CN103464891B - Laser processing device and laser processing - Google Patents
Laser processing device and laser processing Download PDFInfo
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- CN103464891B CN103464891B CN201310217681.2A CN201310217681A CN103464891B CN 103464891 B CN103464891 B CN 103464891B CN 201310217681 A CN201310217681 A CN 201310217681A CN 103464891 B CN103464891 B CN 103464891B
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- 230000005855 radiation Effects 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 abstract description 24
- 230000001678 irradiating effect Effects 0.000 abstract description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 238000004088 simulation Methods 0.000 description 7
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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Abstract
The present invention provides a kind of laser processing device and laser processing that can reduce surface roughness in Three-dimension process further。The laser processing of the present invention is as follows: machining area being set as, the direction of illumination along laser piles up the region of multilayer processing layer, the lattice point of the virtual triangular lattice that machined layer is set is carried out irradiating laser as pulse irradiation point and is processed, in multilayer processing layer, by using processing sequence for from 3 layers of continuous print of the 1st layer to the 3rd layer as 1 cycle, including at least the layer being equivalent to 1 cycle, in two trianglees adjacent in the triangle (T1) lattice point of triangular lattice moving to 3 adjacent pulse irradiations point (P1) in linking the 1st layer in the 2nd layer and constitute, the center of gravity (G1) of a side is used as pulse irradiation point (P2), the center of gravity that the lattice point of triangular lattice moves the opposing party in described two adjacent trianglees (T1) in the 3rd layer is used as pulse irradiation point (P3)。
Description
Technical field
The present invention relates to a kind of laser processing device and laser processing realizing Three-dimension process by surface roughness is greatly lowered。
Background technology
In the past, as utilizing laser that material is carried out, one of method of three-dimensional configuration processing is known following method: as shown in Figure 7, the position processing removal from workpiece W is divided into the multiple layers (below also known as machined layer LY) in the direction stacking vertical with the direction of illumination of laser L, starts to be sequentially carried out processing from the machined layer LY of that side, surface near workpiece W and remove (hereinafter referred to as layer processing method) (referenced patent document 1)。Although this layer of processing method can process the form that comparison is random accurately, but concavo-convex due to what produce caused by the fine processing trace (hereinafter referred to as pulse trace) caused by the pulse of laser L on machined surface, therefore the surface roughness of machined surface can become big compared with grinding etc.。
Therefore, in order to reduce the surface roughness of machined surface, following means can be taked: by controlling the distribution (below also known as pulse irradiation point be distributed) of the irradiation position (hereinafter referred to as pulse irradiation point) of the laser to machined layer pulse irradiation regularly, thus suppress by pulse trace cause concavo-convex。Such as, in patent documentation 2, control the interval etc. of the scanning line of the laser being scanned, for instance be distributed pulse irradiation point with square lattice shape。
Patent documentation 1: Japanese Patent Publication 2012-16735 publication
Patent documentation 2: Japanese Patent Publication 2007-229756 publication
Above-mentioned conventional art has been left over following problem。
In processing method described in patent documentation 2, there is the situation of the surface roughness fully not reducing Laser Processing face。Its reason is in that, it does not have consider the coincidence distribution of pulse irradiation point between layers, and what therefore result from layer concavo-convex piles up between the layers, sometimes also obvious especially, and likely whenever increasing working depth, surface roughness will increase。And, more reduce the distance between adjacent pulse point of irradiation, what one layer endogenous cause of ill pulse trace caused concavo-convex just becomes more obvious, more make the surface roughness step-down in a layer, this thickness being equivalent to increase layer, its result, becomes the difference of height of bigger notch cuttype when the face tilted relative to laser axis being processed and being formed, and therefore there is the problem making on the contrary to increase relative to the surface roughness in the face of laser axis inclination。
