JP2008235493A - Light-emitting element storage package - Google Patents

Light-emitting element storage package Download PDF

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JP2008235493A
JP2008235493A JP2007071695A JP2007071695A JP2008235493A JP 2008235493 A JP2008235493 A JP 2008235493A JP 2007071695 A JP2007071695 A JP 2007071695A JP 2007071695 A JP2007071695 A JP 2007071695A JP 2008235493 A JP2008235493 A JP 2008235493A
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emitting element
heat sink
light
sink plate
light emitting
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Norikazu Fukunaga
憲和 福永
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Sumitomo Metal SMI Electronics Device Inc
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Sumitomo Metal SMI Electronics Device Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive light-emitting element storage package which is capable of efficiently dissipating heat generated from a light-emitting element, and has superior temperature cycle and high connection reliability. <P>SOLUTION: According to the light-emitting element storage package 10, a light-emitting element 11 is directly mounted on the center of a square heat sink plate 12 for dissipating heat generated from the light-emitting element 11. The light-emitting element storage package 10 includes a flexible wiring board 13 which has a through-hole 14 encircling the light-emitting element 11, a peripheral portion around the through-hole 14 that is joined to the central portion in one direction of the heat sink plate 12, and both ends that project out of the heat sink plate 12 to extend in a crossing direction thereof. The flexible wiring board 13 bends at its both end side portions close to the heat sink plate 12, and is fixed with screws or with both screws and solder to a board substrate 15 to which the heat sink plate 12 is fixed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、発行ダイオード（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ：以下、ＬＥＤという。）等の発光素子を収容するための発光素子収納用パッケージに関し、より詳細には、ＬＤＥ等の発光素子からの高発熱を効率的に放熱できる発光素子収納用パッケージに関する。   The present invention relates to a light emitting element housing package for housing a light emitting element such as a light emitting diode (hereinafter referred to as an LED), and more particularly, to efficiently generate high heat from a light emitting element such as an LDE. The present invention relates to a light emitting element storage package that can dissipate heat.

従来からＬＥＤ等の発光素子を収容するための発光素子収納用パッケージには、発光素子からの発熱を速やかに放熱させるために、様々な様式のものがある。
図２に示すように、例えば、この従来の発光素子収納用パッケージ５０は、発光素子５１を直接載置して搭載するためのヒートシンク板５２と、このヒートシンク板５２上に載置した発光素子５１からの発光を反射させるための反射体５３を有している。また、この発光素子収納用パッケージ５０は、外部と電気的に導通状態とするためのリードフレームからなる外部接続端子５４を有している。この発光素子収納用パッケージ５０は、ヒートシンク板５２と、反射体５３と、外部接続端子５４がセットされた型にモールド樹脂５５を流し込んで一体化して上部を開口部とする発光素子５１を実装するためのキャビティ部５６を設けると共に、下部のヒートシンク板５２の一部を外部に露出する形態に作製されている。 Conventionally, there are various types of light emitting element storage packages for accommodating light emitting elements such as LEDs in order to quickly dissipate heat generated from the light emitting elements.
As shown in FIG. 2, for example, this conventional light emitting element storage package 50 includes a heat sink plate 52 for directly mounting and mounting the light emitting element 51, and the light emitting element 51 placed on the heat sink plate 52. It has a reflector 53 for reflecting light emitted from. The light emitting element storage package 50 has an external connection terminal 54 formed of a lead frame for making it electrically conductive with the outside. In this light emitting element storage package 50, a light emitting element 51 having an upper portion as an opening is mounted by pouring a mold resin 55 into a mold in which a heat sink plate 52, a reflector 53, and an external connection terminal 54 are set. The cavity portion 56 is provided, and a part of the lower heat sink plate 52 is exposed to the outside.

