CN102189344A - Laser processing method - Google Patents
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- CN102189344A CN102189344A CN2011100355679A CN201110035567A CN102189344A CN 102189344 A CN102189344 A CN 102189344A CN 2011100355679 A CN2011100355679 A CN 2011100355679A CN 201110035567 A CN201110035567 A CN 201110035567A CN 102189344 A CN102189344 A CN 102189344A
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Abstract
The invention provides a laser processing method, which can execute the processing while suppressing the heat storage and not generating crazing, and the like, even in the cutting process of a fragile material having a high residual stress. A method for processing by irradiating laser lights to a processed object (W) comprises a laser lights irradiating step of oscillating the laser lights with impulse, simultaneously irradiating and scanning the processed object (W) with a certain repeating frequency, bonding a metal thin film (8) on the opposite surface of the processed surface of the processed object (W) while bonding a bonding resin thin film (7) on the processed surface of the processed object (W), attaching the metal thin film (8) to a mounting clamp (4) and fixing the processed object (W) on the mounting clamp (4), and irradiating laser lights to the processed surface from the resin thin film(7).
Description
Technical field
The present invention relates to the laser processing of a kind of cutting processing that is suitable for fragile material for example etc.
Background technology
Usually, in cutting processing, use mechanics methods such as grinding to carry out shaping based on whetstone as fragile materials such as Low fire ceramic sheets.But Low fire ceramic sheet etc. are owing to produce high residue stress by sintering in inside, so particularly its substrate thickness is got over attenuation, residual stress will uprise more, are difficult to be processed into crack when not producing the processing beginning etc.
And also known have a following method: in order to obtain desirable processing trait, to irradiating lasers such as Low fire ceramic sheets, thereby implement processing such as cutting grade.For example, in patent documentation 1, propose to have following method in the past: a kind of on the sheet holding plate mounting ceramic green sheet, carry out the method for hole processing or cutting processing to this ceramic green sheet irradiating laser, wherein, above-mentioned holding plate has vacuum attraction mechanism, the absorption of described vacuum attraction mechanism keeps mounting in the lip-deep object of sheet holding plate, when intervention is equipped with supplementary plate between above-mentioned holding plate and ceramic green sheet, the back side of ceramic green sheet is pasted with carrier thin film, together by above-mentioned laser carrier thin film is also processed with the ceramic green sheet.
And, record the adhesion sheet that has base material and be arranged at the adhering agent layer on the face of this base material in the patent documentation 2, as the Laser Processing that utilizes laser to carry out to use in the cutting processing of semiconductor crystal wafer with the adhesion sheet.
In these Laser Processings, at the back side of processing object thing adhesive film with in when cutting supporting machining object.
Patent documentation 1: No. 3858382 communique of Japan Patent
Patent documentation 2: the open 2009-297734 communique of Japan Patent
In the above-mentioned conventional art, leave following problem.
Promptly, in the method for utilizing in the past, i.e. irradiating laser and scan repeatedly and when delineating the method that wire casing cuts off, also there are the following problems, promptly because of processing midway heat affecting or the deployment conditions of impurity, produce the crack and cause cutting apart to the inexpectancy direction when ruling.Especially there are the following problems point: the processing thermal regenerator that causes because of laser is in the processing object thing, and the stress of processing object thing changes and produces be full of cracks or crack etc.
Summary of the invention
The present invention finishes in view of above-mentioned problem, also can suppress accumulation of heat and do not produce be full of cracks etc. and the laser processing processed in the cutting processing of the fragile material with high residue stress even its purpose is to provide a kind of.
The present invention has adopted following structure in order to solve above-mentioned problem.Promptly, laser processing of the present invention, process to processing object thing irradiating laser, it is characterized in that, has the laser irradiation process, described laser irradiation process pulsed oscillation laser, scan when described processing object thing shines with certain repetition rate, in the machined surface binding resin film of described processing object thing, opposing face binding metal film at the machined surface of described processing object thing, make this metallic film adhere on the sectional fixture and on this sectional fixture, fix described processing object thing, from the described resin film to described machined surface irradiating laser.