Summary of the invention
The present invention completes in view of above-mentioned problem, its object is to provide a kind of laser processing device and laser processing that can reduce surface roughness in Three-dimension process further。
The present invention is to solve that above-mentioned problem adopts following structure。That is, the laser processing device of the present invention, it is the processing unit (plant) by workpiece irradiating laser carries out shape formation, wherein, possesses: laser radiation mechanism, and is scanned the described workpiece described laser of irradiation with constant repetition rate；Position adjusting mechanism, it is possible to keep described workpiece that the relative position relation of this workpiece Yu described laser is adjusted；And control portion, control these mechanisms, when carrying out the scanning of described laser, machining area being set as, the direction of illumination along described laser piles up the region of multilayer processing layer, by each machined layer being irradiated described laser and removing the predetermined portions of each described machined layer and form the machined surface of 3D shape, this control portion is by irradiating described laser using the lattice point of the virtual triangular lattice that described machined layer is set be processed as pulse irradiation point, in machined layer described in multilamellar, by using processing sequence for from 3 layers of continuous print of the 1st layer to the 3rd layer as 1 cycle, including at least the layer being equivalent to 1 cycle, in described 2nd layer, the center of gravity of the wherein side in two trianglees adjacent in the triangle lattice point of described triangular lattice moving to 3 adjacent described pulse irradiation points in linking described 1st layer and constitute is used as pulse irradiation point, in described 3rd layer, the lattice point of described triangular lattice is moved to the center of gravity of the opposing party in described two adjacent trianglees and is used as pulse irradiation point。Additionally, at this, triangular lattice is defined as: equilateral triangle that 3 hithermost lattice points are constituted, right angled triangle, equilateral triangle or be not belonging to this any one shape of general triangle therein, and the shape that it is identical is paved with in the plane with having no gap。It addition, when such as hithermost 4 lattice points are square, are generally mostly considered as square lattice, but are considered as the set that 2 acute angles are the right angled triangle of 45 ° at this, and included in above-mentioned triangular lattice。
And, the laser processing of the present invention, it is the processing method by workpiece irradiating laser is carried out shape formation, wherein, have: laser irradiation process, to the described workpiece described laser of irradiation and be scanned with constant repetition rate in this operation；And position adjustment operation, this operation can keep described workpiece the relative position relation of this workpiece Yu described laser is adjusted, when carrying out the scanning of described laser, machining area is set as, and the direction of illumination along described laser piles up the region of multilayer processing layer, by each machined layer being irradiated described laser and removing the predetermined portions of each described machined layer and form the machined surface of 3D shape, the lattice point of the virtual triangular lattice that described machined layer is set irradiates described laser be processed, in machined layer described in multilamellar, by using processing sequence for from 3 layers of continuous print of the 1st layer to the 3rd layer as 1 cycle, including at least the layer being equivalent to 1 cycle, in described 2nd layer, the center of gravity of the wherein side in two trianglees adjacent in the triangle lattice point of described triangular lattice moving to 3 adjacent described pulse irradiation points in linking described 1st layer and constitute is used as pulse irradiation point, in described 3rd layer, the lattice point of described triangular lattice is moved to the center of gravity of the opposing party in described two adjacent trianglees and is used as pulse irradiation point。
In these laser processing devices and laser processing, in multilayer processing layer, by using processing sequence for from 3 layers of continuous print of the 1st layer to the 3rd layer as 1 cycle, including at least the layer being equivalent to 1 cycle, it is used as pulse irradiation point as described above by the lattice point moving triangular lattice respectively for the 2nd layer to the 3rd layer, thus lattice point random mobile with in x-y face be the triangular lattice of pulse irradiation point when carrying out stacking compared with, it is possible to reduce by pulse trace cause concavo-convex。