この発光素子収納用パッケージ５０のキャビティ部５６に搭載される発光素子５１は、ボンディングワイヤ５７を介して外部接続端子５４の一方の端子部と接続され外部と電気的に導通状態とされるようになっている。また、キャビティ部５６の底面であるヒートシンク板５２に搭載される発光素子５１は、発光素子５１からの発熱をヒートシンク板５２を介して下方に熱伝導できるようになっている。キャビティ部５６に発光素子５１が実装された発光素子収納用パッケージ５０は、発光素子５１をキャビティ部５６に透明樹脂等で封止するようにしている。このキャビティ部５６に実装された発光素子５１の発光は、反射体５３によって発光効率を向上させることができるようになっている。そして、発光素子５１が実装された発光素子収納用パッケージ５０は、ボード基板５８に形成される導体パターンからなる半田パッド５９に、ヒートシンク板５２及び外部接続端子５４を半田６０で接合する形態となっている。   The light emitting element 51 mounted in the cavity portion 56 of the light emitting element storage package 50 is connected to one terminal portion of the external connection terminal 54 via the bonding wire 57 so as to be electrically connected to the outside. It has become. Further, the light emitting element 51 mounted on the heat sink plate 52 which is the bottom surface of the cavity portion 56 can conduct heat downward from the light emitting element 51 through the heat sink plate 52. In the light emitting element storage package 50 in which the light emitting element 51 is mounted in the cavity portion 56, the light emitting element 51 is sealed in the cavity portion 56 with a transparent resin or the like. The light emission of the light emitting element 51 mounted in the cavity portion 56 can improve the light emission efficiency by the reflector 53. The light emitting element storage package 50 on which the light emitting element 51 is mounted is configured such that the heat sink plate 52 and the external connection terminal 54 are joined by the solder 60 to the solder pad 59 formed of the conductor pattern formed on the board substrate 58. ing.

ＬＥＤ等の発光素子は、最近のＬＥＤ等の高輝度化の要求に伴い、光出力を大きくする必要がある。光出力を大きくするためには、発光素子に流す電流を増加させることで可能であるが、電流の増加に併せて発光素子からの発熱が増加して逆に光出力の低下を引き起こすことになっている。そこで、発光素子収納用パッケージには、発光素子からの発熱を速やかに放熱させることが必要となり、発光素子が搭載されるパッケージの裏面側にヒートシンク板を取り付けて放熱させるようにしている。   A light emitting element such as an LED needs to have a large light output in accordance with the recent demand for higher brightness of the LED or the like. In order to increase the light output, it is possible to increase the current flowing through the light emitting element. However, as the current increases, the heat generated from the light emitting element increases, causing a decrease in the light output. ing. Therefore, it is necessary for the light emitting element storage package to quickly dissipate heat generated from the light emitting element, and a heat sink plate is attached to the back side of the package on which the light emitting element is mounted to dissipate heat.

発光素子収納用パッケージには、ヒートシンク板上にガラスエポキシ等からなる樹脂基体や、表面に反射層を形成したフレキシブル基板を接合させて、樹脂基体や、フレキシブル基板の開口部から露出するヒートシンク板に設けた突出部に発光素子を搭載させ、放熱性を向上させたものが提案されている（例えば、特許文献１、特許文献２参照）。
また、発光素子収納用パッケージには、ヒートシンク板上にフレキシブル基板を接合させて、フレキシブル基板の開口部から露出するヒートシンク板にシリコン基板を介して発光素子を搭載させ、放熱性を向上させたものが提案されている（例えば、特許文献３参照）。 In the light emitting element storage package, a resin substrate made of glass epoxy or the like on a heat sink plate or a flexible substrate having a reflective layer formed on the surface is bonded to the heat sink plate exposed from the resin substrate or the opening of the flexible substrate. A device in which a light emitting element is mounted on the provided protruding portion to improve heat dissipation has been proposed (see, for example, Patent Document 1 and Patent Document 2).
The light emitting element storage package has a heat sink improved by bonding a flexible substrate on the heat sink plate and mounting the light emitting element via a silicon substrate on the heat sink plate exposed from the opening of the flexible substrate. Has been proposed (see, for example, Patent Document 3).

