CN103464891A - Laser processing device and laser processing method - Google Patents
Laser processing device and laser processing method Download PDFInfo
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- CN103464891A CN103464891A CN2013102176812A CN201310217681A CN103464891A CN 103464891 A CN103464891 A CN 103464891A CN 2013102176812 A CN2013102176812 A CN 2013102176812A CN 201310217681 A CN201310217681 A CN 201310217681A CN 103464891 A CN103464891 A CN 103464891A
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Abstract
The invention provides a laser processing device and a laser processing method capable of further reducing the surface roughness during the three-dimensional processing procedure. According to the laser processing method, a plurality of processing layers are stacked up along the laser irradiation direction within a processing region, wherein the processing is carried out with the lattice points of virtual triangular lattices on the processing layers as pulse irradiation points. Among the plurality of processing layers, according to the processing sequence, three continuous processing layers, namely a first processing layer, a second processing layer and a third processing layer, are deemed as the layers for one processing cycle. A lattice point on the second processing layer is moved to one center of gravity of a triangle (P1) formed by the connection of three adjacent pulse irradiation points (P1) on the first processing layer to serve as a pulse irradiation point (P2). A lattice point on the third processing layer is moved to the other center of gravity of a second triangle (T1) formed by the connection of adjacent pulse irradiation points to serve as a pulse irradiation point (P3).
Description
Technical field
The present invention relates to a kind of laser processing device and laser processing of realizing three-dimensional processing by the decrease surface roughness.
Background technology
In the past, as one of method of utilizing laser to carry out three-dimensional configuration processing to material is known following method arranged: as shown in Figure 7, to from workpiece W, process the position of removing and be divided into the stacked a plurality of layers (the following machined layer LY that also is called) of the direction vertical at the direction of illumination with laser L, from the machined layer LY of that side of surface near workpiece W, start to process successively removal (hereinafter referred to as layer processing method) (referring to Patent Document 1).Although this layer of processing method can process more random form accurately, but concavo-convex due to the fine processing trace (hereinafter referred to as the pulse trace) caused due to the pulse produced on machined surface by laser L, so the surface roughness of machined surface and grinding etc. are compared and can be become large.
Therefore, in order to reduce the surface roughness of machined surface, can take following means: the distribution by controlling regularly the irradiation position (hereinafter referred to as the pulse irradiation point) to the laser of machined layer pulse irradiation (the following pulse irradiation point that also is called distributes), thereby suppress to be caused by the pulse trace concavo-convex.For example, in patent documentation 2, the interval of the scan line of the laser that control is scanned etc., for example, with square lattice shape distribution pulse irradiation point.
Patent documentation 1: Japanese Patent Publication 2012-16735 communique
Patent documentation 2: Japanese Patent Publication 2007-229756 communique
Left over following problem in above-mentioned conventional art.
In the processing method of putting down in writing in patent documentation 2, there is the situation of the surface roughness of Laser Processing face that fully do not reduce.Its reason is, do not consider that the coincidence of pulse irradiation point between layers distributes, and therefore results from concavo-convex in layer and piles up between the layers, sometimes also obvious especially, and likely when increasing working depth surface roughness will increase.And, more dwindle the distance between the adjacent pulse point of irradiation, layer internal cause pulse trace causes concavo-convexly just becomes more obvious, more make the surface roughness step-down in a layer, this just is equivalent to increase the thickness of layer, its result becomes the difference of height of larger notch cuttype when the face to tilting with respect to laser axis is processed to form, so has the problem of the surface roughness increase of the face that makes on the contrary to tilt with respect to laser axis.
Summary of the invention
The present invention completes in view of above-mentioned problem, and its purpose is to provide a kind of laser processing device and laser processing that can further reduce surface roughness in three-dimensional processing.