Additionally, the laser processing device of the present invention, wherein, described control portion is when continuously repeating described 1 cycle, it is repeated with continuous 3 cycles for 1 unit, in the 2nd cycle in constituent parts, in described 1st layer, the center of gravity that the lattice point of described triangular lattice moves to the wherein side in two the 2nd trianglees adjacent one another are in the 2nd triangle linking 3 described pulse irradiation points adjacent one another are until a upper cycle and constitute is used as pulse irradiation point, in 3rd cycle of constituent parts, in described 1st layer, the lattice point of described triangular lattice is moved to the center of gravity of the opposing party in described two adjacent the 2nd trianglees and is used as pulse irradiation point。
Namely, in this laser processing device, when continuously repeating described 1 cycle, it is repeated with continuous 3 cycles for 1 unit, in constituent parts the 2nd and in the 3rd cycle, the lattice point of described triangular lattice is moved by the 1st layer link until on a cycle pulse irradiation point adjacent one another are and the 2nd adjacent barycenter oftriangle that constitutes is used as pulse irradiation point, therefore, it is possible to reduce concavo-convex further。
It addition, the laser processing device of the present invention preferably makes described control portion be set as last described machined layer by described 3rd layer。
That is, in this laser processing device, by being set as last machined layer by the 3rd layer, it is possible to make surface roughness become minimum。
Following effect is played according to the present invention。
Namely, according to laser processing device involved in the present invention and laser processing, in multilayer processing layer, by using processing sequence for from 3 layers of continuous print of the 1st layer to the 3rd layer as 1 cycle, including at least the layer being equivalent to 1 cycle, it is used as pulse irradiation point as described above by the lattice point moving triangular lattice respectively for the 2nd layer to the 3rd layer, thus lattice point random mobile with in x-y face be the triangular lattice of pulse irradiation point when carrying out stacking compared with, reduce by processing trace cause concavo-convex, and the surface roughness in Laser Processing face can be reduced。
Then, the laser processing device of the present invention and laser processing are suitable for such as requiring the shape processing etc. of the product of the three-dimensional shape with complexity of surface roughness Rz≤3 μm。
Accompanying drawing explanation
Fig. 1 is in an embodiment of laser processing device involved in the present invention and laser processing, represents the outline overall structure figure of laser processing device。
Fig. 2 is the explanation figure representing pulse irradiation point based on the equilateral triangle grid from the 1st layer (a) to the 3rd layer (c) in present embodiment with process sequence。
Fig. 3 represents based on the explanation figure from the pulse irradiation point of the equilateral triangle grid of the 1st layer to the 9th layer with process sequence in present embodiment。
Fig. 4 as embodiment involved in the present invention, the shape graph in the Laser Processing face of simulation experiment result when indicating that by the method for the present invention the 1st layer (a) to the 3rd layer (c) irradiating laser。
Fig. 5 as comparative example involved in the present invention, indicates that the shape graph in the Laser Processing face of simulation experiment result by the way of moving at random to the 1st layer (a) to the 3rd layer (c) irradiating laser time。
Fig. 6 indicates that in embodiment involved in the present invention and comparative example, the curve chart of the practical laser processing experiment result that surface roughness changes along with the number of plies。
Fig. 7 indicates that the explanation figure of the laser processing method based on Laser Processing。
Symbol description
1-laser processing device, 2-laser radiation mechanism, 3-position adjusting mechanism, C-control portion, G1～G2-barycenter oftriangle, L-laser, P1～P9-pulse irradiation point, W-workpiece。
Detailed description of the invention
Hereinafter, referring to figs. 1 to Fig. 3, one embodiment of laser processing device involved in the present invention and laser processing is illustrated。
