CN103464892A - Laser processing device and laser processing method - Google Patents
Laser processing device and laser processing method Download PDFInfo
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Abstract
The invention provides a laser processing device and a laser processing method capable of further reducing the surface roughness during the three-dimensional processing procedure. According to the laser processing method, a plurality of processing layers are stacked up along the laser irradiation direction within a processing region, wherein the processing is carried out with the lattice points of virtual quadrangular lattices on the processing layers as pulse irradiation points. Among the plurality of processing layers, according to the processing sequence, four continuous processing layers, namely a first processing layer, a second processing layer, a third processing layer and the fourth processing layer, are deemed as the layers for one processing cycle. Lattice points on the second processing layer are moved to four adjacent pulse irradiation points (P1) on the first processing layer to form the center of gravity (G1) of a quadrangle (Q1) served as a pulse irradiation point (P2). Lattice points on the third processing layer are moved to adjacent pulse irradiation points (P1, P2) on the first and second processing layers to form the center of gravity (G2) of a quadrangle (Q2) served as a pulse irradiation point (P3). Lattice points on the fourth processing layer are moved to four adjacent pulse irradiation points (P1) on the third processing layer to form the center of gravity (G3) of a quadrangle (Q3) served as a pulse irradiation point (P4).
Description
Technical field
The present invention relates to a kind of laser processing device and laser processing of realizing three-dimensional processing by the decrease surface roughness.
Background technology
In the past, as one of method of utilizing laser to carry out three-dimensional configuration processing to material is known following method arranged: as shown in Figure 7, to from workpiece W, process the position of removing and be divided into the stacked a plurality of layers (the following machined layer LY that also is called) of the direction vertical at the direction of illumination with laser L, from the machined layer LY of that side of surface near workpiece W, start to process successively removal (hereinafter referred to as layer processing method) (referring to Patent Document 1).Although this layer of processing method can process more random form accurately, but concavo-convex due to the fine processing trace (hereinafter referred to as the pulse trace) caused due to the pulse produced on machined surface by laser L, so the surface roughness of machined surface and grinding etc. are compared and can be become large.
Therefore, in order to reduce the surface roughness of machined surface, can take following means: the distribution by controlling regularly the irradiation position (hereinafter referred to as the pulse irradiation point) to the laser of machined layer pulse irradiation (the following pulse irradiation point that also is called distributes), thereby suppress to be caused by the pulse trace concavo-convex.For example, in patent documentation 2, the interval of the scan line of the laser that control is scanned etc., for example, with square lattice shape distribution pulse irradiation point.
Patent documentation 1: Japanese Patent Publication 2012-16735 communique
Patent documentation 2: Japanese Patent Publication 2007-229756 communique
Left over following problem in above-mentioned conventional art.
In the processing method of putting down in writing in patent documentation 2, there is the situation of the surface roughness of Laser Processing face that fully do not reduce.Its reason is, do not consider that the coincidence of pulse irradiation point between layers distributes, and therefore results from concavo-convex in layer and piles up between the layers, sometimes also obvious especially, and likely when increasing working depth surface roughness will increase.And, more dwindle the distance between the adjacent pulse point of irradiation, layer internal cause pulse trace causes concavo-convexly just becomes more obvious, more make the surface roughness step-down in a layer, this just is equivalent to increase the thickness of layer, its result becomes the difference of height of larger notch cuttype when the face to tilting with respect to laser axis is processed to form, so has the problem of the surface roughness increase of the face that makes on the contrary to tilt with respect to laser axis.
Summary of the invention
The present invention completes in view of above-mentioned problem, and its purpose is to provide a kind of laser processing device and laser processing that can further reduce surface roughness in three-dimensional processing.
