CN103382285B - 石墨填充的聚酯组合物 - Google Patents

石墨填充的聚酯组合物 Download PDF

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Publication number
CN103382285B
CN103382285B CN201310157878.1A CN201310157878A CN103382285B CN 103382285 B CN103382285 B CN 103382285B CN 201310157878 A CN201310157878 A CN 201310157878A CN 103382285 B CN103382285 B CN 103382285B
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China
Prior art keywords
weight
composition
amount
polyester
graphite
Prior art date
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Active
Application number
CN201310157878.1A
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English (en)
Chinese (zh)
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CN103382285A (zh
Inventor
佐贺祐司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celanese Polymers Holding Inc
Original Assignee
EI Du Pont de Nemours and Co
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Publication of CN103382285A publication Critical patent/CN103382285A/zh
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Publication of CN103382285B publication Critical patent/CN103382285B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN201310157878.1A 2012-05-02 2013-05-02 石墨填充的聚酯组合物 Active CN103382285B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-116945 2012-05-02
JP2012116945A JP5932480B2 (ja) 2012-05-02 2012-05-02 黒鉛が充填されたポリエステル組成物

Publications (2)

Publication Number Publication Date
CN103382285A CN103382285A (zh) 2013-11-06
CN103382285B true CN103382285B (zh) 2016-09-14

Family

ID=47900782

Family Applications (1)

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CN201310157878.1A Active CN103382285B (zh) 2012-05-02 2013-05-02 石墨填充的聚酯组合物

Country Status (4)

Country Link
US (1) US8877851B2 (enExample)
EP (1) EP2679632B1 (enExample)
JP (1) JP5932480B2 (enExample)
CN (1) CN103382285B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201510061A (zh) * 2013-07-01 2015-03-16 Kaneka Corp 射出成形性優異之高熱傳導性熱塑性樹脂組合物
KR102388821B1 (ko) 2015-06-18 2022-04-21 다우 글로벌 테크놀로지스 엘엘씨 열전도성 엘라스토머 복합물
CN106854344A (zh) * 2016-11-24 2017-06-16 广东美塑塑料科技有限公司 低成本耐老化阻燃增强pbt组合物及其制备方法
US11633983B2 (en) * 2017-05-08 2023-04-25 Pirelli Tyre S.P.A. Tyre for bicycle wheels
BR112022023927A2 (pt) * 2020-05-29 2022-12-27 Dsm Ip Assets Bv Correia transportadora
WO2025192468A1 (ja) * 2024-03-15 2025-09-18 東洋紡エムシー株式会社 熱伝導性樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101490172A (zh) * 2006-12-19 2009-07-22 胜技高分子株式会社 聚对苯二甲酸丁二醇酯树脂组合物
CN101861353A (zh) * 2007-11-16 2010-10-13 纳幕尔杜邦公司 导热树脂组合物
CN101891938A (zh) * 2010-07-16 2010-11-24 金发科技股份有限公司 一种非圆形横截面玻璃纤维增强液晶聚合物材料及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6184608B1 (en) * 1998-12-29 2001-02-06 Honeywell International Inc. Polymer microactuator array with macroscopic force and displacement
US6620497B2 (en) 2000-01-11 2003-09-16 Cool Options, Inc. Polymer composition with boron nitride coated carbon flakes
US6849684B2 (en) 2000-10-20 2005-02-01 E. I. Du Pont De Nemours And Company Molded soft elastomer/hard polyester composition with noise damping properties
CA2409524A1 (fr) 2002-10-23 2004-04-23 Hydro-Quebec Particule comportant un noyau a base de graphite recouvert d'au moins une couche continue ou discontinue, leurs procedes d'obtention et leurs utilisations
JP4631272B2 (ja) * 2003-11-14 2011-02-16 東レ株式会社 フィラー高充填樹脂組成物およびそれから得られる成形品
US20060018123A1 (en) 2004-07-02 2006-01-26 Rose Eric P Curing light having a reflector
JP4681382B2 (ja) * 2005-07-28 2011-05-11 帝人化成株式会社 熱可塑性樹脂組成物
US8007885B2 (en) 2005-09-14 2011-08-30 Georgios Topoulos Light-emitting diode assembly housing comprising poly(cyclohexanedimethanol terephthalate) compositions
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
SM200600005A (it) 2006-02-15 2007-08-22 Idealed.It S R L Unita' luminosa led ad alta potenza, nonche' apparato di illuminazione comprendente tale unita'
JP2007302831A (ja) * 2006-05-12 2007-11-22 Mitsubishi Rayon Co Ltd 熱可塑性樹脂組成物および成形品
TWI302372B (en) 2006-08-30 2008-10-21 Polytronics Technology Corp Heat dissipation substrate for electronic device
JP5085925B2 (ja) * 2006-12-20 2012-11-28 ウィンテックポリマー株式会社 ポリブチレンテレフタレート系樹脂組成物および成形品
EP2178975B1 (de) 2007-08-15 2011-03-09 Basf Se POLYESTERMISCHUNG MIT VERBESSERTER FLIEßFÄHIGKEIT UND GUTEN MECHANISCHEN EIGENSCHAFTEN
TWM353308U (en) 2008-06-09 2009-03-21 qiu-shuang Ke LED illumination device
US8529102B2 (en) 2009-04-06 2013-09-10 Cree, Inc. Reflector system for lighting device
US8575246B2 (en) 2009-07-17 2013-11-05 Toray Industries, Inc. Flame-retardant thermoplastic resin composition and molded article
US8299159B2 (en) 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
US8080599B2 (en) 2009-09-23 2011-12-20 Sabic Innovative Plastics Ip B.V. Thermoplastic polyester compositions, methods of manufacture, and articles thereof
DE102015224701A1 (de) 2015-12-09 2017-06-14 Rolls-Royce Deutschland Ltd & Co Kg Fluggasturbine mit variabler Austrittsdüse eines Nebenstromkanals

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101490172A (zh) * 2006-12-19 2009-07-22 胜技高分子株式会社 聚对苯二甲酸丁二醇酯树脂组合物
CN101861353A (zh) * 2007-11-16 2010-10-13 纳幕尔杜邦公司 导热树脂组合物
CN101891938A (zh) * 2010-07-16 2010-11-24 金发科技股份有限公司 一种非圆形横截面玻璃纤维增强液晶聚合物材料及其制备方法

Also Published As

Publication number Publication date
JP5932480B2 (ja) 2016-06-08
US8877851B2 (en) 2014-11-04
US20130292603A1 (en) 2013-11-07
EP2679632B1 (en) 2015-04-22
CN103382285A (zh) 2013-11-06
EP2679632A1 (en) 2014-01-01
JP2013234309A (ja) 2013-11-21

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Effective date of registration: 20221118

Address after: Delaware

Patentee after: DuPont polymer

Address before: Wilmington, Delaware

Patentee before: E. I. du Pont de Nemours and Co.

TR01 Transfer of patent right