CN103492396A - 硅氧烷化合物及其固化物 - Google Patents
硅氧烷化合物及其固化物 Download PDFInfo
- Publication number
- CN103492396A CN103492396A CN201280018918.8A CN201280018918A CN103492396A CN 103492396 A CN103492396 A CN 103492396A CN 201280018918 A CN201280018918 A CN 201280018918A CN 103492396 A CN103492396 A CN 103492396A
- Authority
- CN
- China
- Prior art keywords
- group
- siloxane compound
- represented
- cured product
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/476—Organic materials comprising silicon
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F30/00—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F30/04—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F30/08—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F38/00—Homopolymers and copolymers of compounds having one or more carbon-to-carbon triple bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Silicon Polymers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Sealing Material Composition (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-094194 | 2011-04-20 | ||
| JP2011094194 | 2011-04-20 | ||
| JP2012-090666 | 2012-04-12 | ||
| JP2012090666A JP2012232975A (ja) | 2011-04-20 | 2012-04-12 | シロキサン化合物およびその硬化物 |
| PCT/JP2012/060314 WO2012144481A1 (ja) | 2011-04-20 | 2012-04-17 | シロキサン化合物およびその硬化物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103492396A true CN103492396A (zh) | 2014-01-01 |
Family
ID=47041587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280018918.8A Pending CN103492396A (zh) | 2011-04-20 | 2012-04-17 | 硅氧烷化合物及其固化物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20140046014A1 (https=) |
| JP (1) | JP2012232975A (https=) |
| KR (1) | KR20130140210A (https=) |
| CN (1) | CN103492396A (https=) |
| DE (1) | DE112012001421T5 (https=) |
| WO (1) | WO2012144481A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108299645A (zh) * | 2018-02-05 | 2018-07-20 | 中国科学院上海有机化学研究所 | 可直接热固化的有机硅氧烷的制备和应用 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105593265B (zh) * | 2013-09-27 | 2019-01-04 | Rimtec株式会社 | 降冰片烯类交联聚合物及其制造方法 |
| JP2017145229A (ja) * | 2016-02-19 | 2017-08-24 | 国立大学法人群馬大学 | ルイス酸を用いた環状シロキサンの製造方法 |
| CN107987278B (zh) * | 2017-11-14 | 2021-03-30 | 复旦大学 | 一种苯并环丁烯官能化有机硅树脂及其制备方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1616468A (zh) * | 2003-06-30 | 2005-05-18 | 三星电子株式会社 | 多官能环状硅氧烷化合物和由该化合物制备的硅氧烷基聚合物和用该聚合物制备介电薄膜的方法 |
| JP2007023163A (ja) * | 2005-07-15 | 2007-02-01 | Fujifilm Corp | 膜形成用組成物、絶縁膜、およびその製造方法 |
| CN101223181A (zh) * | 2006-03-02 | 2008-07-16 | 设计分子有限公司 | 含有环硅氧烷的粘合剂组合物 |
| US20090252975A1 (en) * | 2008-04-04 | 2009-10-08 | Samsung Electronics Co., Ltd. | Protective film and encapsulation material comprising the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4414375A (en) * | 1980-09-02 | 1983-11-08 | Neefe Russell A | Oxygen permeable contact lens material comprising copolymers of multifunctional siloxanyl alkylesters |
| JP2937622B2 (ja) * | 1992-05-25 | 1999-08-23 | 北辰工業株式会社 | 定着ロール |