The present invention adopts following structure in order to solve above-mentioned problem.That is, laser processing device of the present invention, it wherein, possesses for by workpiece being irradiated to the processing unit (plant) that laser carries out shape formation: laser radiation mechanism, irradiate the line scanning of going forward side by side of described laser with constant repetition rate to described workpiece, position adjusting mechanism, can keep described workpiece to be adjusted the relative position relation of this workpiece and described laser, and control part, control these mechanisms, described machining area is set as piling up along the direction of illumination of described laser the zone of multilayer processing layer when carrying out the scanning of described laser, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to described laser and removing each described machined layer, the lattice point of this control part by the virtual triangular lattice that will set described machined layer irradiates described laser as pulse irradiation point to be processed, in the described machined layer of multilayer, to using processing sequence as 3 the continuous layers from the 1st layer to the 3rd layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, in described the 2nd layer, the lattice point of described triangular lattice is moved to adjacent in linking described the 1st layer 3 described pulse irradiation points and in the triangle of formation a wherein side the center of gravity in adjacent two triangles be used as the pulse irradiation point, in described the 3rd layer, the center of gravity of the lattice point of described triangular lattice being moved to the opposing party in described adjacent two triangles is used as the pulse irradiation point.In addition, at this, triangular lattice is defined as: equilateral triangle, right angled triangle, the equilateral triangle that 3 hithermost lattice points form or do not belong to this any general leg-of-mutton shape wherein, and identical shape is paved with in the plane by it to have no ground, gap.In addition, for example, when hithermost 4 lattice points are square, usually mostly be considered as square lattice, but be considered as at this set that 2 acute angles are the right angled triangle of 45 °, and it is included in above-mentioned triangular lattice.
And, laser processing of the present invention, it is the processing method by workpiece irradiation laser is carried out to shape formation, wherein, have: the Ear Mucosa Treated by He Ne Laser Irradiation operation, with constant repetition rate, described workpiece is irradiated to the line scanning of going forward side by side of described laser in this operation, and operation is adjusted in position, in this operation, can keep described workpiece to be adjusted the relative position relation of this workpiece and described laser, when carrying out the scanning of described laser, described machining area is set as piling up along the direction of illumination of described laser to the zone of multilayer processing layer, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to described laser and removing each described machined layer, irradiating described laser on the lattice point of the virtual grid that described machined layer is set is processed, in the described machined layer of multilayer, to using processing sequence as 3 the continuous layers from the 1st layer to the 3rd layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, in described the 2nd layer, the lattice point of described triangular lattice is moved to adjacent in linking described the 1st layer 3 described pulse irradiation points and in the triangle of formation a wherein side the center of gravity in adjacent two triangles be used as the pulse irradiation point, in described the 3rd layer, the center of gravity of the lattice point of described triangular lattice being moved to the opposing party in described adjacent two triangles is used as the pulse irradiation point.
In these laser processing devices and laser processing, in the multilayer processing layer, to using processing sequence as 3 the continuous layers from the 1st layer to the 3rd layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, be used as the pulse irradiation point by the lattice point that moves respectively triangular lattice for the 2nd layer as mentioned above to the 3rd layer, come when stacked to compare with random mobile lattice point is pulse irradiation point in the x-y face triangular lattice thus, can reduce caused by the pulse trace concavo-convex.
In addition, laser processing device of the present invention, wherein, described control part is when repeating continuously described 1 cycle, take continuous 3 cycles carries out repetition as 1 unit, in the 2nd cycle in constituent parts, in described the 1st layer, by the lattice point of described triangular lattice move to link until in the 2nd triangle of 3 described pulse irradiation points adjacent one another are of the upper cycle and formation a wherein side the center of gravity in two the 2nd triangles adjacent one another are be used as the pulse irradiation point, in the 3rd cycle of constituent parts, in described the 1st layer, the center of gravity of the lattice point of described triangular lattice being moved to the opposing party in described adjacent two the 2nd triangles is used as the pulse irradiation point.
; in this laser processing device; while repeating continuously described 1 cycle; take continuous 3 cycles carries out repetition as 1 unit; in in constituent parts the 2nd and the 3rd cycle; in the 1st layer, the lattice point of described triangular lattice is moved to link until on cycle pulse irradiation point adjacent one another are and the 2nd adjacent leg-of-mutton center of gravity that forms is used as the pulse irradiation point, so can further reduce concavo-convex.
In addition, in laser processing device of the present invention, preferably make described control part be set as last described machined layer by described the 3rd layer.
That is,, in this laser processing device, by being set as last machined layer by the 3rd layer, can make surface roughness become minimum.
Bring into play following effect according to the present invention.
