CN103389309B - 用于检查过孔的方法和设备 - Google Patents

用于检查过孔的方法和设备 Download PDF

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Publication number
CN103389309B
CN103389309B CN201310167190.1A CN201310167190A CN103389309B CN 103389309 B CN103389309 B CN 103389309B CN 201310167190 A CN201310167190 A CN 201310167190A CN 103389309 B CN103389309 B CN 103389309B
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China
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reference value
image
maximum
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binary
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Expired - Fee Related
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CN201310167190.1A
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English (en)
Chinese (zh)
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CN103389309A (zh
Inventor
李活石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Aerospace Co Ltd
Hanwha Precision Machinery Co Ltd
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Samsung Techwin Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/08—Measuring arrangements characterised by the use of optical techniques for measuring diameters
    • G01B11/12—Measuring arrangements characterised by the use of optical techniques for measuring diameters internal diameters
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/168—Segmentation; Edge detection involving transform domain methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G01N2021/8893—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques providing a video image and a processed signal for helping visual decision

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201310167190.1A 2012-05-11 2013-05-08 用于检查过孔的方法和设备 Expired - Fee Related CN103389309B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0050462 2012-05-11
KR1020120050462A KR101767923B1 (ko) 2012-05-11 2012-05-11 비아홀을 검사하는 방법 및 장치

Publications (2)

Publication Number Publication Date
CN103389309A CN103389309A (zh) 2013-11-13
CN103389309B true CN103389309B (zh) 2018-05-04

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CN201310167190.1A Expired - Fee Related CN103389309B (zh) 2012-05-11 2013-05-08 用于检查过孔的方法和设备

Country Status (3)

Country Link
JP (1) JP6143445B2 (ko)
KR (1) KR101767923B1 (ko)
CN (1) CN103389309B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109014725A (zh) * 2018-08-28 2018-12-18 昆山华恒焊接股份有限公司 工件的管孔定位方法、装置以及计算机存储介质

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6282907B2 (ja) * 2014-03-18 2018-02-21 株式会社東光高岳 画像処理装置、立体形状計測装置および画像処理方法
CN104359404B (zh) * 2014-11-24 2017-10-20 南京航空航天大学 飞机零件上大量小尺寸导孔的快速视觉检测方法
CN104764712B (zh) * 2015-04-29 2017-08-25 浙江工业大学 一种pcb过孔内壁质量的检测方法
KR101882645B1 (ko) 2018-01-05 2018-07-26 조관국 기판의 비아홀 검사장치
CN108759676B (zh) * 2018-07-12 2023-11-03 浙江大学 基于棋盘格的传动箱端面大尺寸形位公差检测装置与方法
KR20190083952A (ko) 2018-07-19 2019-07-15 조관국 기판의 비아홀 검사장치
CN109373894B (zh) * 2018-09-27 2020-06-09 南京航空航天大学 一种基于分布式单目视觉的飞机部件连接交点孔系自动定位方法
KR20200110493A (ko) * 2019-03-13 2020-09-24 삼성디스플레이 주식회사 표시 모듈 검사 장치 및 표시 모듈 검사 방법
CN109931892B (zh) * 2019-03-30 2021-03-05 廊坊华安汽车装备有限公司 一种碳罐卡扣结构检测方法
KR102170352B1 (ko) * 2020-05-07 2020-10-27 이태희 인쇄회로기판의 홀 검사 장치 및 방법
KR102554169B1 (ko) * 2021-10-06 2023-07-12 (주)구일엔지니어링 웨이퍼의 비아홀 검사 방법

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060537A (ja) * 1983-09-13 1985-04-08 Konishiroku Photo Ind Co Ltd 材料評価装置
JPH0560537A (ja) * 1991-09-05 1993-03-09 Matsushita Electric Ind Co Ltd スルーホール検査装置
JPH0791914A (ja) * 1993-10-12 1995-04-07 Yamatake Honeywell Co Ltd 回路基板の原点検出方法及び装置
US5430810A (en) * 1990-11-20 1995-07-04 Imra America, Inc. Real time implementation of the hough transform
JPH10334240A (ja) * 1997-06-04 1998-12-18 Toshiba Corp 図形位置検出方法および図形位置検出装置
JP2002149239A (ja) * 2000-11-08 2002-05-24 Hokuyo Automatic Co 無人搬送車の位置検出装置
CN1614632A (zh) * 2003-11-06 2005-05-11 Ge医疗系统环球技术有限公司 调制传递函数测量方法和系统
CN101432777A (zh) * 2006-02-28 2009-05-13 索尼株式会社 登记装置、核对装置、提取方法以及程序
JP4789097B2 (ja) * 2001-08-29 2011-10-05 セイコーインスツル株式会社 フェルール孔等の内径測定方法および装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060537A (ja) * 1983-09-13 1985-04-08 Konishiroku Photo Ind Co Ltd 材料評価装置
US5430810A (en) * 1990-11-20 1995-07-04 Imra America, Inc. Real time implementation of the hough transform
JPH0560537A (ja) * 1991-09-05 1993-03-09 Matsushita Electric Ind Co Ltd スルーホール検査装置
JPH0791914A (ja) * 1993-10-12 1995-04-07 Yamatake Honeywell Co Ltd 回路基板の原点検出方法及び装置
JPH10334240A (ja) * 1997-06-04 1998-12-18 Toshiba Corp 図形位置検出方法および図形位置検出装置
JP2002149239A (ja) * 2000-11-08 2002-05-24 Hokuyo Automatic Co 無人搬送車の位置検出装置
JP4789097B2 (ja) * 2001-08-29 2011-10-05 セイコーインスツル株式会社 フェルール孔等の内径測定方法および装置
CN1614632A (zh) * 2003-11-06 2005-05-11 Ge医疗系统环球技术有限公司 调制传递函数测量方法和系统
CN101432777A (zh) * 2006-02-28 2009-05-13 索尼株式会社 登记装置、核对装置、提取方法以及程序

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109014725A (zh) * 2018-08-28 2018-12-18 昆山华恒焊接股份有限公司 工件的管孔定位方法、装置以及计算机存储介质

Also Published As

Publication number Publication date
CN103389309A (zh) 2013-11-13
KR101767923B1 (ko) 2017-08-17
JP2013238582A (ja) 2013-11-28
JP6143445B2 (ja) 2017-06-07
KR20130126370A (ko) 2013-11-20

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