CN103464892B - Laser processing device and laser processing - Google Patents
Laser processing device and laser processing Download PDFInfo
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- CN103464892B CN103464892B CN201310218251.2A CN201310218251A CN103464892B CN 103464892 B CN103464892 B CN 103464892B CN 201310218251 A CN201310218251 A CN 201310218251A CN 103464892 B CN103464892 B CN 103464892B
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Abstract
The invention provides a kind of laser processing device and the laser processing that can reduce surface roughness in Three-dimension process further.Laser processing of the present invention is as follows: machining area is set as the direction of illumination along laser piles up the region of multilayer processing layer, the lattice point of the virtual corner grid set machined layer is irradiated laser as pulse irradiation point and processes, in multilayer processing layer, to be as 1 cycle using processing sequence from continuous print 4 layers of the 1st layer to the 4th layer, at least comprise the layer being equivalent to 1 cycle, the center of gravity (G1) of lattice point being moved to the quadrangle (Q1) be made up of 4 adjacent pulse irradiation points (P1) in the 1st layer in the 2nd layer is used as pulse irradiation point (P2), lattice point is moved to by pulse irradiation point (P1 adjacent in the 1st ~ 2nd layer in the 3rd layer, the center of gravity (G2) of the quadrangle (Q2) P2) formed is used as pulse irradiation point (P3), the center of gravity (G3) of lattice point being moved to the quadrangle (Q3) be made up of 4 adjacent pulse irradiation points (P3) in the 3rd layer in the 4th layer is used as pulse irradiation point (P4).
Description
Technical field
The present invention relates to a kind of laser processing device and the laser processing that realize Three-dimension process by significantly reducing surface roughness.
Background technology
In the past, as utilizing laser, one of method of three-dimensional configuration processing is carried out to material and there will be a known following method: as shown in Figure 7, the position processing removal from workpiece W is divided into the multiple layers (be below also called machined layer LY) stacked in the direction vertical with the direction of illumination of laser L, from the machined layer LY of that side, surface near workpiece W, carries out processing successively remove (hereinafter referred to as layer processing method) (referenced patent document 1).Although this layer of processing method can process more random form accurately, but concavo-convex due to what produce caused by the fine processing trace (hereinafter referred to as pulse trace) that caused by the pulse of laser L on machined surface, therefore the surface roughness of machined surface can become large compared with grinding etc.
Therefore, in order to reduce the surface roughness of machined surface, following means can be taked: by controlling the distribution (being also called that pulse irradiation point distributes below) of the irradiation position (hereinafter referred to as pulse irradiation point) of the laser to machined layer pulse irradiation regularly, thus suppress by pulse trace cause concavo-convex.Such as, in patent document 2, control the interval etc. of carrying out the scan line of the laser scanned, such as, with square lattice shape distribution pulse irradiation point.
Patent document 1: Japanese Patent Publication 2012-16735 publication
Patent document 2: Japanese Patent Publication 2007-229756 publication
Following problem has been left in above-mentioned conventional art.
In processing method described in patent document 2, there is the situation of the surface roughness fully not reducing Laser Processing face.Its reason is, does not consider the coincidence distribution of pulse irradiation point between layers, and therefore to result from layer concavo-convex piles up between the layers, sometimes also obvious especially, and likely whenever increasing working depth surface roughness will increase.And, more reduce the distance between adjacent pulse point of irradiation, what layer internal cause pulse trace caused concavo-convexly just becomes more obvious, more make the surface roughness step-down in a layer, this is just equivalent to the thickness increasing layer, its result, becomes the difference of height of larger notch cuttype when being processed to form the face tilted relative to laser axis, therefore there is the problem making the surface roughness in the face tilted relative to laser axis increase on the contrary.
Summary of the invention
The present invention completes in view of above-mentioned problem, its object is to provide a kind of laser processing device and the laser processing that can reduce surface roughness in Three-dimension process further.