In this laser processing, in the machined surface binding resin film of processing object thing, opposing face binding metal film at the machined surface of processing object thing, from the resin film to the machined surface irradiating laser, so pass through the absorbed while of excentral dump energy of the laser of surperficial resin film incident, the metallic film heat release of the heat that adds man-hour by the high back side of heat conductivity be to sectional fixture, thereby can prevent the accumulation of heat to processing object things such as fragile materials.And, can keep processing object thing in the processing at the two sides mechanics by resin film and metallic film, and can suppress to chap or the generation in crack etc.
And laser processing of the present invention is characterized in that, when the inside of described sectional fixture makes the cooling fluid circulation, carries out described irradiation.
Promptly, in this laser processing, when the inside of sectional fixture makes the cooling fluid circulation, shine, so can absorb heat to the processing heat that causes because of laser by the cooling fluid that is circulated and by the metallic film of sectional fixture, thereby further prevent accumulation of heat to processing object things such as fragile materials from the back side.
According to the present invention, obtain following effect.
Promptly, according to laser processing involved in the present invention, because in the machined surface binding resin film of processing object thing, opposing face binding metal film at machined surface, so by the resin film on surface and the metallic film at the back side, can seek laser dump energy absorption and when preventing accumulation of heat to the processing object thing, can keep the processing object thing at the two sides mechanics, and can suppress to chap or the generation in crack etc.
Thereby,, also can not produce be full of cracks or crack etc. and carry out stable processing even in the cutting processing of the fragile material with high residue stress etc.
Description of drawings
Fig. 1 is the easy overall structure figure of expression laser processing device in the embodiment of laser processing involved in the present invention.
Fig. 2 is a sectional view of representing processing object thing and sectional fixture in the present embodiment.
Fig. 3 is the key diagram of the scan method of expression laser in the present embodiment.
Symbol description
The 1-laser processing device, 2-laser radiation mechanism, 4-sectional fixture, 5-cooling body, 5a-cooling fluid, 7-resin film, 8-metallic film, B-laser, W-processing object thing.
The specific embodiment
Below, an embodiment of laser processing involved in the present invention is described referring to figs. 1 through Fig. 3.In addition, in each accompanying drawing of Shi Yonging,, suitably change engineer's scale in the following description for each parts being made as the size that to discern or discern easily.
As shown in Figure 1 to Figure 3, the laser processing device 1 that uses in the laser processing of present embodiment is the device of processing to processing object thing W irradiating laser B, possessing has: laser radiation mechanism 2, its pulsed oscillation laser B, and scan when processing object thing W shines with certain repetition rate; Travel mechanism 3 can keep processing object thing W and moves; Sectional fixture 4 is arranged in this travel mechanism 3, and processing object thing W is installed and fixes; Cooling body 5 makes cooling fluid 5a circulation in the inside of this sectional fixture 4; And the control part 6 of controlling these.
The substrate that above-mentioned processing object thing W is a for example ceramic sintered bodies etc. has the fragile material of high residue stress.
In addition, as shown in Figure 2, add machined surface (surface) the binding resin film 7 of man-hour at processing object thing W, from the resin film 7 to machined surface irradiating laser B.And opposing face (back side) the binding metal film 8 at the machined surface of processing object thing W makes this metallic film 8 adhere to sectional fixture 4, and on this sectional fixture 4 fixing processing object thing W and shining.
As above-mentioned resin film 7, can adopt ultraviolet (uv) transmission films such as plastic sheetings such as polytetrafluoroethylene film, polyethylene terephthalate thin film, polyethylene film, polypropylene film, poly-methyl pentene film, polyvinyl chloride film, polyolefin etc.
