CN108436283B - Laser marking machine and marking method thereof - Google Patents
Laser marking machine and marking method thereof Download PDFInfo
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- CN108436283B CN108436283B CN201810322886.XA CN201810322886A CN108436283B CN 108436283 B CN108436283 B CN 108436283B CN 201810322886 A CN201810322886 A CN 201810322886A CN 108436283 B CN108436283 B CN 108436283B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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Abstract
The invention relates to a laser marking machine and a marking method thereof, wherein the laser marking machine comprises: the laser, the mirror vibrating mechanism and the focusing mirror are sequentially connected, the controller is connected with the mirror vibrating mechanism, and the laser is used for generating laser; the controller is used for carrying out dot matrix filling on the input pattern to be marked so as to form dot matrix pattern output consisting of a plurality of filling points arranged in an array; the galvanometer mechanism is used for controlling the deflection of the laser according to the position parameters of each filling point output by the controller; the focusing mirror is used for focusing the laser output from the galvanometer mechanism on a workpiece to form a mark. Because each filling point of the dot matrix pattern formed by dot matrix filling is uniformly and regularly distributed, the uniform marking effect on the surface of the workpiece is ensured, the problems of uneven marking effect caused by bending of filling lines forming output patterns and uneven intervals when the patterns to be marked are input in a traditional line filling mode are solved, and the marking quality of the workpiece is greatly improved.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser marking machine and a marking method thereof.
Background
When a traditional laser marking machine marks a workpiece, a controller of the traditional laser marking machine carries out line filling on an input pattern to be marked so as to form pattern output consisting of a plurality of filling lines which are distributed in a staggered mode; the galvanometer mechanism controls the deflection of the laser according to the pattern output information of the controller, and finally ensures that the laser moves on the surface to be marked of the workpiece according to a set track to leave a permanent mark. Because the mode of adopting the line to fill is often limited by the influence of the positioning accuracy of the mirror mechanism that shakes when inputing the mark pattern, make the filling line that constitutes this output pattern appear buckling easily and interval inhomogeneous scheduling problem, finally lead to the work piece that the processing out to appear the stripe, mark the quality and be difficult to reach satisfactory effect.
Disclosure of Invention
In view of the above, it is necessary to provide a laser marking machine and a marking method thereof, which can improve the marking quality of a workpiece.
A laser marking machine comprising: the laser device, the mirror vibrating mechanism and the focusing mirror are sequentially connected, the controller is connected with the mirror vibrating mechanism, and the laser device is used for generating laser; the controller is used for carrying out dot matrix filling on the input pattern to be marked so as to form dot matrix pattern output consisting of a plurality of filling points arranged in an array; the galvanometer mechanism is used for controlling the deflection of the laser according to the position parameters of each filling point output by the controller; the focusing mirror is used for focusing the laser output from the galvanometer mechanism on a workpiece to form a mark.
In one embodiment, the controller is configured to set a density level of the filling points.
In one embodiment, the controller is configured to control the filling point to perform a certain amount of random shift within a preset range and to set the size of the preset range.
In one embodiment, the controller is configured to control the galvanometer mechanism to perform a disordering process on the identification of each of the fill points.
In one embodiment, the method further comprises at least one of the following steps:
a beam expander for expanding a diameter of laser light output from the laser, the beam expander being disposed between the laser and the galvanometer mechanism; and
and the working platform is used for bearing the workpiece and is positioned below the focusing mirror.
In one embodiment, the laser is an infrared fiber laser and/or the focusing lens is an F-Theta lens.
A marking method, comprising:
inputting a pattern to be marked;
carrying out dot matrix filling on the input pattern to be marked so as to form dot matrix pattern output consisting of a plurality of filling points arranged in an array;
controlling the deflection of the laser according to the output position parameters of each filling point; and
focusing the output laser on a workpiece to form a mark.
In one embodiment, before the step of performing dot matrix filling on the input pattern to be marked to form a dot matrix pattern output composed of a plurality of filling points arranged in an array, the method further includes:
and setting the density of the filling points according to the actual requirement of the marking effect.