The present invention has adopted following structure in order to solve above-mentioned problem., laser processing device of the present invention is set to the processing unit (plant) by the workpiece irradiated with pulse laser is carried out to shape formation, wherein, possess: pulsed laser irradiation mechanism, with constant repetition rate, described workpiece is irradiated to the line scanning of going forward side by side of described laser, position adjusting mechanism, can keep described workpiece to be adjusted the relative position relation of this workpiece and described laser, and control part, control these mechanisms, described machining area is set as piling up along the direction of illumination of described laser the zone of multilayer processing layer when carrying out the scanning of described laser, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to described laser and removing each described machined layer, the lattice point of this control part by the virtual four jiaos of grid that will set described machined layer irradiates described laser as pulse irradiation point to be processed, in the described machined layer of multilayer, to using processing sequence as 4 the continuous layers from the 1st layer to the 4th layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, in described the 2nd layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that 4 described pulse irradiation points adjacent in described the 1st layer form and be used as the pulse irradiation point, in described the 3rd layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that described pulse irradiation point adjacent in described the 1st layer and described the 2nd layer forms and be used as the pulse irradiation point, in described the 4th layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that 4 described pulse irradiation points adjacent in described the 3rd layer form and be used as the pulse irradiation point.In addition, at this, four jiaos of grid are defined as: 4 hithermost lattice points form any shape among square, rectangle, rhombus, parallelogram, and seamless by it, identical shape is paved with in the plane.And, for example, when hithermost 3 lattice points are equilateral triangle, usually mostly be considered as the equilateral triangle grid, but be considered as at this parallelogram that acute angle is 60 °, and it is included in above-mentioned four jiaos of grid.
And, laser processing of the present invention, it is the processing method by workpiece irradiation laser is carried out to shape formation, wherein, have: the Ear Mucosa Treated by He Ne Laser Irradiation operation, with constant repetition rate, described workpiece is irradiated to the line scanning of going forward side by side of described laser in this operation, and operation is adjusted in position, in this operation, can keep described workpiece to be adjusted the relative position relation of this workpiece and described laser, when carrying out the scanning of described laser, described machining area is set as piling up along the direction of illumination of described laser to the zone of multilayer processing layer, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to described laser and removing each described machined layer, irradiating described laser on the lattice point of virtual four jiaos of grid that described machined layer is set is processed, in the described machined layer of multilayer, to using processing sequence as 4 the continuous layers from the 1st layer to the 4th layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, in described the 2nd layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that 4 described pulse irradiation points adjacent in described the 1st layer form and be used as the pulse irradiation point, in described the 3rd layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that described pulse irradiation point adjacent in described the 1st layer and described the 2nd layer forms and be used as the pulse irradiation point, in described the 4th layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that 4 described pulse irradiation points adjacent in described the 3rd layer form and be used as the pulse irradiation point.
In these laser processing devices and laser processing, in the multilayer processing layer, to using processing sequence as 4 the continuous layers from the 1st layer to the 4th layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, be used as the pulse irradiation point by the lattice point that moves respectively four jiaos of grid for the 2nd layer as mentioned above to the 4th layer, compare when four jiaos of grid that are pulse irradiation point with random mobile lattice point in the x-y face thus are next stacked, can reduce caused by the pulse trace concavo-convex.
In addition, laser processing device of the present invention, wherein, described control part is when repeating continuously described 1 cycle, in the 2nd later cycle, in described the 1st layer, the lattice point of described four jiaos of grid is moved to the arbitrary tetragonal center of gravity consisted of described pulse irradiation point adjacent till a upper cycle and be used as the pulse irradiation point.
; in this laser processing device; when repeating continuously described 1 cycle; in the 2nd later cycle; in the 1st layer; the lattice point of described four jiaos of grid is moved to the arbitrary tetragonal center of gravity consisted of described pulse irradiation point adjacent till a upper cycle and be used as the pulse irradiation point, therefore can further reduce concavo-convex.
In addition, in laser processing device of the present invention, preferably make described control part be set as last described machined layer by described the 4th layer.
That is,, in this laser processing device, by being set as last machined layer by the 4th layer, can make surface roughness become minimum.
Bring into play following effect according to the present invention.
; according to laser processing device involved in the present invention and laser processing; in the multilayer processing layer; to using processing sequence as 4 the continuous layers from the 1st layer to the 4th layer as 1 cycle; at least comprise the layer that is equivalent to 1 cycle; be used as the pulse irradiation point by the lattice point that moves respectively four jiaos of grid for the 2nd layer as mentioned above to the 4th layer; when four jiaos of grid that are pulse irradiation point with random mobile lattice point in the x-y face thus are next stacked, compare; what reduce to be caused by the pulse trace is concavo-convex, and can reduce the surface roughness of Laser Processing face.
So laser processing device of the present invention and laser processing are suitable for such as shape processing of the product with complicated three-dimensional shape that requires surface roughness Rz≤3 μ m etc.
The accompanying drawing explanation
Fig. 1 is in an embodiment of laser processing device involved in the present invention and laser processing, means the summary overall structure figure of laser processing device.