The present invention have employed following structure to solve above-mentioned problem.Namely, laser processing device of the present invention is set to the processing unit (plant) by carrying out shape formation to workpiece irradiated with pulse laser, wherein, possess: pulsed laser irradiation mechanism, with constant repetition rate described laser irradiated to described workpiece and scan, position adjusting mechanism, can keep the relative position relation of described workpiece to this workpiece and described laser to adjust, and control part, control these mechanisms, when carrying out the scanning of described laser, machining area is set as that the direction of illumination along described laser piles up the region of multilayer processing layer, by irradiating described laser to each machined layer and the reservations removing each described machined layer assign to be formed the machined surface of 3D shape, this control part is by irradiating described laser to process as pulse irradiation point using the lattice point of the virtual corner set described machined layer grid, in machined layer described in multilayer, to be as 1 cycle using processing sequence from continuous print 4 layers of the 1st layer to the 4th layer, at least comprise the layer being equivalent to 1 cycle, in described 2nd layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of 4 adjacent described pulse irradiation points in described 1st layer is used as pulse irradiation point, in described 3rd layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of adjacent described pulse irradiation point in described 1st layer and described 2nd layer is used as pulse irradiation point, in described 4th layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of 4 adjacent described pulse irradiation points in described 3rd layer is used as pulse irradiation point.In addition, at this, corner grid is defined as: 4 hithermost lattice points form any one shape among square, rectangle, rhombus, parallelogram, and its identical shape are paved with in the plane seamlessly.Further, such as, when hithermost 3 lattice points are equilateral triangle, be usually mostly considered as equilateral triangle grid, but be considered as at this parallelogram that acute angle is 60 °, and included in the grid of above-mentioned corner.
And, laser processing of the present invention, it is by irradiating to workpiece the processing method that laser carries out shape formation, wherein, have: laser irradiation process, in this operation, with constant repetition rate described laser is irradiated to described workpiece and scan, and position adjustment operation, the relative position relation of described workpiece to this workpiece and described laser can be kept in this operation to adjust, when carrying out the scanning of described laser, machining area is set as the direction of illumination along described laser piles up the region of multilayer processing layer, by irradiating described laser to each machined layer and the reservations removing each described machined layer assign to be formed the machined surface of 3D shape, the lattice point of the virtual corner grid set described machined layer irradiates described laser to process, in machined layer described in multilayer, to be as 1 cycle using processing sequence from continuous print 4 layers of the 1st layer to the 4th layer, at least comprise the layer being equivalent to 1 cycle, in described 2nd layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of 4 adjacent described pulse irradiation points in described 1st layer is used as pulse irradiation point, in described 3rd layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of adjacent described pulse irradiation point in described 1st layer and described 2nd layer is used as pulse irradiation point, in described 4th layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of 4 adjacent described pulse irradiation points in described 3rd layer is used as pulse irradiation point.
In these laser processing devices and laser processing, in multilayer processing layer, to be as 1 cycle using processing sequence from continuous print 4 layers of the 1st layer to the 4th layer, at least comprise the layer being equivalent to 1 cycle, pulse irradiation point is used as to the 4th layer as described above by the lattice point moving corner grid respectively for the 2nd layer, thus with at mobile lattice point random in x-y face be pulse irradiation point corner grid come stacked time compared with, can reduce by pulse trace cause concavo-convex.
In addition, laser processing device of the present invention, wherein, described control part is when repeating described 1 cycle continuously, in 2nd later cycle, in described 1st layer, the center of gravity of the lattice point of described corner grid being moved to the arbitrary quadrangle be made up of described pulse irradiation point adjacent to a upper cycle is used as pulse irradiation point.
Namely, in this laser processing device, when repeating described 1 cycle continuously, in 2nd later cycle, in the 1st layer, the center of gravity of the lattice point of described corner grid being moved to the arbitrary quadrangle be made up of described pulse irradiation point adjacent to a upper cycle is used as pulse irradiation point, therefore, it is possible to reduce concavo-convex further.