; according to laser processing device involved in the present invention and laser processing; in the multilayer processing layer; to using processing sequence as 3 the continuous layers from the 1st layer to the 3rd layer as 1 cycle; at least comprise the layer that is equivalent to 1 cycle; be used as the pulse irradiation point by the lattice point that moves respectively triangular lattice for the 2nd layer as mentioned above to the 3rd layer; with random mobile lattice point is pulse irradiation point in the x-y face triangular lattice, come when stacked to compare thus; reduce by processing concavo-convex that trace causes, and can reduce the surface roughness of Laser Processing face.
So laser processing device of the present invention and laser processing are suitable for such as shape processing of the product with complicated three-dimensional shape that requires surface roughness Rz≤3 μ m etc.
The accompanying drawing explanation
Fig. 1 is in an embodiment of laser processing device involved in the present invention and laser processing, means the summary overall structure figure of laser processing device.
Fig. 2 means the key diagram based on the pulse irradiation point of the equilateral triangle grid to the 3rd layer (c) from the 1st layer (a) with process sequence in present embodiment.
Fig. 3 means the key diagram of the pulse irradiation point of the equilateral triangle grid based on from the 1st layer to the 9th layer with process sequence in present embodiment.
Fig. 4, as embodiment involved in the present invention, means the shape figure of the Laser Processing face of the simulated experiment result while by method of the present invention, the 1st layer (a) to the 3rd layer (c) being irradiated to laser.
Fig. 5, as comparative example involved in the present invention, means the shape figure of the Laser Processing face of the simulated experiment result while in mobile at random mode, the 1st layer (a) to the 3rd layer (c) being irradiated to laser.
Fig. 6 means in embodiment and comparative example involved in the present invention, the curve map of the practical laser processing experiment result that surface roughness changes along with the number of plies.
Fig. 7 means the key diagram of the laser processing method based on Laser Processing.
Symbol description
The 1-laser processing device, 2-laser radiation mechanism, 3-position adjusting mechanism, C-control part, the leg-of-mutton center of gravity of G1～G2-, L-laser, P1～P9-pulse irradiation point, W-workpiece.
The specific embodiment
Below, referring to figs. 1 to Fig. 3, one embodiment of laser processing device involved in the present invention and laser processing is described.
As shown in Figure 1, the laser processing device of present embodiment 1 is for irradiating to workpiece W the processing unit (plant) that laser L carries out shape formation, and it possesses: laser radiation mechanism 2, irradiate the laser L line scanning of going forward side by side with constant repetition rate to workpiece W; Position adjusting mechanism 3, can keep workpiece W to be adjusted the relative position relation of this workpiece W and laser L; And control part C, control these mechanisms, and machining area is set as piling up along the direction of illumination of laser L the zone of multilayer processing layer when carrying out the scanning of laser L, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to laser L and removing each machined layer.
Above-mentioned position adjusting mechanism 3 links following formation: X-axis objective table 4x can move on the directions X parallel with horizontal plane; Y-axis objective table 4y, be arranged at this X-axis objective table 4x upper and vertical and can move on the Y-direction parallel with horizontal plane with respect to directions X; And Z axis objective table 4z, be arranged at this Y-axis objective table 4y above and can move on the direction vertical with horizontal plane when can keeping workpiece W.
Above-mentioned laser radiation mechanism 2 possesses: LASER Light Source 5, vibrate by the laser L of the trigger signal pulse of Q-switch; Optical beam expander 6, will become certain diameter from the beam spread of the laser L of this LASER Light Source 5; Current scanning instrument 7, scanned the laser L from this optical beam expander 6; F-θ lens 8, carry out optically focused and shine on workpiece W the laser L from this current scanning instrument 7; And ccd video camera 9, for the Working position of confirming maintained workpiece W is taken.In addition, on the light path of optical beam expander 6 front and back, the opticses such as configuration speculum or wave plate are also harmless.
The light intensity distributions that the laser L penetrated by this laser radiation mechanism 2 is single mode and beam cross section is Gaussian shaped profile.
As above-mentioned LASER Light Source 5, can use the LASER Light Source that can irradiate the laser that any wavelength is 190～550nm, the LASER Light Source that has for example used in the present embodiment laser that the wavelength that can vibrate is 266nm to penetrate.