| JPH0853622A (ja) * | 1994-06-07 | 1996-02-27 | Shin Etsu Chem Co Ltd | シリコーンゲル組成物 |
| US5599894A (en) * | 1994-06-07 | 1997-02-04 | Shin-Etsu Chemical Co., Ltd. | Silicone gel compositions |
| JP3427713B2 (ja) | 1997-01-22 | 2003-07-22 | 株式会社日立製作所 | 樹脂封止型半導体装置およびその製造方法 |
| US6284906B1 (en) * | 1999-10-12 | 2001-09-04 | University Of Southern California | Cyclotrisiloxanes, new siloxane polymers and their preparation |
| JP4256756B2 (ja) | 2002-09-30 | 2009-04-22 | 新日鐵化学株式会社 | 官能基を有するかご型シルセスキオキサン樹脂の製造方法 |
| JP2007015991A (ja) | 2005-07-08 | 2007-01-25 | Tokyo Univ Of Science | かご状シルセスキオキサンの製造方法 |
| US20090171058A1 (en) * | 2007-12-31 | 2009-07-02 | John Kilgour | Low temperature platinum-vinylpolysiloxane hydrosilylation catalyst |
| JP2009191024A (ja) | 2008-02-14 | 2009-08-27 | Tatsuya Okubo | かご型シロキサン化合物 |
| JP2009269820A (ja) | 2008-04-30 | 2009-11-19 | Showa Denko Kk | かご型シロキサン化合物の製造方法 |
| JP5278040B2 (ja) * | 2009-02-27 | 2013-09-04 | 信越化学工業株式会社 | 嵩高い置換基を有するシロキシ基含有シリル(メタ)アクリレート化合物及びその製造方法 |
-
2012
- 2012-04-12 JP JP2012090666A patent/JP2012232975A/ja active Pending
- 2012-04-17 KR KR1020137030819A patent/KR20130140210A/ko not_active Ceased
- 2012-04-17 CN CN201280018918.8A patent/CN103492396A/zh active Pending
- 2012-04-17 DE DE112012001421T patent/DE112012001421T5/de not_active Ceased
- 2012-04-17 US US14/112,866 patent/US20140046014A1/en not_active Abandoned
- 2012-04-17 WO PCT/JP2012/060314 patent/WO2012144481A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1616468A (zh) * | 2003-06-30 | 2005-05-18 | 三星电子株式会社 | 多官能环状硅氧烷化合物和由该化合物制备的硅氧烷基聚合物和用该聚合物制备介电薄膜的方法 |
| JP2007023163A (ja) * | 2005-07-15 | 2007-02-01 | Fujifilm Corp | 膜形成用組成物、絶縁膜、およびその製造方法 |
| CN101223181A (zh) * | 2006-03-02 | 2008-07-16 | 设计分子有限公司 | 含有环硅氧烷的粘合剂组合物 |
| US20090252975A1 (en) * | 2008-04-04 | 2009-10-08 | Samsung Electronics Co., Ltd. | Protective film and encapsulation material comprising the same |
Non-Patent Citations (3)
| Title |
|---|
| G. CAI ET AL: "Preparation and reactivity of polyfunctional six- and eight-membered cyclic silicates", 《JOURNAL OF ORGANOMETALLIC CHEMISTRY》, vol. 689, no. 3, 10 December 2003 (2003-12-10), pages 689 - 693, XP004487861, DOI: 10.1016/j.jorganchem.2003.11.001 * |
| N. BILOW ET AL: "Synthesis and Polymerization of 1,3-Bis-(2,3-epoxypropylphenyl)tetramethyldisiloxanes and Related Compounds", 《JOURNAL OF POLYMER SCIENCE: PART A-1》, vol. 5, no. 10, 31 October 1967 (1967-10-31), pages 2066 * |
| 邱玮丽: "《无机-有机杂化聚合物电解质的制备与电化学性能》", 《高分子学报》, vol. 4, no. 4, 31 August 2005 (2005-08-31) * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108299645A (zh) * | 2018-02-05 | 2018-07-20 | 中国科学院上海有机化学研究所 | 可直接热固化的有机硅氧烷的制备和应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140046014A1 (en) | 2014-02-13 |
| WO2012144481A1 (ja) | 2012-10-26 |
| JP2012232975A (ja) | 2012-11-29 |
| DE112012001421T5 (de) | 2013-12-24 |
| KR20130140210A (ko) | 2013-12-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140101 |