In one embodiment, the step of performing dot matrix filling on the input pattern to be marked to form a dot matrix pattern output composed of a plurality of filling points arranged in an array further includes:
and controlling the filling point to perform a certain amount of random offset within a preset range.
In one embodiment, the step of performing dot matrix filling on the input pattern to be marked to form a dot matrix pattern output composed of a plurality of filling points arranged in an array further includes:
and carrying out disorder processing on the identification of each filling point.
According to the laser marking machine and the marking method thereof, the lattice filling is carried out on the input to-be-marked pattern to form the lattice pattern output consisting of a plurality of filling points which are arranged in an array, and the filling points of the lattice pattern formed by the lattice filling are uniformly and regularly distributed, so that the uniform marking effect on the surface of the workpiece is ensured, the problem of non-uniform marking effect caused by the bending and non-uniform spacing of the filling lines forming the output pattern when the to-be-marked pattern is input in the traditional line filling mode is solved, the appearance elegance of the workpiece is ensured, and the marking quality of the workpiece is greatly improved; meanwhile, the method can be suitable for industries needing marking treatment such as carving, marking, code spraying and the like on a steel mirror surface die for leather, shoemaking, jewelry, commemorative coins, PC and the like, and can correspondingly meet the actual requirement of large-breadth marking processing.
Drawings
FIG. 1 is a schematic structural diagram of a laser marking machine according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a dot pattern according to an embodiment of the invention;
FIG. 3 is a flow chart of a marking method in an embodiment of the present invention;
FIG. 4 is a diagram illustrating a random offset of filled dots in the dot matrix pattern of FIG. 2;
FIG. 5 is a graph illustrating the effect of random shifting of filled dots in the dot matrix pattern of FIG. 2;
FIG. 6 is a comparison of the marking effect of a workpiece according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 and 2, a laser marking machine 100 according to an embodiment of the present invention includes a laser 110, a galvanometer mechanism 120, a focusing mirror 130, and a controller 140. The laser 110, the galvanometer mechanism 120, and the focusing mirror 130 are connected in sequence. The controller 140 is connected to the galvanometer mechanism 120. The laser 110 is used to generate laser light. The controller 140 is configured to perform dot matrix filling on the input pattern to be marked to form a dot matrix pattern 200 composed of a plurality of filling dots 210 arranged in an array, and output the dot matrix pattern. The galvanometer mechanism 120 is used to control the deflection of the laser based on the positional parameters of the respective fill spots 210 output by the controller 140. The focusing mirror 130 is used to focus the laser light output from the galvanometer mechanism 120 on a workpiece to form a mark.
Further, in the present embodiment, the pulse width of the laser 110 is 1-200 ns. Different lasers 110 can have their pulse width varied in a large range, and the pulse width is an important factor for ensuring the marking quality of the workpiece, the smaller the pulse width is, the higher the instantaneous energy of the laser is, the higher the peak power is, the effective shortening of the action time of the laser on the surface of the workpiece can be achieved, and the instantaneous single pulse laser acts on the surface of the workpiece, so that the marking can be achieved without damaging the workpiece. The pulse width of the laser 110 defined in this embodiment is 1-200ns, so that the laser 110 can emit a pulse small enough to ensure uniform marking of the workpiece.
In one embodiment, the laser 110 may be an infrared fiber laser with a wavelength of 1064nm, a repetition rate of 1-3000kHz, and a power of 20W. The infrared fiber laser has the advantages of good beam quality, large single-point energy, short pulse width and high peak power, and can well remove a polishing layer on the surface of a workpiece; meanwhile, the thermal influence of laser generated by the infrared fiber laser is small, and the marking effect of yellowing caused by workpiece thermal deformation and burning marks is not easy to cause.
In one embodiment, the galvanometer mechanism 120 further includes an X galvanometer and a Y galvanometer, wherein the X galvanometer and the Y galvanometer are both formed by combining a scanning motor and an optical mirror. The scanning motors of the X-galvanometer and the Y-galvanometer are respectively utilized to drive the corresponding optical reflectors to perform deflection type movement in the X direction and the Y direction, so that the laser moves to the positions of the filling points 210 of the dot matrix pattern 200 output by the controller 140.