In addition, described control part is preferably made to be set as machined layer described in last by described 4th layer in laser processing device of the present invention.
That is, in this laser processing device, by being set as last machined layer by the 4th layer, surface roughness can be made to become minimum.
Following effect is played according to the present invention.
Namely, according to laser processing device involved in the present invention and laser processing, in multilayer processing layer, to be as 1 cycle using processing sequence from continuous print 4 layers of the 1st layer to the 4th layer, at least comprise the layer being equivalent to 1 cycle, pulse irradiation point is used as to the 4th layer as described above by the lattice point moving corner grid respectively for the 2nd layer, compared with when coming stacked with the corner grid at mobile lattice point random in x-y face being pulse irradiation point thus, reduce by pulse trace cause concavo-convex, and the surface roughness in Laser Processing face can be reduced.
So laser processing device of the present invention and laser processing are suitable for such as requiring the shape processing etc. with the product of complicated three-dimensional shape of surface roughness Rz≤3 μm.
Accompanying drawing explanation
Fig. 1 is in an embodiment of laser processing device involved in the present invention and laser processing, represents the outline overall structure figure of laser processing device.
Fig. 2 be in present embodiment with process sequence represent based on from the 1st layer (a) to the key diagram of the pulse irradiation point of the square lattice of the 4th layer (d).
Fig. 3 represents the key diagram based on the pulse irradiation point from the parallelogram grid of the 1st layer to the 16th layer with process sequence in present embodiment.
Fig. 4, as embodiment involved in the present invention, is the shape figure in the Laser Processing face of the simulated experiment result represented when irradiating laser by method of the present invention to the 1st layer (a) to the 4th layer (d).
Fig. 5, as comparative example involved in the present invention, is the shape figure in the Laser Processing face of the simulated experiment result represented when irradiating laser in the mode of movement at random to the 1st layer (a) to the 4th layer (d).
Fig. 6 represents in embodiment involved in the present invention and comparative example, the curve map of the practical laser processing experiment result that surface roughness changes along with the number of plies.
Fig. 7 is the key diagram of the laser processing method represented based on Laser Processing.
Symbol description
1-laser processing device, 2-laser radiation mechanism, 3-position adjusting mechanism, C-control part, the center of gravity of G1 ~ G6-quadrangle, L-laser, P1 ~ P16-pulse irradiation point, W-workpiece.
Detailed description of the invention
Below, referring to figs. 1 to Fig. 3, one embodiment of laser processing device involved in the present invention and laser processing is described.
As shown in Figure 1, the laser processing device 1 of present embodiment is irradiate to workpiece W the processing unit (plant) that laser L carries out shape formation, and it possesses: laser radiation mechanism 2, irradiates laser L and scan with constant repetition rate to workpiece W; Position adjusting mechanism 3, can keep the relative position relation of workpiece W to this workpiece W and laser L to adjust; And control part C, control these mechanisms, and when carrying out the scanning of laser L, machining area is set as that the direction of illumination along laser L piles up the region of multilayer processing layer, by irradiating laser L to each machined layer and the reservations removing each machined layer assign to be formed the machined surface of 3D shape.
Above-mentioned position adjusting mechanism 3 is by forming as follows: X-axis objective table 4x, can with the X-direction of plane-parallel on move; Y-axis objective table 4y, to be arranged on this X-axis objective table 4x and relative to X-direction vertical and can with the Y-direction of plane-parallel on move; And z-stage 4z, to be arranged on this Y-axis objective table 4y and can to move up in the side with horizontal plane while can keeping workpiece W.
