CN113618250A - Metal marking method - Google Patents
Metal marking method Download PDFInfo
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- CN113618250A CN113618250A CN202010381406.4A CN202010381406A CN113618250A CN 113618250 A CN113618250 A CN 113618250A CN 202010381406 A CN202010381406 A CN 202010381406A CN 113618250 A CN113618250 A CN 113618250A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 86
- 239000002184 metal Substances 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000010329 laser etching Methods 0.000 claims description 33
- 241000276489 Merlangius merlangus Species 0.000 claims description 7
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 241001085205 Prenanthella exigua Species 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 20
- 238000010276 construction Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 11
- 238000010330 laser marking Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000002679 ablation Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a metal marking method, which comprises the following steps: acquiring a mark pattern outline; rotating a laser head layer by layer along the edge of the marked pattern contour to fill inwards to form a design drawing file; placing the metal to be marked on a processing station; and marking the metal to be marked according to the design drawing. The marking pattern profile is acquired, and the marking is facilitated to be carried out on the whole. And the laser head is rotated layer by layer to fill inwards along the edge of the marked pattern outline, compared with the traditional cross filling, the edge heat effect is lower, and a cavity with a certain gradient is formed at the marked position. Placing the metal to be marked on a processing station to ensure that flaws caused by operation factors cannot be generated in the construction process; and finally, marking the metal to be marked according to the design drawing file, so that the metal to be marked can be processed according to a plan. In conclusion, the marked position forms a cavity with a certain gradient, so that a stable pattern is carved, and the stereoscopic impression is strong and obvious in vision.
Description
Technical Field
The invention relates to a metal surface treatment technology, in particular to a metal marking method.
Background
At present, the requirements for making permanent marks on the surfaces of metal products are higher and higher, and the current methods include a chemical reagent treatment method, a steel seal printing method and a traditional laser marking method. Among these, the use of dyes, inks and other chemicals in marking commercial consumer and industrial products has certain limitations on supply chain, logistics and environment. Although the steel printing method and the laser marking method can solve the problems, the marking content of the steel printing has no color, the marking depth is shallow and unobvious, and the marking content is easy to wear; the traditional laser marking method has shallow marking depth, and the marking content is easily worn and lost under the influence of the environment. The traditional laser marking method adopts a cross filling mode, and the filling mode is one of factors causing unstable marking content.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the process for marking metal is provided, and the filling mode is changed, so that a cavity with a certain gradient is formed at each marking position, and the marking is ensured to be more stable.
In order to solve the technical problems, the invention adopts the technical scheme that: a metal marking method comprising the steps of:
acquiring a mark pattern outline;
rotating a laser head layer by layer along the edge of the marked pattern contour to fill inwards to form a design drawing file;
placing the metal to be marked on a processing station;
and marking the metal to be marked according to the design drawing.
Preferably, the step of filling by rotating the laser head layer by layer along the edge of the contour of the marking pattern includes:
acquiring the spot diameter of laser;
confirming that the filling layer interval is not larger than the spot diameter of the laser;
and filling the mark pattern outline inwards layer by layer according to the filling layer interval.
Specifically, the step of marking the metal to be marked includes:
selecting a laser;
setting processing parameters for the laser;
guiding the design drawing file into a laser processing device;
and marking the metal to be marked according to the design drawing.
Further, the processing parameter includes a marking speed, and the step of marking the metal to be marked according to the design drawing file includes:
adjusting the marking speed to be a depth laser etching speed;
repeatedly performing deep laser etching on the metal to be marked for multiple times;
wherein the depth laser etching speed is 800-1500 mm/s.
Further, after the step of performing deep laser etching on the metal to be marked, the method further includes:
adjusting the marking speed to be a whiting laser etching speed;
carrying out laser etching on the metal to be marked;
wherein the whiting laser etching speed is 1000-1800 mm/s.
Specifically, the step of setting the processing parameters for the laser includes the following steps:
setting the marking speed, the skip speed, the Q frequency, the laser pulse width and the focus position of the laser;
the skip speed is 1000-3000 mm/s, the Q frequency is 100-1000 KHz, the laser pulse width is 5-30 PS, and the focus position is positive focus.
Further, the step of marking the metal to be marked according to the design drawing specifically includes:
acquiring the marking depth;
determining the laser etching times;
and marking the metal to be marked according to the laser etching times.
Further, after the step of marking the metal to be marked according to the design drawing, the method further comprises the following steps:
carrying out ultrasonic cleaning on the metal to be marked;
and wiping the metal to be marked by using alcohol dust-free cloth.
