CN103496845B - Feeding system and substrate cut machine for substrate processing - Google Patents

Feeding system and substrate cut machine for substrate processing Download PDF

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Publication number
CN103496845B
CN103496845B CN201310441730.0A CN201310441730A CN103496845B CN 103496845 B CN103496845 B CN 103496845B CN 201310441730 A CN201310441730 A CN 201310441730A CN 103496845 B CN103496845 B CN 103496845B
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CN
China
Prior art keywords
substrate
vacuum cup
feeding
hoisting gear
feeding device
Prior art date
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Application number
CN201310441730.0A
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Chinese (zh)
Other versions
CN103496845A (en
Inventor
庞春明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to CN201310441730.0A priority Critical patent/CN103496845B/en
Priority to PCT/CN2013/085629 priority patent/WO2015043026A1/en
Publication of CN103496845A publication Critical patent/CN103496845A/en
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Publication of CN103496845B publication Critical patent/CN103496845B/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations

Abstract

A kind of feeding system for substrate processing of disclosure and substrate cut machine: including: feeding device, it includes lowering or hoisting gear and is arranged on described lowering or hoisting gear one end vacuum cup, described lowering or hoisting gear pushes described vacuum cup the substrate of feed entrance point to, adsorbs described substrate by vacuum cup and makes it be fixed on described vacuum cup to carry out feeding；Also including pay-off, it is connected with described feeding device, in order to the substrate of described feeding device and absorption thereof is pushed to Working position.What adopt due to vacuum cup is that a face of sorbing substrate is to realize feeding, mode relative to chuck feeding, it is not necessary to adjust the clamping spacing of chuck, safeguards simple, additionally, owing to there is no chuck, thus also without the abrasion of pad, vacuum cup will not cause capturing unsuccessfully because of the abrasion of pad, which improves the operational efficiency of equipment and production capacity, it addition, also a saving the pad being largely used on chuck, therefore also save substantial amounts of cost.

