CN103496845B - Feeding system and substrate cut machine for substrate processing - Google Patents

Feeding system and substrate cut machine for substrate processing Download PDF

Info

Publication number
CN103496845B
CN103496845B CN201310441730.0A CN201310441730A CN103496845B CN 103496845 B CN103496845 B CN 103496845B CN 201310441730 A CN201310441730 A CN 201310441730A CN 103496845 B CN103496845 B CN 103496845B
Authority
CN
China
Prior art keywords
feeding
substrate
vacuum cup
lowering
hoisting gear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310441730.0A
Other languages
Chinese (zh)
Other versions
CN103496845A (en
Inventor
庞春明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to CN201310441730.0A priority Critical patent/CN103496845B/en
Publication of CN103496845A publication Critical patent/CN103496845A/en
Application granted granted Critical
Publication of CN103496845B publication Critical patent/CN103496845B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations

Abstract

A kind of feeding system for substrate processing of disclosure and substrate cut machine: including: feeding device, it includes lowering or hoisting gear and is arranged on described lowering or hoisting gear one end vacuum cup, described lowering or hoisting gear pushes described vacuum cup the substrate of feed entrance point to, adsorbs described substrate by vacuum cup and makes it be fixed on described vacuum cup to carry out feeding;Also including pay-off, it is connected with described feeding device, in order to the substrate of described feeding device and absorption thereof is pushed to Working position.What adopt due to vacuum cup is that a face of sorbing substrate is to realize feeding, mode relative to chuck feeding, it is not necessary to adjust the clamping spacing of chuck, safeguards simple, additionally, owing to there is no chuck, thus also without the abrasion of pad, vacuum cup will not cause capturing unsuccessfully because of the abrasion of pad, which improves the operational efficiency of equipment and production capacity, it addition, also a saving the pad being largely used on chuck, therefore also save substantial amounts of cost.