Above-mentioned current scanning instrument 7 be configured in Z axis objective table 4z directly over.And above-mentioned ccd video camera 9 is by 7 configurations of current scanning instrument.
As shown in Figure 2, above-mentioned control part C has following effect: the lattice point by the virtual triangular lattice that will set machined layer irradiates laser L as pulse irradiation point to be processed, in the multilayer processing layer, to using processing sequence as 3 the continuous layers from the 1st layer to the 3rd layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, in the 2nd layer, by the lattice point of triangular lattice move to link the 1st layer in 3 adjacent pulse irradiation point P1 and in the triangle T 1 that forms the center of gravity G1 of the side in adjacent two triangles be used as pulse irradiation point P2, in the 3rd layer, the center of gravity G1 that the lattice point of described triangular lattice is moved to the opposing party in two described adjacent triangle T 1 is used as pulse irradiation point P3.In addition, above-mentioned lattice point and the pulse irradiation point coordinate points when overlooking the vertical face (x-y plane) of the direction of illumination (z direction) observed with laser L.
And, control part C is when repeating continuously described 1 cycle, take continuous 3 cycles carries out repetition as 1 unit, in the 2nd cycle in constituent parts, in the 1st layer, by the lattice point of triangular lattice move to link until in the 2nd triangle of 3 pulse irradiation points adjacent one another are of the upper cycle and formation a wherein side the center of gravity in adjacent two the 2nd triangles be used as the pulse irradiation point, in the 3rd cycle of constituent parts, in the 1st layer, the lattice point of described triangular lattice is moved to and links until the center of gravity of the opposing party in two adjacent triangles of upper adjacent pulse irradiation point of a cycle and formation is used as the pulse irradiation point.
In addition, preferably make control part C by the 3rd layer of last machined layer that is set as machined layer.
In present embodiment, when carrying out the scanning of laser L, in scanning imaging system, in the mode of piling up the multilayer processing layer, set, with this, to each machined layer vertical irradiation laser L, removed reservations assign to form the gradually machined surface of 3D shape in each machined layer.Therefore when controlling the scanning of laser L, at first along the direction of illumination of laser L, workpiece W is divided into to a plurality of machined layer and is set.
And, in each machined layer, set out from the shape of first being processed and the part that the shape after processing based on design, processing is removed, and in each machined layer, scan laser L removes predetermined portions, forms gradually thus predetermined machined surface.
If more specifically this laser processing is described, as shown in Figure 7, when at first control part C is processed into the target three-dimensional shape by laser L by the original-shape of workpiece W, the three-dimensional shape part that will process removal on the face perpendicular to Z axis is uniformly-spaced cut apart (layering) and is become a plurality of machined layer LY.
Now, the energy when thickness of layer (machined layer LY) depends on every pulse and layer space density of interior pulse irradiation point, be easier to when but bed thickness is constant all the time control, and become evenly by the concavo-convex of the face tilted with respect to laser axis that the ladder of layer causes, therefore preferably.Therefore, constant for bed thickness is made as, the sweep speed of the energy density of work in-process laser L, the repetition rate of laser L and laser L and the conditions such as interval of surface sweeping line are set to constant all the time.Therefore the triangular lattice that the distribution of the pulse irradiation point of all layers is made as to identical shaped and the same size condition that necessitates.
Control part C by being evenly distributed of pulse irradiation point, sets the shape that its lattice point becomes the triangular lattice of pulse irradiation point under the above-mentioned condition of layer processing method.That is, the bias (distance of the laser scanning line direction in adjacent laser scanning line between hithermost pulse irradiation point) between the laser scanning line of the interval of the distance between the pulse irradiation point in the laser scanning line of setting triangular lattice, adjacent laser scanning line, pulse irradiation point and the sweep starting point of each laser scanning line etc.When the cross-sectional strength of laser is distributed as comparatively ideal Gaussian, triangular lattice preferably is made as the equilateral triangle grid, and while in the cross-sectional strength of laser distributes, having anisotropy, is made as the oblique triangle grid according to the distortion of its shape and just can reduces surface roughness.