Further, the laser is an infrared picosecond laser with the wavelength of 1064 nm.
Further, the step of rotating the laser head to fill inwards along the edge of the marked pattern contour layer by layer comprises the following steps: and when the mark pattern outline is a character outline, filling the character outline with bright white as shading.
The marking pattern profile is acquired, and the marking is facilitated to be carried out on the whole. And the laser head is rotated layer by layer to fill inwards along the edge of the outline of the marked pattern, compared with the traditional cross filling, the edge heat effect is lower, and the printed mark has a certain gradient. Placing the metal to be marked on a processing station to ensure that flaws caused by operation factors cannot be generated in the construction process; and finally, marking the metal to be marked according to the design drawing file, so that the metal to be marked can be processed according to a plan. The mark carved by the process has a certain gradient and cannot fade or become shallow due to wiping or interference of environmental factors. Moreover, the three-dimensional effect is more obvious.
Drawings
The specific structure of the invention is detailed below with reference to the accompanying drawings:
FIG. 1 is an overall flow chart of a metal marking method according to a first embodiment of the present invention;
FIG. 2 is a schematic view illustrating a filling effect according to the first embodiment of the present invention;
FIG. 3 is another schematic diagram illustrating the filling effect of the first embodiment of the present invention;
FIG. 4 is a schematic view of a cavity at a mark location after filling by the method of the first embodiment of the present invention;
FIG. 5 is a schematic view of a first layer mark during filling by the method according to the first embodiment of the present invention;
FIG. 6 is a diagram illustrating a layer of marks when filling by the method according to the first embodiment of the present invention;
FIG. 7 is a diagram illustrating a last layer of marks when filling is performed by the method according to the first embodiment of the present invention;
FIG. 8 is a schematic illustration of a cavity marked after a conventional filling method is applied;
FIG. 9 is an overall flow chart of a filling method according to a second embodiment of the present invention;
FIG. 10 is a flow chart illustrating the marking of a metal to be marked according to a third embodiment of the present invention;
FIG. 11 is a flow chart illustrating the marking of a metal to be marked according to a fourth embodiment of the present invention;
FIG. 12 is a schematic diagram of an appearance effect of a fourth embodiment of the present invention with a mark depth of 54 μm;
fig. 13 is a schematic diagram of the appearance effect of the fourth embodiment of the present invention with a mark depth of 26 μm.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 8, fig. 1 is a general flowchart of a metal marking method according to a first embodiment of the present invention. FIG. 2 is a schematic view illustrating a filling effect according to the first embodiment of the present invention; FIG. 3 is another schematic diagram illustrating the filling effect of the first embodiment of the present invention; FIG. 4 is a schematic view of a cavity at a mark location after filling by the method of the first embodiment of the present invention; FIG. 5 is a schematic illustration of a cavity marked with a mark after a conventional filling method is applied; FIG. 6 is a schematic diagram of a first layer mark during filling by the method according to the first embodiment of the present invention; FIG. 7 is a diagram illustrating a layer of marks when filling by the method according to the first embodiment of the present invention; FIG. 8 is a diagram illustrating a last layer of marks when filling is performed by the method according to the first embodiment of the present invention. The application provides a metal marking method, which comprises the following steps:
s100, acquiring a marking pattern outline;
s200, rotating a laser head layer by layer to fill inwards along the edge of the outline of the marked pattern to form a design drawing file;
s300, placing the metal to be marked on a processing station;
and S400, marking the metal to be marked according to the design drawing.
The marking pattern profile is acquired, and the marking is facilitated to be carried out on the whole. And the laser head is rotated layer by layer to fill inwards along the edge of the marked pattern contour. In this embodiment, after the layer that is close to the laser head finishes processing, the laser head rotates certain angle, fills to the next layer of pattern wheel frame inboard. Compared with the traditional cross filling, the edge heat effect is low, and the cavity at the marked position has a certain gradient. Placing the metal to be marked on a processing station to ensure that flaws caused by operation factors cannot be generated in the construction process; and finally, marking the metal to be marked according to the design drawing file, so that the metal to be marked can be processed according to a plan. According to the method, the cavities with certain gradients are formed at the mark positions, and the cavities are not faded or lightened due to the interference of wiping or environmental factors. Moreover, the stereoscopic impression is strong and the visual effect is obvious. When the mark pattern contour is a character contour, the character contour is filled with bright white as shading. Therefore, people can obtain visual contrast, a visual effect with obvious contrast is formed, and the marking effect is ensured.
