CN103456701B - 带有散热器的集成电路管芯组件 - Google Patents

带有散热器的集成电路管芯组件 Download PDF

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Publication number
CN103456701B
CN103456701B CN201310214508.7A CN201310214508A CN103456701B CN 103456701 B CN103456701 B CN 103456701B CN 201310214508 A CN201310214508 A CN 201310214508A CN 103456701 B CN103456701 B CN 103456701B
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CN
China
Prior art keywords
package substrate
heat sink
semiconductor element
sink part
signal contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310214508.7A
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English (en)
Chinese (zh)
Other versions
CN103456701A (zh
Inventor
伯顿·J·卡蓬特
利奥·M·希金斯三世
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NXP USA Inc
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Freescale Semiconductor Inc
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Publication date
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Publication of CN103456701A publication Critical patent/CN103456701A/zh
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201310214508.7A 2012-05-31 2013-05-31 带有散热器的集成电路管芯组件 Expired - Fee Related CN103456701B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/485,912 US8674509B2 (en) 2012-05-31 2012-05-31 Integrated circuit die assembly with heat spreader
US13/485,912 2012-05-31

Publications (2)

Publication Number Publication Date
CN103456701A CN103456701A (zh) 2013-12-18
CN103456701B true CN103456701B (zh) 2017-08-08

Family

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Family Applications (1)

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CN201310214508.7A Expired - Fee Related CN103456701B (zh) 2012-05-31 2013-05-31 带有散热器的集成电路管芯组件

Country Status (3)

Country Link
US (1) US8674509B2 (de)
EP (1) EP2669942A3 (de)
CN (1) CN103456701B (de)

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US9913412B2 (en) 2014-03-18 2018-03-06 Apple Inc. Shielding structures for system-in-package assemblies in portable electronic devices
US9949359B2 (en) 2014-03-18 2018-04-17 Apple Inc. Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
US9820373B2 (en) * 2014-06-26 2017-11-14 Apple Inc. Thermal solutions for system-in-package assemblies in portable electronic devices
US9165855B1 (en) 2014-07-02 2015-10-20 Freescale Semiconductor, Inc. Semiconductor device with die attached heat spreader
CN107636812B (zh) * 2015-06-17 2021-07-27 英特尔公司 双材料高k热密封剂系统
US9899290B2 (en) 2016-03-23 2018-02-20 Nxp Usa, Inc. Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant
US9774174B1 (en) 2016-03-23 2017-09-26 Eaton Corporation Dielectric heat transfer windows, and systems and methods using the same
US10283945B2 (en) 2016-03-23 2019-05-07 Eaton Intelligent Power Limited Load center thermally conductive component
US10115657B2 (en) * 2016-03-23 2018-10-30 Eaton Intelligent Power Limited Dielectric heat path devices, and systems and methods using the same
US11211305B2 (en) 2016-04-01 2021-12-28 Texas Instruments Incorporated Apparatus and method to support thermal management of semiconductor-based components
US10861796B2 (en) * 2016-05-10 2020-12-08 Texas Instruments Incorporated Floating die package
US10179730B2 (en) 2016-12-08 2019-01-15 Texas Instruments Incorporated Electronic sensors with sensor die in package structure cavity
US9761543B1 (en) 2016-12-20 2017-09-12 Texas Instruments Incorporated Integrated circuits with thermal isolation and temperature regulation
US9865537B1 (en) 2016-12-30 2018-01-09 Texas Instruments Incorporated Methods and apparatus for integrated circuit failsafe fuse package with arc arrest
US10411150B2 (en) 2016-12-30 2019-09-10 Texas Instruments Incorporated Optical isolation systems and circuits and photon detectors with extended lateral P-N junctions
US9929110B1 (en) 2016-12-30 2018-03-27 Texas Instruments Incorporated Integrated circuit wave device and method
US10074639B2 (en) 2016-12-30 2018-09-11 Texas Instruments Incorporated Isolator integrated circuits with package structure cavity and fabrication methods
US10121847B2 (en) 2017-03-17 2018-11-06 Texas Instruments Incorporated Galvanic isolation device
US10410999B2 (en) * 2017-12-19 2019-09-10 Amkor Technology, Inc. Semiconductor device with integrated heat distribution and manufacturing method thereof
DE102020108916A1 (de) * 2020-03-31 2021-09-30 Infineon Technologies Ag Package mit Clip und Konnektor über elektronischen Komponenten
CN114730747B (zh) * 2022-02-22 2023-04-04 香港应用科技研究院有限公司 带有冷却翅片的热增强型中介层的电源转换器封装结构

Citations (7)

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US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package
JP2000077575A (ja) * 1998-08-28 2000-03-14 Ind Technol Res Inst 熱的及び電気的に増強された半導体パッケージ
US6278613B1 (en) * 2000-09-27 2001-08-21 St Assembly Test Services Pte Ltd Copper pads for heat spreader attach
TW510034B (en) * 2001-11-15 2002-11-11 Siliconware Precision Industries Co Ltd Ball grid array semiconductor package
CN1387252A (zh) * 2001-05-21 2002-12-25 矽品精密工业股份有限公司 具散热结构的半导体封装件
EP1347513A2 (de) * 2002-03-22 2003-09-24 Broadcom Corporation Ball grid array Gehäuse mit geringem Spannungsabfall und hoher thermischer Leistung
CN1833317A (zh) * 2003-07-30 2006-09-13 皇家飞利浦电子股份有限公司 用于引线接合焊球阵列的接地拱顶

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US6146921A (en) * 1998-09-16 2000-11-14 Intel Corporation Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink
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US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package
JP2000077575A (ja) * 1998-08-28 2000-03-14 Ind Technol Res Inst 熱的及び電気的に増強された半導体パッケージ
US6278613B1 (en) * 2000-09-27 2001-08-21 St Assembly Test Services Pte Ltd Copper pads for heat spreader attach
CN1387252A (zh) * 2001-05-21 2002-12-25 矽品精密工业股份有限公司 具散热结构的半导体封装件
TW510034B (en) * 2001-11-15 2002-11-11 Siliconware Precision Industries Co Ltd Ball grid array semiconductor package
EP1347513A2 (de) * 2002-03-22 2003-09-24 Broadcom Corporation Ball grid array Gehäuse mit geringem Spannungsabfall und hoher thermischer Leistung
CN1833317A (zh) * 2003-07-30 2006-09-13 皇家飞利浦电子股份有限公司 用于引线接合焊球阵列的接地拱顶

Also Published As

Publication number Publication date
US20130320548A1 (en) 2013-12-05
US8674509B2 (en) 2014-03-18
EP2669942A2 (de) 2013-12-04
EP2669942A3 (de) 2017-03-01
CN103456701A (zh) 2013-12-18

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