Above-mentioned laser radiation mechanism 2 possesses: LASER Light Source 5, vibrates by the laser L of the trigger signal pulse of Q-switch; Optical beam expander 6, becomes certain diameter by the beam spread of the laser L from this LASER Light Source 5; Current scanning instrument 7, scans the laser L from this optical beam expander 6; F-θ lens 8, carry out optically focused to the laser L from this current scanning instrument 7 and are irradiated on workpiece W; And ccd video camera 9, take for confirming the Working position of workpiece W that is kept.In addition, the light path before and after optical beam expander 6 configures the optics such as speculum or wave plate also harmless.
The laser L penetrated by this laser radiation mechanism 2 is single mode and the light intensity distributions of beam cross section is Gaussian shaped profile.
As above-mentioned LASER Light Source 5, can use and can irradiate the LASER Light Source that any one wavelength is the laser of 190 ~ 550nm, such as employing the wavelength that can vibrate in the present embodiment is the LASER Light Source that the laser of 266nm penetrates.
Above-mentioned current scanning instrument 7 is configured in directly over z-stage 4z.Further, above-mentioned ccd video camera 9 configures by current scanning instrument 7.
As shown in Figure 2, above-mentioned control part C has following effect: process by the lattice point of the virtual corner set machined layer grid is irradiated laser L as pulse irradiation point, in multilayer processing layer, to be as 1 cycle using processing sequence from continuous print 4 layers of the 1st layer to the 4th layer, at least comprise the layer being equivalent to 1 cycle, in the 2nd layer, the center of gravity G1 lattice point of corner grid being moved to the quadrangle Q1 be made up of 4 adjacent pulse irradiation point P1 in the 1st layer is used as pulse irradiation point P2, in the 3rd layer, the lattice point of described corner grid is moved to by pulse irradiation point P1 adjacent in the 1st layer and the 2nd layer, the center of gravity G2 of the quadrangle Q2 that P2 is formed is used as pulse irradiation point P3, in the 4th layer, the center of gravity G3 lattice point of described corner grid being moved to the quadrangle Q3 be made up of 4 adjacent pulse irradiation point P3 in the 3rd layer is used as pulse irradiation point P4.In addition, coordinate points when above-mentioned lattice point and pulse irradiation point are top view face (x-y plane) vertical with the direction of illumination (z direction) of laser L.
And, control part C is when repeating described 1 cycle continuously, in 2nd later cycle, in the 1st layer, the center of gravity of the lattice point of described corner grid being moved to the arbitrary quadrangle be made up of pulse irradiation point adjacent to a upper cycle is used as pulse irradiation point.
In addition, control part C is preferably made to be set as last machined layer of machined layer by the 4th layer.
In present embodiment, when carrying out the scanning of laser L, setting in the mode of piling up multilayer processing layer in scanning imaging system, with this to each machined layer vertical irradiation laser L, in each machined layer, removing the machined surface that reservations assign to be formed gradually 3D shape.Therefore, when controlling the scanning of laser L, workpiece W is divided into multiple machined layer to set by the direction of illumination first along laser L.
Further, in each machined layer, set out the part of processing removal from the shape before processing and the shape after processing based on design, and in each machined layer, scan laser L remove predetermined portions, form predetermined machined surface gradually thus.
If be more specifically described this laser processing, then as shown in Figure 7, first, when control part C is processed into target three-dimensional shape by laser L by the original-shape of workpiece W, multiple machined layer LY is become splitting (layering) at equal intervals perpendicular to the three-dimensional shape part face of Z axis will processing removal.
Now, the space density of the energy when thickness of layer (machined layer LY) depends on every pulse and the pulse irradiation point in layer, be easier to when but thickness is constant all the time control, and the concavo-convex of face tilted relative to laser axis caused by the ladder of layer becomes even, therefore preferably.Therefore, constant in order to thickness be set to, the energy density of work in-process laser L, the repetition rate of laser L and the condition such as the sweep speed of laser L and the interval of surface sweeping line are set to constant all the time.Therefore necessitate the corner grid that the distribution of the pulse irradiation of all layers point is set to same shape and same size condition.
