CN103325744B - A kind of LED light source module with high withstand voltage performance - Google Patents
A kind of LED light source module with high withstand voltage performance Download PDFInfo
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- CN103325744B CN103325744B CN201310269708.2A CN201310269708A CN103325744B CN 103325744 B CN103325744 B CN 103325744B CN 201310269708 A CN201310269708 A CN 201310269708A CN 103325744 B CN103325744 B CN 103325744B
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- thermal land
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- negative terminal
- light source
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Abstract
The invention provides a kind of LED light source module with high withstand voltage performance, comprising: metal base printed circuit board and the LED lamp bead be mounted thereon; Metal base printed circuit board comprises metal substrate, be adhered to the thermally conductive insulating layer on this metal substrate one surface and be formed at the positive terminal pad on the surface of not adhering with metal substrate and the negative terminal pad of this thermally conductive insulating layer; The surface that metal substrate and thermally conductive insulating layer are adhered is formed with protruding heating column, and the end face of heating column is formed with thermal land; LED lamp bead has positive pole, negative pole and heat sink, and it is respectively welded on positive terminal pad, negative terminal pad and thermal land, between positive terminal pad and thermal land and between negative terminal pad and thermal land, be all formed with gap; The insulating cement that dielectric strength is greater than 4kV/mm is filled with in described gap.Because the dielectric strength of insulating cement is greater than air, make the present invention have higher withstand voltage properties, improve the product quality of LED light source module, expanded its range of application.
Description
Technical field
The present invention relates to LED applied technical field, be specifically related to a kind of LED light source module with high withstand voltage performance.
Background technology
Fig. 1 is the cross-sectional view of existing a kind of LED light source module, and as shown in Figure 1, LED lamp bead 1 is welded in the end face of metal base printed circuit board and forms LED light source module.Described metal base printed circuit board comprises metal substrate 21, be adhered to the thermally conductive insulating layer 22 on metal substrate 21 1 surface and the positive terminal pad 23 that is formed on the surface of not adhering with metal substrate 21 of this thermally conductive insulating layer 22 and negative terminal pad 24.The surface that described metal substrate 21 and described thermally conductive insulating layer 22 are adhered is formed with protruding heating column 25, the position that described thermally conductive insulating layer 22 is corresponding to this heating column 25 is formed with through hole, and the end face of heating column 25 through this through hole to metal base printed circuit board extends.The end face of heating column 25 is formed with thermal land 26, and thermal land 26 is between positive terminal pad 23 and negative terminal pad 24 and its upper surface is concordant with the upper surface of negative terminal pad 24 with positive terminal pad 23.Solder mask 27 is coated in the end face of metal base printed circuit board and positive terminal pad 23, negative terminal pad 24 and thermal land 26 is exposed.Described LED lamp bead 1 has positive pole 11, negative pole 12 and heat sink 13, positive pole 11, negative pole 12 and heat sink 13 are respectively welded to positive terminal pad 23, negative terminal pad 24 and thermal land 26 by tin cream 3, thus form gap 15 between positive terminal pad 23 and thermal lands 26 and between negative terminal pad 24 and thermal land 26.
In this LED light source module, LED lamp bead 1 is directly welded on and is formed on the thermal land 26 of heating column end face, the heat produced when LED lamp bead 1 works conducts to the bottom surface of metal substrate 21 fast by this heating column 25, therefore this metal base printed circuit board has extraordinary heat dispersion.But based on the demand of LED light source module miniaturization, distance between the positive terminal pad 23 of metal base printed circuit board and thermal land 26 and between negative terminal pad 24 and thermal land 26 needs to design less usually, simultaneously owing to there is not thermally conductive insulating layer in the gap 15 between positive terminal pad 23 and thermal land 26 and between negative terminal pad 24 and thermal land 26, and be conduct electricity between the bottom surface of thermal land 26 and metal substrate 21, therefore easily leakage current is produced between positive terminal pad 23/ negative terminal pad 24 of metal base printed circuit board and metal substrate 21, the withstand voltage properties of LED light source module is low, easy damage.
Summary of the invention
In view of the defect that the withstand voltage properties existing for above-mentioned LED light source module is low, the object of this invention is to provide a kind of LED light source module with more high withstand voltage performance.
