JP2012064676A - Lighting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting system which provides preferable heat radiation effect without causing conduction failure.SOLUTION: In a lighting system 100 according to an embodiment, a filler 160 functions as an insulation member. Thus, even if the filler 160 comes in contact with any of pattern wiring 122a and 122b, the contact does not cause conduction failure. Further, the filler 160 has predetermined fluidity and thus allows the displacement of the relative positions of the LED light emitting element 121 and a heat transfer part 133 in a certain range while maintaining the contact state of the LED light emitting element 121 and the heat transfer part 133. As a result, even if the LED light emitting element 121 generates heat and the temperature of the area around a junction part rises, the filler 160 does not restrict the positional relationship of the LED light emitting element 121 and the heat transfer part 133 and thus preventing the occurrence of heat stress.

Description

  The present invention relates to an illumination device using an LED light emitting element as a light source, and is particularly suitable for use in dissipating heat generated by an LED light emitting element.

  In recent years, LED (Light Emitting Diode) product development has progressed, and devices using LED light-emitting elements are used in every situation. In addition, since the LED light emitting element has a very long life when used at a rated current or lower, it is being replaced as a substitute for a light source such as an incandescent lamp or a fluorescent lamp.

  However, since the LED light emitting element has a property of reducing the light emission efficiency when the input current is increased, the amount of heat generation is increased for the decrease in the light emission energy. Therefore, when the input current is increased to obtain a desired light amount, the LED light emitting element causes a vicious circle in which the light emission efficiency is further reduced and the heat generation amount is further increased. For this reason, in the apparatus using an LED light emitting element, an appropriate heat dissipation structure is required for the mounting portion of the element.

  Therefore, Japanese Patent Laying-Open No. 2003-168829 (Patent Document 1) introduces a substrate structure for improving the heat dissipation of a circuit board on which an LED is mounted. As shown in FIG. 5A, the substrate structure includes a conductor plate 13 having good electrical conductivity, an insulating layer 12 laminated on the conductor plate and having wiring layers 12a and 12b formed on the upper surface, and a wiring layer. It is comprised from the light emitting diode chip 14 mounted in 12a, 12b.

  The insulating layer 12 has through holes formed at appropriate positions, and the light emitting diode chip 14 is disposed in the vicinity of the through holes. The light-emitting diode chip 14 includes an anode-side electrode layer and a cathode-side electrode layer (see FIG. 5A), and is provided with a light-emitting surface. The anode-side electrode layer is electrically connected to the anode-side wiring layer 12a via the solder bump Bm2, and the cathode-side wiring layer 12b is electrically connected to the cathode-side wiring layer 12b via the solder bump Bm1. The conductor plate 13 is formed of an aluminum conductive material, and a convex heat transfer member 13a is integrally formed. As illustrated, the heat transfer member 13a is inserted into the through hole of the insulating layer and is in contact with the electrode layer on the cathode side.

  Therefore, in such a substrate structure, when the LED generates heat, the amount of heat is transmitted to the conductive plate 13 via the heat transfer member 13a. At this time, since the heat transfer member 13a and the conductive plate 13 are made of aluminum with high heat transfer efficiency, it is possible to effectively dissipate the heat quantity of the LED.

JP 2003-168829 A

(First problem related to poor conduction)
However, in the technique of Patent Document 1, since the heat transfer portion 13a conducted to the electrode layer on the cathode side is arranged in the immediate vicinity of the wiring layer 12a on the anode side and the solder bump Bm2, the heat transfer portion 13a is connected to the anode side (heat transfer portion 13a). The gap with the cathode side (mainly, the wiring layer 12a and the solder bump Bm2) becomes extremely narrow. Therefore, the anode side (heat transfer portion 13a) and the cathode side (mainly the wiring layer 12a and the solder bump Bm2) are in electrical contact depending on the deposits such as dust or the shape of the solder bump Bm2 after reflow. As a result, there arises a problem that the light emission failure of the LED is caused.