Description

Feeding system and substrate cut machine for substrate processing
Technical field
The present invention relates to display device and manufacture field, in particular, relate to a kind of feeding system for substrate processing and substrate cut machine.
Background technology
The cutting of glass substrate is the critical processes of liquid crystal panel, at present, in the cutting process of glass substrate, as shown in Figure 1, glass substrate in cutting machine material mode of giving before cutting is by material chuck 11(Chuck) offal timber (between display screen or the glass at display screen edge be called offal timber) at glass substrate 700 edge is gripped at feed entrance point, from whole group of cylinder 10 or motor driving cutting machine to material chuck 11(Chuck) thus driving full wafer glass substrate 700 to be transmitted to toward downstream Working position, being provided with roller 15 bottom glass substrate 700 makes glass substrate steadily deliver to Working position.
Owing to the thickness of current glass substrate is unique, use above-mentioned will for the glass substrate of different-thickness through usually adjusting the clamping spacing of chuck to the words of material in gripping mode to material chuck 11, process is comparatively laborious.As shown in Figure 2, to material chuck 11 is additionally provided with buffering spacer simultaneously, along with board uses the time more and more longer, playing that the pad 13 of cushioning effect weares and teares to material chuck 11 surface also can be day by day serious, so can cause that board occurs abnormal, thus increase the frequency adjusting pad 13 to eliminate exception, and pad price is higher, the quantity of one board pad 13 altogether is more, not only increases person works and changes (loading) workload, too increases production cost and also results in production capacity decline simultaneously.
Summary of the invention
It is high that the technical problem to be solved is to provide a kind of efficiency, and what cost was low is used for feeding system and the substrate cut machine of substrate processing.
It is an object of the invention to be achieved through the following technical solutions: a kind of feeding system for substrate processing, including:
Feeding device, it includes lowering or hoisting gear and is arranged on the vacuum cup of described lowering or hoisting gear one end, described lowering or hoisting gear, for described vacuum cup is pushed to the substrate of feed entrance point, adsorbs described substrate by vacuum cup and makes it be fixed on described vacuum cup to carry out feeding；
Pay-off, it is connected with described feeding device, for the substrate of described feeding device and absorption thereof is pushed to Working position.
Preferably, described vacuum cup includes: a disk body and be arranged on the suction vacuum equipment of disk body, and described disc surfaces is provided with multiple pore, and described pore connects with described suction vacuum equipment.Directly arranging pore on disk body, and connect with inhaling vacuum equipment, its structure is relatively simple, it is not necessary to arrange multiple suction vacuum head, less costly.
Preferably, described lowering or hoisting gear includes a pusher cylinder, and described vacuum cup is arranged on the push rod of described pusher cylinder.The mode structure that pusher cylinder pushes is relatively simple, and cost is low.
Preferably, described pay-off includes: screw rod, for driving driving motor and a guide rail of described screw rod；Described feeding device is provided with the nut being connected with described screw rod, and one is arranged on slide block on described guide rail.The mode degree of accuracy that bolt and nut drives is higher, pushes process relatively more steady, and structure is also relatively simple.
Preferably, described screw rod and described driving motor direct connection.
A kind of substrate cut machine, including feeding system, described feeding system includes:
Feeding device, it includes lowering or hoisting gear and is arranged on the vacuum cup of described lowering or hoisting gear one end, described lowering or hoisting gear, for described vacuum cup is pushed to the substrate of feed entrance point, adsorbs described substrate by vacuum cup and makes it be fixed on described vacuum cup to carry out feeding；
Pay-off, it is connected with described feeding device, for the substrate of described feeding device and absorption thereof is pushed to Working position.
Preferably, described vacuum cup includes: a disk body and be arranged on the suction vacuum equipment of disk body, and described disc surfaces is provided with multiple pore, and described pore connects with described suction vacuum equipment.Directly arranging pore on disk body, and connect with inhaling vacuum equipment, its structure is relatively simple, it is not necessary to arrange multiple suction vacuum head, less costly.
Preferably, described lowering or hoisting gear includes a pusher cylinder, and described vacuum cup is arranged on the push rod of described pusher cylinder.The mode structure that pusher cylinder pushes is relatively simple, and cost is low.
Preferably, described pay-off includes: screw rod, for driving driving motor and a guide rail of described screw rod；Described feeding device is provided with the nut being connected with described screw rod, and one is arranged on slide block on described guide rail.The mode degree of accuracy that bolt and nut drives is higher, pushes process relatively more steady, and structure is also relatively simple.
Preferably, described screw rod and described driving motor direct connection.
The feeding device of the feeding system that substrate is processed by the present invention have employed vacuum cup and carries out absorption feeding, and realize reclaiming process by lowering or hoisting gear propelling movement vacuum cup, what adopt due to vacuum cup is that a face of sorbing substrate is to realize feeding, mode relative to chuck feeding, need not differ for substrate thickness and adjust the clamping spacing of chuck, safeguard fairly simple, decrease the operating pressure of staff, additionally, owing to there is no chuck, thus also without the abrasion of pad, that is, vacuum cup will not cause capturing unsuccessfully because of the abrasion of pad, which improves the operational efficiency of equipment and production capacity, additionally, also a saving the pad being largely used on chuck, therefore substantial amounts of cost is also saved.