The object of the invention is to be achieved through the following technical solutions:
Have a LED light source module for high withstand voltage performance, it comprises:
Metal base printed circuit board and the LED lamp bead being installed on metal base printed circuit board end face;
Described metal base printed circuit board comprises metal substrate, be adhered to the thermally conductive insulating layer on this metal substrate one surface and be formed at the positive terminal pad on the surface of not adhering with described metal substrate and the negative terminal pad of this thermally conductive insulating layer;
The surface that described metal substrate and described thermally conductive insulating layer are adhered is formed with protruding heating column, and the position that described thermally conductive insulating layer is corresponding to described heating column is formed with through hole, and the end face of described heating column through this through hole to metal base printed circuit board extends; The end face of described heating column is formed with thermal land, and this thermal land is between described positive terminal pad and negative terminal pad and its upper surface is concordant with the upper surface of negative terminal pad with described positive terminal pad;
Solder mask, it is coated in the end face of metal base printed circuit board and positive terminal pad, negative terminal pad and thermal land is exposed;
Described LED lamp bead has positive pole, negative pole and heat sink, and it is respectively welded on described positive terminal pad, negative terminal pad and thermal land, between this positive terminal pad and thermal land and between negative terminal pad and thermal land, be formed with gap;
It is characterized in that, in the gap between described positive terminal pad and thermal land and between negative terminal pad and thermal land, be filled with the insulating cement that dielectric strength is greater than 4kV/mm.
As the preferred technical scheme of the present invention, the dielectric strength of described insulating cement is greater than 15kV/mm.
It is further preferred that the dielectric strength of described insulating cement is greater than 20kV/mm.
As the preferred technical scheme of the present invention, described insulating cement is filled in described gap under negative pressure state.
Compared with prior art, the present invention possesses following advantage:
The insulating cement that dielectric strength is greater than 4kV/mm is filled with in the gap of the positive terminal pad of the LED light source module of the present invention/between negative terminal pad and thermal land, LED light source module is made to have higher withstand voltage properties, improve the product quality of LED light source module, expand its range of application.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the LED light source module of prior art;
Fig. 2 is the cross-sectional view of the LED light source module of the embodiment of the present invention.
Embodiment
The present embodiment provides a kind of LED light source module with high withstand voltage performance, and as shown in Figure 2, LED light source module comprises metal base printed circuit board equally and is installed on the LED lamp bead 10 of metal base printed circuit board end face.Described metal base printed circuit board comprises metal substrate 210, be adhered to the thermally conductive insulating layer 220 on this metal substrate 210 1 surface and be formed at the positive terminal pad 230 on the surface of not adhering with described metal substrate 210 and the negative terminal pad 240 of this thermally conductive insulating layer 220.The surface that described metal substrate 210 and described thermally conductive insulating layer 220 are adhered is formed with protruding heating column 250, the position that described thermally conductive insulating layer 220 is corresponding to described heating column 250 is formed with through hole, and the end face of described heating column 250 through this through hole to metal base printed circuit board is extended.The end face of described heating column 250 is formed with thermal land 260, and this thermal land 260 is between described positive terminal pad 230 and negative terminal pad 240 and its upper surface is concordant with the upper surface of negative terminal pad 240 with described positive terminal pad 230.Solder mask 270 is coated in the end face of metal base printed circuit board and positive terminal pad 230, negative terminal pad 240 and thermal land 260 is exposed.
LED lamp bead 10 has positive pole 110, negative pole 120 and heat sink 130, positive pole 110, negative pole 120 and heat sink 130 are respectively welded to described positive terminal pad 230, negative terminal pad 240 and thermal land 260 by tin cream 30, between this positive terminal pad 230 and thermal land 260 and between negative terminal pad 240 and thermal land 260, be formed with gap.
In order to improve the dieletric strength between positive terminal pad 230/ negative terminal pad 240 and metal substrate 210, by the distance between increase positive terminal pad 230/ negative terminal pad 240 and thermal land 260 and/or the higher dielectric material of dielectric strength can be filled between positive terminal pad 230/ negative terminal pad 240 and thermal land 260.But based on the demand of LED light source module miniaturization, distance between positive terminal pad 230/ negative terminal pad 240 and thermal land 260 is limited usually, and by filling the higher dielectric material of dielectric strength between positive terminal pad 230/ negative terminal pad 240 and thermal land 260, the dieletric strength between positive terminal pad 230/ negative terminal pad 240 and metal substrate 210 can be improved on the basis realizing the miniaturization of LED light source module.Consider that the dielectric material in the gap of the positive terminal pad of existing LED light source module/between negative terminal pad and thermal land is air, and the dielectric strength of air only has 3-4kV/mm, therefore, only need fill the dielectric material of dielectric strength higher than air in the gap between positive terminal pad 230/ negative terminal pad 240 of the present embodiment and thermal land 260, the dieletric strength between positive terminal pad 230/ negative terminal pad 240 and metal substrate 210 can be improved.
In the present embodiment, dielectric strength is greater than 4kV/mm insulating cement higher than the insulating cement 40(of air and dielectric strength is filled with in gap between the positive terminal pad 230 of LED light source module and thermal land 260 and between negative terminal pad 240 and thermal land 260), make LED light source module have higher withstand voltage properties.