(Second problem related to poor conduction)
If the further problem which concerns on the technique of patent document 1 is given, the board | substrate structure shown by Fig.5 (a) will be suitable gap between the electrode layer of LED light emitting element 14, and wiring layers 12a and 12b by the side of a board | substrate. A portion is provided to ensure the electrical connection state of the junction portion after the solder bump is welded to the wiring layer. For this reason, if the predetermined dimensional tolerance is not cleared about the level of the wiring layer surface and the height of the heat transfer member 13a, a good conduction state cannot be formed at the junction. In addition, the problem regarding the dimensional tolerance occurs when the lower surface of the LED light emitting element 14 and the heat transfer member 13a are brought into contact with each other even when the LED light emitting element is directly mounted on the wiring layer (pattern wiring) (see FIG. 5b). It is also a problem.

(Third problem related to poor conduction)
Further, since the LED light emitting element 14 inevitably generates heat at the same time as the light emitting operation, a temperature change appears remarkably around the LED light emitting element. In this scene, the heat transfer portion 13a and the insulating layer 12 have different coefficients of thermal expansion. Therefore, at the junction portion of the LED light emitting element 14 (conducting portion between the electrode layer and the wiring layers 12a and 12b), the solder bumps Bm1, Since the risk of peeling or cracking of Bm2 increases, there is a concern that an electrical conduction failure may be caused at the junction. In addition, in the board | substrate structure of FIG.5 (b), it is also considered to form a solder layer between the lower surface of the LED light emitting element 14, and the heat transfer member 13a. In this case, thermal stress is applied to the solder layer and the solder part Ms in accordance with the light emitting operation of the LED light emitting element. Therefore, the substrate structure in FIG. There is a danger of causing it.

(Avoidance plan for the second and third issues)
FIG. 5C shows a workaround for the second and third problems described above. The substrate structure according to the avoidance plan is to fill the gap between the heat transfer member 13a and the cathode electrode layer of the LED light-emitting element 14 with grease or the like that has both good electrical and thermal conductivity. According to such a substrate structure, the grease performs a thermal stress interference function, and even if the ambient temperature of the junction portion fluctuates, adverse effects such as peeling or cracking of the solder bumps Bm1 and Bm2 are eliminated.

(Fourth problem related to poor conduction)
However, since the grease (cathode side) has higher fluidity than the solid material, it has a risk of coming into contact with the anode, as in the first problem, and causes the LED light emitting element 14 to malfunction. There is a fear. In addition, it is conceivable to use an adhesive (having conductivity and thermal conductivity) instead of grease. However, since the adhesive has a predetermined fluidity at the application stage of the adhesive, the adhesive having conductivity is an anode. The risk of touching the side is inevitable.

  An object of this invention is to provide the illuminating device which can give the suitable heat dissipation effect, without raise | generating a conduction defect in view of the said subject.

  In order to solve the above-described problems, the present invention has the following illumination device configuration. That is, an LED light emitting element, a wiring board having a through hole communicating with one surface and the other surface, the LED light emitting element being mounted on the pattern wiring in the vicinity of the through hole, and thermal conductivity and electrical It is formed from a material that has both excellent insulating properties, and a heat dissipation substrate in which the wiring board is laminated on the laminated surface formed of the material, and both the thermal conductivity and electrical insulating properties are excellent. And a heat transfer portion inserted into the through hole so as to be interposed between the LED light emitting element and the heat dissipation substrate.

  Preferably, the heat dissipation substrate is made of the same material as that forming the heat transfer portion, and the heat transfer portion is integrally formed on the laminated surface.

  Preferably, the heat dissipation substrate is formed from a ceramic insulating material.

  Preferably, when an image obtained by projecting the LED light emitting element onto the stacking surface along the stacking direction is a light emitting element projected image, at least a part of the heat transfer unit is included in the light emitting element projected image. .