特開２００３−１５２２２５号公報JP 2003-152225 A 特開２００５−１３６２２４号公報JP 2005-136224 A 特開２００７−１９０７７号公報JP 2007-19077 A

しかしながら、前述したような従来の発光素子収納用パッケージは、次のような問題がある。
発光素子収納用パッケージには、発光素子を点灯させたときの発光素子からの発熱による昇温と、発光素子を消灯させたときの冷却の繰り返しの熱膨張、収縮に耐えることができる接合部の接合信頼性が重要となっているが、外部接続端子や、ヒートシンク板を半田で接合する場合には、発光素子の昇温と冷却による温度サイクルで接合部材間の熱膨張係数差による歪みによって半田接合部に亀裂等が発生し、実装の信頼性低下となっている。また、外部接続端子や、ヒートシンク板を半田で接合するのに、ボード基板が樹脂基板からなる場合には、樹脂基板の熱伝導率が低いので、発光素子からの発熱の伝熱が遮られ、ボード基板からの放熱性の低下となっている。あるいは、ボード基板にアルミニウムのような放熱性に優れる金属板を用いて接合するのに、半田接合のために金属板に絶縁層を設けて、その上に外部接続端子や、ヒートシンク板を半田で接合するための導体パターンを設ける必要があるので、絶縁層によって発光素子からの発熱の伝熱が遮られ、ボード基板からの放熱性の低下となっている。 However, the conventional light emitting element storage package as described above has the following problems.
The light-emitting element storage package has a junction that can withstand repeated thermal expansion and contraction due to heat generation from the light-emitting element when the light-emitting element is turned on and cooling when the light-emitting element is turned off. Bonding reliability is important, but when connecting external connection terminals and heat sink plates with solder, soldering is caused by distortion due to the difference in thermal expansion coefficient between the bonding members in the temperature cycle due to temperature rise and cooling of the light emitting element. Cracks or the like are generated at the joints, which reduces the mounting reliability. Also, when the board substrate is made of a resin substrate to join the external connection terminal or the heat sink plate with solder, the heat conductivity of the resin substrate is low, so heat transfer from the light emitting element is blocked, The heat dissipation from the board substrate is reduced. Alternatively, when using a metal plate with excellent heat dissipation, such as aluminum, to the board substrate, an insulating layer is provided on the metal plate for soldering, and the external connection terminals and heat sink plate are soldered on it. Since it is necessary to provide a conductor pattern for bonding, heat transfer from the light emitting element is blocked by the insulating layer, and heat dissipation from the board substrate is reduced.

また、特開２００３−１５２２２５号公報や、特開２００５−１３６２２４号公報で開示されるような、発光素子が載置されるヒートシンク板を有する発光素子収納用パッケージは、ヒートシンク板に突出部を設ける複雑な加工を要するので、発光素子収納用パッケージが高価なものとなっている。   Further, a light emitting element storage package having a heat sink plate on which a light emitting element is placed as disclosed in Japanese Patent Application Laid-Open No. 2003-152225 and Japanese Patent Application Laid-Open No. 2005-136224 is provided with a protrusion on the heat sink plate. Since complicated processing is required, the light emitting element storage package is expensive.

更に、特開２００７−１９０７７号公報で開示されるようなレーザユニットを発光素子収納用パッケージに応用する場合には、発光素子をヒートシンク板に載置するのに、シリコン基板を介しているので、シリコン基板の熱伝導率が低く発光素子からの発熱を速やかにヒートシンク板に伝熱することができなくなっている。   Furthermore, when applying a laser unit as disclosed in Japanese Patent Application Laid-Open No. 2007-19077 to a light emitting element storage package, since the light emitting element is placed on the heat sink plate, a silicon substrate is interposed. The heat conductivity of the silicon substrate is low and heat generated from the light emitting element cannot be quickly transferred to the heat sink plate.