Accompanying drawing explanation
Fig. 1 is the feeding system structural representation being currently used for substrate processing,
Fig. 2 is the chuck structure schematic diagram of the feeding system being currently used for substrate processing,
Fig. 3 is the feeding system structural representation that the embodiment of the present invention is processed for substrate,
Fig. 4 is the vacuum cup body structure schematic diagram of the feeding system that the embodiment of the present invention is processed for substrate.
Wherein, in Fig. 1-4: 1, feeding system, 10, cylinder, 100, feeding device, 110, lowering or hoisting gear, 11, to material chuck, 13, pad, 111, pusher cylinder, 112, push rod, 120, vacuum cup, 121, disk body, 122, inhale vacuum equipment, 123, pore；130, nut, 15, roller；150, slide block, 200, pay-off, 210, drive motor, 220, screw rod, 230, guide rail, 700, substrate.
Detailed description of the invention
Below in conjunction with accompanying drawing and preferred embodiment, the invention will be further described.
As shown in Figure 3, present embodiments provide a specific embodiment of the feeding system 1 processed for substrate, comprising: feeding device 100, this feeding device 100 includes lowering or hoisting gear 110 and is arranged on described lowering or hoisting gear 110 one end vacuum cup 120, described lowering or hoisting gear 110, for pushing to bottom the substrate 700 of feed entrance point by described vacuum cup, adsorbs described substrate 700 by vacuum cup 120 and makes it be fixed on described vacuum cup 700 to carry out feeding；This feeding system 1 is additionally provided with a pay-off 200 simultaneously, and it is connected with described feeding device 100, in order to described feeding device 100 and substrate thereon 700 are pushed to Working position.What adopt due to vacuum cup 120 is that a face (i.e. bottom surface) of sorbing substrate 700 realizes feeding, relative to adopting to the mode of material chuck 11 feeding as shown in Figure 1 or 2, need not adjust to the clamping spacing of material chuck 11 for substrate 700 variable thickness, safeguard fairly simple, decrease the operating pressure of staff, also improve operational efficiency and the production capacity of equipment, additionally simultaneously, also a saving the pad being largely used on chuck, therefore also save substantial amounts of cost.
As shown in Figure 3, vacuum cup 120 includes: a disk body 121 and be arranged on the suction vacuum equipment 122 bottom disk body 121, shown in Fig. 4, disk body 121 surface configuration has multiple pore 123, described pore 123 connects with described suction vacuum equipment 122, concrete, this suction vacuum equipment 122 is equipped with vacuum line in disk body 121 and connects with the pore on described disk body 121.Vacuum cup can also be arranged in a matrix composition by multiple little suckers (size is suitable with described pore), but its structure is complex, and cost is of a relatively high.
Lowering or hoisting gear 110 includes a pusher cylinder 111, and described vacuum cup 120 is arranged on the push rod 112 of described pusher cylinder 111.Certainly, the effect of pusher cylinder 111 is to push vacuum cup 120 to arrive feed entrance point, it it is the motion of straight line, this kind of mode can be substituted by multiple driving mechanism, such as modes such as crank block, cam, screw mandrels, its structure is not unique but adopts the mode of cylinder, and its structure is relatively simple, and cost is relatively low.
Pay-off 200 includes: screw rod 220, for driving driving motor 210 and a guide rail 230 of described screw rod 220, screw rod 220 with drive motor 210 direct connection；Described feeding device 100 is provided with the nut 130 being connected with described screw rod 220, and one is arranged on slide block 150 on described guide rail 230, is undertaken leading and support described feeding device 100 by guide rail 230.Same, in the present embodiment, pay-off feeding process is also rectilinear motion, above-mentioned mechanism can also be replaced by alternate manner, if the most direct mode is to adopt cylinder to replace, but, the mode that bolt and nut drives, the relatively flat stability of its motor process is higher, and structure is also fairly simple.
When cutting machine works, system controls the pusher cylinder 111 of lowering or hoisting gear 110 and vacuum cup 120 is pushed to feed entrance point, disk body 121 is provided with the surface of described pore 123 and is attached at a face (i.e. bottom surface) of substrate 700, now inhale vacuum equipment 122 in work, produce negative pressure, vacuum cup 120 is driven to decline lowering or hoisting gear 110 after glass substrate 700 surface being adsorbed on disk body 121 tightly, system controls the driving motor 210 of pay-off 200 and works, screw mandrel 220 is driven to rotate and then drive feeding device 100 to move ahead along guide rail 230, substrate 700 and feeding device 100 are delivered to Working position simultaneously, now inhale vacuum equipment 122 to quit work, after vacuum cup 120 decontrols glass substrate, feeding device 100 is drawn meeting original position by pay-off 200, carry out the action of feeding and feeding next time.
It is above the feeding system 1 of substrate cut described in the present embodiment, based on above-mentioned feeding system, the present embodiment can provide a kind of substrate cut machine simultaneously, it includes above-mentioned feeding system 1, in the present embodiment, and substrate cut machine, except glass substrate is thought, for adopting some other substrate for display device, such as plastic construction can also.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, it is impossible to assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, it is also possible to make some simple deduction or replace, protection scope of the present invention all should be considered as belonging to.