Description

Feeding system and substrate cut machine for substrate processing
Technical field
The present invention relates to display device and manufacture field, in particular, relate to a kind of feeding system for substrate processing and substrate cut machine.
Background technology
The cutting of glass substrate is the critical processes of liquid crystal panel, at present, in the cutting process of glass substrate, as shown in Figure 1, glass substrate in cutting machine material mode of giving before cutting is by material chuck 11(Chuck) offal timber (between display screen or the glass at display screen edge be called offal timber) at glass substrate 700 edge is gripped at feed entrance point, from whole group of cylinder 10 or motor driving cutting machine to material chuck 11(Chuck) thus driving full wafer glass substrate 700 to be transmitted to toward downstream Working position, being provided with roller 15 bottom glass substrate 700 makes glass substrate steadily deliver to Working position.
Owing to the thickness of current glass substrate is unique, use above-mentioned will for the glass substrate of different-thickness through usually adjusting the clamping spacing of chuck to the words of material in gripping mode to material chuck 11, process is comparatively laborious.As shown in Figure 2, to material chuck 11 is additionally provided with buffering spacer simultaneously, along with board uses the time more and more longer, playing that the pad 13 of cushioning effect weares and teares to material chuck 11 surface also can be day by day serious, so can cause that board occurs abnormal, thus increase the frequency adjusting pad 13 to eliminate exception, and pad price is higher, the quantity of one board pad 13 altogether is more, not only increases person works and changes (loading) workload, too increases production cost and also results in production capacity decline simultaneously.
Summary of the invention
It is high that the technical problem to be solved is to provide a kind of efficiency, and what cost was low is used for feeding system and the substrate cut machine of substrate processing.
It is an object of the invention to be achieved through the following technical solutions: a kind of feeding system for substrate processing, including:
Feeding device, it includes lowering or hoisting gear and is arranged on the vacuum cup of described lowering or hoisting gear one end, described lowering or hoisting gear, for described vacuum cup is pushed to the substrate of feed entrance point, adsorbs described substrate by vacuum cup and makes it be fixed on described vacuum cup to carry out feeding;
Pay-off, it is connected with described feeding device, for the substrate of described feeding device and absorption thereof is pushed to Working position.
Preferably, described vacuum cup includes: a disk body and be arranged on the suction vacuum equipment of disk body, and described disc surfaces is provided with multiple pore, and described pore connects with described suction vacuum equipment.Directly arranging pore on disk body, and connect with inhaling vacuum equipment, its structure is relatively simple, it is not necessary to arrange multiple suction vacuum head, less costly.
Preferably, described lowering or hoisting gear includes a pusher cylinder, and described vacuum cup is arranged on the push rod of described pusher cylinder.The mode structure that pusher cylinder pushes is relatively simple, and cost is low.
Preferably, described pay-off includes: screw rod, for driving driving motor and a guide rail of described screw rod;Described feeding device is provided with the nut being connected with described screw rod, and one is arranged on slide block on described guide rail.The mode degree of accuracy that bolt and nut drives is higher, pushes process relatively more steady, and structure is also relatively simple.
Preferably, described screw rod and described driving motor direct connection.
A kind of substrate cut machine, including feeding system, described feeding system includes:
Feeding device, it includes lowering or hoisting gear and is arranged on the vacuum cup of described lowering or hoisting gear one end, described lowering or hoisting gear, for described vacuum cup is pushed to the substrate of feed entrance point, adsorbs described substrate by vacuum cup and makes it be fixed on described vacuum cup to carry out feeding;
Pay-off, it is connected with described feeding device, for the substrate of described feeding device and absorption thereof is pushed to Working position.
Preferably, described vacuum cup includes: a disk body and be arranged on the suction vacuum equipment of disk body, and described disc surfaces is provided with multiple pore, and described pore connects with described suction vacuum equipment.Directly arranging pore on disk body, and connect with inhaling vacuum equipment, its structure is relatively simple, it is not necessary to arrange multiple suction vacuum head, less costly.
Preferably, described lowering or hoisting gear includes a pusher cylinder, and described vacuum cup is arranged on the push rod of described pusher cylinder.The mode structure that pusher cylinder pushes is relatively simple, and cost is low.
Preferably, described pay-off includes: screw rod, for driving driving motor and a guide rail of described screw rod;Described feeding device is provided with the nut being connected with described screw rod, and one is arranged on slide block on described guide rail.The mode degree of accuracy that bolt and nut drives is higher, pushes process relatively more steady, and structure is also relatively simple.
Preferably, described screw rod and described driving motor direct connection.
The feeding device of the feeding system that substrate is processed by the present invention have employed vacuum cup and carries out absorption feeding, and realize reclaiming process by lowering or hoisting gear propelling movement vacuum cup, what adopt due to vacuum cup is that a face of sorbing substrate is to realize feeding, mode relative to chuck feeding, need not differ for substrate thickness and adjust the clamping spacing of chuck, safeguard fairly simple, decrease the operating pressure of staff, additionally, owing to there is no chuck, thus also without the abrasion of pad, that is, vacuum cup will not cause capturing unsuccessfully because of the abrasion of pad, which improves the operational efficiency of equipment and production capacity, additionally, also a saving the pad being largely used on chuck, therefore substantial amounts of cost is also saved.