It should be noted that in one embodiment, focusing lens 130 is an F-Theta lens. The focusing mirror 130 determines the working range of the laser marking machine 100, the longer the focal length of the focusing mirror 130, the larger the working range is, the larger the focused light spot is, and the worse the energy distribution uniformity degree in the working range after focusing is. Common F-Theta lenses include F80 (focal length 80mm), F100 (focal length 100mm), F160 (focal length 160mm), F210 (focal length 210mm), F254 (focal length 254mm), F300 (focal length 300mm), and F430 (focal length 430 mm). In the present embodiment, the focusing lens 130 is selected to be an F-Theta lens of F100 (focal length 100 mm).
As shown in fig. 1, in an embodiment, the laser marking machine 100 may further include a beam expander 150. The beam expander 150 is disposed between the laser 110 and the galvanometer mechanism 120. The beam expander 150 is used to expand the diameter of the laser light output from the laser 110, thereby improving the transmission characteristics of the laser light to better focus the laser light onto the surface of the workpiece. Further, the beam expansion multiple of the beam expander 150 may be 1-3 times. In an embodiment, the laser marking machine 100 may further include a working platform 160. The work platform 160 is located below the focusing mirror 130. The work platform 160 is used to carry a workpiece.
In order to obtain a finer marking effect, the size of the focused light spot must be reduced, and factors affecting the size of the focused light spot include the focal length of the focusing mirror 130, the quality of the laser beam, the wavelength, and the size of the incident light spot before focusing. The small spot is acquired by selecting the beam expander 150, as determined by the focusing mirror 130 and the laser 110. As described above, the beam expander 150 is used to enlarge the diameter of the laser beam emitted from the laser 110 and before being focused by the focusing mirror 130, and the marking effect is more precise as the beam expander 150 magnification is larger, the spot before being focused is larger, and the spot after being focused is smaller. The multiple of the beam expander 150 is determined to be about 2 times, so that the laser is completely received and reflected by the vibrating mirror mechanism 120, and if the multiple of the beam expander 150 is too large, the vibrating mirror mechanism 120 cannot receive the whole light spot, so that the loss of laser energy and the deformation of the light spot are caused.
Further, in one embodiment, the controller 140 can be used to set the density of the filling points 210 to meet the actual requirements of different marking effects. In the actual marking process, different marking effects have different requirements on the density of the filling points 210. In one embodiment, for example, a frosted pattern is engraved on a steel mirror mold, and when a full-sand marking effect is required, the density of the filling points 210 with a larger value can be set by the controller 140, so as to ensure the overlapping rate of the filling points 210 and avoid the occurrence of a substrate leakage phenomenon of the mirror mold; similarly, when the sand leaking marking effect is needed, the density of the filling points 210 can be appropriately adjusted through the controller 140 to adapt to the actual requirements of the sand leaking marking effect with different density degrees, and the debugging method is simple and visual and has strong controllability.
Further, in one embodiment, the controller 140 is configured to control the filling point 210 to perform a random offset within a predetermined range and to set the size of the predetermined range. Because the filling points 210 of the dot matrix pattern 200 formed by dot matrix filling are uniformly and regularly distributed, the final marking effect of the workpiece has certain regularity, which is relatively unnatural. In order to obtain a more natural marking effect, the controller 140 can control each filling point 210 to perform a certain amount of random offset within a preset range, so that the distribution of the filling points 210 is more random, and the final marking effect of the workpiece is more natural.
The function of the above-mentioned range of predetermineeing of controller 140 is particularly effective when marking the effect to whole sand, because whole sand is marked the effect and need guarantee the overlapping rate of filling point 210, through controller 140 to the reasonable settlement of the above-mentioned range of predetermineeing to can avoid leaking the emergence of the substrate phenomenon of this mirror surface grinding apparatus better.
In one embodiment, further, the controller 140 may be configured to control the galvanometer mechanism 120 to randomize the identification of each fill spot 210. In order to make the marking effect of the workpiece more natural, the controller 140 can control the mirror vibration mechanism 120 to perform disorder processing on the identification of each filling point 210, so that the mirror vibration mechanism 120 deflects and emits laser in a disorder manner, and the final marking effect of the workpiece is more natural.