And, start the processing of machined layer with above-mentioned setting.As shown in Fig. 2 (a), at first, in the processing of the 1st layer of machined layer, using the lattice point of predetermined triangular lattice as the pulse irradiation point P1 of the 1st layer, carry out the scanning of laser L.In addition, the arrow in figure means the scanning direction of laser L.
Then, as (a) of Fig. 2 with (b), in the processing of the 2nd layer, by the lattice point of triangular lattice move to link the 1st layer in 3 adjacent pulse irradiation point P1 and in the triangle T 1 that forms a wherein side the center of gravity G1 in adjacent two triangles be used as pulse irradiation point P2, and carry out the scanning of laser L.
And then, as (b) of Fig. 2 with (c), last as 1 cycle, in the processing of the 3rd layer, the center of gravity G1 that the lattice point of triangular lattice is moved to the opposing party in described adjacent two triangle T 1 is used as pulse irradiation point P3, and carries out the scanning of laser L.
Finish the processing to 3 layers in the 1st cycle of machined layer with this.Afterwards, when repeating continuously described 1 cycle,, when the number of plies by layering surpasses 3 layers, take continuous 3 cycles as 1 unit carries out repetition, repeat equally the Laser Processing in described 1 cycle.
For example, if describe for total number of plies being made as to 9 layers and pulse irradiation point till being machined to 3 cycles the time, in the 2nd cycle of constituent parts, as shown in Figure 3, control part C is in the 2nd cycle of constituent parts, in the 1st layer, by the lattice point of triangular lattice move to link until in the 2nd triangle T 2 of upper one-period 3 pulse irradiation points adjacent one another are and formation a wherein side the center of gravity G2 in adjacent two the 2nd triangles be used as the pulse irradiation point, in the 3rd cycle of constituent parts, in the 1st layer, the center of gravity G2 that the lattice point of triangular lattice is moved to the opposing party in described adjacent two the 2nd triangle T 2 is used as the pulse irradiation point.
; as shown in Fig. 3 (a); in the 1st cycle 3 layers during by pulse irradiation point P1～P3 Laser Processing; in the 1st layer in the 2nd cycle; as shown in Fig. 3 (b); the lattice point of triangular lattice is moved in two the 2nd triangles adjacent in the 2nd triangle T 2 that links 3 pulse irradiation point P1～P3 adjacent one another are till one-period (the 1st cycle) and form to a wherein side center of gravity G2 and be used as pulse irradiation point P4, and carry out the irradiation of laser L.In addition, till the 2nd layer to the 3rd layer from the 2nd cycle, using the pulse irradiation point P4 of the 4th layer as benchmark from counting at first two layers till the 5th layer to the 6th layer, with same pulse irradiation point P5, the pulse irradiation point P6 of the 6th layer that sets the 5th layer of the 1st cycle, and carry out successively the scanning of laser L.
In addition, as shown in Fig. 3 (b), in the 3rd cycle, the center of gravity G2 of the opposing party in two the 2nd triangle T 2 adjacent as described in the 1st layer, the lattice point of triangular lattice being moved as shown in Fig. 3 (c), be used as the 1st layer in the 3rd cycle with this, from counting at first the pulse irradiation point P7 of the 7th layer, and carry out the scanning of laser L.And, till the 2nd layer to the 3rd layer from the 3rd cycle, using the pulse irradiation point P7 of the 7th layer as benchmark from counting at first two layers till the 8th layer to the 9th layer, with same pulse irradiation point P8, the pulse irradiation point P9 of the 9th layer that sets the 8th layer of the 1st cycle and the 2nd cycle, and carry out successively the scanning of laser L.
In addition, even also same as described above while being set to below the 10th layer, by the lattice point of triangular lattice move to link until the 2nd triangle of 3 pulse irradiation points adjacent one another are of the upper cycle and formation (, the triangle of the minimum that is attached to the pulse irradiation point till a cycle and forms) a wherein side the center of gravity G2 in adjacent two the 2nd triangles is used as the pulse irradiation point, carries out the scanning of laser L simultaneously.
So, by the pulse irradiation point in the 1st layer of next cycle move by pulse irradiation point adjacent one another are till a upper cycle around the 2nd leg-of-mutton center of gravity be set as the pulse irradiation point of 3 layers in this cycle, space between the adjacent pulse point of irradiation is filled up by the pulse irradiation point thus, when repeating the above-mentioned cycle, this space dwindles gradually, thereby can gradually dwindle caused by the processing trace concavo-convex.
