ROM drive motor (210) and a guide rail (230) for driving described screw rod (220); Described take out device (100) is provided with the nut (130) be connected with described screw rod (220), and a slide block (150) be arranged on described guide rail (230).
10. as claimed in claim 9ly for the substrate cut machine, it is characterized in that described screw rod (220) and described CD-ROM drive motor (210) direct connection.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310441730.0A CN103496845B (en) | 2013-09-25 | 2013-09-25 | Feeding system and substrate cut machine for substrate processing |
| PCT/CN2013/085629 WO2015043026A1 (en) | 2013-09-25 | 2013-10-22 | Feeding system for substrate processing and substrate cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310441730.0A CN103496845B (en) | 2013-09-25 | 2013-09-25 | Feeding system and substrate cut machine for substrate processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103496845A true CN103496845A (en) | 2014-01-08 |
| CN103496845B CN103496845B (en) | 2016-06-29 |
Family
ID=49862136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310441730.0A Expired - Fee Related CN103496845B (en) | 2013-09-25 | 2013-09-25 | Feeding system and substrate cut machine for substrate processing |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103496845B (en) |
| WO (1) | WO2015043026A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109399901A (en) * | 2018-10-09 | 2019-03-01 | 成都中光电科技有限公司 | A kind of split type push and block device |
| CN109437538A (en) * | 2018-11-09 | 2019-03-08 | 嵊州市天骏电器有限公司 | Cutting means are used in a kind of processing of kitchen ventilator front glass panel |
| WO2019047464A1 (en) * | 2017-09-11 | 2019-03-14 | 武汉华星光电半导体显示技术有限公司 | Evaporator |
| CN110407451A (en) * | 2019-07-12 | 2019-11-05 | 大族激光科技产业集团股份有限公司 | A kind of glass-cutting microscope carrier and its application method |
| CN111072271A (en) * | 2019-12-10 | 2020-04-28 | 深圳市华星光电半导体显示技术有限公司 | Material feeding equipment and substrate cutting machine |
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- 2013-09-25 CN CN201310441730.0A patent/CN103496845B/en not_active Expired - Fee Related
- 2013-10-22 WO PCT/CN2013/085629 patent/WO2015043026A1/en active Application Filing
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| CN2101043U (en) * | 1991-09-09 | 1992-04-08 | 赵宇 | Glass cutting conveying device |
| TW422808B (en) * | 1998-05-20 | 2001-02-21 | Applied Komatsu Technology Inc | Substrate transfer shuttle |
| CN201165488Y (en) * | 2008-02-28 | 2008-12-17 | 王伟中 | Processing worktable for glass |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019047464A1 (en) * | 2017-09-11 | 2019-03-14 | 武汉华星光电半导体显示技术有限公司 | Evaporator |
| CN109399901A (en) * | 2018-10-09 | 2019-03-01 | 成都中光电科技有限公司 | A kind of split type push and block device |
| CN109399901B (en) * | 2018-10-09 | 2021-09-10 | 成都中光电科技有限公司 | Split type pushing device |
| CN109437538A (en) * | 2018-11-09 | 2019-03-08 | 嵊州市天骏电器有限公司 | Cutting means are used in a kind of processing of kitchen ventilator front glass panel |
| CN109437538B (en) * | 2018-11-09 | 2021-06-04 | 嵊州市法帝电器有限公司 | Cutting device is used in processing production of lampblack absorber front glass panel |
| CN110407451A (en) * | 2019-07-12 | 2019-11-05 | 大族激光科技产业集团股份有限公司 | A kind of glass-cutting microscope carrier and its application method |
| CN110407451B (en) * | 2019-07-12 | 2022-08-09 | 大族激光科技产业集团股份有限公司 | Glass cutting carrying platform and using method thereof |
| CN111072271A (en) * | 2019-12-10 | 2020-04-28 | 深圳市华星光电半导体显示技术有限公司 | Material feeding equipment and substrate cutting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103496845B (en) | 2016-06-29 |
| WO2015043026A1 (en) | 2015-04-02 |
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