Further, as shown in fig. 9, fig. 9 is an overall flowchart of a filling method according to a second embodiment of the present invention. In step S200, the step of rotating the laser head layer by layer to fill the pattern along the edge of the marked pattern contour includes:
step S210, acquiring the spot diameter of laser;
step S220, confirming that the space between the filling layers is not more than the diameter of a light spot of the laser;
and step S230, according to the filling layer interval, filling the marking pattern outline inwards layer by layer.
Specifically, step S210 is to obtain the spot diameter of the laser. In this embodiment, the light spot diameter of laser can be directly measured by directly adopting the beam quality analyzer, and the light spot diameter of laser can be obtained by applying other modes.
Step S220, confirming that the space between the filling layers is not more than the diameter of a light spot of the laser;
and step S230, according to the filling layer interval, filling the marking pattern outline inwards layer by layer.
It can be understood that the designed character filling mode is that the character is filled from outside layer to inside layer. The space between filling layers is the distance from the filling point to the next filling layer in the character outline after the filling of any layer close to the filling outline is finished. Based on this, when the filling layer interval is not more than the facula diameter of laser, the sign of mark position forms the effect that continuous abrupt slope slided down for the effect of mark is more meticulous, and the third dimension is stronger, and visual effect is more obvious.
In step S400, the step of marking the metal to be marked includes:
step S410, selecting a laser;
step S420, setting processing parameters aiming at the laser;
step S430, importing the design drawing file into a laser processor;
and step S440, marking the metal to be marked according to the design drawing.
In one embodiment, after the processing parameters of the precise laser marker are set, laser generated by the laser is used for acting with the stainless steel material at a laser focus, the position of the laser point is controlled through a high-precision high-speed vibrating mirror arranged on the laser, the stainless steel material is processed according to a design drawing file, and required characters are marked on a watch rear cover.
Specifically, step S410 selects a laser.
In this embodiment, the laser is an infrared picosecond laser with a wavelength of 1064 nm. The maximum power of the laser was 20W, and the mark range was 100mm by 100 mm.
Step S420, setting a processing parameter for the laser, including the following steps:
step S421, setting marking speed, skip speed, Q frequency, laser pulse width and focus position of the laser;
wherein the skip speed is 1000-3000 mm/s, the Q frequency is 100-1000 KHz, the laser pulse width is 5-30 PS, and the focus position is positive focus.
In the technical scheme, the larger the backlash speed is, the less the whole processing time is, but the fineness is reduced. The skip speed is 1000mm/s, which can ensure that the processing time is not particularly high and the fineness is better. The skip speed is 3000mm/s, so that the processing time consumption is low, and the meticulous change is not obvious.
In the technical scheme, the Q frequency refers to the frequency of laser emission, the higher the Q frequency is, the more the number of laser pulses emitted per second is, and meanwhile, the period of the laser pulses is shortened, the stronger the discontinuity of the laser is, so that the marking times are more, but the marking is finer. The Q frequency is 100-1000 KHz, and metals can be marked according to different requirements. In the implementation, the Q frequency is 100KHz, the pulse number is less, the period is longer, the continuity is better, and the marking speed is faster. The Q frequency is 1000KHz, the pulse number is more, the period is shorter, and the mark is more detailed.
The pulse width of the laser is 5-30 PS. On the one hand, as the pulse width increases, the ablation efficiency increases and the marking speed becomes faster. On the other hand, for pulse widths on the order of picoseconds or more, the smaller such laser pulse width, the lower the laser fluence density required for ablation. Therefore, the structure formed on the material is more similar to strong ablation with smaller pulse width, namely, deeper mark can be obtained with shorter laser pulse width, and the metal surface appearance is better by adopting femtosecond laser with shorter pulse width for processing.
In this embodiment, for some metals, when the laser pulse width is 5PS, it is ensured that the mark is made finer and the efficiency is appropriate. When the laser pulse width is 30PS, the marking efficiency can be ensured to be high and the marking fineness is satisfactory. It will be appreciated that for some more specific metals, there may be some variation in the pulse width parameters. It is to be understood that the parameters in this embodiment are within ranges and do not have particularly significant variations.
Step S430, the design drawing is imported into the laser processing machine.
Referring to fig. 10, fig. 10 is a flow chart illustrating a marking process for a metal to be marked according to a third embodiment of the present invention.