Accompanying drawing explanation
Fig. 1 is the feeding system structural representation being currently used for substrate processing,
Fig. 2 is the chuck structure schematic diagram of the feeding system being currently used for substrate processing,
Fig. 3 is the feeding system structural representation that the embodiment of the present invention is processed for substrate,
Fig. 4 is the vacuum cup body structure schematic diagram of the feeding system that the embodiment of the present invention is processed for substrate.
Wherein, in Fig. 1-4: 1, feeding system, 10, cylinder, 100, feeding device, 110, lowering or hoisting gear, 11, to material chuck, 13, pad, 111, pusher cylinder, 112, push rod, 120, vacuum cup, 121, disk body, 122, inhale vacuum equipment, 123, pore;130, nut, 15, roller;150, slide block, 200, pay-off, 210, drive motor, 220, screw rod, 230, guide rail, 700, substrate.
Detailed description of the invention
Below in conjunction with accompanying drawing and preferred embodiment, the invention will be further described.
As shown in Figure 3, present embodiments provide a specific embodiment of the feeding system 1 processed for substrate, comprising: feeding device 100, this feeding device 100 includes lowering or hoisting gear 110 and is arranged on described lowering or hoisting gear 110 one end vacuum cup 120, described lowering or hoisting gear 110, for pushing to bottom the substrate 700 of feed entrance point by described vacuum cup, adsorbs described substrate 700 by vacuum cup 120 and makes it be fixed on described vacuum cup 700 to carry out feeding;This feeding system 1 is additionally provided with a pay-off 200 simultaneously, and it is connected with described feeding device 100, in order to described feeding device 100 and substrate thereon 700 are pushed to Working position.What adopt due to vacuum cup 120 is that a face (i.e. bottom surface) of sorbing substrate 700 realizes feeding, relative to adopting to the mode of material chuck 11 feeding as shown in Figure 1 or 2, need not adjust to the clamping spacing of material chuck 11 for substrate 700 variable thickness, safeguard fairly simple, decrease the operating pressure of staff, also improve operational efficiency and the production capacity of equipment, additionally simultaneously, also a saving the pad being largely used on chuck, therefore also save substantial amounts of cost.
As shown in Figure 3, vacuum cup 120 includes: a disk body 121 and be arranged on the suction vacuum equipment 122 bottom disk body 121, shown in Fig. 4, disk body 121 surface configuration has multiple pore 123, described pore 123 connects with described suction vacuum equipment 122, concrete, this suction vacuum equipment 122 is equipped with vacuum line in disk body 121 and connects with the pore on described disk body 121.Vacuum cup can also be arranged in a matrix composition by multiple little suckers (size is suitable with described pore), but its structure is complex, and cost is of a relatively high.
Lowering or hoisting gear 110 includes a pusher cylinder 111, and described vacuum cup 120 is arranged on the push rod 112 of described pusher cylinder 111.Certainly, the effect of pusher cylinder 111 is to push vacuum cup 120 to arrive feed entrance point, it it is the motion of straight line, this kind of mode can be substituted by multiple driving mechanism, such as modes such as crank block, cam, screw mandrels, its structure is not unique but adopts the mode of cylinder, and its structure is relatively simple, and cost is relatively low.
Pay-off 200 includes: screw rod 220, for driving driving motor 210 and a guide rail 230 of described screw rod 220, screw rod 220 with drive motor 210 direct connection;Described feeding device 100 is provided with the nut 130 being connected with described screw rod 220, and one is arranged on slide block 150 on described guide rail 230, is undertaken leading and support described feeding device 100 by guide rail 230.Same, in the present embodiment, pay-off feeding process is also rectilinear motion, above-mentioned mechanism can also be replaced by alternate manner, if the most direct mode is to adopt cylinder to replace, but, the mode that bolt and nut drives, the relatively flat stability of its motor process is higher, and structure is also fairly simple.
When cutting machine works, system controls the pusher cylinder 111 of lowering or hoisting gear 110 and vacuum cup 120 is pushed to feed entrance point, disk body 121 is provided with the surface of described pore 123 and is attached at a face (i.e. bottom surface) of substrate 700, now inhale vacuum equipment 122 in work, produce negative pressure, vacuum cup 120 is driven to decline lowering or hoisting gear 110 after glass substrate 700 surface being adsorbed on disk body 121 tightly, system controls the driving motor 210 of pay-off 200 and works, screw mandrel 220 is driven to rotate and then drive feeding device 100 to move ahead along guide rail 230, substrate 700 and feeding device 100 are delivered to Working position simultaneously, now inhale vacuum equipment 122 to quit work, after vacuum cup 120 decontrols glass substrate, feeding device 100 is drawn meeting original position by pay-off 200, carry out the action of feeding and feeding next time.
It is above the feeding system 1 of substrate cut described in the present embodiment, based on above-mentioned feeding system, the present embodiment can provide a kind of substrate cut machine simultaneously, it includes above-mentioned feeding system 1, in the present embodiment, and substrate cut machine, except glass substrate is thought, for adopting some other substrate for display device, such as plastic construction can also.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, it is impossible to assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, it is also possible to make some simple deduction or replace, protection scope of the present invention all should be considered as belonging to.

