CN103390578A - 金属熔丝的制造方法 - Google Patents
金属熔丝的制造方法 Download PDFInfo
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- CN103390578A CN103390578A CN2012101470236A CN201210147023A CN103390578A CN 103390578 A CN103390578 A CN 103390578A CN 2012101470236 A CN2012101470236 A CN 2012101470236A CN 201210147023 A CN201210147023 A CN 201210147023A CN 103390578 A CN103390578 A CN 103390578A
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- metal fuse
- passivation layer
- metal
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- interlayer film
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CN201210147023.6A CN103390578B (zh) | 2012-05-11 | 2012-05-11 | 金属熔丝的制造方法 |
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CN201210147023.6A CN103390578B (zh) | 2012-05-11 | 2012-05-11 | 金属熔丝的制造方法 |
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CN103390578A true CN103390578A (zh) | 2013-11-13 |
CN103390578B CN103390578B (zh) | 2015-10-14 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022103A (zh) * | 2014-06-12 | 2014-09-03 | 上海先进半导体制造股份有限公司 | 芯片及其制造方法 |
CN108630664A (zh) * | 2017-03-17 | 2018-10-09 | 中芯国际集成电路制造(上海)有限公司 | 熔丝结构及其形成方法 |
CN109887901A (zh) * | 2019-02-27 | 2019-06-14 | 上海华虹宏力半导体制造有限公司 | 一种避免金属熔丝被过刻蚀的方法 |
CN110137152A (zh) * | 2018-02-08 | 2019-08-16 | 长鑫存储技术有限公司 | 半导体器件及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060214260A1 (en) * | 2005-03-22 | 2006-09-28 | Samsung Electronics Co., Ltd. | Semiconductor device having fuse pattern and methods of fabricating the same |
CN102110640A (zh) * | 2009-12-24 | 2011-06-29 | 北大方正集团有限公司 | 一种单铝的金属熔丝处理方法 |
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2012
- 2012-05-11 CN CN201210147023.6A patent/CN103390578B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060214260A1 (en) * | 2005-03-22 | 2006-09-28 | Samsung Electronics Co., Ltd. | Semiconductor device having fuse pattern and methods of fabricating the same |
CN102110640A (zh) * | 2009-12-24 | 2011-06-29 | 北大方正集团有限公司 | 一种单铝的金属熔丝处理方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022103A (zh) * | 2014-06-12 | 2014-09-03 | 上海先进半导体制造股份有限公司 | 芯片及其制造方法 |
CN108630664A (zh) * | 2017-03-17 | 2018-10-09 | 中芯国际集成电路制造(上海)有限公司 | 熔丝结构及其形成方法 |
CN108630664B (zh) * | 2017-03-17 | 2020-06-09 | 中芯国际集成电路制造(上海)有限公司 | 熔丝结构及其形成方法 |
CN110137152A (zh) * | 2018-02-08 | 2019-08-16 | 长鑫存储技术有限公司 | 半导体器件及其制造方法 |
CN110137152B (zh) * | 2018-02-08 | 2021-09-17 | 长鑫存储技术有限公司 | 半导体器件及其制造方法 |
CN109887901A (zh) * | 2019-02-27 | 2019-06-14 | 上海华虹宏力半导体制造有限公司 | 一种避免金属熔丝被过刻蚀的方法 |
CN109887901B (zh) * | 2019-02-27 | 2020-11-20 | 上海华虹宏力半导体制造有限公司 | 一种避免金属熔丝被过刻蚀的方法 |
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Publication number | Publication date |
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CN103390578B (zh) | 2015-10-14 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140116 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20140116 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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