As it is shown in figure 1, the laser processing device 1 of present embodiment is the processing unit (plant) that workpiece W irradiating laser L carries out shape formation, it possesses: laser radiation mechanism 2, and is scanned workpiece W irradiating laser L with constant repetition rate；Position adjusting mechanism 3, it is possible to keep workpiece W that the relative position relation of this workpiece W Yu laser L is adjusted；And control portion C, control these mechanisms, and when carrying out the scanning of laser L, machining area being set as, the direction of illumination along laser L piles up the region of multilayer processing layer, by each machined layer irradiating laser L and remove the predetermined portions of each machined layer and form the machined surface of 3D shape。
Above-mentioned position adjusting mechanism 3 links following composition: X-axis object stage 4x, it is possible to the X-direction of plane-parallel on move；Y-axis object stage 4y, be arranged on this X-axis object stage 4x and vertical relative to X-direction and can with the Y-direction of plane-parallel on move；And z-stage 4z, being arranged on this Y-axis object stage 4y and while can keeping workpiece W can move up in the side with horizontal plane。
Above-mentioned laser radiation mechanism 2 possesses: LASER Light Source 5, vibrates by the laser L of the trigger signal pulse of Q-switch；Optical beam expander 6, becomes certain diameter by the beam spread of the laser L from this LASER Light Source 5；Current scanning instrument 7, is scanned the laser L from this optical beam expander 6；F-θ lens 8, carry out optically focused to the laser L from this current scanning instrument 7 and are irradiated on workpiece W；And ccd video camera 9, shoot for confirming the Working position of the workpiece W being kept。It addition, the configuration optics such as reflecting mirror or wave plate is also harmless in light path before and after optical beam expander 6。
It is gaussian shaped profile by the light intensity distributions that laser L is single mode and beam cross section of this laser radiation mechanism 2 injection。
As above-mentioned LASER Light Source 5, the LASER Light Source that can irradiate the laser that any one wavelength is 190～550nm can be used, for instance employ the LASER Light Source that the laser that wavelength is 266nm that can vibrate penetrates in the present embodiment。
Above-mentioned current scanning instrument 7 is arranged in the surface of z-stage 4z。Further, above-mentioned ccd video camera 9 configures by current scanning instrument 7。
As shown in Figure 2, above-mentioned control portion C has the effect that by being processed as pulse irradiation point irradiating laser L by the lattice point of the virtual triangular lattice that machined layer is set, in multilayer processing layer, by using processing sequence for from 3 layers of continuous print of the 1st layer to the 3rd layer as 1 cycle, including at least the layer being equivalent to 1 cycle, in the 2nd layer, the center of gravity G1 of the side in two trianglees adjacent in the triangle T 1 lattice point of triangular lattice moving to 3 adjacent pulse irradiation point P1 in linking the 1st layer and constitute is used as pulse irradiation point P2, in the 3rd layer, the lattice point of described triangular lattice is moved to the center of gravity G1 of the opposing party in two described adjacent triangle T1 and is used as pulse irradiation point P3。It addition, coordinate points during above-mentioned lattice point and pulse irradiation point face (x-y plane) that to be top view vertical with the direction of illumination of laser L (z direction)。
And, control portion C is when continuously repeating described 1 cycle, it is repeated with continuous 3 cycles for 1 unit, in the 2nd cycle in constituent parts, in the 1st layer, the center of gravity that the lattice point of triangular lattice moves to the wherein side in two the 2nd trianglees adjacent in the 2nd triangle linking 3 pulse irradiation points adjacent one another are until a upper cycle and constitute is used as pulse irradiation point, in 3rd cycle of constituent parts, in the 1st layer, the center of gravity that the lattice point of described triangular lattice moves to the opposing party in adjacent two triangle linking pulse irradiation point adjacent until a upper cycle and constitute is used as pulse irradiation point。
Furthermore it is preferred that make control portion C be set as last machined layer of machined layer by the 3rd layer。
In present embodiment, when carrying out the scanning of laser L, it is set in the way of piling up multilayer processing layer in scanning imaging system, with this to each machined layer vertical irradiation laser L, each machined layer is removed predetermined portions and gradually forms the machined surface of 3D shape。Therefore, when controlling the scanning of laser L, first along the direction of illumination of laser L, workpiece W is divided into multiple machined layer and is set。