Control part C by the distribution uniformity of pulse irradiation point, sets the shape that its lattice point becomes the corner grid of pulse irradiation point under the above-mentioned condition of layer processing method.That is, the bias (distance in the laser scanning line direction in adjacent laser scan line between hithermost pulse irradiation point) between the laser scanning line setting the distance between the pulse irradiation point in the laser scanning line of corner grid, the interval of adjacent laser scan line, pulse irradiation point and the sweep starting point etc. of each laser scanning line.And, now, as shown in (a) of Fig. 2, when the cross-sectional strength of laser is distributed as comparatively ideal Gaussian, corner grid is preferably set to square lattice, and when there is anisotropy in the cross-sectional strength distribution of laser, be set to rectangle grid according to the distortion of its shape or parallelogram grid just can reduce surface roughness.
Further, the processing of machined layer is started with above-mentioned setting.As shown in (a) of Fig. 2, first, in the processing of the 1st layer of machined layer, the lattice point of predetermined corner grid is carried out the scanning of laser L as the pulse irradiation point P1 of the 1st layer.In addition, the arrow in figure represents the scanning direction of laser L.
Then, as shown in (a) and (b) of Fig. 2, in the processing of the 2nd layer, the center of gravity G1 lattice point of corner grid being moved to the 1st quadrangle Q1 be made up of 4 adjacent pulse irradiation point P1 in the 1st layer is used as the pulse irradiation point P2 of the 2nd layer, and carries out the scanning of laser L.
And then, as shown in (b) and (c) of Fig. 2, in the processing of the 3rd layer, the center of gravity G2 lattice point of described corner grid being moved to the 2nd quadrangle Q2 be made up of adjacent pulse irradiation point P1, P2 in the 1st layer and the 2nd layer is used as the pulse irradiation point P3 of the 3rd layer, and carries out the scanning of laser L.
And, last as 1 cycle, in the processing of the 4th layer, as shown in (c) and (d) of Fig. 2, the center of gravity G3 lattice point of described corner grid being moved to the 3rd quadrangle Q3 be made up of 4 adjacent pulse irradiation point P3 in the 3rd layer is used as point of irradiation P4, and carries out the scanning of laser L.
The processing to 4 layers in the 1st cycle of machined layer is terminated with this.Afterwards, when repeating described 1 cycle continuously, namely when the number of plies be layered is more than 4 layers, repeat the Laser Processing in described 1 cycle equally.
Such as, when corner grid is set to parallelogram grid, if be described for pulse irradiation point when total number of plies being set to 16 layers and being machined to 4 cycles, then as shown in Figure 3, in 2nd later cycle, in the 1st layer, the center of gravity of the lattice point of described corner grid being moved to the arbitrary quadrangle be made up of pulse irradiation point adjacent to a upper cycle is used as pulse irradiation point.
Namely, as shown in (a) of Fig. 3, when in 1st cycle, the pulse irradiation point P1 ~ P4 of 4 layers is set to the lattice point of parallelogram grid, as shown in (b) of Fig. 3, in the 1st layer in the 2nd cycle, the center of gravity G4 lattice point of described parallelogram grid being moved to the 4th quadrangle Q4 be made up of pulse irradiation point P1 ~ P4 adjacent in the 1st cycle is used as pulse irradiation point P5, and carries out the scanning of laser L.And, from the 2nd the 2nd cycle layer to the 4th layer, namely from counting the 5th layer of 3 layer to the 8th layer at first using the pulse irradiation point P5 of the 5th layer as benchmark, the pulse irradiation point P8 that set the pulse irradiation point P6 of 6th layer, 7th layer pulse irradiation point P7 and 8th layer same with the 1st cycle, and carry out the scanning of laser L successively.