本発明は、かかる事情に鑑みてなされたものであって、発光素子からの発熱を効率よく放熱することができ、温度サイクルに優れる接合信頼性の高い、安価な発光素子収納用パッケージを提供することを目的とする。   The present invention has been made in view of such circumstances, and provides an inexpensive light-emitting element storage package that can efficiently dissipate heat generated from a light-emitting element, has excellent temperature cycle, and has high bonding reliability. For the purpose.

前記目的に沿う本発明に係る発光素子収納用パッケージは、発光素子からの発熱を放熱するための四角形状のヒートシンク板の中央部に発光素子が直接搭載される発光素子収納用パッケージであって、発光素子を囲繞できる貫通孔を設け、貫通孔の周辺部をヒートシンク板の一方向の中央部で接合し、両端部側をヒートシンク板から突出してクロス方向に延設するフレキシブル配線基板を有し、フレキシブル配線基板が両端部側のヒートシンク板と近接する部分で屈曲すると共に、ヒートシンク板を固定するボード基板にねじ止め固定、又はねじ止め固定と半田固定の併用で固定される。   The light-emitting element storage package according to the present invention that meets the above-described object is a light-emitting element storage package in which a light-emitting element is directly mounted at the center of a rectangular heat sink plate for radiating heat generated from the light-emitting element. A through-hole that can surround the light emitting element is provided, a peripheral portion of the through-hole is joined at a central portion in one direction of the heat sink plate, and both end portions protrude from the heat sink plate and extend in the cross direction, The flexible wiring board is bent at a portion close to the heat sink plate on both ends, and is fixed to the board substrate to which the heat sink plate is fixed by screwing or a combination of screwing and soldering.

ここで、発光素子収納用パッケージは、ヒートシンク板がボード基板にねじ止め固定されるのがよい。   Here, in the light emitting element storage package, the heat sink plate is preferably screwed and fixed to the board substrate.

請求項１又はこれに従属する請求項２記載の発光素子収納用パッケージは、発光素子からの発熱を放熱するための四角形状のヒートシンク板の中央部に発光素子が直接搭載される発光素子収納用パッケージであって、発光素子を囲繞できる貫通孔を設け、貫通孔の周辺部をヒートシンク板の一方向の中央部で接合し、両端部側をヒートシンク板から突出してクロス方向に延設するフレキシブル配線基板を有し、フレキシブル配線基板が両端部側のヒートシンク板と近接する部分で屈曲すると共に、ヒートシンク板を固定するボード基板にねじ止め固定、又はねじ止め固定と半田固定の併用で固定されるので、フレキシブル配線基板に外部接続端子としての機能をもたせることができ、しかもこのフレキシブル配線基板をボード基板にねじ止め固定、又はねじ止め固定と半田固定の併用で固定することで、接合部の温度サイクルによる接合部材間の熱膨張係数差の歪みをフレキシブル配線基板の柔軟性によって接合部の亀裂等の発生を防止でき、実装の信頼性を向上させることができる。また、ヒートシンク板には、特段の突出部等を設けるような加工を必要としないので、発光素子収納用パッケージを安価にすることができる。更に、発光素子は、ヒートシンク板に直接搭載できるので、発光素子からの発熱を速やかにヒートシンク板に伝熱させることができる。   The light-emitting element storage package according to claim 1 or claim 2 dependent thereon is for light-emitting element storage in which the light-emitting element is directly mounted at the center of a rectangular heat sink plate for radiating heat generated from the light-emitting element. Flexible wiring that is a package and has a through hole that can surround the light emitting element, the peripheral part of the through hole is joined at the center of one direction of the heat sink plate, and both ends protrude from the heat sink plate and extend in the cross direction Because it has a board, the flexible wiring board is bent at the part close to the heat sink plate on both ends, and it is fixed to the board board that fixes the heat sink plate by screwing or using screwing and soldering together The flexible wiring board can have the function of an external connection terminal, and the flexible wiring board can be screwed to the board board. Fixed or fixed by screwing and soldering together, the distortion of the difference in thermal expansion coefficient between the joint members due to the temperature cycle of the joint prevents the occurrence of cracks in the joint due to the flexibility of the flexible wiring board It is possible to improve the mounting reliability. Further, since the heat sink plate does not require any processing such as providing a special protrusion or the like, the light emitting element storage package can be made inexpensive. Furthermore, since the light emitting element can be directly mounted on the heat sink plate, heat generated from the light emitting element can be quickly transferred to the heat sink plate.