Further, each machined layer sets out the part processing removal from the shape before processing and the shape after being processed based on design, and in each machined layer, scan laser L remove predetermined portions, thus gradually form predetermined machined surface。
If more specifically this laser processing being illustrated, then as shown in Figure 7, first, when control portion C is processed into target three-dimensional shape by laser L by the original-shape of workpiece W, the face be perpendicular to Z axis will process the three-dimensional shape part of removal and split (layering) at equal intervals and become multiple machined layer LY。
Now, the spatial density of the energy when thickness of layer (machined layer LY) depends on every pulse and the pulse irradiation point in layer, it is easier to when but thickness is constant all the time control, and the concavo-convex of face tilted relative to laser axis caused by the ladder of layer becomes uniform, it is thus preferred to。Therefore, constant in order to thickness be set to, the condition such as interval of the energy density of work in-process laser L, the repetition rate of laser L and the scanning speed of laser L and surface sweeping line is set to constant all the time。Therefore the pulse irradiation point of all layers is distributed the triangular lattice being set to same shape and same size necessitate condition。
Control portion C by the distribution uniformity of pulse irradiation point, sets the shape that its lattice point becomes the triangular lattice of pulse irradiation point under the above-mentioned condition of layer processing method。That is, the sweep starting point etc. of bias between the laser scanning line of the distance between the pulse irradiation point in the laser scanning line of triangular lattice, the adjacent laser scanning interval of line, pulse irradiation point (in adjacent laser scanning line the distance in laser scanning line direction between hithermost pulse irradiation point) and each laser scanning line is set。When the cross-sectional strength of laser is distributed as comparatively ideal Gaussian, triangular lattice is preferably set to equilateral triangle grid, and when there is anisotropy in the cross-sectional strength of laser is distributed, is set to oblique triangle grid according to the deformation of its shape and just can reduce surface roughness。
Further, the processing of machined layer is started with above-mentioned setting。As shown in (a) of Fig. 2, first, in the processing of the 1st layer of machined layer, the lattice point of predetermined triangular lattice is carried out as the pulse irradiation point P1 of the 1st layer the scanning of laser L。It addition, the arrow in figure represents the scanning direction of laser L。
Then, as shown in (a) and (b) of Fig. 2, in the processing of the 2nd layer, the center of gravity G1 of the wherein side in two trianglees adjacent in the triangle T 1 lattice point of triangular lattice moving to 3 adjacent pulse irradiation point P1 in linking the 1st layer and constitute is used as pulse irradiation point P2, and carries out the scanning of laser L。
And then, as shown in (b) and (c) of Fig. 2, last as 1 cycle, in the processing of the 3rd layer, the center of gravity G1 that the lattice point of triangular lattice moves the opposing party in described two adjacent triangle T 1 is used as pulse irradiation point P3, and carries out the scanning of laser L。
The processing to 3 layers in the 1st cycle of machined layer is terminated with this。Afterwards, when continuously repeating described 1 cycle, namely when the number of plies being layered is more than 3 layers, it is repeated for 1 unit with continuous 3 cycles, repeats the Laser Processing in described 1 cycle equally。
Such as, if pulse irradiation point when processing to 3 cycles for total number of plies is set to 9 layers illustrates, then in the 2nd cycle of constituent parts, as shown in Figure 3, control portion C is in the 2nd cycle of constituent parts, in the 1st layer, the center of gravity G2 that the lattice point of triangular lattice moves to the wherein side in two the 2nd trianglees adjacent in the 2nd triangle T 2 linking 3 pulse irradiation points adjacent one another are until a upper cycle and constitute is used as pulse irradiation point, in 3rd cycle of constituent parts, in the 1st layer, the lattice point of triangular lattice is moved to the center of gravity G2 of the opposing party in described two adjacent the 2nd triangle T 2 and is used as pulse irradiation point。