  Preferably, when an image obtained by projecting the LED light emitting element onto the stacking surface along the stacking direction is a light emitting element projected image, the entire heat transfer portion is included in the light emitting element projected image.

  Preferably, a gap is formed between the LED light emitting element and the heat transfer unit, and the gap is filled with a filler having excellent performance in both thermal conductivity and electrical insulation. To do.

  Preferably, in the wiring substrate, the substrate layer on which the pattern wiring is laminated is a resinous material.

  According to the lighting device according to the present invention, the amount of heat generated in the LED light emitting element by disposing the heat transfer unit close to the LED light emitting element (including being disposed in close proximity and contacting each other). Is effectively transmitted to the heat dissipation board. The lighting device has the following effects as well as the heat dissipation effect.

  That is, according to the lighting device according to the present invention, the heat transfer portion is made of an electrically insulating material, so that the heat transfer portion is disposed close to the pattern wiring on the wiring board or the solder on the pattern wiring. However, since the material of the heat transfer portion is an insulating material, the input current input to the anode side does not leak to the cathode side via the heat transfer portion 13a. For this reason, in the LED light emitting element, a sufficient input current is supplied to the anode electrode, so that a problem such as defective light emission is solved.

  In addition, when the filler is filled in the gap between the LED light emitting element and the heat transfer portion, problems due to dimensional tolerance and thermal stress are eliminated. Since the filler is made of an electrically insulating material, the input current supplied to the anode side does not leak to the cathode side through the filler. For this reason, in the LED light emitting element, the problem such as defective light emission is solved as described above.

FIG. 6 illustrates a structure of a lighting device according to an embodiment. The figure which shows the manufacturing method of the illuminating device which concerns on embodiment. The figure which shows the other manufacturing method which concerns on an illuminating device. The figure which shows the arrangement | positioning relationship between a LED light emitting element and a heat-transfer part. The figure which shows the structure of the illuminating device which concerns on a prior art example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, the lighting device 100 (so-called LED bulb) includes a light transmission part 110, a wiring board 120, a heat radiating member 130, a control circuit 140, and a control circuit housing 150.

  The light transmitting portion 110 is formed of a light transmitting resin material or glass material, and in the present embodiment, has a hemispherical shape as illustrated. The light transmission unit 110 plays a role of adjusting the light amount or the light diffusion direction depending on the material or shape thereof. It also plays a role of protecting the LED light emitting element (light source).

  The wiring substrate 120 has a pattern wiring 122 laminated on a substrate layer 126 made of an insulating material. The pattern wiring 122 is formed of a thin film body such as aluminum or copper, and a land having an appropriate area is formed at the end of the pattern wiring. Among these, the land 123 and the land 124 have through holes formed in the lower layer thereof, and currents are input / output via the control circuit 140.

  As shown in FIG. 2A (cross-sectional view taken along the line AA in FIG. 1), the wiring board 120 has a through hole 125 penetrating from the upper surface (one surface) to the lower surface (the other surface) of the substrate layer 126. ing. In the present embodiment, the pattern wirings 122a and 122b are blocked around the through hole 125, and the pattern wirings are arranged on both sides. Each of the pattern wirings 122a and 122b has lands La and Lb formed in the vicinity of the through hole 125, respectively. In the LED light emitting element 121, electrodes 121a and 121b provided on the LED light emitting element are disposed on the lands La and Lb, and the electrodes and the lands are electrically connected by solder Ms (see FIG. 2b). That is, the LED light emitting element 121 is disposed in the vicinity of the through hole 125.

  Therefore, the pattern wiring 122 forms a series circuit as a whole as shown in FIG. 1 with the LED light emitting elements mounted on the lands La and Lb. Hereinafter, the land La is referred to as the anode-side land La, assuming that the anode-side electrode of the LED light emitting element 125 is conductive. The land Lb is referred to as the cathode-side land Lb, assuming that the cathode-side electrode of the LED light emitting element 125 is conductive. In response to this, the name of each component is changed to the anode side pattern wiring 122a, the cathode side pattern wiring 122b, the anode side electrode 121a, and the cathode side electrode 121b.

