CN203675433U - Voltage-withstanding metal-based circuit board - Google Patents
Voltage-withstanding metal-based circuit board Download PDFInfo
- Publication number
- CN203675433U CN203675433U CN201420021797.9U CN201420021797U CN203675433U CN 203675433 U CN203675433 U CN 203675433U CN 201420021797 U CN201420021797 U CN 201420021797U CN 203675433 U CN203675433 U CN 203675433U
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- CN
- China
- Prior art keywords
- circuit board
- solder mask
- voltage
- metal
- withstanding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to the circuit board filed, especially relates to a metal-based circuit board, and concretely discloses to a voltage-withstanding metal-based circuit board. The voltage-withstanding metal-based circuit board comprises solder mask layers, a circuit diagram layer, a dielectric layer and a metal layer, wherein the structure of the circuit diagram layer is specially configured, and the dielectric layer is made of a material which is voltage-withstanding and excellent in heat conduction. The voltage-withstanding metal-based circuit board provided by the utility model has the characteristics of being excellent in voltage-withstanding property, excellent in heat conduction, reliable in insulation and low in production cost, and the manufacturing costs of the metal-based circuit board are lowered.
Description
Technical field
The utility model relates to wiring board field, and particularly metal base circuit board is specifically related to a kind of withstand voltage metal base circuit board.
Background technology
Along with the develop rapidly of global LED technology, LED is widely applied in multiple fields such as illumination, signal signature, advertisement, automobile, display screen, backlight, space flight and aviation, military projects, wherein great power LED demand increases day by day, the withstand voltage properties of this supporting metal base circuit board of LED of will suing for peace is higher, industry common practice is to adopt the method for thickening barrier or select the extraordinary insulating material of expensive high heat conduction as dielectric layer at present, thereby improves withstand voltage properties and the thermal conductivity of metal base circuit board.
Existing high-power metallic base circuit board manufacturing cost is high, and heat conductivility can not finely meet the normal heat radiation of great power LED, has affected the life-span of product, has restricted to a certain extent the application of great power LED.
Summary of the invention
The deficiency existing for prior art, the utility model provides a kind of withstand voltage metal base circuit board, has good withstand voltage properties, and heat conductivility is good, and production cost is low, suitable batch large-scale production.
For achieving the above object, the utility model provides following technical scheme: described one is withstand voltage metal base circuit board, formed by solder mask, circuit diagram layer, dielectric layer and metal level successively from outside to inside, wherein solder mask is the thickening solder mask of Hou Du≤30 micron, formed by solder mask and secondary solder mask, a welding resistance bed thickness 15-18 micron, secondary welding resistance bed thickness 10-15 micron; Wherein Ju Li≤1 millimeter on the circuit on circuit diagram layer, pad, paster and moulding limit, Ju Li≤1 millimeter of circuit, pad, paster and through hole, Ju Li≤0.3 millimeter between paster, line conductor; Wherein dielectric layer is thick 100-120 micron, the insulating cement of conductive coefficient 1-1.5W/m.K.
Adopt the technical scheme that the utility model provides to produce following beneficial effect: owing to adopting thickening solder mask, to improve the resistance to pressure of wiring board; Ju Li≤1 millimeter on circuit, pad, paster and moulding limit on circuit diagram layer, Ju Li≤1 millimeter of circuit, pad, paster and through hole, Ju Li≤0.3 millimeter between paster, line conductor, avoids energising to occur micro-short circuit phenomenon, further improves and guarantee the withstand voltage properties of wiring board; Dielectric layer adopts conductive coefficient to be greater than the insulating cement of 1W/m.K, except giving the good insulating properties of wiring board, has good thermal conductivity simultaneously, is convenient to heat radiation, has overcome the conventional metals base circuit board bad drawback of dispelling the heat.
Describe and make the utility model accurately for more clear, with instantiation, the utility model is described in detail by reference to the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is the withstand voltage metal base circuit board structural representation of the one of the utility model embodiment.
Fig. 2 is the circuit diagram layer plane structural representation of the utility model embodiment.
In figure: 1 solder mask, 11 solder masks, 12 2 solder masks, 2 circuit diagram layers, 21 circuits, 22 pads, 23 pasters, 24 through holes, 25 moulding limits, 3 dielectric layers, 4 metal levels.
Embodiment
The utility model embodiment provides a kind of withstand voltage metal base circuit board, has good withstand voltage properties, and heat conductivility is good, and production cost is low, suitable batch large-scale production.
Fig. 1 is a kind of withstand voltage metal base circuit board structural representation of the utility model embodiment, a kind of withstand voltage metal base circuit board of the present embodiment, formed by solder mask 1, circuit diagram layer 2, dielectric layer 3 and metal level 4 successively from outside to inside, wherein solder mask 1 is the thickening solder mask of 32 microns of thickness, formed by solder mask 11 and secondary solder mask 12, thick 18 microns of solder mask 11, thick 14 microns of secondary solder mask 12, has effectively improved the withstand voltage properties of wiring board; Wherein dielectric layer 3 is thick 105 microns, and the insulating cement of conductive coefficient 1.4W/m.K not only gives wiring board good thermal insulation, and thermal diffusivity is good simultaneously, stability and the useful life of having improved wiring board.
Fig. 2 is the circuit diagram layer plane structural representation of the utility model embodiment, Ju Li≤1 millimeter on circuit 21, pad 22, paster 23 and moulding limit 25 on described circuit diagram layer 2, Ju Li≤1 millimeter of circuit 21, pad 22, paster 23 and through hole 24, Ju Li≤0.3 millimeter between paster 23, circuit 21 conductors, so just effectively avoid energising to occur micro-short circuit phenomenon, further improved and guaranteed the withstand voltage properties of wiring board.
The above is the embodiment of the utility model embodiment; should be understood that; application of the present utility model is not limited to above-mentioned giving an example; for those skilled in the art; can improve according to the above description or convert, all these improvement and conversion all should belong to the protection range of the utility model claims.
Claims (3)
1. a withstand voltage metal base circuit board, formed by solder mask, circuit diagram layer, dielectric layer and metal level successively from outside to inside, it is characterized in that: wherein solder mask is the thickening solder mask of Hou Du≤30 micron, formed by solder mask and secondary solder mask, a welding resistance bed thickness 15-18 micron, secondary welding resistance bed thickness 10-15 micron.
2. the withstand voltage metal base circuit board of one according to claim 1, it is characterized in that: wherein Ju Li≤1 millimeter on the circuit on circuit diagram layer, pad, paster and moulding limit, Ju Li≤1 millimeter of circuit, pad, paster and through hole, Ju Li≤0.3 millimeter between paster, line conductor.
3. the withstand voltage metal base circuit board of one according to claim 1, is characterized in that: wherein dielectric layer is thick 100-120 micron, the insulating cement of conductive coefficient 1-1.5W/m.K.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420021797.9U CN203675433U (en) | 2014-01-14 | 2014-01-14 | Voltage-withstanding metal-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420021797.9U CN203675433U (en) | 2014-01-14 | 2014-01-14 | Voltage-withstanding metal-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203675433U true CN203675433U (en) | 2014-06-25 |
Family
ID=50971675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420021797.9U Expired - Fee Related CN203675433U (en) | 2014-01-14 | 2014-01-14 | Voltage-withstanding metal-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203675433U (en) |
-
2014
- 2014-01-14 CN CN201420021797.9U patent/CN203675433U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140625 Termination date: 20160114 |