Therefore, in the laser processing device 1 and laser processing of present embodiment, in the multilayer processing layer, to using processing sequence as 3 the continuous layers from the 1st layer to the 3rd layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, be used as the pulse irradiation point by the lattice point that moves respectively triangular lattice for the 2nd layer as mentioned above to the 3rd layer, thereby compare when next stacked with the triangular lattice that random mobile lattice point is pulse irradiation point on the x-y direction, can dwindle caused by the pulse trace concavo-convex.
And, when repeating continuously described 1 cycle, in the 2nd later cycle, in the 1st layer, the lattice point of described triangular lattice is moved to and links until the 2nd leg-of-mutton center of gravity that adjacent pulse irradiation point of a cycle forms is used as the pulse irradiation point, therefore can further reduce concavo-convex.Especially by being set as last machined layer by the 3rd layer, can make surface roughness become minimum.
[embodiment]
Simulated experiment result while then, the laser processing device that utilizes above-mentioned embodiment being carried out to Laser Processing to the surface of workpiece describes.
In this simulated experiment, be set as above-mentioned triangular lattice the square lattice that length of side size is 2.5 μ m, as shown in Fig. 4 (a)～(c), calculate surface state concavo-convex that the machined layer till the 1st layer (a) to the 3rd layer (c) in the 1st cycle is added to the workpiece in man-hour.
In addition, in this simulated experiment, suppose in 1 pulse irradiation point, the processing trace that produces the cross sectional shape of being stipulated by following Gaussian function on the finished surface of workpiece calculates.
Gaussian function: z=-exp(-x
2-y
2)
As from this simulated experiment result, concavo-convex being eliminated when lamination, thus obtain level and smooth machined surface.In addition, while reaching the 3rd layer, surface roughness Rz(maximum height) be 0.028 μ m.
In addition, as a comparative example, same as the previously described embodiments, be set as triangular lattice the triangular lattice that length of side size is 2.5 μ m, all layers are only moved on the x-y direction to the random amount that is equivalent to, as shown in Fig. 5 (a)～(c), calculate surface state concavo-convex that the machined layer till the 1st layer (a) in the 1st cycle to the 3rd layer (c) is added to the workpiece in man-hour.
As from this simulated experiment result, carry out in the comparative example of Laser Processing moving at random, concavo-convex even lamination is not eliminated yet, when lamination, concavo-convex change is large.In addition, while reaching the 3rd layer, surface roughness Rz(maximum height) be 1.129 μ m.
Then, using aluminium sheet (the surface roughness Rz before processing: about 0.2 μ m), during as workpiece, the number of plies of the machined layer in the time of will carrying out Laser Processing of the present invention and the relation between surface roughness (in figure " stacked triangular lattice regularly ") are shown in Fig. 6.
Lasing condition now is made as: wavelength is 266nm, and repetition rate is 100kHz, and power is 2W.And be set as above-mentioned triangular lattice the equilateral triangle grid that length of side size is 6 μ m.In addition, what curve map was got the bid meeting is the measured value of surface roughness, and dotted line and solid line are to visually observe these rotating savings and the line of matching.
And, as a comparative example, same as the previously described embodiments, be set as triangular lattice the equilateral triangle grid that length of side size is 6 μ m, by all layers on the x-y direction only mobile be equivalent to that random amount carries out the number of plies same as described above add man-hour (" random mobile come stacked triangular lattice " in figure), also shown in Figure 6 in the lump.In addition, for with above-mentioned comparative example equally with mobile processing at random, only wherein 3 layers (the 10th to the 12nd layers) are carried out and the 1st layer during to the 3rd layer of identical Laser Processing of the present invention (" random mobile come stacked triangular lattice " (solid line section) in figure), also shown in Figure 6 in the lump.
As can be known from these results, in laser processing of the present invention, all layers are added to man-hour, from the 1st layer, when the accumulation number of plies, surface roughness just diminishes, in contrast to this, in the comparative examples so that movement is processed all layers at random, when the accumulation number of plies, surface roughness will become large.And, with respect to the comparative examples so that movement is processed all layers at random, in the example that only part in total number of plies is carried out layer processing by laser processing of the present invention, surface roughness diminishes, by having at least a part to be processed by the laser processing of the present invention of regularization, can obtain the effect that reduces surface roughness.