特に、請求項２記載の発光素子収納用パッケージは、ヒートシンク板がボード基板にねじ止め固定されるので、ボード基板に半田接合を用いないねじ止め固定しているの接合部の温度サイクルによる接合部材間の熱膨張係数差の歪みによる亀裂等の発生を防止でき、実装の信頼性を向上させることができる。   In particular, in the light emitting element storage package according to claim 2, since the heat sink plate is screwed and fixed to the board substrate, the bonding member according to the temperature cycle of the bonding portion that is screwed and fixed to the board substrate without using solder bonding It is possible to prevent the occurrence of cracks and the like due to the distortion of the difference in thermal expansion coefficient between them, and to improve the mounting reliability.

続いて、添付した図面を参照しつつ、本発明を具体化した実施するための最良の形態について説明し、本発明の理解に供する。
ここに、図１（Ａ）〜（Ｃ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図、Ｂ−Ｂ’線縦断面図である。 Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
Here, FIGS. 1A to 1C are a plan view, a vertical cross-sectional view taken along line AA ′, and a vertical cross-sectional view taken along line BB ′, respectively, of the light emitting element storage package according to the embodiment of the present invention. is there.

図１に示すように、本発明の一実施の形態に係る発光素子収納用パッケージ１０は、ＬＥＤ等の発光素子１１からの発熱を放熱するための正方形や、長方形等の四角形状のヒートシンク板１２の一方向の中央部に発光素子１１が直接搭載されるようになっている。この発光素子収納用パッケージ１０のヒートシンク板１２は、銅や、銅合金の金属板や、銅と他の金属との複合金属板や、銅と他の金属との接合金属板等からなる高い熱伝導率を有する金属板を用いることができ、発光素子１１からの発熱を速やかにヒートシンク板１２を介して下方側に伝熱させることができる。また、この発光素子収納用パッケージ１０は、ヒートシンク板１２の上面側に厚さの薄いフレキシブル配線基板１３を有している。   As shown in FIG. 1, a light-emitting element storage package 10 according to an embodiment of the present invention includes a square heat sink plate 12 such as a square or a rectangle for radiating heat generated from a light-emitting element 11 such as an LED. The light emitting element 11 is directly mounted at the center in one direction. The heat sink plate 12 of the light-emitting element storage package 10 is made of copper, a copper alloy metal plate, a composite metal plate of copper and other metals, a bonded metal plate of copper and other metals, or the like. A metal plate having conductivity can be used, and heat generated from the light emitting element 11 can be quickly transferred downward through the heat sink plate 12. The light emitting element storage package 10 has a thin flexible wiring board 13 on the upper surface side of the heat sink plate 12.

