CN103361690B - Pcb的盲孔清洗方法 - Google Patents
Pcb的盲孔清洗方法 Download PDFInfo
- Publication number
- CN103361690B CN103361690B CN201210097618.5A CN201210097618A CN103361690B CN 103361690 B CN103361690 B CN 103361690B CN 201210097618 A CN201210097618 A CN 201210097618A CN 103361690 B CN103361690 B CN 103361690B
- Authority
- CN
- China
- Prior art keywords
- blind hole
- pcb
- free root
- fluorine
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004140 cleaning Methods 0.000 title claims abstract description 14
- 239000002893 slag Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 22
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 11
- UOBPHQJGWSVXFS-UHFFFAOYSA-N [O].[F] Chemical compound [O].[F] UOBPHQJGWSVXFS-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 9
- 239000011737 fluorine Substances 0.000 claims abstract description 9
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 8
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 7
- 238000005260 corrosion Methods 0.000 claims abstract description 6
- 238000000608 laser ablation Methods 0.000 claims abstract description 4
- 239000007789 gas Substances 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 239000001117 sulphuric acid Substances 0.000 claims description 2
- 235000011149 sulphuric acid Nutrition 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 238000007747 plating Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000009713 electroplating Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210097618.5A CN103361690B (zh) | 2012-03-31 | 2012-03-31 | Pcb的盲孔清洗方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210097618.5A CN103361690B (zh) | 2012-03-31 | 2012-03-31 | Pcb的盲孔清洗方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103361690A CN103361690A (zh) | 2013-10-23 |
CN103361690B true CN103361690B (zh) | 2016-08-24 |
Family
ID=49363916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210097618.5A Expired - Fee Related CN103361690B (zh) | 2012-03-31 | 2012-03-31 | Pcb的盲孔清洗方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103361690B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105376927B (zh) * | 2015-09-24 | 2018-07-17 | 中国航天科技集团公司第九研究院第七七一研究所 | 一种ptfe产品孔壁的加工方法 |
CN107385487B (zh) * | 2017-07-24 | 2019-05-10 | 电子科技大学 | 2,4,8,10-四氧杂-3,9-二磷杂螺环化合物在hdi板快速镀铜前处理溶液的应用及其前处理工艺 |
CN107567209A (zh) * | 2017-09-30 | 2018-01-09 | 华宇华源电子科技(深圳)有限公司 | 一种高效率高频微波复合多层板制作方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102296293A (zh) * | 2011-06-24 | 2011-12-28 | 李沛泓 | 印刷线路板微蚀刻剂 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01137693A (ja) * | 1987-11-24 | 1989-05-30 | Fujitsu Ltd | プリント基板の製造方法 |
JP3529849B2 (ja) * | 1994-05-23 | 2004-05-24 | 富士通株式会社 | 半導体装置の製造方法 |
US6554004B1 (en) * | 2000-11-07 | 2003-04-29 | Motorola, Inc. | Method for removing etch residue resulting from a process for forming a via |
CN101808477A (zh) * | 2009-02-17 | 2010-08-18 | 欣兴电子股份有限公司 | 线路板的制作方法 |
-
2012
- 2012-03-31 CN CN201210097618.5A patent/CN103361690B/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102296293A (zh) * | 2011-06-24 | 2011-12-28 | 李沛泓 | 印刷线路板微蚀刻剂 |
Non-Patent Citations (1)
Title |
---|
挠性多层线路板孔金属化技术研究;霍彩红;《中国优秀硕士学位论文全文数据库信息科技辑 》;20051115;第1-96页 * |
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Publication number | Publication date |
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CN103361690A (zh) | 2013-10-23 |
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Effective date of registration: 20220622 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20160824 |