As shown in fig. 3, the present invention further provides a marking method using the laser marking machine 100. The marking method comprises the following steps:
and S110, inputting a pattern to be marked. The pattern to be marked is input to the controller 140. The pattern to be marked can be a drawing file with a format such as PLT, DXF, AI and the like.
And S130, performing dot matrix filling on the input pattern to be marked to form a dot matrix pattern 200 consisting of a plurality of filling points 210 arranged in an array and output the dot matrix pattern. The controller 140 performs dot matrix filling on the input pattern to be marked to form a dot matrix pattern 200 composed of a plurality of filling points 210 arranged in an array and output.
S150, controlling the deflection of the laser according to the output position parameters of the filling points 210.
Step S130 is a laser marking process, and the galvanometer mechanism 120 controls the deflection of the laser output by the laser 110 according to the position parameters of the filling points 210 output by the controller 140. Specifically, the scanning motors of the X-galvanometer and the Y-galvanometer drive the corresponding optical mirrors to perform deflection motion in the X direction and the Y direction, so that the laser output by the laser 110 moves to the positions of the filling points 210 of the dot matrix pattern 200 output by the controller 140.
And S170, focusing the output laser on the workpiece to form a mark. Specifically, the laser light output from the galvanometer mechanism 120 at this time is focused on the workpiece by the focusing mirror 130 to form a mark.
In an embodiment, before the step S130 of performing dot matrix filling on the input pattern to be marked to form the output dot matrix pattern 200 composed of a plurality of filling dots 210 arranged in an array, the method may further include: step S120, setting the density of the filling points 210 according to the actual requirement of the marking effect.
The density of the filler dots 210 is preset by the controller 140 to accommodate the different demands of different marking effects on the density of the filler dots 210. In one embodiment, the lateral spacing and the longitudinal spacing of the filling points 210 are set by the controller 140.
Further, step S130 may be followed by: in step S134, the filling point 210 is controlled to perform a certain amount of random offset within a preset range. Specifically, as shown in fig. 4 and 5, the controller 140 controls the filling points 210 to perform a certain amount of random offset in a circular area formed by taking the center P as the center of the circle and the preset length R as the radius, so that the distribution of the filling points 210 is more random, and the final marking effect of the workpiece is more natural.
It is to be noted that the operation of step S134 is performed before step S150 of controlling the deflection of the laser light in accordance with the output position parameters of the respective filling points 210. Further, before the step S134, the method further includes: and S131, setting the size of a preset range according to actual requirements of different marking effects. Step S132, automatically allocating the random offset of each filling point 210 according to the obtained size of the preset range.
In specific implementation, as shown in fig. 4, before controlling the random offset of the filling point 210, the numerical value of the preset length R is set by the controller 140 according to actual requirements of different standard effects, so as to obtain the preset range of the random offset of the filling point 210. After the controller 140 obtains the size of the preset range of the random offset of the filling points 210, the controller 140 automatically allocates the random offset of each filling point 210 through a preset program.
In an embodiment, step S130 may be followed by: in step S136, the identification of each filling point 210 is subjected to a disordering process. Preferably, the operation of step S136 is performed after step S134 of controlling the filling point 210 to perform a certain amount of random offset within a preset range.
As shown in fig. 6, the controller 140 controls the galvanometer mechanism 120 to perform a disordering process on the identification of each filling point 210, so that the galvanometer mechanism 120 can deflect and emit laser in a disordered manner in the process of executing step S150, and the final marking effect of the workpiece is more natural.
It should be noted that, in an embodiment, the step S110 of inputting the pattern to be marked may further include: and S100, setting corresponding laser marking parameters. In a specific implementation, before laser processing, the wavelength, repetition frequency, pulse width of the laser 110, the beam expansion multiple of the beam expander 150, and the focal length of the focusing mirror 130 are preset.