In addition, as shown in (b) of Fig. 3, the center of gravity G5 lattice point of described parallelogram grid being moved to as shown in (c) of Fig. 3 arbitrary 5th quadrangle Q5 that adjacent pulse irradiation point P1 ~ P8 is formed by a upper cycle (the 1st cycle and the 2nd cycle) is used as the 1st layer of the 3rd cycle, namely from the pulse irradiation point P9 counting the 9th layer at first, and the scanning of laser L is carried out.And, from the 2nd layer of the 3rd cycle to the 4th layer, namely from counting the 10th layer of 3 layer to the 12nd layer at first using the pulse irradiation point P9 of the 9th layer as benchmark, the pulse irradiation point P12 that set the pulse irradiation point P10 of 10th layer, pulse irradiation point P11 and 12nd layer of 11th layer same with the 1st cycle, and carry out the scanning of laser L successively.
Then, the center of gravity G6 lattice point of described parallelogram grid being moved to the 6th quadrangle Q6 be made up of pulse irradiation point P9 ~ P12 adjacent in the 3rd cycle is used as the 1st layer of the 4th cycle, namely from the pulse irradiation point P13 counting the 13rd layer at first, and the scanning of laser L is carried out.And, from the 2nd the 4th cycle layer to the 4th layer, namely from counting the 14th layer of 3 layer to the 16th layer at first using the pulse irradiation point P13 of the 13rd layer as benchmark, the pulse irradiation point P16 that set the pulse irradiation point P14 of 14th layer, 15th layer pulse irradiation point P15 and 16th layer same with the 1st cycle, and carry out the scanning of laser L successively.
So, pulse irradiation point in the 1st of next cycle layer is moved to by pulse irradiation point adjacent one another are to a upper cycle around the center of gravity of arbitrary quadrangle to be set as the pulse irradiation point of 4 layers in this cycle, space between pulse irradiation point adjacent is thus filled up by pulse irradiation point, whenever repeating the above-mentioned cycle, this space reduces gradually, thus can gradually reduce by processing trace cause concavo-convex.
Therefore, in the laser processing device 1 of present embodiment and laser processing, in multilayer processing layer, to be as 1 cycle using processing sequence from continuous print 4 layers of the 1st layer to the 4th layer, at least comprise the layer being equivalent to 1 cycle, pulse irradiation point is used as to the 4th layer as described above by the lattice point moving corner grid respectively for the 2nd layer, thus when coming stacked with the corner grid that random mobile lattice point is in x-y direction pulse irradiation point compared with, can reduce by pulse trace cause concavo-convex.
And, when repeating described 1 cycle continuously, in the 2nd later cycle, in the 1st layer, the center of gravity of the lattice point of described corner grid being moved to the arbitrary quadrangle be made up of pulse irradiation point adjacent to a upper cycle is used as pulse irradiation point, therefore, it is possible to reduce concavo-convex further.Be set as last machined layer particularly by by the 4th layer, surface roughness can be made to become minimum.
[embodiment]
Then, simulated experiment result when utilizing the laser processing device of above-mentioned embodiment to carry out Laser Processing to the surface of workpiece is described.
In this simulated experiment, be set as that length of side size is the square lattice of 2.5 μm as above-mentioned quadrangle grid, as shown in (a) ~ (d) of Fig. 4, calculate and the concavo-convex of the surface state of the workpiece in man-hour is added to the 1st layer (a) machined layer to the 4th layer (d) in the 1st cycle.
In addition, in this simulated experiment, assuming that in 1 pulse irradiation point, the processing trace that the finished surface of workpiece produces the cross sectional shape specified by following Gaussian function calculates.
Gaussian function: z=-exp (-x
2-y
2)
As from this simulated experiment result, concavo-convexly whenever lamination to be eliminated, thus to obtain level and smooth machined surface.In addition, when reaching the 4th layer, surface roughness Rz (maximum height) is 0.029 μm.
In addition, as comparative example, same as the previously described embodiments, be set as that length of side size is the square lattice of 2.5 μm as quadrangle grid, by all layers in x-y direction only movement be equivalent to random amount, as shown in (a) ~ (d) of Fig. 5, calculate and the concavo-convex of the surface state of the workpiece in man-hour is added to the 1st layer (a) machined layer to the 4th layer (d) in the 1st cycle.