Claims (9)

1. the feeding system for substrate processing, it is characterised in that including:
Feeding device (100), it includes lowering or hoisting gear (110) and is arranged on the vacuum cup (120) of described lowering or hoisting gear (110) one end, described lowering or hoisting gear (110), for described vacuum cup is pushed to the substrate (700) of feed entrance point, adsorbs described substrate (700) by vacuum cup (120) and makes it be fixed on described vacuum cup (700) to carry out feeding;
Pay-off (200), it is connected with described feeding device (100), for the substrate (700) of described feeding device (100) and absorption thereof is pushed to Working position;
Described pay-off (200) including: screw rod (220), is used for driving the driving motor (210) of described screw rod (220) and a guide rail (230);Described feeding device (100) is provided with the nut (130) being connected with described screw rod (220), and one is arranged on slide block (150) on described guide rail (230).
2. the feeding system for substrate processing as claimed in claim 1, it is characterized in that, described vacuum cup (120) including: a disk body (121) and be arranged on the suction vacuum equipment (122) of disk body (121), described disk body (121) surface configuration has multiple pore (123), and described pore (123) connects with described suction vacuum equipment (122).
3. the feeding system for substrate processing as claimed in claim 1, it is characterized in that, described lowering or hoisting gear (110) includes a pusher cylinder (111), and described vacuum cup (120) is arranged on the push rod (112) of described pusher cylinder (111).
4. the feeding system for substrate processing as claimed in claim 1, it is characterised in that described screw rod (220) and described driving motor (210) direct connection.
5. a substrate cut machine, including feeding system (1), it is characterised in that described feeding system (1) including:
Feeding device (100), it includes lowering or hoisting gear (110) and is arranged on the vacuum cup (120) of described lowering or hoisting gear one end, described lowering or hoisting gear (110), for described vacuum cup is pushed to the substrate (700) of feed entrance point, adsorbs described substrate (700) by vacuum cup (120) and makes it be fixed on described vacuum cup (700) to carry out feeding;
Pay-off (200), it is connected with described feeding device (100), for the substrate (700) of described feeding device (100) and absorption thereof is pushed to Working position.
6. substrate cut machine as claimed in claim 5, it is characterized in that, described vacuum cup (120) including: a disk body (121) and be arranged on the suction vacuum equipment (122) of disk body (121), described disk body (121) surface configuration has multiple pore (123), and described pore (123) connects with described suction vacuum equipment (122).
7. substrate cut machine as claimed in claim 5, it is characterized in that, described lowering or hoisting gear (110) includes a pusher cylinder (111), and described vacuum cup (120) is arranged on the push rod (112) of described pusher cylinder (111).
8. substrate cut machine as claimed in claim 5, it is characterized in that, described pay-off (200) including: screw rod (220), is used for driving the driving motor (210) of described screw rod (220) and a guide rail (230);Described feeding device (100) is provided with the nut (130) being connected with described screw rod (220), and one is arranged on slide block (150) on described guide rail (230).
9. substrate cut machine as claimed in claim 8, it is characterised in that described screw rod (220) and described driving motor (210) direct connection.
CN201310441730.0A 2013-09-25 2013-09-25 Feeding system and substrate cut machine for substrate processing Active CN103496845B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310441730.0A CN103496845B (en) 2013-09-25 2013-09-25 Feeding system and substrate cut machine for substrate processing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310441730.0A CN103496845B (en) 2013-09-25 2013-09-25 Feeding system and substrate cut machine for substrate processing
PCT/CN2013/085629 WO2015043026A1 (en) 2013-09-25 2013-10-22 Feeding system for substrate processing and substrate cutting machine

Publications (2)

Publication Number Publication Date
CN103496845A CN103496845A (en) 2014-01-08
CN103496845B true CN103496845B (en) 2016-06-29

Family

ID=49862136

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310441730.0A Active CN103496845B (en) 2013-09-25 2013-09-25 Feeding system and substrate cut machine for substrate processing

Country Status (2)

Country Link
CN (1) CN103496845B (en)
WO (1) WO2015043026A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107475675A (en) * 2017-09-11 2017-12-15 武汉华星光电半导体显示技术有限公司 evaporator