In addition, technical scope of the present invention is not limited to above-mentioned embodiment and above-described embodiment, in the scope that does not break away from aim of the present invention, can impose various changes.
Claims (4)
1. a laser processing device, it is characterized in that possessing for by the processing unit (plant) that the workpiece irradiated with pulse laser is carried out to shape formation:
Laser radiation mechanism, irradiate the line scanning of going forward side by side of described laser with constant repetition rate to described workpiece;
Position adjusting mechanism, can keep described workpiece to be adjusted the relative position relation of this workpiece and described laser; And
Control part, control these mechanisms, described machining area is set as piling up along the direction of illumination of described laser the zone of multilayer processing layer when carrying out the scanning of described laser, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to described laser and removing each described machined layer
The lattice point of this control part by the virtual triangular lattice that will set described machined layer irradiates described laser as pulse irradiation point to be processed,
In the described machined layer of multilayer, will using processing sequence as 3 the continuous layers from the 1st layer to the 3rd layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle,
In described the 2nd layer, the lattice point of described triangular lattice is moved to adjacent in linking described the 1st layer 3 described pulse irradiation points and in the triangle of formation a wherein side the center of gravity in adjacent two triangles be used as the pulse irradiation point,
In described the 3rd layer, the center of gravity of the lattice point of described triangular lattice being moved to the opposing party in described adjacent two triangles is used as the pulse irradiation point.
2. laser processing device according to claim 1, is characterized in that,
Described control part is when repeating continuously described 1 cycle, take 3 continuous cycles carries out repetition as 1 unit, in the 2nd cycle of constituent parts, in described the 1st layer, by the lattice point of described triangular lattice move to link until in the 2nd triangle of 3 described pulse irradiation points adjacent one another are of the upper cycle and formation a wherein side the center of gravity in adjacent two the 2nd triangles be used as the pulse irradiation point
In the 3rd cycle of constituent parts, in described the 1st layer, the center of gravity of the lattice point of described triangular lattice being moved to the opposing party in described adjacent two the 2nd triangles is used as the pulse irradiation point.
3. laser processing device according to claim 1 and 2, is characterized in that,
Described control part is set as last described machined layer by described the 3rd layer.
4. a laser processing, it is characterized in that having for by the processing method that the workpiece irradiated with pulse laser is carried out to shape formation:
The Ear Mucosa Treated by He Ne Laser Irradiation operation is irradiated the line scanning of going forward side by side of described laser with constant repetition rate to described workpiece in this operation; And
Operation is adjusted in position, in this operation, can keep described workpiece to be adjusted the relative position relation of this workpiece and described laser,
When carrying out the scanning of described laser, described machining area is set as piling up along the direction of illumination of described laser to the zone of multilayer processing layer, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to described laser and removing each described machined layer
Irradiate described laser and processed on the lattice point of the virtual grid that described machined layer is set,
In the described machined layer of multilayer, will using processing sequence as 3 the continuous layers from the 1st layer to the 3rd layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle,
In described the 2nd layer, the lattice point of described triangular lattice is moved to adjacent in linking described the 1st layer 3 described pulse irradiation points and in the triangle of formation a wherein side the center of gravity in adjacent two triangles be used as the pulse irradiation point,
In described the 3rd layer, the center of gravity of the lattice point of described triangular lattice being moved to the opposing party in described adjacent two triangles is used as the pulse irradiation point.
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| CN107931829A (en) * | 2017-11-07 | 2018-04-20 | 苏州新代数控设备有限公司 | Laser cutting power adjusts system and method |
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| JP7380602B2 (en) * | 2019-02-13 | 2023-11-15 | ソニーグループ株式会社 | Laser processing machine and laser processing method |
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| CN107931829A (en) * | 2017-11-07 | 2018-04-20 | 苏州新代数控设备有限公司 | Laser cutting power adjusts system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5920662B2 (en) | 2016-05-18 |
| CN103464891B (en) | 2016-06-22 |
| JP2013252529A (en) | 2013-12-19 |
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