And,, can adopt aluminium, copper, stainless steel metal tapes such as (SUS) as above-mentioned metallic film 8.This metallic film 8 is bonded in processing object thing W by the sticker that with acrylic rubber, polyurethane resin, silicone resin etc. is principal component.
In addition, as these resin films 7 and metallic film 8, preferably adopt thermal coefficient of expansion identical with processing object thing W or with its near and be difficult for to produce the film of the low-thermal-expansion rate of the thermal expansion difference that adds man-hour.Be 8.8 * 10 for example with thermal coefficient of expansion
-6Aluminium oxide (the Al of/K
2O
3) or thermal coefficient of expansion be 10.8 * 10
-6The lanthanum gallate of/K adds man-hour as processing object thing W, and adopting thermal coefficient of expansion is 6～10 * 10
-6The low-thermal-expansion rate special resin of/K (for example, low-thermal-expansion polyimides) is as resin film 7.And, at this moment, be 13.6 * 10 as metallic film 8 preferred thermal coefficient of expansions
-6The SUS304 of/K.
Above-mentioned travel mechanism 3 is made of following: the X-axis objective table 3x of portion, can move to the directions X that is parallel to horizontal plane; The Y-axis objective table 3y of portion is arranged on this X-axis objective table 3x of portion, and can move to Y direction vertical with respect to directions X and that be parallel to horizontal plane; And the Z axle objective table 3z of portion, be arranged on this Y-axis objective table 3y of portion, when being fixed with sectional fixture 4 and can keeping processing object thing W, can move to respect to the horizontal plane vertical direction.
Above-mentioned laser radiation mechanism 2 possesses and has: LASER Light Source 9 when vibrating laser B by the triggering signal of Q-switch, also has the optical system that makes laser focusing become point-like; Galvano scanner 10, the laser B that scanning is shone; And ccd video camera 11, take for the Working position of confirming maintained processing object thing W.
Above-mentioned LASER Light Source 9 can use the light source of the laser B of any one wavelength that can shine among 190～550nm, for example in the present embodiment, uses and can vibrate the light source of wavelength as the laser B outgoing of 355nm.
Above-mentioned galvano scanner 10 be disposed at travel mechanism 3 directly over.And above-mentioned ccd video camera 11 is provided with in abutting connection with galvano scanner 10.
Above-mentioned cooling body 5 has following structure, promptly for example makes the structure of cooling water as cooling fluid 5a circulation in the circulation flow path 5b that is arranged at sectional fixture 4 inside, is connected with the supply source (omitting diagram) of cooling fluid 5a on the circulation flow path 5b.
And sectional fixture 4 is formed with a plurality of adsorption hole 4a at the installed surface (upper surface) of processing object thing W, and these adsorption holes 4a is connected in vacuum source (omitting diagram) by the 4b of chamber portion that is formed at anchor clamps inside.That is, can be by adsorption hole 4a vacuum suction mounting in the processing object thing W of installed surface to keep.Like this, sectional fixture 4 becomes the water-cooled suction jig with water-cooled function and vacuum suction function.
Above-mentioned laser radiation mechanism 2 is set at as follows: repetition rate is being made as H, the beam diameter of laser B is made as a, the scanning times of laser B on same processing line is made as n, when the displacement L of every irradiation 1 subpulse laser B is made as n/2 * a, when the sweep speed S of laser B is made as L/ (1/H), scanning times is that the irradiation starting position of the 1st time laser B is made as L1, the irradiation starting position Ln that with scanning times is the n time laser is made as L1+ (L/n) * (n-1), in each scanning hour offset irradiation starting position and shine.
In addition, at this moment, the time of whenever sending a laser becomes 1/H.And scanning times n is for any number and do not produce the number of be full of cracks etc., and is set in the scope that can control sweep speed S.
And laser radiation mechanism 2 is set at the processing threshold value that is higher than processing object thing W a little with laser output.
If be described in detail, as shown in Figure 3, when scanning times is made as 3 times (n=3), when the 1st scanning, begin scanning, and vacate repetition rate H and sweep speed S on processing line the irradiating laser B of displacement L to set from irradiation starting position L1.For example, beam diameter a is made as 20 μ m, when repetition rate H was made as 10kHz, sweep speed S was configured to 300mm/sec.In the 1st scanning, process owing on processing line, vacating at interval, so processing object thing W links to each other between processing stand.
Secondly, when the 2nd scanning, the irradiation starting position of laser B is set at L1+ (L/2), from the 1st irradiation starting position skew, with the 1st the identical enterprising line scanning of processing line of scanning.In addition, the 3rd when scanning in the end, the irradiation starting position of laser B is set at L1+ (L/3) * 2, from the 1st time and the 2nd irradiation starting position skew, with the 1st the identical enterprising line scanning of processing line of scanning.According to these 3 times scanning, processing object thing W is cut on processing line fully.
So in the present embodiment, in the machined surface binding resin film 7 of processing object thing W, opposing face binding metal film 8 at the machined surface of processing object thing W, from the resin film 7 to machined surface irradiating laser B, when so the resin film 7 by the surface absorbs the excentral dump energy of laser B of institutes' incident, metallic film 8 heat releases of the heat that adds man-hour by the high back side of heat conductivity are to sectional fixture 4, thereby can prevent the accumulation of heat to processing object thing W such as fragile materials.And, can keep processing object thing W in the processing at the two sides mechanics by resin film 7 and metallic film 8, and can suppress to chap or the generation in crack etc.
And, when the inside of sectional fixture 4 makes cooling fluid 5a circulation, shine, thus can absorb heat from 8 pairs of processing of the metallic film heat at the back side according to the cooling fluid 5a that is circulated and by sectional fixture 4, thus further prevent accumulation of heat to processing object thing W such as fragile materials.
In addition, when the sweep speed S of laser B is made as L/ (1/H), scanning times is that the irradiation starting position of the 1st time laser B is made as L1, scanning times is that the irradiation starting position Ln of the n time laser B is made as L1+ (L/n) * (n-1), thereby shine in each scanning hour offset irradiation starting position, sharply change so suppress the stress of processing object thing W, and can not produce be full of cracks etc. and just can process.
Promptly, the starting position of skew irradiation on one side, on identical processing line, scan successively to lay equal stress on one side and be added with the worker, so that fill the point of the laser B that shines to processing object thing W with the form of pulse is above-mentioned displacement L at interval, so when scanning 1 time, processing stand vacate at interval and away from, so processing object thing W vacates at interval and becomes continuous state scanning midway, be difficult to break.And, as in the past, when overlapping mode scans continuously with the processing stand based on laser, make continuous groove extension and carry out cutting processing, thus rapid STRESS VARIATION produced, in contrast, in the present embodiment, processing stand can suppress rapid STRESS VARIATION not in succession when scanning 1 time.
[embodiment 1]
Then, according to laser processing involved in the present invention, the actual embodiment that adds man-hour is specifically described.
In the present embodiment, using the laser processing of present embodiment, is that the laser of 355nm is processed ceramic sintered bodies (thickness 250 μ m) as the processing object thing by wavelength.At this moment, polyimide resin film (thickness 0.1mm) is bonded in the surface of ceramic sintered bodies as resin film, aluminium film (thickness 0.05mm) is bonded in the back side as metallic film with the silicone-based binding agent with the acrylic acid series binding agent.The processing object thing of this state is adsorbed on the sectional fixture.
The output of laser is set at 1.3W, and repetition rate H is set at 125kHz, and measures light beam spot, and beam diameter is 20 μ m as a result, therefore sweep speed S is set at 3750mm/sec, is processed with 3 scanning times by galvano scanner.
Its result can obtain fissureless good cut surface.
Industrial applicibility
Laser processing of the present invention is particularly useful for having the cutting processing of the fragile material of high residue stress.
Claims (2)
1. a laser processing is processed to processing object thing irradiating laser, it is characterized in that,
Have the laser irradiation process, described laser irradiation process pulsed oscillation laser scans when described processing object thing shines with certain repetition rate,
In the machined surface binding resin film of described processing object thing, at the opposing face binding metal film of the machined surface of described processing object thing,
Make this metallic film adhere on the sectional fixture and on this sectional fixture, fix described processing object thing, from the described resin film to described machined surface irradiating laser.
2. laser processing as claimed in claim 1 is characterized in that,
When the inside of described sectional fixture makes the cooling fluid circulation, carry out described irradiation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010047395A JP2011177782A (en) | 2010-03-04 | 2010-03-04 | Laser beam machining method |
| JP2010-047395 | 2010-03-04 |
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|---|---|
| CN102189344A true CN102189344A (en) | 2011-09-21 |
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| CN2011100355679A Pending CN102189344A (en) | 2010-03-04 | 2011-01-28 | Laser processing method |
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| CN (1) | CN102189344A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102500896A (en) * | 2011-10-25 | 2012-06-20 | 常州碳元科技发展有限公司 | Method and system for thermal cutting of graphene layer |
| CN103464891A (en) * | 2012-06-05 | 2013-12-25 | 三菱综合材料株式会社 | Laser processing device and laser processing method |
| CN104979435A (en) * | 2014-04-14 | 2015-10-14 | 株式会社迪思科 | Processing method for optical device chips |
| CN106769324A (en) * | 2017-01-13 | 2017-05-31 | 正新橡胶（中国）有限公司 | A kind of detection method of tire supporting material nonwoven fabric from filaments |
| CN110860799A (en) * | 2018-08-07 | 2020-03-06 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting system |
| CN114054957A (en) * | 2021-07-06 | 2022-02-18 | 武汉帝尔激光科技股份有限公司 | Laser welding method and system for dissimilar metal films |
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| JP6096705B2 (en) * | 2013-07-31 | 2017-03-15 | ミネベアミツミ株式会社 | Planar illumination device and light guide plate manufacturing method |
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| JP2005279757A (en) * | 2004-03-30 | 2005-10-13 | Nitto Denko Corp | Production method for laser processed article and laser processing protection sheet |
| JP2007301631A (en) * | 2006-05-15 | 2007-11-22 | Shibaura Mechatronics Corp | Cleaving apparatus and cleaving method |
| JP2008229682A (en) * | 2007-03-22 | 2008-10-02 | Epson Toyocom Corp | Manufacturing method of package component |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102500896A (en) * | 2011-10-25 | 2012-06-20 | 常州碳元科技发展有限公司 | Method and system for thermal cutting of graphene layer |
| CN102500896B (en) * | 2011-10-25 | 2015-01-07 | 碳元科技股份有限公司 | Method and system for thermal cutting of graphene layer |
| CN103464891A (en) * | 2012-06-05 | 2013-12-25 | 三菱综合材料株式会社 | Laser processing device and laser processing method |
| CN103464891B (en) * | 2012-06-05 | 2016-06-22 | 三菱综合材料株式会社 | Laser processing device and laser processing |
| CN104979435A (en) * | 2014-04-14 | 2015-10-14 | 株式会社迪思科 | Processing method for optical device chips |
| CN106769324A (en) * | 2017-01-13 | 2017-05-31 | 正新橡胶（中国）有限公司 | A kind of detection method of tire supporting material nonwoven fabric from filaments |
| CN110860799A (en) * | 2018-08-07 | 2020-03-06 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting system |
| CN114054957A (en) * | 2021-07-06 | 2022-02-18 | 武汉帝尔激光科技股份有限公司 | Laser welding method and system for dissimilar metal films |
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| JP2011177782A (en) | 2011-09-15 |
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Application publication date: 20110921 |