この発光素子収納用パッケージ１０のフレキシブル配線基板１３は、ポリイミドフィルムに銅箔配線を形成したフィルム回路基板や、ＢＴ樹脂（ビスマレイミドトリアジンを主成分にした樹脂）に銅箔を貼り付けた銅張り樹脂基板に銅配線を施した樹脂基板等が用いられている。このフレキシブル配線基板１３には、発光素子１１を囲繞できる円形や、四角形や、多角形等の貫通孔１４を設けている。そして、フレキシブル配線基板１３は、貫通孔１４の周辺部の一方の主面側をヒートシンク板１２の一方向の中央部でプリプレグ等を用いて接合し、両端部側をヒートシンク板１２から突出してクロス方向に延設して設けられている。更に、このフレキシブル配線基板１３は、両端部側のヒートシンク板１２と近接する部分で屈曲すると共に、ヒートシンク板１２を固定するボード基板１５にねじ１６でねじ止め固定されるようになっている。あるいは、フレキシブル配線基板１３は、両端部側のヒートシンク板１２と近接する部分で屈曲すると共に、ヒートシンク板１２を固定するボード基板１５にねじ１６でねじ止め固定、及び半田で接合する半田固定を併用することで固定されるようになっている。フレキシブル配線基板１３は、ボード基板１５に半田接合を併用したとしても、フレキシブル配線基板１３に柔軟性があるので、接合部材間の熱膨張係数差による歪みをフレキシブル配線基板１３で吸収させることができ、半田接合部の亀裂の発生を防止することができる。   The flexible wiring board 13 of the light emitting element storage package 10 is a film circuit board in which a copper foil wiring is formed on a polyimide film, or a copper-clad board in which a copper foil is bonded to a BT resin (a resin mainly composed of bismaleimide triazine). A resin substrate or the like in which a copper wiring is provided on a resin substrate is used. The flexible wiring board 13 is provided with a through-hole 14 such as a circle, a rectangle, or a polygon that can surround the light-emitting element 11. Then, the flexible wiring board 13 is joined by joining one main surface side of the peripheral portion of the through-hole 14 using a prepreg or the like at a central portion in one direction of the heat sink plate 12, and projecting both end sides from the heat sink plate 12. It extends in the direction. Further, the flexible wiring board 13 is bent at a portion close to the heat sink plate 12 on both ends, and is fixed to the board substrate 15 to which the heat sink plate 12 is fixed with screws 16. Alternatively, the flexible wiring board 13 bends at a portion close to the heat sink plate 12 on both ends, and is also used in combination with a board substrate 15 for fixing the heat sink plate 12 by screwing and fixing by screws 16 and soldering by soldering. To be fixed. Since the flexible wiring board 13 is flexible even if the solder bonding is used for the board substrate 15, the flexible wiring board 13 can absorb the distortion caused by the difference in thermal expansion coefficient between the joining members. The occurrence of cracks in the solder joint can be prevented.

ここで、ボード基板１５は、通常、熱伝導性に優れるアルミニウム等の金属板からなり、ヒートシンク板１５がねじ１６ａで固定されるのがよい。ヒートシンク板１５がボード基板１５に半田接合固定ではなく、ねじ１６ａでねじ止め固定される発光素子収納用パッケージ１０は、ヒートシンク板１５と、ボード基板１５との間に熱膨張係数の差があったとしても、歪みをねじ止め固定によって吸収でき接合部の亀裂発生を防止できる接合信頼性の高いパッケージを提供することができる。   Here, the board substrate 15 is usually made of a metal plate such as aluminum having excellent thermal conductivity, and the heat sink plate 15 is preferably fixed by screws 16a. In the light emitting element storage package 10 in which the heat sink plate 15 is not fixed to the board substrate 15 by solder bonding but by screws 16a, there is a difference in thermal expansion coefficient between the heat sink plate 15 and the board substrate 15. Even so, it is possible to provide a package with high bonding reliability in which distortion can be absorbed by screwing and fixing, and cracking of the bonded portion can be prevented.