Namely, as shown in (a) of Fig. 3, when in 1st cycle 3 layers are laser machined by pulse irradiation point P1～P3, in in the 2nd cycle the 1st layer, as shown in (b) of Fig. 3, in two the 2nd trianglees adjacent in the 2nd triangle T 2 lattice point of triangular lattice moving to 3 pulse irradiation point P1～P3 adjacent one another are linking a upper cycle (the 1st cycle) and constitute, wherein the center of gravity G2 of a side is used as pulse irradiation point P4, and carries out the irradiation of laser L。In addition, the 2nd layer from the 2nd cycle to the 3rd layer, namely from counting the 5th layer of two layer to the 6th layer at first using the pulse irradiation point P4 of the 4th layer as benchmark, the pulse irradiation point P5, the pulse irradiation point P6 of 6th layer that set 5th layer same with the 1st cycle, and it is sequentially carried out the scanning of laser L。
Additionally, as shown in (b) of Fig. 3, in the 3rd cycle, the center of gravity G2 of the opposing party that will move shown in (c) of the lattice point of triangular lattice such as Fig. 3 in described two adjacent the 2nd triangle T 2 in the 1st layer, it is used as the 1st layer in the 3rd cycle with this, namely from the pulse irradiation point P7 counting the 7th layer at first, and the scanning of laser L is carried out。And, the 2nd layer from the 3rd cycle to the 3rd layer, namely from counting the 8th layer of two layer to the 9th layer at first using the pulse irradiation point P7 of the 7th layer as benchmark, the pulse irradiation point P8, the pulse irradiation point P9 of 9th layer that set 8th layer same with the 1st cycle and the 2nd cycle, and it is sequentially carried out the scanning of laser L。
Additionally, even if it is also same as described above when being set to below the 10th layer, the 2nd triangle lattice point of triangular lattice moving link 3 pulse irradiation points adjacent one another are until a upper cycle and constitute is (namely, pulse irradiation point till being attached to a cycle and the minimum triangle that constitutes) in the center of gravity G2 of a wherein side in adjacent two the 2nd trianglees be used as pulse irradiation point, carry out the scanning of laser L simultaneously。
So, pulse irradiation point in the 1st of next cycle layer is moved to by pulse irradiation point adjacent one another are to a upper cycle around the 2nd barycenter oftriangle to the pulse irradiation point of be set as this cycle 3 layers, thus the space between adjacent pulse point of irradiation is filled up by pulse irradiation point, whenever repeating the above-mentioned cycle, this space is gradually reduced such that it is able to gradually reduce by processing trace cause concavo-convex。
Therefore, in the laser processing device 1 of present embodiment and laser processing, in multilayer processing layer, by using processing sequence for from 3 layers of continuous print of the 1st layer to the 3rd layer as 1 cycle, including at least the layer being equivalent to 1 cycle, be used as pulse irradiation point for the 2nd layer to the 3rd layer as described above by the lattice point moving triangular lattice respectively, thus compared with moving at random in x-y direction when the triangular lattice that lattice point is pulse irradiation point carrys out stacking, it is possible to reduce by pulse trace cause concavo-convex。
And, when continuously repeating described 1 cycle, in the 2nd later cycle, in the 1st layer, the lattice point of described triangular lattice is moved to the 2nd barycenter oftriangle linking pulse irradiation point composition adjacent until a cycle and is used as pulse irradiation point, therefore, it is possible to reduce concavo-convex further。It is set as last machined layer, it is possible to make surface roughness become minimum particularly by by the 3rd layer。
[embodiment]
Then, the simulation experiment result when surface of workpiece being laser machined by the laser processing device utilizing above-mentioned embodiment illustrates。
In this simulation experiment, it is set as that the length of side is sized to the square lattice of 2.5 μm as above-mentioned triangular lattice, as shown in (a)～(c) of Fig. 4, calculate apparent condition concavo-convex of workpiece when the 1st layer (a) to the 1st cycle machined layer to the 3rd layer (c) is processed。
It addition, in this simulation experiment, it is assumed that in 1 pulse irradiation point, the processing trace of cross sectional shape producing to be specified by following Gaussian function on the finished surface of workpiece calculates。
Gaussian function: z=-exp (-x2-y2)
As from this simulation experiment result it can be seen that concavo-convex whenever the lamination be eliminated, thus obtaining smooth machined surface。It addition, when reaching the 3rd layer, surface roughness Rz (maximum height) is 0.028 μm。