Fig. 2 means the key diagram based on the pulse irradiation point of the square lattice to the 4th layer (d) from the 1st layer (a) with process sequence in present embodiment.
Fig. 3 means the key diagram of the pulse irradiation point of the parallelogram grid based on from the 1st layer to the 16th layer with process sequence in present embodiment.
Fig. 4, as embodiment involved in the present invention, means the shape figure of the Laser Processing face of the simulated experiment result while by method of the present invention, the 1st layer (a) to the 4th layer (d) being irradiated to laser.
Fig. 5, as comparative example involved in the present invention, means the shape figure of the Laser Processing face of the simulated experiment result while in mobile at random mode, the 1st layer (a) to the 4th layer (d) being irradiated to laser.
Fig. 6 means in embodiment and comparative example involved in the present invention, the curve map of the practical laser processing experiment result that surface roughness changes along with the number of plies.
Fig. 7 means the key diagram of the laser processing method based on Laser Processing.
Symbol description
The 1-laser processing device, 2-laser radiation mechanism, 3-position adjusting mechanism, C-control part, the tetragonal center of gravity of G1～G6-, L-laser, P1～P16-pulse irradiation point, W-workpiece.
The specific embodiment
Below, referring to figs. 1 to Fig. 3, one embodiment of laser processing device involved in the present invention and laser processing is described.
As shown in Figure 1, the laser processing device of present embodiment 1 is for irradiating to workpiece W the processing unit (plant) that laser L carries out shape formation, and it possesses: laser radiation mechanism 2, irradiate the laser L line scanning of going forward side by side with constant repetition rate to workpiece W; Position adjusting mechanism 3, can keep workpiece W to be adjusted the relative position relation of this workpiece W and laser L; And control part C, control these mechanisms, and machining area is set as piling up along the direction of illumination of laser L the zone of multilayer processing layer when carrying out the scanning of laser L, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to laser L and removing each machined layer.
Above-mentioned position adjusting mechanism 3 is by forming as follows: X-axis objective table 4x can move on the directions X parallel with horizontal plane; Y-axis objective table 4y, be arranged at this X-axis objective table 4x upper and vertical and can move on the Y-direction parallel with horizontal plane with respect to directions X; And Z axis objective table 4z, be arranged at this Y-axis objective table 4y above and can move on the direction vertical with horizontal plane when can keeping workpiece W.
Above-mentioned laser radiation mechanism 2 possesses: LASER Light Source 5, vibrate by the laser L of the trigger signal pulse of Q-switch; Optical beam expander 6, will become certain diameter from the beam spread of the laser L of this LASER Light Source 5; Current scanning instrument 7, scanned the laser L from this optical beam expander 6; F-θ lens 8, carry out optically focused and shine on workpiece W the laser L from this current scanning instrument 7; And ccd video camera 9, for the Working position of confirming maintained workpiece W is taken.In addition, on the light path of optical beam expander 6 front and back, the opticses such as configuration speculum or wave plate are also harmless.
The light intensity distributions that the laser L penetrated by this laser radiation mechanism 2 is single mode and beam cross section is Gaussian shaped profile.
As above-mentioned LASER Light Source 5, can use the LASER Light Source that can irradiate the laser that any wavelength is 190～550nm, the LASER Light Source that has for example used in the present embodiment laser that the wavelength that can vibrate is 266nm to penetrate.
Above-mentioned current scanning instrument 7 be configured in Z axis objective table 4z directly over.And above-mentioned ccd video camera 9 is by 7 configurations of current scanning instrument.
As shown in Figure 2, above-mentioned control part C has following effect: the lattice point by the virtual four jiaos of grid that will set machined layer irradiates laser L as pulse irradiation point to be processed, in the multilayer processing layer, to using processing sequence as 4 the continuous layers from the 1st layer to the 4th layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, in the 2nd layer, the center of gravity G1 that the lattice point of four jiaos of grid is moved to the quadrangle Q1 that 4 pulse irradiation point P1 adjacent in the 1st layer form is used as pulse irradiation point P2, in the 3rd layer, the lattice point of described four jiaos of grid is moved to pulse irradiation point P1 adjacent in the 1st layer and the 2nd layer, the center of gravity G2 of the quadrangle Q2 that P2 forms is used as pulse irradiation point P3, in the 4th layer, the center of gravity G3 that the lattice point of described four jiaos of grid is moved to the quadrangle Q3 that 4 pulse irradiation point P3 adjacent in the 3rd layer form is used as pulse irradiation point P4.In addition, above-mentioned lattice point and the pulse irradiation point coordinate points when overlooking the vertical face (x-y plane) of the direction of illumination (z direction) observed with laser L.
And, control part C is when repeating continuously described 1 cycle, in the 2nd later cycle, in the 1st layer, the lattice point of described four jiaos of grid is moved to the arbitrary tetragonal center of gravity consisted of pulse irradiation point adjacent till a upper cycle and be used as the pulse irradiation point.
In addition, preferably make control part C by the 4th layer of last machined layer that is set as machined layer.
In present embodiment, when carrying out the scanning of laser L, in scanning imaging system, in the mode of piling up the multilayer processing layer, set, with this, to each machined layer vertical irradiation laser L, removed reservations assign to form the gradually machined surface of 3D shape in each machined layer.Therefore when controlling the scanning of laser L, at first along the direction of illumination of laser L, workpiece W is divided into to a plurality of machined layer and is set.
And, in each machined layer, set out from the shape of first being processed and the part that the shape after processing based on design, processing is removed, and in each machined layer, scan laser L removes predetermined portions, forms gradually thus predetermined machined surface.
If more specifically this laser processing is described, as shown in Figure 7, when at first control part C is processed into the target three-dimensional shape by laser L by the original-shape of workpiece W, the three-dimensional shape part that will process removal on the face perpendicular to Z axis is uniformly-spaced cut apart (layering) and is become a plurality of machined layer LY.
Now, the energy when thickness of layer (machined layer LY) depends on every pulse and layer space density of interior pulse irradiation point, be easier to when but bed thickness is constant all the time control, and become evenly by the concavo-convex of the face tilted with respect to laser axis that the ladder of layer causes, therefore preferably.Therefore, constant for bed thickness is made as, the energy density of work in-process laser L, the repetition rate of laser L, the sweep speed that reaches laser L and the conditions such as interval of surface sweeping line are set to constant all the time.Therefore four jiaos of grid that the distribution of the pulse irradiation point of all layers are made as to identical shaped and same size condition that necessitates.
Control part C by being evenly distributed of pulse irradiation point, sets the shape that its lattice point becomes four jiaos of grid of pulse irradiation point under the above-mentioned condition of layer processing method.That is, set bias (distance of the laser scanning line direction in adjacent laser scanning line between hithermost pulse irradiation point) between the laser scanning line of interval, pulse irradiation point of the distance between the pulse irradiation point in the laser scanning line of four jiaos of grid, adjacent laser scanning line and the sweep starting point of each laser scanning line etc.And, now, as shown in Fig. 2 (a), when the cross-sectional strength of laser is distributed as comparatively ideal Gaussian, four jiaos of grid preferably are made as square lattice, and while in the cross-sectional strength of laser distributes, having anisotropy, according to the distortion of its shape, be made as the rectangle grid or the parallelogram grid just can reduce surface roughness.
And, start the processing of machined layer with above-mentioned setting.As shown in Fig. 2 (a), at first, in the processing of the 1st layer of machined layer, using the lattice point of four jiaos of predetermined grid as the pulse irradiation point P1 of the 1st layer, carry out the scanning of laser L.In addition, the arrow in figure means the scanning direction of laser L.
Then, as (a) of Fig. 2 with (b), in the processing of the 2nd layer, the center of gravity G1 that the lattice point of four jiaos of grid is moved to the 1st quadrangle Q1 that 4 pulse irradiation point P1 adjacent in the 1st layer form is used as the pulse irradiation point P2 of the 2nd layer, and carries out the scanning of laser L.
And then, as (b) of Fig. 2 with (c), in the processing of the 3rd layer, the center of gravity G2 that the lattice point of described four jiaos of grid is moved to the 2nd quadrangle Q2 that pulse irradiation point P1, P2 adjacent in the 1st layer and the 2nd layer form is used as the pulse irradiation point P3 of the 3rd layer, and carries out the scanning of laser L.
And, last as 1 cycle, in the processing of the 4th layer, as (c) of Fig. 2 with (d), the center of gravity G3 that the lattice point of described four jiaos of grid is moved to the 3rd quadrangle Q3 that 4 pulse irradiation point P3 adjacent in the 3rd layer form is used as point of irradiation P4, and carries out the scanning of laser L.
Finish the processing to 4 layers in the 1st cycle of machined layer with this.Afterwards, when repeating continuously described 1 cycle,, when the number of plies by layering surpasses 4 layers, repeat equally the Laser Processing in described 1 cycle.
For example, when four jiaos of grid are made as to the parallelogram grid, if describe for total number of plies being made as to 16 layers and pulse irradiation point while being machined to 4 cycles, as shown in Figure 3, in the 2nd later cycle, in the 1st layer, the lattice point of described four jiaos of grid is moved to the arbitrary tetragonal center of gravity consisted of pulse irradiation point adjacent till a upper cycle and be used as the pulse irradiation point.
; as shown in Fig. 3 (a); when in the 1st cycle, the pulse irradiation point P1～P4 of 4 layers is set to the lattice point of parallelogram grid; as shown in Fig. 3 (b); in the 1st layer in the 2nd cycle; the center of gravity G4 that the lattice point of described parallelogram grid is moved to the 4th quadrangle Q4 that pulse irradiation point P1～P4 adjacent in the 1st cycle forms is used as pulse irradiation point P5, and carries out the scanning of laser L.And, from the 2nd cycle the 2nd layer to the 4th layer, using the pulse irradiation point P5 of the 5th layer as benchmark from counting at first 3 layers till the 5th layer to the 8th layer, with pulse irradiation point P6, the pulse irradiation point P7 of the 7th layer of the 6th layer of same setting of the 1st cycle and the pulse irradiation point P8 of the 8th layer, and carry out successively the scanning of laser L.
In addition, as shown in Fig. 3 (b), the center of gravity G5 that the lattice point of described parallelogram grid is moved as shown in Fig. 3 (c) to arbitrary the 5th quadrangle Q5 consisted of pulse irradiation point P1 adjacent till the upper cycle (the 1st cycle and the 2nd cycle)～P8 is used as the 1st layer of the 3rd cycle, from counting at first the pulse irradiation point P9 of the 9th layer, and carry out the scanning of laser L.And, till the 2nd layer to the 4th layer of the 3rd cycle, using the pulse irradiation point P9 of the 9th layer as benchmark from counting at first 3 layers till the 10th layer to the 12nd layer, with pulse irradiation point P10, the pulse irradiation point P11 of 11th layer of the 10th layer of same setting of the 1st cycle and the pulse irradiation point P12 of the 12nd layer, and carry out successively the scanning of laser L.
Then, the center of gravity G6 that the lattice point of described parallelogram grid is moved to the 6th quadrangle Q6 that pulse irradiation point P9～P12 adjacent in the 3rd cycle forms is used as the 1st layer of the 4th cycle, from counting at first the pulse irradiation point P13 of the 13rd layer, and carry out the scanning of laser L.And, till the 2nd layer to the 4th layer from the 4th cycle, using the pulse irradiation point P13 of the 13rd layer as benchmark from counting at first 3 layers till the 14th layer to the 16th layer, with pulse irradiation point P14, the pulse irradiation point P15 of the 15th layer of the 14th layer of same setting of the 1st cycle and the pulse irradiation point P16 of the 16th layer, and carry out successively the scanning of laser L.
So, by the pulse irradiation point in the 1st layer of next cycle move by pulse irradiation point adjacent one another are till a upper cycle around arbitrary tetragonal center of gravity be set as the pulse irradiation point of 4 layers in this cycle, space between adjacent pulse irradiation point is filled up by the pulse irradiation point thus, when repeating the above-mentioned cycle, this space dwindles gradually, thereby can gradually dwindle caused by the processing trace concavo-convex.
Therefore, in the laser processing device 1 and laser processing of present embodiment, in the multilayer processing layer, to using processing sequence as 4 the continuous layers from the 1st layer to the 4th layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle, be used as the pulse irradiation point by the lattice point that moves respectively four jiaos of grid for the 2nd layer as mentioned above to the 4th layer, compare when thereby four jiaos of grid that are pulse irradiation point with random mobile lattice point on the x-y direction are next stacked, can dwindle caused by the pulse trace concavo-convex.
And, when repeating continuously described 1 cycle, in the 2nd later cycle, in the 1st layer, the lattice point of described four jiaos of grid is moved to the arbitrary tetragonal center of gravity consisted of pulse irradiation point adjacent till a upper cycle and be used as the pulse irradiation point, therefore can further reduce concavo-convex.Especially by being set as last machined layer by the 4th layer, can make surface roughness become minimum.
[embodiment]
Simulated experiment result while then, the laser processing device that utilizes above-mentioned embodiment being carried out to Laser Processing to the surface of workpiece describes.
In this simulated experiment, be set as above-mentioned quadrangle grid the square lattice that length of side size is 2.5 μ m, as shown in Fig. 4 (a)～(d), calculate surface state concavo-convex that the machined layer till the 1st layer (a) to the 4th layer (d) in the 1st cycle is added to the workpiece in man-hour.
In addition, in this simulated experiment, suppose in 1 pulse irradiation point, the processing trace that produces the cross sectional shape of being stipulated by following Gaussian function on the finished surface of workpiece calculates.
Gaussian function: z=-exp(-x
2-y
2)
As from this simulated experiment result, concavo-convex being eliminated when lamination, thus obtain level and smooth machined surface.In addition, while reaching the 4th layer, surface roughness Rz(maximum height) be 0.029 μ m.
In addition, as a comparative example, same as the previously described embodiments, be set as the quadrangle grid square lattice that length of side size is 2.5 μ m, all layers are only moved on the x-y direction to the random amount that is equivalent to, as shown in Fig. 5 (a)～(d), calculate surface state concavo-convex that the machined layer till the 1st layer (a) in the 1st cycle to the 4th layer (d) is added to the workpiece in man-hour.
As from this simulated experiment result, carry out in the comparative example of Laser Processing moving at random, concavo-convex even lamination is not eliminated yet, when lamination, concavo-convex change is large.In addition, while reaching the 4th layer, surface roughness Rz(maximum height) be 1.878 μ m.
Then, using aluminium sheet (the surface roughness Rz before processing: about 0.2 μ m), during as workpiece, the number of plies of the machined layer in the time of will carrying out Laser Processing of the present invention and the relation between surface roughness (in figure " stacked square lattice regularly ") are shown in Fig. 6.
Lasing condition now is made as: wavelength is 266nm, and repetition rate is 100kHz, and power is 2W.And be set as above-mentioned quadrangle grid the square lattice that length of side size is 6 μ m.In addition, what curve map was got the bid meeting is the measured value of surface roughness, and dotted line and solid line are to visually observe these rotating savings and the line of matching.
And, as a comparative example, same as the previously described embodiments, be set as the quadrangle grid square lattice that length of side size is 6 μ m, by all layers on the x-y direction only mobile be equivalent to that random amount carries out the number of plies same as described above add man-hour (" random mobile come stacked square lattice " in figure), also shown in Figure 6 in the lump.In addition, for with above-mentioned comparative example equally with mobile processing at random, only wherein 4 layers (the 10th to the 13rd layers) are carried out and the 1st layer during to the 4th layer of identical Laser Processing of the present invention (" random mobile come stacked square lattice " (solid line section) in figure), also shown in Figure 6 in the lump.
As can be known from these results, in laser processing of the present invention, all layers are added to man-hour, from the 1st layer, when the accumulation number of plies, surface roughness just diminishes, in contrast to this, in the comparative examples so that movement is processed all layers at random, when the accumulation number of plies, surface roughness will become large.And, with respect to the comparative examples so that movement is processed all layers at random, in the example that only part in total number of plies is carried out layer processing by laser processing of the present invention, surface roughness diminishes, by having at least a part to be processed by the laser processing of the present invention of regularization, can obtain the effect that reduces surface roughness.
In addition, technical scope of the present invention is not limited to above-mentioned embodiment and above-described embodiment, in the scope that does not break away from aim of the present invention, can impose various changes.
Claims (4)
1. a laser processing device, it is characterized in that possessing for by the processing unit (plant) that the workpiece irradiated with pulse laser is carried out to shape formation:
Pulsed laser irradiation mechanism, irradiate the line scanning of going forward side by side of described laser with constant repetition rate to described workpiece;
Position adjusting mechanism, can keep described workpiece to be adjusted the relative position relation of this workpiece and described laser; And
Control part, control these mechanisms, described machining area is set as piling up along the direction of illumination of described laser the zone of multilayer processing layer when carrying out the scanning of described laser, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to described laser and removing each described machined layer
The lattice point of this control part by the virtual four jiaos of grid that will set described machined layer irradiates described laser as pulse irradiation point to be processed,
In the described machined layer of multilayer, will using processing sequence as 4 the continuous layers from the 1st layer to the 4th layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle,
In described the 2nd layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that 4 described pulse irradiation points adjacent in described the 1st layer form and be used as the pulse irradiation point,
In described the 3rd layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that described pulse irradiation point adjacent in described the 1st layer and described the 2nd layer forms and be used as the pulse irradiation point,
In described the 4th layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that 4 described pulse irradiation points adjacent in described the 3rd layer form and be used as the pulse irradiation point.
2. laser processing device according to claim 1, is characterized in that,
Described control part is when repeating continuously described 1 cycle, in the 2nd later cycle, in described the 1st layer, the lattice point of described four jiaos of grid is moved to the arbitrary tetragonal center of gravity consisted of described pulse irradiation point adjacent till a upper cycle and be used as the pulse irradiation point.
3. laser processing device according to claim 1 and 2, is characterized in that,
Described control part is set as last described machined layer by described the 4th layer.
4. a laser processing, it is characterized in that having for by the processing method that the workpiece irradiated with pulse laser is carried out to shape formation:
The Ear Mucosa Treated by He Ne Laser Irradiation operation is irradiated the line scanning of going forward side by side of described laser with constant repetition rate to described workpiece in this operation; And
Operation is adjusted in position, in this operation, can keep described workpiece to be adjusted the relative position relation of this workpiece and described laser,
When carrying out the scanning of described laser, described machining area is set as piling up along the direction of illumination of described laser to the zone of multilayer processing layer, assign to form the machined surface of 3D shape by the reservations of each machined layer being irradiated to described laser and removing each described machined layer
Irradiate described laser and processed on the lattice point of virtual four jiaos of grid that described machined layer is set,
In the described machined layer of multilayer, will using processing sequence as 4 the continuous layers from the 1st layer to the 4th layer as 1 cycle, at least comprise the layer that is equivalent to 1 cycle,
In described the 2nd layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that 4 described pulse irradiation points adjacent in described the 1st layer form and be used as the pulse irradiation point,
In described the 3rd layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that described pulse irradiation point adjacent in described the 1st layer and described the 2nd layer forms and be used as the pulse irradiation point,
In described the 4th layer, the lattice point of described four jiaos of grid is moved to the tetragonal center of gravity that 4 described pulse irradiation points adjacent in described the 3rd layer form and be used as the pulse irradiation point.
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| JP2012-128444 | 2012-06-05 | ||
| JP2012128444A JP5920661B2 (en) | 2012-06-05 | 2012-06-05 | Laser processing apparatus and laser processing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108436283A (en) * | 2018-04-11 | 2018-08-24 | 大族激光科技产业集团股份有限公司 | Laser marking machine and its marking method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP7023214B2 (en) * | 2018-11-05 | 2022-02-21 | 京セラ株式会社 | How to manufacture cutting tools |
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| JP3764155B2 (en) * | 2003-10-23 | 2006-04-05 | 住友重機械工業株式会社 | Laser processing method and laser processing apparatus |
| JP5116979B2 (en) * | 2006-02-28 | 2013-01-09 | パナソニック デバイスＳｕｎｘ株式会社 | Laser processing equipment |
| JP2010194560A (en) * | 2009-02-23 | 2010-09-09 | Nisshinbo Holdings Inc | Laser machining method of solar battery panel |
| JP2011212726A (en) * | 2010-03-31 | 2011-10-27 | Fujifilm Corp | Laser machining device and laser machining method |
| JP5861494B2 (en) * | 2012-02-23 | 2016-02-16 | 三菱マテリアル株式会社 | Laser processing apparatus and laser processing method |
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| CN1087750A (en) * | 1992-06-26 | 1994-06-08 | 株式会社半导体能源研究所 | Laser processing |
| US6087625A (en) * | 1997-03-21 | 2000-07-11 | Sumitomo Heavy Industries, Ltd. | Laser machining apparatus |
| CN1678426A (en) * | 2002-08-30 | 2005-10-05 | 住友重机械工业株式会社 | Laser processing method and processing device |
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| CN108436283A (en) * | 2018-04-11 | 2018-08-24 | 大族激光科技产业集团股份有限公司 | Laser marking machine and its marking method |
Also Published As
| Publication number | Publication date |
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| JP2013252528A (en) | 2013-12-19 |
| CN103464892B (en) | 2016-03-09 |
| JP5920661B2 (en) | 2016-05-18 |
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