As from this simulated experiment result, with move at random carry out Laser Processing comparative example in, even if lamination is not eliminated concavo-convex yet, whenever lamination, concavo-convex change is large.In addition, when reaching the 4th layer, surface roughness Rz (maximum height) is 1.878 μm.
Then, during using aluminium sheet (the surface roughness Rz before processing: about 0.2 μm) as workpiece, the relation (in figure " regularly stacked square lattice ") between the number of plies of machined layer when carrying out Laser Processing of the present invention and surface roughness is shown in Fig. 6.
Lasing condition be now set to: wavelength is 266nm, repetition rate is 100kHz, and power is 2W.And be set as that length of side size is the square lattice of 6 μm as above-mentioned quadrangle grid.In addition, curve map acceptance of the bid can be the measured value of surface roughness, dotted line and solid line are the line visually observing these rotating savings and matching.
And, as comparative example, same as the previously described embodiments, be set as that length of side size is the square lattice of 6 μm as quadrangle grid, by all layers in x-y direction only movement be equivalent to random amount to what carry out the number of plies same as described above and add man-hour (" random mobile come stacked square lattice " in figure), also shown in Figure 6 in the lump.In addition, process with movement at random for same with above-mentioned comparative example, only to wherein 4 layers (the 10th to the 13rd layers) carry out with of the present invention 1st layer to (in figure " random mobile come stacked square lattice " (solid line portion)) during the 4th layer of identical Laser Processing, also shown in Figure 6 in the lump.
As can be known from these results, in laser processing of the present invention, added to all layers man-hour, from the 1st layer, whenever accumulating the number of plies, surface roughness just diminishes, in contrast to this, with in the comparative example that movement is processed all layers at random, whenever accumulating the number of plies, surface roughness will become large.And, relative to the comparative example processed all layers with movement at random, only the part in total number of plies is being carried out in the example of layer processing by laser processing of the present invention, surface roughness diminishes, by having at least a part to be processed by the laser processing of the present invention of regularization, the effect reducing surface roughness can be obtained.
In addition, technical scope of the present invention is not limited to above-mentioned embodiment and above-described embodiment, can impose various change without departing from the scope of spirit of the present invention.
Claims (4)
1. a laser processing device, it is the processing unit (plant) by carrying out shape formation to workpiece irradiated with pulse laser, it is characterized in that possessing:
Pulsed laser irradiation mechanism, irradiates described laser with constant repetition rate to described workpiece and scans;
Position adjusting mechanism, can keep the relative position relation of described workpiece to this workpiece and described laser to adjust; And
Control part, control these mechanisms, when carrying out the scanning of described laser, machining area is set as that the direction of illumination along described laser piles up the region of multilayer processing layer, by irradiating described laser to each machined layer and the reservations removing each described machined layer assign to be formed the machined surface of 3D shape
This control part by the lattice point of the virtual corner set described machined layer grid is irradiated described laser to process as pulse irradiation point,
In machined layer described in multilayer, by using processing sequence be from continuous print 4 layers of the 1st layer to the 4th layer as 1 cycle, at least comprise the layer being equivalent to 1 cycle,
In described 2nd layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of 4 adjacent described pulse irradiation points in described 1st layer is used as pulse irradiation point,
In described 3rd layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of adjacent described pulse irradiation point in described 1st layer and described 2nd layer is used as pulse irradiation point,
In described 4th layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of 4 adjacent described pulse irradiation points in described 3rd layer is used as pulse irradiation point.
2. laser processing device according to claim 1, is characterized in that,
Described control part is when repeating described 1 cycle continuously, in 2nd later cycle, in described 1st layer, the center of gravity of the lattice point of described corner grid being moved to the arbitrary quadrangle be made up of described pulse irradiation point adjacent to a upper cycle is used as pulse irradiation point.