  The substrate layer 126 of the wiring substrate 120 is made of a resin material. This resinous material is determined according to the amount of heat generated by the LED light-emitting element 121, but is generally considered to be a material that can withstand about 80 ° C to 100 ° C. Therefore, a glass epoxy board, a paper epoxy board, a paper phenol board, or the like is preferably used for the wiring board 120. These substrates satisfy the heat resistance described above, and can be manufactured at low cost.

  In the LED light emitting element 121, an LED semiconductor is sealed in a package, and an anode side electrode 121a and a cathode side electrode 121b are arranged in the package. Further, in this package, a light transmissive material or a lens is provided in the vicinity of the light emitting portion of the LED. When an input current is input to the anode-side electrode 121a, in the semiconductor constituting the LED, light corresponding to both energy band gaps is generated when electrons in the conduction band and holes in the valence band recombine. Let At this time, light is emitted from the LED light emitting element 121 through a lens or the like, and heat is generated in the same manner as a normal diode.

  As shown in the figure, the heat dissipation substrate 130 has heat dissipation fins 131 and a laminated surface 132 formed thereon. In addition, the heat dissipation board 130 is formed with a space having an opening on the lower side in the stacking direction Fd, and accommodates a part of the control circuit housing 150 in the space. A plurality of the heat radiation fins 131 are formed mainly on the side portion of the heat radiation substrate 130 and have a shape that ensures a large surface area. The laminated surface 132 is a substantially flat surface, and the wiring substrate 120 is laminated via an adhesive layer (not shown) or the like.

  The heat transfer unit 133 is laid out corresponding to the through hole 125 of the wiring board 120. As shown in FIG. 2D, the heat transfer portion 133 is arranged inside the through-hole 125 so that when the wiring board 120 is stacked on the heat dissipation board 130, the heat transfer section 133 is interposed between the LED light emitting element 121 and the heat dissipation board. Will be inserted.

  The material of the heat transfer unit 133 needs to satisfy both the first condition that the material is excellent in heat conduction performance and the second condition that the material is excellent in electrical insulation performance. And The first condition (heat conduction performance) is to effectively transfer the amount of heat generated in the LED light emitting element 141 to the heat dissipation substrate 130. In addition, the second condition (electrical insulation performance) is the input input to the anode side even when the anode side pattern wiring 122a (including the anode side solder) contacts the heat transfer unit 133 for some reason. This is to prevent current from flowing into the cathode via the heat transfer unit 133.

  In addition, the material of the heat dissipation substrate 130 must satisfy both the first condition that the material has excellent heat conduction performance and the second condition that the material has excellent electrical insulation performance. Need. The first condition (heat conduction performance) is mainly for maintaining a large thermal gradient in the path from the heat transfer portion 133 to the heat dissipating fin 131 and maintaining high heat dissipation efficiency. On the other hand, regarding the electrical properties of the heat dissipation board 130, if the heat dissipation board 130 is a good conductor such as aluminum, fine solder or dust is deposited in the gaps of the through holes 125, and an energization path is formed. There arises a problem that the current on the pattern wiring is leaked through the aluminum material (heat dissipation board). Therefore, the second condition (electrical insulation performance) is provided, current leakage is cut off by the heat dissipation board 130 that performs electrical insulation, and the light emitting operation of the LED light emitting element 121 is maintained in a suitable state.

  Therefore, it is preferable that both the heat dissipation substrate 130 and the heat transfer unit 133 are made of the same material and material, while the same conditions relating to the material are imposed. If the same material / material is selected for the heat dissipation substrates 130 and 133, both can be integrally formed, and the manufacturing process can be simplified and the manufacturing cost can be reduced.

  Further, the heat dissipation substrate 130 and the heat transfer part 133 are formed of a ceramic insulating material having a relatively high thermal conductivity such as aluminum nitride, alumina, zirconia, etc. in order to satisfy the first condition and the second condition. preferable.

  Returning to FIG. 1, the control circuit 140 mounts a power transistor or a control IC on the substrate, and commercial power is supplied on the input side, and appropriate wiring is applied to the lands 123 and 124 on the output side terminals. Is done. The control circuit 140 converts the commercial power into a desired state and outputs a current required for the LED light emitting element. In the control circuit 140, the light amount may be controlled, or the color tone of the LED may be controlled.

  The control circuit storage body 150 includes a cylindrical portion 152, a base portion 151, and a base portion 153. The cylindrical portion 152 and the base portion 151 are made of an electrically insulating material such as a resin material, and both are integrally formed. The cylindrical portion 152 is formed with an opening at one end and accommodates the control circuit 140. The base portion 153 is made of a conductive material such as a copper alloy and has a shape that can be screwed into a socket (not shown). The base part 153 is appropriately wired with the control circuit 140 inside, and relays commercial power to the control circuit 140.

  The lighting device 100 having such a configuration is sequentially assembled in the stacking direction Fd, and a base portion 153 is attached to a socket portion (not shown). When commercial power is supplied from the socket, the LED light-emitting element 121 emits light, and the light emitted at this time is adjusted in the light traveling direction by the light passage 110, and lights around the light passage. provide.

  Moreover, according to the illuminating device 100, the heat transfer part 133 is arrange | positioned in the vicinity of the LED light emitting element 121, and the quantity of heat which generate | occur | produced in the LED light emitting element 121 is effectively transmitted to a thermal radiation board | substrate.

  In addition, according to the lighting device 100, even if the heat transfer unit 133 is disposed close to the pattern wirings 122a and 122b on the wiring board or the solder Ms on the pattern wiring, the material of the heat transfer unit 133 is electrically insulated. Therefore, the input current supplied to the anode side does not leak to the cathode side through the heat transfer portion 13a. For this reason, in the LED light emitting element 121, a sufficient input current is supplied to the anode terminal, so that the problem of defective light emission is solved. Furthermore, the current on the cathode side does not leak to the heat dissipation substrate side. For this reason, an LED light emitting element (not shown) connected to the subsequent stage on the cathode side can also ensure a sufficient input current to be supplied to the anode electrode and radiate a desired amount of light.

  That is, the lighting device 100 according to the present embodiment realizes heat dissipation performance and electrical insulation performance for the peripheral structure of the through-hole 125 formed in the wiring board 120, and the anode electrode of the LED light-emitting element 121 without loss. An effect of maintaining the light emission efficiency of the LED light emitting element 121 is achieved by supplying an input current to 121a and ensuring a suitable heat dissipation function.

  Hereinafter, the manufacturing method of the illuminating device 100 which concerns on this Embodiment is demonstrated. As shown in FIG. 2A, in the manufacturing process of the lighting device, the wiring board 120 in which the through holes 125 are formed is used. As the wiring substrate 120, a glass epoxy substrate or the like is used. However, a substrate in which a through hole has been previously drilled may be put into a production line, or a proper place of the substrate may be drilled on the production line. good. Then, the wiring board 120 is sent to the hole processing step, and a through hole 125 is formed between the anode side land 122a and the cathode side land 122b formed on the surface. Thereafter, the wiring board 120 is sent to the mounting process as shown in FIG. 2B, and after the electrodes of the LED light emitting elements 121 are arranged on the lands, the electrodes and the lands are joined by the solder Ms. In addition, this process may be performed with the apparatus using a flow solder tank, and may use a reflow solder apparatus.

  In the case of FIG. 2, an appropriate amount of filler 160 is injected into the through-hole 125 in the step of FIG. The filler 160 is made of a material having both excellent thermal conductivity and electrical insulation performance. The filler 160 is a material that is more fluid than the surrounding structure.

  The filler 160 may be a material that itself has thermal conductivity and electrical insulation. The filler 160 may include a filler and other inclusions, and the thermal conductivity and electrical insulation. You may adjust the property of. For example, the filler is preferably silicon grease. This is because such a material can maintain a predetermined fluidity for a long time. Also, an adhesive or the like can be used as long as predetermined elastic deformation is ensured after solidification. Further, an elastic body capable of filling the gap portion of the through hole 125 may be used as long as it has the above-described properties.

  When the injection of the filler 160 is completed, the wiring board 120 is laminated on the laminated surface 132 of the heat dissipation board 130 as shown in FIG. At this time, the heat transfer part 133 is pushed into the through hole 125, and the filler 160 spreads over the entire gap in the through hole accordingly.

  As described above, according to the substrate structure in which the filler 160 is filled in the gap portion of the through hole, the filler 160 functions as an insulating material. Therefore, even if it contacts any of the pattern wirings 122a and 122b, a conduction failure is caused. There is nothing. In addition, the filler 160 has a predetermined fluidity, and allows the relative displacement between the LED light emitting element 121 and the heat transfer unit 133 to be allowed within a certain range while maintaining the contact state between the LED light emitting element 121 and the heat transfer unit 133. .

  As a result, a sufficient tolerance is recognized for the surface level of the pattern wiring and the height dimension of the heat transfer portion 133. In addition, even if the LED light emitting element 121 generates heat and the ambient temperature of the junction portion increases, the filler 160 does not restrain the positional relationship between the LED light emitting element 121 and the heat transfer portion 133, and thus a problem related to the generation of thermal stress. Is also eliminated.

  Here, with reference to FIG. 3, another manufacturing method will be examined. In this manufacturing method, after the through hole 125 is formed in the wiring substrate 120 (FIG. 3A), the wiring substrate 120 is laminated and pasted on the heat dissipation substrate 130 (FIG. 3B), and the filler 160 is injected into the through hole 125. Later (FIG. 3c), the LED light emitting element 121 is mounted on the pattern wiring (FIG. 3d). According to this manufacturing method, the step of checking whether the LED light-emitting element and the pattern wiring are conductive (continuity inspection) can be performed unless the step is subsequent to the step of laminating and attaching the wiring substrate 120 to the heat dissipation substrate 130. There will be no. For this reason, if a defective product is found by the continuity test, the heat dissipation board 130 must be removed from the production line together with the wiring board and the LED light emitting element, and in some cases, the heat dissipation board 130 must also be disposed of. I must.

  On the other hand, according to the manufacturing method according to FIG. 2, the step (FIG. 2 b) of mounting the LED light emitting element 121 on the wiring substrate 120 is completed before the stacking step (FIG. 2 d) on the heat dissipation substrate 130. For this reason, since the continuity inspection of the wiring board 120 can be performed before the step of stacking the heat radiating board 130 (FIG. 2d), it becomes possible to quickly remove the wiring board having a poor conduction state from the manufacturing process. Therefore, according to this manufacturing method, as compared with the manufacturing method according to FIG. 3, the amount of removal and disposal of the heat dissipation substrate 130 is reduced, and the manufacturing cost can be reduced.

  Next, a layout relationship between the LED light emitting element 121 and the heat transfer unit 133 will be described. FIG. 4A shows a state where the wiring board 120 is removed from the above-described board structure. The LED light-emitting element 130 shown in the figure is disposed immediately above the heat transfer unit 133, and is disposed at a suitable position for transferring the amount of heat of the LED light-emitting element 130 to the heat dissipation substrate side. In the figure, the projection direction is shown, and the projection direction is assumed to be directed to the lamination surface 132 along the lamination direction Fd. In addition, an actual size image of the LED light emitting element 121 is projected onto the laminated surface 132 of the heat dissipation substrate 130 by the projection light, and this projected image is referred to as a light emitting element projected image.

  FIG. 4B shows a case where the projected image of the LED light emitting element 130 is sufficiently larger than the heat transfer unit 133. As shown in the figure, it is preferable that the outline 133a of the heat transfer unit 133 is arranged so that all of the outline 133a is included in the light emitting element projection image Syd. In the substrate structure having such a positional relationship, since all of the heads of the heat transfer unit 133 function as heat absorption surfaces, an excellent heat dissipation effect can be expected. In addition, as a matter of course, by inserting the filler 160 between the LED light emitting element 121 and the heat transfer part 133, the heat dissipation effect is remarkably improved.

  More preferably, as shown in FIG. 4 (c), the head area of the heat transfer unit 133 may be increased to improve the heat absorption performance of the heat transfer unit 133. In this case, since heat exchange is effectively performed in the region Y where the light emitting element projection image Syd and the head of the heat transfer unit 133 overlap, the heat transfer unit 133 has a contour 133a that enlarges the area of the region Y. By being defined, an excellent heat dissipation effect is realized.

  In addition, in the same figure, although the preferable positional relationship on the layout of the LED light emitting element 121 and the heat transfer part 133 was demonstrated, when the restrictions on a layout exist, the light emitting element projection image Syd and the heat transfer part 133 of FIG. The region Y where the head overlaps may take a disadvantageous form on the heat dissipation function.

  The embodiment according to the present invention has been described above, but the present invention is not limited to the above embodiment, and various improvements can be made within the scope of the technical idea described in the claims. It is. For example, the lighting device described in the embodiment has been described for a consumer lighting device having a base. However, the lighting device according to the present invention is a lighting device or an electric decoration whose power input unit is a non-standard product. It can be applied in all technical fields that require a light source, such as signs, printers, signals or traffic signs. Also, the form of the heat dissipation substrate can be not only a lump having a certain size as described above, but also a plate-like body or other shapes.

  In the embodiment described above, the manufacturing method according to FIG. 2 is preferred, but the lighting device according to the present invention can also be manufactured by the manufacturing method according to FIG. Furthermore, the lighting device according to the present invention can be applied to the substrate structure having the solder bumps mentioned in the conventional example.

DESCRIPTION OF SYMBOLS 100 Illuminating device 120 Wiring board 121 LED light emitting element 122 Pattern wiring 125 Through-hole 130 Heat radiation board 132 Laminated surface 133 Heat transfer part

Claims (7)

  An LED light-emitting element, a wiring board having a through-hole communicating with one surface and the other surface, and the LED light-emitting element mounted on the pattern wiring in the vicinity of the through-hole, and thermal conductivity and electrical insulation A material that is formed from a material that is excellent in both performances and that has the wiring board laminated on the laminated surface formed of the material, and a material that is superior in both thermal conductivity and electrical insulation properties And a heat transfer part inserted into the through hole so as to be interposed between the LED light emitting element and the heat dissipation substrate.   The lighting device according to claim 1, wherein the heat dissipation substrate is made of the same material as that forming the heat transfer portion, and the heat transfer portion is integrally formed on the laminated surface.   The lighting device according to claim 1, wherein the heat dissipation substrate is formed of a ceramic insulating material.   When an image obtained by projecting the LED light emitting element onto the stacking surface along the stacking direction is a light emitting element projected image, at least a part of the heat transfer unit is included in the light emitting element projected image. The lighting device according to any one of claims 2 to 3.   3. The light emitting element projection image includes all of the heat transfer unit when an image obtained by projecting the LED light emitting element onto the stacking surface along the stacking direction is a light emitting element projection image. The illuminating device of Claim 3 thru | or 3.   A gap is formed between the LED light emitting element and the heat transfer part, and the gap is filled with a filler having excellent performance of both thermal conductivity and electrical insulation. The lighting device according to claim 1.   The lighting device according to claim 1, wherein a substrate layer on which the pattern wiring is laminated is a resin material.

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