Additionally, as comparative example, same as the previously described embodiments, it is set as that the length of side is sized to the triangular lattice of 2.5 μm as triangular lattice, all layers are only moved in x-y direction and is equivalent to random amount, as shown in (a)～(c) of Fig. 5, calculate the concavo-convex of apparent condition to workpiece when the 1st layer (a) machined layer to the 3rd layer (c) is processed in the 1st cycle。
As from this simulation experiment result it can be seen that to move in the comparative example carrying out laser machining at random, even if lamination is concavo-convex also without eliminating, whenever lamination, concavo-convex change is big。It addition, when reaching the 3rd layer, surface roughness Rz (maximum height) is 1.129 μm。
Then, during using aluminium sheet (the surface roughness Rz before processing: about 0.2 μm) as workpiece, the relation (in figure " regularly stacking triangular lattice ") between the number of plies and the surface roughness of machined layer when carrying out the Laser Processing of the present invention is shown in Fig. 6。
Lasing condition being now set to: wavelength is 266nm, repetition rate is 100kHz, and power is 2W。And it is set as that the length of side is sized to the equilateral triangle grid of 6 μm as above-mentioned triangular lattice。It addition, curve chart acceptance of the bid can be the measured value of surface roughness, dotted line and solid line are the line of these rotating savings of perusal and matching。
And, as comparative example, same as the previously described embodiments, it is set as that the length of side is sized to the equilateral triangle grid of 6 μm as triangular lattice, all layers are only moved in x-y direction and is equivalent to random amount and adds man-hour (" random mobile come stacking triangular lattice " in figure) to what carry out the number of plies same as described above, also figure 6 illustrates in the lump。Additionally, it is processed with random movement for same with above-mentioned comparative example, when only wherein 3 layers (the 10th to the 12nd layers) being carried out the 1st layer with the present invention to the 3rd layer of identical Laser Processing (figure " moves stacking triangular lattice " in (solid line portion) at random), also figure 6 illustrates in the lump。
As can be known from these results, when all layers are processed by the laser processing of the present invention, from the 1st layer, whenever accumulating the number of plies, surface roughness just diminishes, in contrast to this, in the comparative example all layers being processed with random movement, whenever accumulating the number of plies, surface roughness will become big。And, relative to the comparative example all layers being processed with random movement, in the example that only part in total number of plies is carried out layer processing by the laser processing of the present invention, surface roughness diminishes, processed by least part of laser processing by the present invention of regularization, it is possible to obtain the effect reducing surface roughness。
It addition, the technical scope of the present invention is not limited to above-mentioned embodiment and above-described embodiment, various change can be imposed without departing from the scope of spirit of the present invention。
Claims (4)
1. a laser processing device, it is the processing unit (plant) by workpiece irradiated with pulse laser carries out shape formation, it is characterised in that possess:
Laser radiation mechanism, and is scanned the described workpiece described laser of irradiation with constant repetition rate；
Position adjusting mechanism, it is possible to keep described workpiece that the relative position relation of this workpiece Yu described laser is adjusted；And
Control portion, control these mechanisms, when carrying out the scanning of described laser, machining area being set as, the direction of illumination along described laser piles up the region of multilayer processing layer, by each machined layer being irradiated described laser and removing the predetermined portions of each described machined layer and form the machined surface of 3D shape
This control portion by the lattice point of the virtual triangular lattice that described machined layer is set is irradiated described laser be processed as pulse irradiation point,
In machined layer described in multilamellar, by using processing sequence for 3 layers of continuous print from the 1st layer to the 3rd layer as 1 cycle, including at least the layer being equivalent to 1 cycle,
In described 2nd layer, the center of gravity that the lattice point of described triangular lattice moves to the wherein side in two trianglees adjacent in the triangle linking 3 adjacent described pulse irradiation points in described 1st layer and constitute is used as pulse irradiation point,