3. laser processing device according to claim 1 and 2, is characterized in that,
Described control part is set as machined layer described in last by described 4th layer.
4. a laser processing, it is the processing method by carrying out shape formation to workpiece irradiated with pulse laser, it is characterized in that having:
Laser irradiation process, irradiates described laser with constant repetition rate to described workpiece and scans in this operation; And
Position adjustment operation, can keep the relative position relation of described workpiece to this workpiece and described laser to adjust in this operation,
When carrying out the scanning of described laser, machining area is set as the direction of illumination along described laser piles up the region of multilayer processing layer, by irradiating described laser to each machined layer and the reservations removing each described machined layer assign to be formed the machined surface of 3D shape,
The lattice point of the virtual corner grid set described machined layer irradiates described laser to process,
In machined layer described in multilayer, by using processing sequence be from continuous print 4 layers of the 1st layer to the 4th layer as 1 cycle, at least comprise the layer being equivalent to 1 cycle,
In described 2nd layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of 4 adjacent described pulse irradiation points in described 1st layer is used as pulse irradiation point,
In described 3rd layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of adjacent described pulse irradiation point in described 1st layer and described 2nd layer is used as pulse irradiation point,
In described 4th layer, the center of gravity of the lattice point of described corner grid being moved to the quadrangle be made up of 4 adjacent described pulse irradiation points in described 3rd layer is used as pulse irradiation point.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1087750A (en) * | 1992-06-26 | 1994-06-08 | 株式会社半导体能源研究所 | Laser processing |
| US6087625A (en) * | 1997-03-21 | 2000-07-11 | Sumitomo Heavy Industries, Ltd. | Laser machining apparatus |
| CN1678426A (en) * | 2002-08-30 | 2005-10-05 | 住友重机械工业株式会社 | Laser processing method and processing device |
| CN1819878A (en) * | 2003-07-08 | 2006-08-16 | 光谱技术有限公司 | Laser removal of layer or coating from a substrate |
| CN102196880A (en) * | 2008-10-23 | 2011-09-21 | 住友电气工业株式会社 | Laser processing method and laser processing device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3764155B2 (en) * | 2003-10-23 | 2006-04-05 | 住友重機械工業株式会社 | Laser processing method and laser processing apparatus |
| JP5116979B2 (en) * | 2006-02-28 | 2013-01-09 | パナソニック デバイスＳｕｎｘ株式会社 | Laser processing equipment |
| EP2252426A4 (en) * | 2008-03-21 | 2014-08-06 | Imra America Inc | Laser-based material processing methods and systems |
| JP2010194560A (en) * | 2009-02-23 | 2010-09-09 | Nisshinbo Holdings Inc | Laser machining method of solar battery panel |
| JP2011212726A (en) * | 2010-03-31 | 2011-10-27 | Fujifilm Corp | Laser machining device and laser machining method |
| JP5861494B2 (en) * | 2012-02-23 | 2016-02-16 | 三菱マテリアル株式会社 | Laser processing apparatus and laser processing method |
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2012
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1087750A (en) * | 1992-06-26 | 1994-06-08 | 株式会社半导体能源研究所 | Laser processing |
| US6087625A (en) * | 1997-03-21 | 2000-07-11 | Sumitomo Heavy Industries, Ltd. | Laser machining apparatus |
| CN1678426A (en) * | 2002-08-30 | 2005-10-05 | 住友重机械工业株式会社 | Laser processing method and processing device |
| CN1819878A (en) * | 2003-07-08 | 2006-08-16 | 光谱技术有限公司 | Laser removal of layer or coating from a substrate |
| CN102196880A (en) * | 2008-10-23 | 2011-09-21 | 住友电气工业株式会社 | Laser processing method and laser processing device |
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| JP2013252528A (en) | 2013-12-19 |
| JP5920661B2 (en) | 2016-05-18 |
| CN103464892A (en) | 2013-12-25 |
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