Step S440, marking the metal to be marked according to the design drawing file, and specifically comprises the following steps:
step S441, obtaining the marking depth;
step S442, determining the laser etching times;
and S443, marking the metal to be marked according to the laser etching times.
The marking depth can be adjusted according to the requirements, the specific adjustment can be according to the specific requirements of customers, and the customers can be divided according to experience to form customized requirements so as to formulate different marking depth specifications. In this embodiment, the depth is controlled by changing the laser etching frequency.
Specifically, please refer to fig. 11 to 13, fig. 11 is a flow chart illustrating a marking process performed on a metal to be marked according to a fourth embodiment of the present invention. FIG. 12 is a schematic diagram of an appearance effect of a fourth embodiment of the present invention with a mark depth of 54 μm; fig. 13 is a schematic diagram of the appearance effect of the fourth embodiment of the present invention with a mark depth of 26 μm.
The processing parameters further include a marking speed, and step S440 includes:
step S444, adjusting the marking speed to be the depth laser etching speed;
step S445, repeatedly performing deep laser etching for multiple times aiming at the metal to be marked;
wherein, the depth laser etching speed is 800 mm/s-1500 mm/s.
And step S444, adjusting the marking speed to be the depth laser etching speed.
The marking speed refers to the scanning galvanometer speed of the laser, and under the condition of constant other conditions, the higher the speed is, the higher the marking speed is. The higher the speed, the less times the same place is hit by laser. The speed is slow, so that the drilling depth is more favorable.
The depth laser etching speed is 800 mm/s-1500 mm/s, and on one hand, the metal can be marked with depth properly under the controllable condition. Wherein, when the depth laser etching speed is 800mm/s, the generated mark is relatively deep; and when the depth laser etching speed is 1500mm/s, the mark generating speed is higher. On the other hand, for metals that are easier to mark, a higher marking speed can be used within this range.
And step S445, repeatedly performing deep laser etching on the metal to be marked for multiple times. Therefore, the depth of the laser etching can be controlled more easily, and the marking effect is ensured.
Further, after performing repeated deep laser etching on the metal to be marked for multiple times in step S445, marking the metal to be marked according to the design drawing file in step S440 further includes the following steps:
step S446, adjusting the marking speed to be the whiting laser etching speed;
step S447, carrying out laser etching on the metal to be marked;
wherein, the whiting radium carving speed is 1000 mm/s-1800 mm/s.
The whiting laser engraving speed is 1000 mm/s-1800 mm/s, white scanning treatment can be carried out to achieve the required effect, the processing effect is good, and the heat influence is small. Whether the marking speed is 1000mm/s or 1800mm/s, the whitening effect on the metal to be marked is similar in the interval.
It will be appreciated that the parameters described above can be suitably adjusted as a whole to accommodate a wide variety of metals.
Further, after the step of marking the metal to be marked according to the design drawing file in step S440, the method further includes the following steps:
and step S450, carrying out ultrasonic cleaning on the metal to be marked. The ultrasonic cleaning is to utilize the cavitation, acceleration and direct current action of ultrasonic waves in liquid to directly and indirectly act on liquid and dirt, so that a dirt layer is dispersed, emulsified and stripped to achieve the purpose of cleaning. By ultrasonic cleaning, floating dust can be removed, and secondary pollution can not be generated.
And step S460, wiping the metal to be marked with the alcohol dust-free cloth. Thereby, the cleanness of the metal to be marked can be better ensured. Thereby achieving the optimal appearance effect.
In summary, the metal marking method provided by the invention forms the cavity with a certain gradient at each marking position, so that the formed mark is not faded or lightened due to interference of artificial wiping factors or environmental factors. And has strong stereoscopic impression and obvious visual effect. Compared with a marking mode requiring chemical treatment, the marking method has more convenient marking conditions, can reduce the use and discharge of chemical substances, and is environment-friendly. Compared with the traditional steel printing method and the laser marking method, the marking stability is guaranteed.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A metal marking method, comprising the steps of:
acquiring a mark pattern outline;
rotating a laser head layer by layer along the edge of the marked pattern contour to fill inwards to form a design drawing file;
placing the metal to be marked on a processing station;
and marking the metal to be marked according to the design drawing.
2. The metal marking method of claim 1, wherein the step of inward filling by rotating the laser head layer by layer along the edge of the marking pattern profile comprises:
acquiring the spot diameter of laser;
confirming that the filling layer interval is not larger than the spot diameter of the laser;
and filling the mark pattern outline inwards layer by layer according to the filling layer interval.
3. The metal marking method according to claim 1, wherein the step of marking the metal to be marked comprises:
selecting a laser;
setting processing parameters for the laser;
guiding the design drawing file into a laser processing device;
and marking the metal to be marked according to the design drawing.
4. The metal marking method as claimed in claim 3, wherein the process parameter includes a marking speed, and the step of marking the metal to be marked according to the design drawing includes:
adjusting the marking speed to be a depth laser etching speed;
repeatedly performing deep laser etching on the metal to be marked for multiple times;
wherein the depth laser etching speed is 800-1500 mm/s.
5. The metal marking method of claim 4, wherein after the step of deep laser etching the metal to be marked, further comprising:
adjusting the marking speed to be a whiting laser etching speed;
carrying out laser etching on the metal to be marked;
wherein the whiting laser etching speed is 1000-1800 mm/s.
6. The metal marking method of claim 3, wherein the step of setting the processing parameters for the laser comprises the steps of:
setting the marking speed, the skip speed, the Q frequency, the laser pulse width and the focus position of the laser;
the skip speed is 1000-3000 mm/s, the Q frequency is 100-1000 KHz, the laser pulse width is 5-30 PS, and the focus position is positive focus.
7. The metal marking method according to claim 3, wherein the step of marking the metal to be marked according to the design drawing specifically comprises:
acquiring the marking depth;
determining the laser etching times;
and marking the metal to be marked according to the laser etching times.
8. The metal marking method of claim 3, wherein the step of marking the metal to be marked according to the design drawing further comprises the steps of:
carrying out ultrasonic cleaning on the metal to be marked;
and wiping the metal to be marked by using alcohol dust-free cloth.
9. A metal marking method as defined in claim 3, wherein: the laser is an infrared picosecond laser with the wavelength of 1064 nm.
10. The metal marking method of claim 3 wherein the step of rotating the laser head inward fill layer by layer along the edge of the marking pattern profile comprises: and when the mark pattern outline is a character outline, filling the character outline with bright white as shading.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010381406.4A CN113618250A (en) | 2020-05-08 | 2020-05-08 | Metal marking method |
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| CN202010381406.4A CN113618250A (en) | 2020-05-08 | 2020-05-08 | Metal marking method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110315667A1 (en) * | 2010-06-25 | 2011-12-29 | Electro Scientific Industries, Inc. | Method and apparatus for reliably laser marking articles |
| CN107175409A (en) * | 2017-05-26 | 2017-09-19 | 苏州菲镭泰克激光技术有限公司 | The three-dimensional laser fine machining system and method for crisp and hard material |
| CN107498189A (en) * | 2017-08-28 | 2017-12-22 | 大族激光科技产业集团股份有限公司 | A kind of laser processing of metal surface three-dimensional V-shaped groove structure |
| CN108436283A (en) * | 2018-04-11 | 2018-08-24 | 大族激光科技产业集团股份有限公司 | Laser marking machine and its marking method |
| CN108581212A (en) * | 2018-04-23 | 2018-09-28 | 长沙八思量信息技术有限公司 | Fill method, device, equipment and the readable storage medium storing program for executing of laser marking |
| CN108620730A (en) * | 2018-05-14 | 2018-10-09 | 大族激光科技产业集团股份有限公司 | Laser marking machine and its marking method |
-
2020
- 2020-05-08 CN CN202010381406.4A patent/CN113618250A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110315667A1 (en) * | 2010-06-25 | 2011-12-29 | Electro Scientific Industries, Inc. | Method and apparatus for reliably laser marking articles |
| CN107175409A (en) * | 2017-05-26 | 2017-09-19 | 苏州菲镭泰克激光技术有限公司 | The three-dimensional laser fine machining system and method for crisp and hard material |
| CN107498189A (en) * | 2017-08-28 | 2017-12-22 | 大族激光科技产业集团股份有限公司 | A kind of laser processing of metal surface three-dimensional V-shaped groove structure |
| CN108436283A (en) * | 2018-04-11 | 2018-08-24 | 大族激光科技产业集团股份有限公司 | Laser marking machine and its marking method |
| CN108581212A (en) * | 2018-04-23 | 2018-09-28 | 长沙八思量信息技术有限公司 | Fill method, device, equipment and the readable storage medium storing program for executing of laser marking |
| CN108620730A (en) * | 2018-05-14 | 2018-10-09 | 大族激光科技产业集团股份有限公司 | Laser marking machine and its marking method |
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Application publication date: 20211109 |