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2101043U (en) * 1991-09-09 1992-04-08 赵宇 Glass cutting conveying device
TW422808B (en) * 1998-05-20 2001-02-21 Applied Komatsu Technology Inc Substrate transfer shuttle
CN201165488Y (en) * 2008-02-28 2008-12-17 王伟中 Processing worktable for glass
CN201350632Y (en) * 2008-12-23 2009-11-25 晶彩科技股份有限公司 Base plate adsorption device
CN102131739A (en) * 2008-08-22 2011-07-20 坂东机工株式会社 Method and apparatus for working glass plate
CN201980760U (en) * 2011-03-10 2011-09-21 李梦琪 Carrying device
EP2418180A1 (en) * 2009-04-10 2012-02-15 Bando Kiko Co., Ltd Glass plate scribing method and scribing device
CN202529984U (en) * 2012-01-19 2012-11-14 三河华辰运通玻璃机电工程技术有限公司 Work platform for processing glass
CN103108841A (en) * 2010-10-08 2013-05-15 川崎重工业株式会社 Plate glass scoring and cutting device
CN103303676A (en) * 2013-06-18 2013-09-18 深圳市华星光电技术有限公司 Automation equipment for picking and placing large-sized liquid crystal substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201115313Y (en) * 2007-06-26 2008-09-10 易发精机(上海)有限公司 A LCD panel feeding device for electronic product assembly line
JP5470460B2 (en) * 2010-07-27 2014-04-16 株式会社アルバック Substrate transfer method and substrate transfer system
CN201952004U (en) * 2011-02-23 2011-08-31 云南众诚士德柔性自动化设备有限公司 Negative-pressure sucking type plate grabbing and transporting device
CN202829027U (en) * 2012-08-10 2013-03-27 中山市携特塑料板材有限公司 Manipulator for grabbing smooth panel

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2101043U (en) * 1991-09-09 1992-04-08 赵宇 Glass cutting conveying device
TW422808B (en) * 1998-05-20 2001-02-21 Applied Komatsu Technology Inc Substrate transfer shuttle
CN201165488Y (en) * 2008-02-28 2008-12-17 王伟中 Processing worktable for glass
CN102131739A (en) * 2008-08-22 2011-07-20 坂东机工株式会社 Method and apparatus for working glass plate
CN201350632Y (en) * 2008-12-23 2009-11-25 晶彩科技股份有限公司 Base plate adsorption device
EP2418180A1 (en) * 2009-04-10 2012-02-15 Bando Kiko Co., Ltd Glass plate scribing method and scribing device
CN102387999A (en) * 2009-04-10 2012-03-21 坂东机工株式会社 Glass plate scribing method and scribing device
CN103108841A (en) * 2010-10-08 2013-05-15 川崎重工业株式会社 Plate glass scoring and cutting device
CN201980760U (en) * 2011-03-10 2011-09-21 李梦琪 Carrying device
CN202529984U (en) * 2012-01-19 2012-11-14 三河华辰运通玻璃机电工程技术有限公司 Work platform for processing glass
CN103303676A (en) * 2013-06-18 2013-09-18 深圳市华星光电技术有限公司 Automation equipment for picking and placing large-sized liquid crystal substrate

Also Published As

Publication number Publication date
CN103496845A (en) 2014-01-08
WO2015043026A1 (en) 2015-04-02

Similar Documents

Publication Publication Date Title
JP2014511277A (en) Electrode sheet laser cutting machine
CN205774100U (en) A kind of glass-painting circle device
CN204603439U (en) Horizontal type thin-wall metal tube fixed-length cutting machine
CN103481290B (en) A kind of robot palletizer sucking disc tongs device
CN204159560U (en) Automatic substandard products detect sorting equipment
CN105364749B (en) A kind of detent mechanism
CN201291630Y (en) Film-facing machine of automatically aligning
CN2684962Y (en) Automatic feeding machine for flat iron sheet
CN201145792Y (en) Apparatus for fetching and laying liquid crystal display screen
CN106004002B (en) A kind of backlight coat peeling unit
CN202076306U (en) Automatic silicon overturn and folding double-sheet inserting machine
CN203697120U (en) Cutting equipment
CN204641013U (en) Polarized light sheet pasting device
CN104441065B (en) It is applicable to the cutting cutter of rule sheet material
CN204176571U (en) For assembling the equipment of light guide plate and lamp bar
CN107697670A (en) Large scale optical film automatic charging device
CN105375058B (en) Battery core glue plastering machine
CN206157045U (en) Glass cutting device
CN102951482A (en) Film feeding mechanism of lamination wrapping machine
CN204078688U (en) A kind of Handling device of silica crucible
CN103979327A (en) Wrapping paper conveyer
CN203751861U (en) Axial-length two-end-surface grinding machine of tile-shaped magnet
CN203449318U (en) Stacking robot sucker gripper device
CN105313088A (en) Clamping and turning mechanism
CN201608228U (en) Double-surface gum tape adhering device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant