CN102500896A - Method and system for thermal cutting of graphene layer - Google Patents

Method and system for thermal cutting of graphene layer Download PDF

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CN102500896A
CN102500896A CN 201110329012 CN201110329012A CN102500896A CN 102500896 A CN102500896 A CN 102500896A CN 201110329012 CN201110329012 CN 201110329012 CN 201110329012 A CN201110329012 A CN 201110329012A CN 102500896 A CN102500896 A CN 102500896A
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layer
graphene
heat
liquid
absorbing
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CN 201110329012
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CN102500896B (en )
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马宇尘
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常州碳元科技发展有限公司
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Abstract

The invention provides a method and system for thermal cutting of a graphene layer, belonging to the technical field of graphene. The system comprises the graphene layer which is of a layer structure comprising a grapheme component, a substrate layer which is of a substrate structure on which the grapheme layer is distributed, and a heat-absorbing layer which is arranged for the grapheme layer, is of a structure which is connected with the graphene substrate layer and realizes the heat-absorbing material layout, and is used for heat-absorbing treatment for the substrate layer under the condition that the substrate layer is heated. By utilizing the system, the thermal cutting method can be better utilized to cut the graphene layer.

Description

针对于石墨烯层进行热切割的方法及系统 A method for thermal cutting and graphene layer system

技术领域 FIELD

[0001 ] 本发明属于石墨烯技术领域。 [0001] The present invention belongs to the technical field alkenyl graphite. 技术背景 technical background

[0002] 石墨烯材料是近几年的研究热点,石墨烯材料具有广泛的特殊性能,包括高度透明性、高导电性、高导热性、高强度等。 [0002] Graphene is a hot material in recent years, a material having a wide range of graphene special properties including high transparency, high electrical conductivity, high thermal conductivity and high strength. 利用石墨烯材料,能够发展出各种各样的产品应用类型,比如石墨烯电路结构、石墨烯芯片结构、石墨烯触摸屏结构,等等。 Using a graphene material, a wide variety of products can develop an application type, a circuit configuration such as graphene, graphene chip structure, the touch screen graphene structure, and the like.

[0003] 虽然有各种各样的应用可能性,但针对于石墨烯材料来说,如何对其进行有效的加工,比如精确切割,仍旧是需要解决的问题。 [0003] Although there are a wide variety of application possibilities, but carry on for graphene materials, how its efficient processing, such as precision cutting, still need to be addressed.

[0004] 在当前的技术下,作为举例,比如说,利用机械刀片的方式进行切割,是一种简单易行的方式。 [0004] In the current technology, by way of example, for example, mechanically using a cutting blade, it is a simple way. 但为了获得更加精确的切割精度,还需要有进一步的改进方案。 But to obtain a more accurate precision cutting also requires further improvements.

[0005] 另一方面,目前用于制备石墨烯材料的方式虽有多种,但针对于大尺度的石墨烯层来说,目前所采用的方案,大多是在金属层上通过化学气象沉积的方式,来生成石墨烯层。 [0005] On the other hand, the current manner to the preparation of graphene Although a variety of materials used, but for the program to large scale graphene layer, the currently used mostly on the metal layer is deposited by chemical vapor mode, generating a graphene layer.

[0006] 基于当前的石墨烯层和相应的衬底结构,可以发展出与其相对应的石墨烯层的切割方案。 [0006] Based on the current and the corresponding graphene layer substrate structure, we can develop a program corresponding thereto is cut graphene layer.

发明内容 SUMMARY

[0007] 本发明的目的,是提供一种针对于石墨烯层进行热切割的方法,以及对应的系统, 利用本发明能够更好地利用热切割的方式,来对石墨烯层进行切割处理。 [0007] The object of the present invention is to provide a method for thermal cutting graphene layer, and a corresponding system, utilize the present invention to make better use of the thermally cut, cutting process is performed on the graphene layer.

[0008] 本发明提供一种针对于石墨烯层进行热切割的系统,该系统包括有如下组成部分: [0008] The present invention provides a system for thermal cutting graphene layer, the system comprises the following components:

[0009] 石墨烯层,它是包括有石墨烯组成部分的层结构; [0009] graphene layer, it comprises a layer composed of graphene moiety;

[0010] 衬底层,它是用以分布前述石墨烯层的衬底结构; [0010] substrate layer, the substrate structure which is distributed to the graphene layer;

[0011] 吸热层,它是针对于石墨烯衬底层来设置的,和前述的石墨烯衬底层进行连接、实现吸热物质布局的结构,用以在所述的衬底层受到加热处理的情况下对衬底层进行吸热处理。 [0011] absorbing layer, which is for connecting, the graphene and graphene substrate layer to the substrate layer provided, the endothermic material layout implementation structure for the case where the substrate layer is subjected to a heat treatment the backing layer of the endothermic process.

[0012] 进一步,所述的吸热层,包括有贴着衬底层所设置的吸热腔体,以及在吸热腔体中所充入的液态吸热物质。 [0012] Further, the heat absorbing layer comprising an endothermic cavity provided against the backing layer and the liquid absorbing substance absorbing chamber in the charged body.

[0013] 进一步,所述的液态吸热物质,为液态无机溶液或者液态有机溶液或者液态金属 [0013] Further, the liquid absorbing material as a liquid solution or liquid inorganic or organic solution of liquid metal

其中之一。 one of them.

[0014] 进一步,所述的液态无机溶液为液态水,或者液态二氧化碳。 [0014] Further, the liquid solution is an inorganic liquid, or liquid carbon dioxide.

[0015] 进一步,所述的液态金属,为处于液态状况下的金属锂或者金属钠,或者金属锂和金属纳的混合液体。 [0015] Further, the liquid metal as a metal lithium or metal sodium in a liquid under conditions, or a mixed liquid of metal lithium and metal sodium.

[0016] 进一步,所述的衬底层,为前述吸热层所对应的吸热腔体的器壁。 [0016] Further, the substrate layer, the absorbent layer of the wall of the corresponding heat-absorbing cavity.

[0017] 进一步,所述的衬底层,在对应着前述的吸热层,设置有向前述的吸热腔体中延伸的、结构相连接的散热凸起。 [0017] Further, the substrate layer, in the corresponding heat absorbing layer is provided extending into said cavity endothermic, heat dissipation structure connected to the projection.

[0018] 进一步,所述的散热凸起,是和前述的衬底层为一体的结构,是向所述吸热腔体中延伸的条状、螺旋状、蜂窝状、锯齿状、网格状其中之一的散热结构。 [0018] Further, the heat dissipation protrusions and the substrate layer is integrated structure is a strip extending toward the heat-absorbing chamber, a spiral, a honeycomb, zigzag, meshed wherein one of the heat dissipation structure.

[0019] 进一步,所述的衬底层,为金属材质的衬底层结构。 [0019] Further, the substrate layer, the substrate layer structure is made of metal.

[0020] 进一步,所述的金属材质的衬底层结构,为金属铜、金属铝、金属铁其中之一的衬底结构。 [0020] Further, according to the substrate layer structure made of metal, metallic copper, aluminum, the substrate structure wherein one of the metallic iron.

[0021] 进一步,对应着所述的吸热腔体,设置有与其相连通的、液位高度高出衬底层300 所在的平面高度的高液位腔 [0021] Further, corresponding to the endothermic chamber is provided with a communicating therewith, the height of the liquid level above the plane of the chamber high liquid level of the substrate layer 300 where the

[0022] 进一步,所述的热切割,是通过激光发生器所实现的激光切割,或者通过等离子体发生器所实现的等离子体切割。 [0022] Further, the thermal cutting, the laser generator is achieved by laser cutting, cutting by plasma or plasma generator implemented.

[0023] 本发明还提供一种针对于石墨烯层进行热切割的系统,该系统包括有如下组成部分: [0023] The present invention further provides a system for thermal cutting graphene layer, the system comprises the following components:

[0024] 石墨烯层,它是包括有石墨烯组成部分的层结构; [0024] graphene layer, it comprises a layer composed of graphene moiety;

[0025] 衬底层,它是用以分布前述石墨烯层的衬底结构; [0025] The backing layer, which is distributed to a substrate structure of the graphene layer;

[0026] 上位吸热层,它是用以布局在所述的石墨烯层上方,从而在针对于石墨烯层进行热切割的情况下,通过石墨烯层和/或衬底层所进行的导热作用,对热切割的热量进行吸附的结构。 [0026] The upper heat absorbing layer, which is used in the layout over the graphene layer, so that in the case of cutting the heat in for a graphene layer, heat conduction performed by a graphene layer and / or substrate layer , the thermal cutting of adsorbing structure.

[0027] 进一步,所述的上位吸热层,它包括有液体喷射结构,用以向热切割的所在位置周围喷射吸热用的液体,以及对应着热切割所在的位置,设置有用以通过气流驱除液体物质的气体喷射结构。 [0027] Further, the upper heat absorbing layer comprising a liquid ejection structure for location around the heat absorbing cutting jet with the liquid, and corresponds to the site where the thermal cutting, provided a useful air flow through purge gas injection structure of the liquid substance.

[0028] 进一步,所述的上位吸热层,它包括有液体喷射结构,用以向热切割的所在位置周围喷射吸热用的液态二氧化碳。 [0028] Further, the upper heat absorbing layer comprising a liquid ejection structure for location around the heat absorbing cutting jet with the liquid carbon dioxide.

[0029] 进一步,所述的上位吸热层,包括有吸热腔体,该吸热腔体包括有能够针对于前述的石墨烯层进行接触来吸收热量的接触型吸热面,对应着该接触型吸热面,在上位吸热腔体中设置有用以吸收热量的液态吸热物质。 [0029] Further, the upper heat absorbing layer, comprising an endothermic cavity, the cavity comprises a heat-absorbing contact surface of the heat sink for absorbing heat can be contacted on the graphene layer, corresponding to the absorbing contact surface is provided in the liquid absorbing material useful in absorbing heat in the heat-absorbing upper cavity.

[0030] 进一步,所述的液态吸热物质,为液态无机溶液或者液态有机溶液或者液态金属 [0030] Further, the liquid absorbing material as a liquid solution or liquid inorganic or organic solution of liquid metal

其中之一。 one of them.

[0031] 进一步,所述的液态无机溶液为液态水,或者液态二氧化碳。 [0031] Further, the liquid solution is an inorganic liquid, or liquid carbon dioxide.

[0032] 进一步,所述的液态金属,为处于液态状况下的金属锂或者金属钠,或者金属锂和金属纳的混合液体。 [0032] Further, the liquid metal as a metal lithium or metal sodium in a liquid under conditions, or a mixed liquid of metal lithium and metal sodium.

[0033] 进一步,所述的接触型吸热面,为分布在热切割位置点两侧的条状、环状结构。 [0033] Further, the contact type heat absorbing surfaces, the distribution in the strip, the position of the annular structure of the heat on both sides of the cutting point.

[0034] 进一步,所述的热切割,是通过激光发生器所实现的激光切割,或者通过等离子体发生器所实现的等离子体切割。 [0034] Further, the thermal cutting, the laser generator is achieved by laser cutting, cutting by plasma or plasma generator implemented.

[0035] 进一步,在所述的衬底层下方,设置有吸热层,它是针对于石墨烯衬底层来设置的,和前述的石墨烯衬底层进行连接、实现吸热物质布局的结构,用以在所述的衬底层受到加热处理的情况下对衬底层进行吸热处理。 [0035] Further, below the substrate layer, is provided with a heat absorbing layer, which is for connecting, the graphene and graphene substrate layer to the substrate layer provided, to realize the structure of the endothermic material layout, with substrate layers endothermic process in the case where the substrate layer is subjected to the heat treatment.

[0036] 本发明还提供一种针对于石墨烯层进行热切割的方法,该方法包括有如下步骤: [0036] The present invention further provides a method for thermal cutting graphene layer, the method comprising the steps of:

[0037] 步骤1,设置具有石墨烯层的衬底层,对应着衬底层或石墨烯层两者至少其一设置用以吸收热切割石墨烯时热量的吸热层; [0037] Step 1, the substrate layer having disposed graphene layers, corresponding to both the substrate layer or at least one graphene layer disposed upon the heat absorption layer to absorb thermal cutting graphene;

6[0038] 步骤2,针对于石墨烯层进行热切割处理,其中在热切割的过程中,热量通过衬底层传输至吸热层,使得热量不会因为衬底层的导热而破坏掉周围的石墨烯结构; 6 [0038] Step 2 for thermal cutting process in the graphene layer, wherein the thermal cutting process, the heat transfer through the backing layer to the absorbent layer, the thermally conductive so that heat will not destroy the underlying layer and the surrounding graphite ene structure;

[0039] 步骤3,在吸热层配合着衬底层和/或石墨烯层进行散热的过程中,完成针对于石墨烯层所进行的热切割处理。 [0039] Step 3, the heat absorbing layer with the underlying layer and / or the graphene layer to dissipate heat in the process, for the completion of the graphene layer to heat conducted cutting process.

[0040] 进一步,所述的衬底层,为金属材质的衬底层结构。 [0040] Further, the substrate layer, the substrate layer structure is made of metal.

[0041] 进一步,所述的吸热层,包括有贴着衬底层所设置的吸热腔体,以及在吸热腔体中所充入的液态吸热物质。 [0041] Further, the heat absorbing layer comprising an endothermic cavity provided against the backing layer and the liquid absorbing substance absorbing chamber in the charged body.

[0042] 进一步,所述的液态吸热物质,为液态无机溶液或者液态有机溶液或者液态金属 [0042] Further, the liquid absorbing material as a liquid solution or liquid inorganic or organic solution of liquid metal

其中之一。 one of them.

[0043] 进一步,所述的液态无机溶液为液态水,或者液态二氧化碳。 [0043] Further, the liquid solution is an inorganic liquid, or liquid carbon dioxide.

[0044] 进一步,所述的衬底层,为前述吸热层所对应的吸热腔体的器壁。 [0044] Further, the substrate layer, the absorbent layer of the wall of the corresponding heat-absorbing cavity.

[0045] 进一步,所述的衬底层,在对应着前述的吸热层,设置有向前述的吸热腔体中延伸的、结构相连接的散热凸起。 [0045] Further, the substrate layer, in the corresponding heat absorbing layer is provided extending into said cavity endothermic, heat dissipation structure connected to the projection.

[0046] 进一步,所述的吸热层,它包括有液体喷射结构,用以向热切割的所在位置周围喷射吸热用的液体,以及对应着热切割所在的位置,设置有用以通过气流驱除液体物质的气体喷射结构。 [0046] Further, the heat absorbing layer, comprising a liquid ejection structure for location around the heat absorbing cutting jet with the liquid, and corresponds to the site where the thermal cutting is provided by air to drive off a useful gas injection structure of the liquid substance.

[0047] 进一步,所述的吸热层,它包括有液体喷射结构,用以向热切割的所在位置周围喷射吸热用的液态二氧化碳。 [0047] Further, the heat absorbing layer, comprising a liquid ejection structure for location around the heat absorbing cutting jet with the liquid carbon dioxide.

[0048] 进一步,所述的吸热层,包括有吸热腔体,该吸热腔体包括有能够针对于前述的石墨烯层进行接触来吸收热量的接触型吸热面,对应着该接触型吸热面,在吸热腔体中设置有用以吸收热量的液态物质。 [0048] Further, the heat absorbing layer comprising an endothermic cavity, the cavity comprises a heat-absorbing contact surface is able to absorb the endothermic heat for the contact to the graphene layer, in contact with the corresponding type heat-absorbing surface, set to a useful liquid absorbing material absorbing heat in the cavity.

[0049] 进一步,在热切割的过程中,设置有用以停顿切割进程的切割间隔时间。 [0049] Further, in the thermal cutting process, provided a useful cutting process to cut the pause interval.

[0050] 进一步,所述的间隔间隔时间,是在热切割过程中,基于不会损伤周边石墨烯材料的散热速度的上限范围内,设置有切割间隔时间,通过该切割间隔时间,使得热切割石墨烯时所造成的热量能够由前述的吸热层在散热速度范围内进行散热。 [0050] Further, the time interval of the interval, in the thermal cutting process, the cooling rate within an upper limit on the periphery of the graphene material is not damaged, is provided with a cutting interval, through which the cutting interval, such that the thermal cutting heat graphene can be caused by heat dissipation within the speed range of the heat absorbing layer.

[0051] 进一步,所述的热切割,是通过激光发生器所实现的激光切割,或者通过等离子体发生器所实现的等离子体切割。 [0051] Further, the thermal cutting, the laser generator is achieved by laser cutting, cutting by plasma or plasma generator implemented.

附图说明 BRIEF DESCRIPTION

[0052] 图1是本发明所描述的热切割系统的结构示意图,为一种实施例。 [0052] FIG. 1 is a schematic view of the present invention as described thermal cutting system for one embodiment.

[0053] 图2是本发明所描述的衬底层在设置有散热凸起情况下的示意图。 [0053] FIG. 2 is a schematic view of a substrate layer as described in the present invention is provided with a convex heat conditions.

[0054] 图3是本发明所描述的热切割系统的结构示意图,为另一种实施例。 [0054] FIG. 3 is a schematic diagram of the present invention as described thermal cutting system as another embodiment.

具体实施方式 detailed description

[0055] 在当前的技术条件下,对石墨烯材料的研究、制备与应用日益广泛。 [0055] In the present technical conditions, material graphene research, prepared and used widely. 其中,通过金属材料衬底来基于气相沉积的方式生成石墨烯的方案,是用来制作大尺度石墨烯层的重要方法。 Wherein the metallic material of the substrate by vapor deposition to a manner based on the program to generate graphene, is an important method for the production of large scale graphene layer is used.

[0056] 针对于已经制作的薄层结构的石墨烯,有多种应用的方式,比如说,可以作为导电材料;所述的石墨烯为透明状态的话,还可以作为透明导电材料用以制作触摸屏等多种结构。 [0056] For the structure of the graphene sheet has been produced to have application in many ways, for example, can be used as the conductive material; graphene the transparent state, it may also be used as a transparent conductive material used to make the touch screen and other structures. 另外,也可以利用薄层结构的石墨烯,来制作各种各样的导电线路。 Further, the graphene sheet can also be used structure to produce a wide range of conductive traces.

[0057] 需要指出的是,用来作为导体的石墨烯结构,自身的厚度通常很薄,在进行机械加工的时候,如何进行精密的切割处理,对石墨烯的应用具有重要的影响。 [0057] It is noted that, as used graphene structure of the conductor, its thickness is usually very thin, machining is performed when, how precise cutting process, has an important impact on the application of graphene.

[0058] 石墨烯材料的性能稳定,对这类材料的切割方式,主要有三种类型,一是采用机械的切割方式,比如,利用刀片来进行切割操作;二是采用化学成分腐蚀来进行切割的方式; 三是采用热切割的方式,利用快速加热的方式,使得切割部位的石墨烯材料被破坏掉,比如被挥发,或者被燃烧掉。 [0058] The stability properties of the graphene material, the way to cut such materials, there are three main types, one cutting mechanically using, for example, with a blade to perform a cutting operation; second is carried out by chemical etching component cutting mode; Third embodiment using thermal cutting by way of rapid heating, so that the cut portion of the graphene material is destroyed, for example by volatilization or are burned.

[0059] 热切割方式,作为典型的实施方案,首先是采用激光。 [0059] The thermal cutting method, as a typical embodiment, the first laser. 利用激光的高强度和瞬间的加热性能,来对石墨烯进行切割处理。 By laser heating performance and high strength instant to graphene cutting process. 而且,利用激光进行热切割的方案,有助于将石墨烯的切割精度控制得更高,并且,也有助于利用机械力或者机器人的方式进行精密的切割操作。 Further, the heat by laser cutting program, help control the graphene higher cutting accuracy, and also helps by mechanical force or precision cutting operation of the robot.

[0060] 另外,通过等离子体发生器所实现的等离子体热切割方式,同样能够快速达到极高的温度,从数千度到上万度不等。 [0060] Further, plasma thermal plasma generator achieved by the cutting mode, the same can quickly reach a high temperature ranging from thousands to tens of thousands of degrees. 通过控制等离子体的流量截面,来应用于热切割操作。 By controlling the flow cross section of the plasma, heat is applied to the cutting operation.

[0061] 下面对本发明的具体实施方式,举例说明如下。 [0061] The following specific embodiments of the present invention, illustrated as follows.

[0062] 参图1所示,这儿展示了本发明所描述的一个实施例。 [0062] The parameters shown in FIG. 1, here showing one embodiment of the present invention is described.

[0063] 所述的热切割系统100,它包括有衬底层300,用以作为分布石墨烯层200的衬底结构。 Cutting system [0063] 100 according to, which comprises a substrate layer 300, a substrate structure for distribution of the graphene layer 200. 所述的石墨烯层200,是包括有石墨烯成份的物质层。 The graphene layer 200, graphene is a material layer component. 它可以是纯净的石墨烯层,也可以是在其它材料表面上或者内部所形成的石墨烯层。 It may be pure graphene layer may be a graphene layer on the inside surface of another material or formed.

[0064] 在本实施例中,衬底层300的材质,是采用铜质材料来实现的薄层结构。 [0064] In the present embodiment, the substrate layer material 300, the structure of a thin layer of copper material to achieve. 需要指出的是,利用铜质材料所实现的薄层结构,能够便利地通过化学气相沉积的方式,生成大尺度的石墨烯薄膜。 It should be noted that the use of a thin layer of copper material to achieve the structure can be conveniently made by chemical vapor deposition mode, generating large scale graphene thin film.

[0065] 在衬底层300的下方,设置有吸热层400。 [0065] In the lower substrate layer 300, 400 is provided with a heat absorbing layer. 在本实施例中,所述的吸热层400包括有吸热腔体410,在吸热腔体410中,容放有用以吸收热量的液态物质,称为液态吸热物质430。 In the present embodiment, the heat absorbing layer 400 comprises a heat-absorbing chamber 410, the heat-absorbing chamber 410 accommodating a liquid substance is useful to absorb heat, the liquid absorbing material 430 is called. 在该实施例中,所述的液态吸热物质430是采用液态水来实现的。 In this embodiment, the liquid absorbing material 430 is implemented using liquid water.

[0066] 对应着所述的吸热层400,它的吸热腔体410的其中一个器壁,就是所述的衬底层300的部分结构。 [0066] corresponds to the absorption layer 400, which is endothermic, wherein a cavity wall 410 is part of the substrate layer structure 300.

[0067] 在本实施例中,所述的衬底层300是水平放置的。 [0067] In the present embodiment, the substrate layer 300 is placed horizontally. 于是,在吸热腔体410中所容放的液态吸热物质430,为了能够起到更加良好的吸热作用,适合将前述的液态吸热物质430 充满到前述的吸热腔体410中,并且和衬底层300充分接触。 Thus, heat-absorbing chamber 410 as the liquid absorbing material 430 accommodated, to be able to play a more favorable heat absorbing action, adapted to the liquid absorbing material 430 is filled into the heat absorbing chamber 410, and the substrate layer 300 and sufficiently. 为实现该目的,在该实施例中,设置有高液位腔440。 For this purpose, in this embodiment, the cavity 440 is provided with a high level. 所述的高液位腔440,是通过和吸热腔体410相连接的管道来实现的,且该管道的高度,以及容放的液体的液位高度,高出衬底层300所在的平面高度。 The high level of cavity 440, is achieved through the conduit 410 and the heat absorption chamber is connected to the body, and the height of the duct, and accommodating the liquid level of the liquid, the height above the plane of the substrate layer 300 where the . 在本实施例中,所述的高液位腔440中,还可以用以实现向前述的吸热腔体410中注入液态吸热物质430。 In the present embodiment, the high level of the cavity 440, may also be used to achieve a liquid absorbing material 430 is injected into the cavity 410 the endothermic. 另外,如果液态吸热物质430的温度很高,会产生气泡的话,还可以通过高液位腔440将其气态成份导出。 Further, if the temperature of the liquid absorbing material 430 is high, bubbles are generated, then, the gaseous component can be derived by a high level of 440 lumen.

[0068] 进一步,需要指出的是,对应着前述的吸热腔体410,还可以设置其它外接的冷却结构,作为举例,冷却的方式,可以采用更换液态吸热物质430的方式来实现。 [0068] Further, it should be noted that, corresponding to the above-described heat-absorbing chamber 410 may also be provided a cooling structure of the other external, by way of example, cooled, the way to replace the liquid absorbing material 430 may be employed to achieve. 具体说来,可以设置两个高液位腔440,一个用以导出高温液体,一个用以导入低温液体。 Specifically, a high level may be provided two chambers 440, to derive a high temperature fluid, for introducing a cryogenic liquid. 当然,也可以通过其它的管道形式来实现该功能。 Of course, this function can also be realized through other forms of pipe.

[0069] 另外,也可以利用换热器的方式,利用其它的冷源来冷却前述的吸热腔体410中的液态吸热物质430。 [0069] Further, the heat exchanger may be utilized in a manner that, with other cold source for cooling the endothermic cavity 410 liquid absorbing material 430.

[0070] 继续参图中所示,对应着所述的石墨烯层200,在本实施例中,采用激光发生器110发出激光束111。 [0070] shown in FIG continue to participate, corresponding to the graphene layer 200, in this embodiment, a laser generator 110 emits the laser beam 111. 利用激光束111所产生的瞬间高温,来对前述的石墨烯层200实现切割目的。 Using the instantaneous high temperature generated by the laser beam 111, 200 to cut the object to achieve the foregoing graphene layer. 另一方面,通过激光束111所产生的热量,还可以通过所述的衬底层300进行传输, 这种情况下,就可以基于吸热层400来快速吸收经由激光束110所发出的热量。 On the other hand, the heat generated by the laser beam 111, also may be transmitted through the substrate layer 300, in this case, it may be based on the absorption layer 400 to quickly heat absorbed from a laser beam 110 emitted. 通过这种降温功能,来减少激光束111在切割石墨烯层200的过程中,因高温而对周围石墨烯层200 的破坏作用,另外,也可以减少激光束111的热量对衬底层300的损伤。 By this cooling function, to reduce the laser beam 111 during the cutting of the graphene layer 200, the effect of the damage due to high temperature around the graphene layer 200, is also possible to reduce the heat of the laser beam 111 on the substrate layer 300 of damage .

[0071] 如前所述,本发明所描述的热切割系统100中,所述的衬底层300,适合作为前述吸热层400所对应吸热腔体410的吸热腔体器壁420,这样能够更便于导热。 [0071] As described above, in 100, the substrate layer 300 according to the present invention described thermal cutting system, suitable as a heat absorbing layer 400 corresponds to the heat absorbing chamber absorbs heat in the wall 420 of the cavity 410, so thermal conductivity can be easier.

[0072] 前述的液态吸热物质430,作为举例而非限定,为液态无机溶液或者液态有机溶液或者液态金属其中之一。 [0072] the liquid absorbing material 430, by way of example and not limitation, one of a liquid solution or liquid inorganic or organic solution in which the liquid metal.

[0073] 所述的液态无机溶液为液态水,或者液态二氧化碳。 [0073] The liquid solution is an inorganic liquid, or liquid carbon dioxide. 所述的液态水,具有很大的热容,吸热能力强,成本低廉,而且对环境没有污染。 The liquid water, having a large heat capacity, heat absorption ability, low cost and no pollution to the environment. 所述的液态二氧化碳,能够在受热的情况下快速气化,从而带走更多的热量;而且液态二氧化碳的成本也较低,同样可以应用于本发明。 The liquid carbon dioxide, can be quickly heated in the case of gasification, so that more heat away; and also lower the cost of liquid carbon dioxide, can also be applied to the present invention. 在使用液态二氧化碳时,也可以主动通过气化二氧化碳的方式,来降低液态吸热物质整体的温度。 When using liquid carbon dioxide, the carbon dioxide may be active by way of gasification, to reduce the overall temperature of the liquid absorbing material.

[0074] 进一步,前述的液态吸热物质,也可以采用所述的液态金属来实现。 [0074] Further, the liquid absorbing material, may be implemented in the liquid metal. 这种情况下, 就适合采用低熔点的金属或者低熔点的合金。 In this case, it is suitable for low-melting metal or a low melting point alloy. 作为典型的实施例,可以采用处于液态状况下的金属锂或者金属钠,或者金属锂和金属纳的混合液体。 As typical examples, can be used metallic lithium or metallic sodium in a liquid under conditions, or a mixed liquid of metal lithium and metal sodium.

[0075] 进一步,参图2所示,对应着所示的衬底层300,面向于前述的吸热层400,设置用以向前述的吸热腔体中延伸,而且结构相连接的散热凸起310,利用这些散热凸起310,能够将衬底层300所接收的热量更快的在吸热层400中的液态物质中散发出去。 [0075] Further, reference Figure 2, correspond to the substrate layer 300 is shown oriented in the heat absorption layer 400 is provided to extend toward the cavity endothermic, and the heat dissipation structure connected to projection 310, use of these radiating projections 310, it is possible to heat the underlying substrate 300 received in the faster the absorption layer 400 in the liquid substance dissipated.

[0076] 作为优选的实施例而非限定,这儿所述的散热凸起310,是和前述的衬底层300连为一体的结构,是向所述吸热腔体410中延伸的条状、螺旋状、蜂窝状、锯齿状、网格状其中之一的散热结构。 [0076] As a preferred embodiment, and not limitation, here the heat dissipation protrusion 310, and the substrate layer is 300 is integral structure, is a strip 410 extending toward the heat-absorbing chamber, spiral , honeycomb, zigzag, grid-like heat-dissipating structure wherein one. 这些结构形式,能够将衬底层300中所接收的热量更快地扩散出去。 The structure, the substrate layer 300 can be received in the heat spread out quickly.

[0077] 前面所描述的衬底层300,作为实施例而非限定,是通过金属铜来实现的。 [0077] The substrate layer 300 previously described, as an example and not limitation, is achieved by means of metallic copper. 当然,也可以采用其它的金属材质来实现衬底层300。 Of course, to achieve the substrate layer 300 may also employ other metal material. 金属材质也有利于作为石墨烯气相沉积的衬底材料。 Metallic material is also advantageous as a substrate material vapor deposited graphene.

[0078] 前述的金属材质的衬底层结构,作为举例而非限定,可以采用金属铜、金属铝、金属铁其中之一的衬底结构。 [0078] The structure of the underlying substrate metal material, by way of example and not limitation, copper, aluminum, the substrate structure wherein one of the metallic iron may be employed.

[0079] 进一步,参图3所示,在本发明中,还提供另外一种实施例,在该实施例中,所述的吸热层,还包括有针对于石墨烯层,从石墨烯层的外侧直接进行热量吸附的相应结构。 [0079] Further, reference to FIG. 3, in the present invention, there is also provided another embodiment, in this embodiment, the heat absorbing layer further comprises a layer for graphene in the graphene layer, from the outer structure corresponding direct adsorption heat.

[0080] 如图3所示,在本图所示的实施例中,对应在衬底层300上,设置有石墨烯层200。 [0080] As shown in FIG. 3, in the embodiment shown in the figure in correspondence on the underlayer 300, 200 is provided with a graphene layer. 并且,设置有激光发生器110,通过产生的激光束111的高温作用,来对石墨烯层200进行切割操作。 And provided with a laser generator 110, to perform the cutting operation of the graphene layer 200 by the high temperature generated by the laser beam 111.

[0081] 对应在石墨烯层200的上方,紧贴着石墨烯层200的位置处,设置有上位吸热层500。 [0081] In correspondence of the top of the graphene layer 200, at a position close to the graphene layer 200, an upper absorption layer 500 is provided. 该上位吸热层500,它用以布局在所述的石墨烯层上方,是在针对于石墨烯层进行热切割的情况下,通过石墨烯层和/或衬底层所进行的导热作用,对热切割的热量进行吸附的结构。 The upper heat absorbing layer 500, which is used in the above arrangement of the graphene layer, in the case of the graphene layer is directed to the thermal cutting, performed by the heat conduction graphene layer and / or substrate layer of adsorption heat thermal cutting structure. [0082] 需要指出的是,本实施例还可以与图1所示的实施例相结合,在衬底层300下方还 [0082] It should be noted that the present embodiment may also be combined with the embodiment shown in FIG. 1, the substrate layer 300 further below

设置一套吸热层结构。 Structure is provided a heat absorbing layer.

[0083] 在本实施例中,所述的上位吸热层500,它包括有液体喷射结构510,用以向热切割的所在位置周围喷射吸热用的喷射流体511。 [0083] In the present embodiment, the upper heat absorbing layer 500, which includes a liquid ejecting structure 510 for location around the thermal cutting jet injection fluid 511 with the endothermic.

[0084] 在该实施例中,所喷射的液体为液态水。 [0084] In this embodiment, the injected liquid is liquid water. 进而,对应着利用激光进行热切割所在位置,以及前述的液体喷射结构510的所在位置,还设置有用以通过气流来驱散液体物质的气体喷射结构520。 Further, corresponding to the location of heat by laser cutting location, and the aforementioned liquid ejection structure 510 is further provided to be useful to disperse the liquid substance stream through the gas injection structure 520.

[0085] 所述的气体喷射结构520,作为实施例而非限定,直接喷射空气就可以了,它设置有喷射口,以及压缩气体用的气泵。 [0085] The gas injector structure 520, as an example and not limitation, direct air injection can be, it is provided with the ejection port, and a compression pump with gas. 在高压气体的喷射作用下,能够将液体喷射结构510所喷射的喷射流体511,利用高压气体的冲力将其冲散,从而提供激光束111的照射空间。 Under the action of high-pressure gas injection, the structure of the liquid jet injected from the injector 510 in fluid 511, the use of high pressure gas momentum to break up, thereby providing a laser beam irradiation space 111.

[0086] 所述的液态吸热物质,进一步,为液态水、液态有机溶液、液态二氧化碳其中之一。 The liquid absorbing substance, and further, liquid water, the organic liquid solution, liquid carbon dioxide is one of the [0086].

[0087] 需要指出的是,当喷射的液体为液态二氧化碳的时候,因为二氧化碳非常便于气化,因此,就不用设置气体喷射结构了。 [0087] It should be noted that, when the liquid is ejected liquid carbon dioxide, since carbon dioxide is very easy gasification, therefore, would not have provided a gas injection structure.

[0088] 另外,所述的上位吸热层,还可以通过类似于前面图1所示的结构来实现。 [0088] Further, the upper heat absorbing layer, can also be achieved by the structure similar to that shown in previous figures. 这种情况下,它包括有吸热腔体。 In this case, it comprises a heat-absorbing chamber. 但在该实施例中,吸热腔体包括有能够针对于前述的石墨烯层进行接触的接触型吸热面,它通过平面结构即可实现,用以通过接触石墨烯层200的方式来吸收热量。 However, in this embodiment, the heat absorption chamber comprises a contact type capable of absorbing surface for contacting in the graphene layer, which can be achieved by the planar structure to be absorbed by the contact of the graphene layer 200 heat. 对应着该接触型吸热面,在上位吸热层的吸热腔体中设置有用以吸收热量的液态物质。 The corresponding heat absorbing contact surface, the liquid substance is provided in order to be useful in absorbing heat absorbing chamber in the upper absorption layer.

[0089] 在使用时,将包括有吸热腔体的上位吸热层的接触型吸热面,贴近着所述的石墨烯层200进行置放,并且,贴近着热切割的加工位置附近进行置放,就可以了。 [0089] In use, the upper surface including a contact type heat absorbing endothermic heat absorbing layer of the cavity, close to the said graphene layer 200 disposed, and, close to the vicinity of the cutting position of the thermal processing is performed placed on it.

[0090] 和前面的实施例类似,所述的液态吸热物质,为液态无机溶液或者液态有机溶液或者液态金属其中之一。 [0090] and similar to the previous embodiment, the liquid absorbing material, one of which is a liquid solution of an inorganic or an organic liquid solution or liquid metal. 作为优选的实施例,所述的液态无机溶液为液态水,或者液态二氧化碳。 As a preferred embodiment, the liquid solution is an inorganic liquid, or liquid carbon dioxide.

[0091] 所述的液态吸热物质采用液态金属时,作为举例而非限定,是处于液态状况下的金属锂或者金属钠,或者金属锂和金属纳的混合液体。 [0091] The liquid absorbing substance using liquid metal, by way of example and not limitation, a metal lithium or metal sodium in a liquid under conditions, metal sodium or metal lithium and a mixed liquid.

[0092] 在采用具有吸热腔体的上位吸热层时,所述的接触型吸热面,作为举例而非限定, 是分布在热切割位置点两侧的条状、环状结构,并且这些结构适合于位置移动;它具有平面结构,适合紧贴于石墨烯层进行置放。 [0092] When using an upper layer having an endothermic heat absorbing chamber, the heat absorbing surface contact, by way of example and not limitation, a distribution strip, the position of the cyclic structure at points on both sides of the heat cutter, and these structures are adapted to position; it has a flat structure, adapted to close the graphene layer is disposed.

[0093] 基于前面所描述的热切割系统,在本发明中,还提供了一种针对于石墨烯层进行热切割的方法,该方法包括有如下步骤: [0093] The cutting system based on the previously described, in the present invention, there is also provided a method for thermal cutting graphene layer, the method comprising the steps of:

[0094] 步骤1,设置具有石墨烯层的衬底层,对应着衬底层或石墨烯层两者至少其一设置用以吸收热切割石墨烯时热量的吸热层; [0094] Step 1, the substrate layer having disposed graphene layers, corresponding to both the substrate layer or at least one graphene layer disposed upon the heat absorption layer to absorb thermal cutting graphene;

[0095] 步骤2,针对于石墨烯层进行热切割处理,其中在热切割的过程中,热量通过衬底层传输至吸热层,使得热量不会因为衬底层的导热而破坏掉周围的石墨烯结构; [0095] Step 2 for thermal cutting process in the graphene layer, wherein the thermal cutting process, the heat transfer through the backing layer to the absorbent layer, the thermally conductive so that heat will not destroy the underlying layer around the graphene structure;

[0096] 步骤3,在吸热层配合着衬底层和/或石墨烯层进行散热的过程中,完成针对于石墨烯层所进行的热切割处理。 [0096] Step 3, the heat absorbing layer with the underlying layer and / or the graphene layer to dissipate heat in the process, for the completion of the graphene layer to heat conducted cutting process.

[0097] 针对于吸热层的具体结构,参见前面所描述的实施例。 [0097] The specific structure in the heat absorbing layer, refer to the previously described embodiments.

[0098] 进一步,在热切割的过程中,设置有用以停顿切割进程的切割间隔时间。 [0098] Further, in the thermal cutting process, provided a useful cutting process to cut the pause interval. 设置该切割间隔时间的目的,是为了能够让热切割针对于石墨烯层200和衬底层300所施加的热量,和散热速度之间能够达到平衡,从而不会对邻近的石墨烯层200造成破坏,或者减少破坏。 Purpose of the cutting interval, in order to allow for thermal cutting between the heat, and the cooling rate in the graphene layer 200 and substrate layer 300 can be applied to reach equilibrium, so as not to cause damage to the adjacent graphene layer 200 or reduce the damage.

[0099] 具体说来,所述的切割间隔时间,是在热切割过程中,基于不会损伤周边石墨烯材料的散热速度的上限范围内,设置有切割间隔时间,通过该切割间隔时间,使得热切割石墨烯时所造成的热量能够由前述的吸热层在散热速度范围内进行散热。 [0099] In particular, according to cutting intervals, in a thermal cutting process, the cooling rate within an upper limit on the periphery of the graphene material is not damaged, is provided with a cutting interval, through which the cutting interval, such that the thermal cutting of graphene can be caused by heat dissipation within the speed range of the heat absorbing layer.

[0100] 比如说,在热切割的过程中,可以设定每热切割1秒钟,就要停止加热1秒钟,利用停止加热这一秒钟的时间,将热切割时所积蓄的热量通过自身的散热作用,以及吸热层的吸热作用,来进行热量扩散。 [0100] For example, in the process of thermal cutting, hot cutting may be set for each 1 second, 1 second necessary heating was stopped, heating was stopped using the second time, cutting the heat accumulated by the heat its cooling effect, the heat absorbing layer and the heat absorbing action, heat diffusion is performed. 当然,这儿所描述的切割间隔时间,可以根据实际需要进行设定。 Of course, cutting interval described here, you can be set according to actual needs.

[0101] 以上是对本发明的描述而非限定,基于本发明思想的其它实施例,亦均在本发明的保护范围之中。 [0101] The above is the description of the invention and not limitation, other embodiments based on the embodiments of the inventive concept, the scope always make in the present invention.

Claims (35)

  1. 1. 一种针对于石墨烯层进行热切割的系统,其特征在于该系统包括有如下组成部分:石墨烯层,它是包括有石墨烯组成部分的层结构;衬底层,它是用以分布前述石墨烯层的衬底结构;吸热层,它是针对于石墨烯衬底层来设置的,和前述的石墨烯衬底层进行连接、实现吸热物质布局的结构,用以在所述的衬底层受到加热处理的情况下对衬底层进行吸热处理。 A system for thermal cutting graphene layer, characterized in that the system comprises the following components: a graphene layer, which is part of a layer structure comprising a graphene; substrate layer, which is distributed to lining heat absorbing layer, it is for, and the graphene in the graphene substrate layer to the substrate layer provided connectivity for the endothermic material structure layout for the; a substrate structure of the graphene layer endothermic process substrate layers where the bottom layer is heated under treatment.
  2. 2.根据权利要求1所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的吸热层,包括有贴着衬底层所设置的吸热腔体,以及在吸热腔体中所充入的液态吸热物质。 The one of the preceding claims for the thermal cutting system in graphene layer, wherein: the heat absorbing layer comprising a cavity with a heat-absorbing backing layer against the set, and the suction thermal cavity the charged liquid absorbing material.
  3. 3.根据权利要求2所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的液态吸热物质,为液态无机溶液或者液态有机溶液或者液态金属其中之一。 According to one of the claim 2, the system for thermal cutting graphene layers, wherein: one of said liquid absorbing material is an inorganic liquid solution or a liquid solution or an organic liquid in which the metal.
  4. 4.根据权利要求3所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的液态无机溶液为液态水,或者液态二氧化碳。 According to one of the claim 3, the system for thermal cutting graphene layers, wherein: the liquid solution is an inorganic liquid, or liquid carbon dioxide.
  5. 5.根据权利要求3所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的液态金属,为处于液态状况下的金属锂或者金属钠,或者金属锂和金属纳的混合液体。 According to one of the claim 3, the system for thermal cutting graphene layers, wherein: the liquid metal, as metal lithium or metal sodium in a liquid under conditions, and metallic lithium or metallic sodium the mixed liquid.
  6. 6.根据权利要求2所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的衬底层,为前述吸热层所对应的吸热腔体的器壁。 According to one of the claim 2, the system for thermal cutting graphene layers, wherein: the substrate layer, the absorbent layer of the wall of the corresponding heat-absorbing cavity.
  7. 7.根据权利要求2所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的衬底层,在对应着前述的吸热层,设置有向前述的吸热腔体中延伸的、结构相连接的散热凸起。 According to one of the claim 2, the system for thermal cutting graphene layers, wherein: the substrate layer, the heat absorbing layer corresponding to the above-described, is provided with a cavity to the endotherm extending, heat dissipation structure connected to the projection.
  8. 8.根据权利要求7所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的散热凸起,是和前述的衬底层为一体的结构,是向所述吸热腔体中延伸的条状、螺旋状、 蜂窝状、锯齿状、网格状其中之一的散热结构。 According to claim 7, wherein one of the systems for the thermal cutting graphene layers, wherein: said heat dissipation protrusions and the substrate layer is integrated in the structure, the heat sink is to stripe cavity extending spiral, a honeycomb, zigzag, grid-like heat-dissipating structure wherein one.
  9. 9.根据权利要求1所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的衬底层,为金属材质的衬底层结构。 According to claim 1, wherein one of the systems for the thermal cutting graphene layers, wherein: the substrate layer, the substrate layer structure is made of metal.
  10. 10.根据权利要求9所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的金属材质的衬底层结构,为金属铜、金属铝、金属铁其中之一的衬底结构。 10. A method according to claim 9 for the thermal cutting system in graphene layer, wherein: said substrate layer structure of a metal material, a metal copper, aluminum, iron, one of the metal liner wherein bottom structure.
  11. 11.根据权利要求2所述的一种针对于石墨烯层进行热切割的系统,其特征在于:对应着所述的吸热腔体,设置有与其相连通的、液位高度高出衬底层300所在的平面高度的高液位腔 According to claim 2, wherein one of said system for thermal cutting graphene layers, wherein: a cavity corresponding to the endothermic, is provided in communication therewith, the liquid level above the substrate layer where the height of the plane of the chamber high liquid level 300
  12. 12.根据权利要求1所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的热切割,是通过激光发生器所实现的激光切割,或者通过等离子体发生器所实现的等离子体切割。 12. A method according to claim 1 for heat-cutting system in graphene layer, wherein: said thermal cut is achieved by laser cutting laser generator, or by a plasma generator achieve plasma cutting.
  13. 13. —种针对于石墨烯层进行热切割的系统,其特征在于该系统包括有如下组成部分:石墨烯层,它是包括有石墨烯组成部分的层结构;衬底层,它是用以分布前述石墨烯层的衬底结构;上位吸热层,它是用以布局在所述的石墨烯层上方,从而在针对于石墨烯层进行热切割的情况下,通过石墨烯层和/或衬底层所进行的导热作用,对热切割的热量进行吸附的结构。 13. - kind of system for thermal cutting graphene layer, characterized in that the system comprises the following components: a graphene layer, which is part of a layer structure comprising a graphene; substrate layer, which is distributed to the substrate structure of the graphene layer; upper heat absorbing layer, which is used in the above arrangement of the graphene layer, so that in the case of thermal cutting layer for graphene by the graphene layer and / or liner heat conduction underlying performed, the thermal cutting of structural adsorption.
  14. 14.根据权利要求13所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的上位吸热层,它包括有液体喷射结构,用以向热切割的所在位置周围喷射吸热用的液体,以及对应着热切割所在的位置,设置有用以通过气流驱除液体物质的气体喷射结构。 14. A method according to claim 13 for thermal cutting system in graphene layer, wherein: the upper absorbing layer, comprising a liquid ejection structure for location around the thermal cutting injection with heat-absorbing liquid, and the corresponding cutting position where the heat is provided to a useful gaseous purge stream by ejecting the liquid material structure.
  15. 15.根据权利要求13所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的上位吸热层,它包括有液体喷射结构,用以向热切割的所在位置周围喷射吸热用的液态二氧化碳。 15. A method according to claim 13 for thermal cutting system in graphene layer, wherein: the upper absorbing layer, comprising a liquid ejection structure for location around the thermal cutting injection of liquid carbon dioxide with the endothermic.
  16. 16.根据权利要求13所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的上位吸热层,包括有吸热腔体,该吸热腔体包括有能够针对于前述的石墨烯层进行接触来吸收热量的接触型吸热面,对应着该接触型吸热面,在上位吸热腔体中设置有用以吸收热量的液态吸热物质。 16. A method according to claim 13 for thermal cutting system in graphene layer, wherein: the upper absorbing layer, comprising heat-absorbing chamber, which comprises a heat-absorbing chamber capable for contact surface for contact with the heat absorbing graphene layer to absorb heat, corresponding to the heat-absorbing contact surface is provided in the liquid absorbing material useful in absorbing heat absorbing chamber in the upper body.
  17. 17.根据权利要求16所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的液态吸热物质,为液态无机溶液或者液态有机溶液或者液态金属其中之一。 17. A method according to claim 16 for thermal cutting system in graphene layer, wherein: said liquid absorbing material as a liquid solution or liquid inorganic or organic solution of liquid metal one.
  18. 18.根据权利要求17所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的液态无机溶液为液态水,或者液态二氧化碳。 18. A method according to claim 17 for thermal cutting system in graphene layer, wherein: said liquid solution is an inorganic liquid, or liquid carbon dioxide.
  19. 19.根据权利要求17所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的液态金属,为处于液态状况下的金属锂或者金属钠,或者金属锂和金属纳的混合液体。 19. A method according to claim 17 for thermal cutting system in graphene layer, wherein: said liquid metal, as metal lithium or metal sodium in a liquid under conditions, and metallic lithium or metallic sodium the mixed liquid.
  20. 20.根据权利要求16所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的接触型吸热面,为分布在热切割位置点两侧的条状、环状结构。 20. According to one of the claim 16 for thermal cutting system in graphene layer, wherein: said contact type heat absorbing surface and the heat is distributed over both sides of the cutting position the point of strips, cyclic structure.
  21. 21.根据权利要求13所述的一种针对于石墨烯层进行热切割的系统,其特征在于:所述的热切割,是通过激光发生器所实现的激光切割,或者通过等离子体发生器所实现的等离子体切割。 21. According to one of the claim 13 for thermal cutting system in graphene layer, wherein: said thermal cut is achieved by laser cutting laser generator, or by a plasma generator achieve plasma cutting.
  22. 22.根据权利要求13所述的一种针对于石墨烯层进行热切割的系统,其特征在于:在所述的衬底层下方,设置有吸热层,它是针对于石墨烯衬底层来设置的,和前述的石墨烯衬底层进行连接、实现吸热物质布局的结构,用以在所述的衬底层受到加热处理的情况下对衬底层进行吸热处理。 22. According to one of the claim 13 for thermal cutting system in graphene layer, wherein: the substrate layer below, is provided with a heat absorbing layer, which is directed to the underlying substrate disposed graphene , the backing layer and the graphene is connected, the endothermic material achieve structural layout for a case where the substrate layer is subjected to a heat treatment to the substrate layer endothermic process.
  23. 23. —种针对于石墨烯层进行热切割的方法,其特征在于该方法包括有如下步骤:步骤1,设置具有石墨烯层的衬底层,对应着衬底层或石墨烯层两者至少其一设置用以吸收热切割石墨烯时热量的吸热层;步骤2,针对于石墨烯层进行热切割处理,其中在热切割的过程中,热量通过衬底层传输至吸热层,使得热量不会因为衬底层的导热而破坏掉周围的石墨烯结构;步骤3,在吸热层配合着衬底层和/或石墨烯层进行散热的过程中,完成针对于石墨烯层所进行的热切割处理。 23. - Method for the thermal cutting species in graphene layer, characterized in that the method comprises the following steps: Step 1, the substrate layer having disposed graphene layers, corresponding to both the substrate layer or at least one graphene layer when the heat absorbing layer provided to absorb thermal cutting graphene; step 2 for thermal cutting process in the graphene layer, wherein the thermal cutting process, the heat transfer through the backing layer to the absorbent layer, so that the heat does because the thermally conductive substrate layer and destroy surrounding graphene structure; process step 3, the heat absorbing layer with the underlying layer and / or the graphene layer to dissipate heat, the heat for the completion of the graphene layer in the cutting process performed.
  24. 24.根据权利要求23所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的衬底层,为金属材质的衬底层结构。 24. According to one of the claim 23 for the thermal cutting method in graphene layer, wherein: said substrate layer, the substrate layer structure is made of metal.
  25. 25.根据权利要求23所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的吸热层,包括有贴着衬底层所设置的吸热腔体,以及在吸热腔体中所充入的液态吸热物质。 25. According to one of the claim 23 for the thermal cutting method in graphene layer, wherein: the heat absorbing layer comprising a cavity with a heat-absorbing backing layer against the set, and the suction thermal cavity the charged liquid absorbing material.
  26. 26.根据权利要求25所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的液态吸热物质,为液态无机溶液或者液态有机溶液或者液态金属其中之一。 26. According to one of the claim 25 for the thermal cutting method in graphene layer, wherein: one of said liquid absorbing material is an inorganic liquid solution or a liquid solution or an organic liquid in which the metal.
  27. 27.根据权利要求沈所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的液态无机溶液为液态水,或者液态二氧化碳。 27. A sink as claimed in claim directed to a method for thermal cutting graphene layers, wherein: the liquid solution is an inorganic liquid, or liquid carbon dioxide.
  28. 28.根据权利要求25所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的衬底层,为前述吸热层所对应的吸热腔体的器壁。 28. According to one of the claim 25 for the thermal cutting method in graphene layer, wherein: said substrate layer, the absorbent layer of the wall of the corresponding heat-absorbing cavity.
  29. 29.根据权利要求23所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的衬底层,在对应着前述的吸热层,设置有向前述的吸热腔体中延伸的、结构相连接的散热凸起。 29. According to one of the claim 23 for the thermal cutting method in graphene layer, wherein: said substrate layer, in the corresponding heat absorbing layer provided to the endothermic chamber extending, heat dissipation structure connected to the projection.
  30. 30.根据权利要求23所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的吸热层,它包括有液体喷射结构,用以向热切割的所在位置周围喷射吸热用的液体,以及对应着热切割所在的位置,设置有用以通过气流驱除液体物质的气体喷射结构。 30. According to one of the claim 23 for the thermal cutting method in graphene layer, wherein: the heat absorbing layer, comprising a liquid ejection structure for location around the thermal cutting jet endotherm with a liquid, and corresponds to the site where the thermal cutting, provided with a gas purge Useful liquid substance stream through eductor.
  31. 31.根据权利要求23所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的吸热层,它包括有液体喷射结构,用以向热切割的所在位置周围喷射吸热用的液态二氧化碳。 31. The one of the claim 23 for the thermal cutting method in graphene layer, wherein: the heat absorbing layer, comprising a liquid ejection structure for location around the thermal cutting jet endotherm with liquid carbon dioxide.
  32. 32.根据权利要求23所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的吸热层,包括有吸热腔体,该吸热腔体包括有能够针对于前述的石墨烯层进行接触来吸收热量的接触型吸热面,对应着该接触型吸热面,在吸热腔体中设置有用以吸收热量的液态物质。 32. According to one of the claim 23 for the thermal cutting method in graphene layer, wherein: said heat absorbing layer, comprising heat absorbing chamber, which comprises a heat-absorbing chamber capable directed to the absorbing surface of the contact type graphene layer contacting to absorb heat, corresponding to the heat-absorbing contact surface, the liquid substance is provided to be useful in the endothermic absorption of heat in the cavity.
  33. 33.根据权利要求23所述的一种针对于石墨烯层进行热切割的方法,其特征在于:在热切割的过程中,设置有用以停顿切割进程的切割间隔时间。 33. According to one of the claim 23 for the thermal cutting method in graphene layer, wherein: the thermal cutting process, the cutting is provided a cutting process is useful to pause interval.
  34. 34.根据权利要求33所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的间隔间隔时间,是在热切割过程中,基于不会损伤周边石墨烯材料的散热速度的上限范围内,设置有切割间隔时间,通过该切割间隔时间,使得热切割石墨烯时所造成的热量能够由前述的吸热层在散热速度范围内进行散热。 34. According to one of the claim 33 for the thermal cutting method in graphene layer, wherein: said time interval is the interval, the cutting process is a thermal, heat the surrounding material does not damage the graphene-based within an upper limit speed, provided with a cutting interval, through which the cutting interval, such that the thermal cutting graphene heat caused by heat can be dissipated within the speed range of the heat absorbing layer.
  35. 35.根据权利要求23所述的一种针对于石墨烯层进行热切割的方法,其特征在于:所述的热切割,是通过激光发生器所实现的激光切割,或者通过等离子体发生器所实现的等离子体切割。 35. According to one of the claim 23 for the thermal cutting method in graphene layer, wherein: said thermal cut is achieved by laser cutting laser generator, or by a plasma generator achieve plasma cutting.
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CN106077970B (en) * 2016-06-30 2018-04-20 维沃移动通信有限公司 A method for machining a ceramic substrate resistor

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