Claims (9)

1. the feeding system for substrate processing, it is characterised in that including:
Feeding device (100), it includes lowering or hoisting gear (110) and is arranged on the vacuum cup (120) of described lowering or hoisting gear (110) one end, described lowering or hoisting gear (110), for described vacuum cup is pushed to the substrate (700) of feed entrance point, adsorbs described substrate (700) by vacuum cup (120) and makes it be fixed on described vacuum cup (700) to carry out feeding；
Pay-off (200), it is connected with described feeding device (100), for the substrate (700) of described feeding device (100) and absorption thereof is pushed to Working position；
Described pay-off (200) including: screw rod (220), is used for driving the driving motor (210) of described screw rod (220) and a guide rail (230)；Described feeding device (100) is provided with the nut (130) being connected with described screw rod (220), and one is arranged on slide block (150) on described guide rail (230).
2. the feeding system for substrate processing as claimed in claim 1, it is characterized in that, described vacuum cup (120) including: a disk body (121) and be arranged on the suction vacuum equipment (122) of disk body (121), described disk body (121) surface configuration has multiple pore (123), and described pore (123) connects with described suction vacuum equipment (122).
3. the feeding system for substrate processing as claimed in claim 1, it is characterized in that, described lowering or hoisting gear (110) includes a pusher cylinder (111), and described vacuum cup (120) is arranged on the push rod (112) of described pusher cylinder (111).
4. the feeding system for substrate processing as claimed in claim 1, it is characterised in that described screw rod (220) and described driving motor (210) direct connection.
5. a substrate cut machine, including feeding system (1), it is characterised in that described feeding system (1) including:
Feeding device (100), it includes lowering or hoisting gear (110) and is arranged on the vacuum cup (120) of described lowering or hoisting gear one end, described lowering or hoisting gear (110), for described vacuum cup is pushed to the substrate (700) of feed entrance point, adsorbs described substrate (700) by vacuum cup (120) and makes it be fixed on described vacuum cup (700) to carry out feeding；
Pay-off (200), it is connected with described feeding device (100), for the substrate (700) of described feeding device (100) and absorption thereof is pushed to Working position.
6. substrate cut machine as claimed in claim 5, it is characterized in that, described vacuum cup (120) including: a disk body (121) and be arranged on the suction vacuum equipment (122) of disk body (121), described disk body (121) surface configuration has multiple pore (123), and described pore (123) connects with described suction vacuum equipment (122).
7. substrate cut machine as claimed in claim 5, it is characterized in that, described lowering or hoisting gear (110) includes a pusher cylinder (111), and described vacuum cup (120) is arranged on the push rod (112) of described pusher cylinder (111).
8. substrate cut machine as claimed in claim 5, it is characterized in that, described pay-off (200) including: screw rod (220), is used for driving the driving motor (210) of described screw rod (220) and a guide rail (230)；Described feeding device (100) is provided with the nut (130) being connected with described screw rod (220), and one is arranged on slide block (150) on described guide rail (230).
9. substrate cut machine as claimed in claim 8, it is characterised in that described screw rod (220) and described driving motor (210) direct connection.
CN201310441730.0A 2013-09-25 2013-09-25 Feeding system and substrate cut machine for substrate processing Active CN103496845B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310441730.0A CN103496845B (en) 2013-09-25 2013-09-25 Feeding system and substrate cut machine for substrate processing
PCT/CN2013/085629 WO2015043026A1 (en) 2013-09-25 2013-10-22 Feeding system for substrate processing and substrate cutting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310441730.0A CN103496845B (en) 2013-09-25 2013-09-25 Feeding system and substrate cut machine for substrate processing

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CN103496845A CN103496845A (en) 2014-01-08
CN103496845B true CN103496845B (en) 2016-06-29

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WO (1) WO2015043026A1 (en)

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CN107475675A (en) * 2017-09-11 2017-12-15 武汉华星光电半导体显示技术有限公司 evaporator
CN109399901B (en) * 2018-10-09 2021-09-10 成都中光电科技有限公司 Split type pushing device
CN109437538B (en) * 2018-11-09 2021-06-04 嵊州市法帝电器有限公司 Cutting device is used in processing production of lampblack absorber front glass panel
CN110407451B (en) * 2019-07-12 2022-08-09 大族激光科技产业集团股份有限公司 Glass cutting carrying platform and using method thereof
CN111072271A (en) * 2019-12-10 2020-04-28 深圳市华星光电半导体显示技术有限公司 Material feeding equipment and substrate cutting machine

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CN103303676A (en) * 2013-06-18 2013-09-18 深圳市华星光电技术有限公司 Automation equipment for picking and placing large-sized liquid crystal substrate

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