Further, in an embodiment, the step S170 of focusing the output laser on the workpiece to form the mark may further include: and step S190, cleaning residues and processing burrs. That is, on the surface of the workpiece after laser processing, residues such as dust accumulated around the processing area are cleaned by a high pressure air gun or ultrasonic waves, and burrs at the edge of the contour are removed by a polishing process.
According to the laser marking machine and the marking method thereof, the lattice filling is carried out on the input to-be-marked pattern to form the output of the lattice pattern 200 consisting of the filling points 210 which are arranged in a plurality of arrays, and the filling points 210 of the lattice pattern 200 formed by the lattice filling are uniformly and regularly distributed, so that the uniform marking effect on the surface of the workpiece is ensured, the problem of non-uniform marking effect caused by the bending of the filling lines forming the output pattern and the non-uniform distance when the to-be-marked pattern is input in the traditional line filling mode is solved, the appearance elegance of the workpiece is ensured, and the marking quality of the workpiece is greatly improved; meanwhile, the method can be suitable for industries needing marking treatment such as carving, marking, code spraying and the like on a steel mirror surface die for leather, shoemaking, jewelry, commemorative coins, PC and the like, and can correspondingly meet the actual requirement of large-breadth marking processing.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A laser marking machine, comprising: the laser device, the mirror vibrating mechanism and the focusing mirror are sequentially connected, the controller is connected with the mirror vibrating mechanism, and the laser device is used for generating laser; the controller is used for carrying out dot matrix filling on the input pattern to be marked so as to form dot matrix pattern output consisting of a plurality of filling points arranged in an array; the controller is used for controlling the galvanometer mechanism to carry out disorder processing on the identification of each filling point, and the galvanometer mechanism is used for controlling the deflection of the laser according to the position parameters of each filling point output by the controller; the focusing mirror is used for focusing the laser output from the galvanometer mechanism on a workpiece to form a mark; the controller is used for controlling the filling point to perform a certain amount of random deviation in a preset range and setting the size of the preset range.
2. The laser marking machine of claim 1, wherein the controller is configured to set a density level of the filler dots.
3. The laser marking machine according to claim 1, wherein the controller controls the filling point to perform a random offset of a certain amount in a circular area formed by taking the center of the filling point as a circle center and a preset length as a radius.
4. The laser marking machine according to claim 1, further comprising a beam expander for expanding a diameter of the laser light output from the laser.
5. The laser marking machine of claim 4, wherein the beam expander is disposed between the laser and the galvanometer mechanism.
6. The laser marking machine of claim 1, further comprising a work platform for carrying the workpiece, the work platform being positioned below the focusing mirror.
7. The laser marking machine according to claim 1, wherein the laser is an infrared fiber laser and/or the focusing lens is an F-Theta lens.
8. A marking method, comprising:
inputting a pattern to be marked;
carrying out dot matrix filling on the input pattern to be marked so as to form dot matrix pattern output consisting of a plurality of filling points arranged in an array;
carrying out disorder processing on the identification of each filling point;
controlling the filling point to perform a certain amount of random offset within a preset range;
controlling the deflection of the laser according to the output position parameters of each filling point; and
focusing the output laser on a workpiece to form a mark.
9. The marking method according to claim 8, wherein the step of dot matrix filling the input pattern to be marked to form a dot matrix pattern output consisting of a plurality of filling dots arranged in an array further comprises:
and setting the density of the filling points according to the actual requirement of the marking effect.
10. The marking method as claimed in claim 8, wherein the input pattern to be marked is dot-matrix filled, and the controller controls the filling point to randomly shift by a certain amount in a circular area formed by taking the center of the filling point as a circle center and a preset length as a radius.
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CN110640326A (en) * | 2019-10-31 | 2020-01-03 | 苏州富强科技有限公司 | Laser marking device |
CN113369701B (en) * | 2020-03-09 | 2024-02-06 | 大族激光科技产业集团股份有限公司 | Method and device for processing anti-fake pattern on transparent plastic product |
CN113618250A (en) * | 2020-05-08 | 2021-11-09 | 大族激光科技产业集团股份有限公司 | Metal marking method |
CN111531279B (en) * | 2020-05-29 | 2022-04-01 | 青岛星成激光科技有限公司 | Metal surface colorful frosting processing method |
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