Preferably, the dielectric strength of described insulating cement 40 is greater than 15kV/mm.It is further preferred that the dielectric strength of described insulating cement 40 is greater than 20kV/mm.
For making described insulating cement 40 fill gap between positive terminal pad 230/ negative terminal pad 240 and thermal land 260 as far as possible fully, insulating cement 40 is preferably made to be filled in this gap under negative pressure state.
Claims (4)
1. have a LED light source module for high withstand voltage performance, it comprises:
Metal base printed circuit board and the LED lamp bead being installed on metal base printed circuit board end face;
Described metal base printed circuit board comprises metal substrate, be adhered to the thermally conductive insulating layer on this metal substrate one surface and be formed at the positive terminal pad on the surface of not adhering with described metal substrate and the negative terminal pad of this thermally conductive insulating layer;
The surface that described metal substrate and described thermally conductive insulating layer are adhered is formed with protruding heating column, and the position that described thermally conductive insulating layer is corresponding to described heating column is formed with through hole, and the end face of described heating column through this through hole to metal base printed circuit board extends; The end face of described heating column is formed with thermal land, and this thermal land is between described positive terminal pad and negative terminal pad and its upper surface is concordant with the upper surface of negative terminal pad with described positive terminal pad;
Solder mask, it is coated in the end face of metal base printed circuit board and positive terminal pad, negative terminal pad and thermal land is exposed;
Described LED lamp bead has positive pole, negative pole and heat sink, and it is respectively welded on described positive terminal pad, negative terminal pad and thermal land by tin cream, between this positive terminal pad and thermal land and between negative terminal pad and thermal land, be formed with gap;
It is characterized in that, in the gap between described positive terminal pad and thermal land and between negative terminal pad and thermal land, be filled with the insulating cement that dielectric strength is greater than 4kV/mm.
2. the LED light source module with high withstand voltage performance according to claim 1, is characterized in that: the dielectric strength of described insulating cement is greater than 15kV/mm.
3. the LED light source module with high withstand voltage performance according to claim 2, is characterized in that: the dielectric strength of described insulating cement is greater than 20kV/mm.
4., according to the arbitrary described LED light source module with high withstand voltage performance of claims 1 to 3, it is characterized in that: described insulating cement is filled in described gap under negative pressure state.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310269708.2A CN103325744B (en) | 2013-06-27 | 2013-06-27 | A kind of LED light source module with high withstand voltage performance |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310269708.2A CN103325744B (en) | 2013-06-27 | 2013-06-27 | A kind of LED light source module with high withstand voltage performance |
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| CN103325744A CN103325744A (en) | 2013-09-25 |
| CN103325744B true CN103325744B (en) | 2016-02-03 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105428505A (en) * | 2015-12-28 | 2016-03-23 | 福建鸿博光电科技有限公司 | Support used for LED flip die bond and die bond method utilizing support |
| CN105578735A (en) * | 2016-03-14 | 2016-05-11 | 龙南骏亚电子科技有限公司 | High-heat-conduction multilayer circuit board |
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| CN101592322A (en) * | 2009-06-05 | 2009-12-02 | 史杰 | The LED method for packing of high-power LED lighting fixture |
| CN101735619A (en) * | 2009-12-28 | 2010-06-16 | 华南理工大学 | Halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and preparation method thereof |
| CN102155666A (en) * | 2011-04-18 | 2011-08-17 | 黄晓华 | Highly efficient heat radiation LED (Light Emitting Diode) lamp |
| CN102593336A (en) * | 2011-01-17 | 2012-07-18 | 三星Led株式会社 | Light-emitting device package and method of manufacturing the same |
| CN103107275A (en) * | 2011-11-10 | 2013-05-15 | 江苏日月照明电器有限公司 | Device for light emitting diode (LED) heat conduction and dissipation and insulation and voltage resistance |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4747265B2 (en) * | 2009-11-12 | 2011-08-17 | 電気化学工業株式会社 | Light-emitting element mounting substrate and manufacturing method thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101592322A (en) * | 2009-06-05 | 2009-12-02 | 史杰 | The LED method for packing of high-power LED lighting fixture |
| CN101735619A (en) * | 2009-12-28 | 2010-06-16 | 华南理工大学 | Halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and preparation method thereof |
| CN102593336A (en) * | 2011-01-17 | 2012-07-18 | 三星Led株式会社 | Light-emitting device package and method of manufacturing the same |
| CN102155666A (en) * | 2011-04-18 | 2011-08-17 | 黄晓华 | Highly efficient heat radiation LED (Light Emitting Diode) lamp |
| CN103107275A (en) * | 2011-11-10 | 2013-05-15 | 江苏日月照明电器有限公司 | Device for light emitting diode (LED) heat conduction and dissipation and insulation and voltage resistance |
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