In described 3rd layer, the lattice point of described triangular lattice is moved to the center of gravity of the opposing party in described two adjacent trianglees and is used as pulse irradiation point。
2. laser processing device according to claim 1, it is characterised in that
Described control portion is when continuously repeating described 1 cycle, it is repeated with 3 cycles of continuous print for 1 unit, in the 2nd cycle of constituent parts, in described 1st layer, the center of gravity that the lattice point of described triangular lattice moves to the wherein side in two the 2nd trianglees adjacent in the 2nd triangle linking 3 described pulse irradiation points adjacent one another are until a upper cycle and constitute is used as pulse irradiation point
In the 3rd cycle of constituent parts, in described 1st layer, the lattice point of described triangular lattice is moved to the center of gravity of the opposing party in described two adjacent the 2nd trianglees and is used as pulse irradiation point。
3. laser processing device according to claim 1 and 2, it is characterised in that
Described control portion is set as last described machined layer by described 3rd layer。
4. a laser processing, it is the processing method by workpiece irradiated with pulse laser is carried out shape formation, it is characterised in that have:
Laser irradiation process, and is scanned the described workpiece described laser of irradiation with constant repetition rate in this operation；And
Position adjustment operation, can keep described workpiece that the relative position relation of this workpiece Yu described laser is adjusted in this operation,
When carrying out the scanning of described laser, machining area is set as, and the direction of illumination along described laser piles up the region of multilayer processing layer, by each machined layer being irradiated described laser and removing the predetermined portions of each described machined layer and form the machined surface of 3D shape,
The lattice point of the virtual triangular lattice that described machined layer is set irradiates described laser be processed,
In machined layer described in multilamellar, by using processing sequence for 3 layers of continuous print from the 1st layer to the 3rd layer as 1 cycle, including at least the layer being equivalent to 1 cycle,
In described 2nd layer, the center of gravity that the lattice point of described triangular lattice moves to the wherein side in two trianglees adjacent in the triangle linking 3 adjacent described pulse irradiation points in described 1st layer and constitute is used as pulse irradiation point,
In described 3rd layer, the lattice point of described triangular lattice is moved to the center of gravity of the opposing party in described two adjacent trianglees and is used as pulse irradiation point。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-128445 | 2012-06-05 | ||
| JP2012128445A JP5920662B2 (en) | 2012-06-05 | 2012-06-05 | Laser processing apparatus and laser processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103464891A CN103464891A (en) | 2013-12-25 |
| CN103464891B true CN103464891B (en) | 2016-06-22 |
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| DE102013112378B4 (en) | 2013-11-11 | 2021-04-22 | Thyssenkrupp Rasselstein Gmbh | Reflector for solar thermal systems and method for manufacturing such a reflector |
| CN107931829B (en) * | 2017-11-07 | 2020-03-24 | 新代科技(苏州)有限公司 | Laser cutting power adjustment system and method thereof |
| WO2020166420A1 (en) * | 2019-02-13 | 2020-08-20 | ソニー株式会社 | Laser processing machine, processing method, and laser light source |
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| JP2011212726A (en) * | 2010-03-31 | 2011-10-27 | Fujifilm Corp | Laser machining device and laser machining method |
| JP5861494B2 (en) * | 2012-02-23 | 2016-02-16 | 三菱マテリアル株式会社 | Laser processing apparatus and laser processing method |
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| CN1128193A (en) * | 1992-06-26 | 1996-08-07 | 株式会社半导体能源研究所 | Laser process |
| CN1195591A (en) * | 1997-03-21 | 1998-10-14 | 住友重机械工业株式会社 | Laser machining apparatus |
| CN101041205A (en) * | 2002-08-30 | 2007-09-26 | 住友重机械工业株式会社 | Laser processing method and processing device |
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| CN102196880A (en) * | 2008-10-23 | 2011-09-21 | 住友电气工业株式会社 | Laser processing method and laser processing device |
| CN102189344A (en) * | 2010-03-04 | 2011-09-21 | 三菱综合材料株式会社 | Laser processing method |
| CN102189336A (en) * | 2010-03-12 | 2011-09-21 | 三菱综合材料株式会社 | Laser processing device and laser processing method |
Also Published As
| Publication number | Publication date |
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| JP5920662B2 (en) | 2016-05-18 |
| CN103464891A (en) | 2013-12-25 |
| JP2013252529A (en) | 2013-12-19 |
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