上記の発光素子収納用パッケージ１０は、通常、フレキシブル配線基板１３に設ける貫通孔１４を囲繞するようにして立設する内周面を外側に開くテーパー形状とする筒状の金属や、絶縁体等からなる反射体１７を接合して有している。この反射体１７によって、発光素子１１は、発光効率を向上させることができるようになっている。また、上記の発光素子収納用パッケージ１０は、フレキシブル配線基板１３の上面側の貫通孔１４近傍に、発光素子１１とボンディングワイヤ１８を介して電気的に導通状態とするための接続用パッド１９を有している。更に、上記の発光素子収納用パッケージ１０は、フレキシブル配線基板１３の両端部側の下面側に、接続用パッド１９と接続する導体配線パターン（図示せず）を介して導出する外部接続用端子パッド（図示せず）を有している。そして、フレキシブル配線基板１３の下面側の外部接続用端子パッドは、ボード基板１５の上面側に設ける導体配線パターン（図示せず）に、フレキシブル配線基板１３のボード基板１５へのねじ止め接合時に接続させて電気的に導通状態としている。これらによって、反射体１７の内部のヒートシンク板１２上に搭載され、蛍光体や、透明樹脂等で気密に封止された発光素子１１は、外部と電気的な導通状態が形成でき、発光素子１１に電流が供給できるようになっている。なお、フレキシブル配線基板１３をボード基板１５にねじ１６でねじ止め固定する場合には、フレキシブル配線基板１３のねじ孔部に、接続用パッド１９と、外部接続用端子パッドを電気的に導通状態としている導体配線パターンが存在しないことが必要である。この導体配線パターンが存在しないことが必要なのは、存在することで接続用パッド１９と、外部接続用端子パッド間を断線したり、金属板からなるボード基板１５に短絡させたりする問題が発生するのを防止するために必要となっている。   The light emitting element storage package 10 is usually a cylindrical metal, an insulator, or the like having a tapered shape that opens an inner peripheral surface that is erected so as to surround a through hole 14 provided in the flexible wiring board 13. The reflector 17 made of is joined. The light emitting element 11 can improve the light emission efficiency by the reflector 17. Further, the light emitting element storage package 10 has a connection pad 19 in the vicinity of the through hole 14 on the upper surface side of the flexible wiring board 13 for electrically connecting the light emitting element 11 and the bonding wire 18. Have. Further, the light-emitting element storage package 10 has external connection terminal pads that are led out via a conductor wiring pattern (not shown) connected to the connection pads 19 on the lower surface side of both ends of the flexible wiring board 13. (Not shown). The external connection terminal pads on the lower surface side of the flexible wiring board 13 are connected to a conductor wiring pattern (not shown) provided on the upper surface side of the board substrate 15 when the flexible wiring board 13 is screwed to the board substrate 15. And is in an electrically conductive state. Accordingly, the light-emitting element 11 mounted on the heat sink plate 12 inside the reflector 17 and hermetically sealed with a phosphor, a transparent resin, or the like can form an electrical continuity with the outside. Can be supplied with current. When the flexible wiring board 13 is fixed to the board board 15 with screws 16, the connection pads 19 and the external connection terminal pads are electrically connected to the screw holes of the flexible wiring board 13. It is necessary that no conductor wiring pattern exists. It is necessary that this conductor wiring pattern does not exist. The presence of the conductor wiring pattern causes problems such as disconnection between the connection pad 19 and the external connection terminal pad, or short circuit to the board substrate 15 made of a metal plate. Is necessary to prevent.

上記の発光素子収納用パッケージ１０は、発光素子１１からの発熱を直接搭載された熱伝導率の高いヒートシンク板１２を介してボード基板１５に速やかに伝熱できると共に、金属板からなるボード基板１５から外部に速やかに放熱させることができる。また、上記の発光素子収納用パッケージ１０は、発光素子１１の発光による昇温と、消灯による冷却の繰り返しの温度サイクルの発生があったとしても、ヒートシンク板１２と、フレキシブル配線基板１３のボード基板１５への接合をねじ止め接合としているので、接合部材間の熱膨張係数差による歪みを吸収でき、半田接合時に発生するような接合部の亀裂の発生を防止することができる。   The light emitting element storage package 10 can quickly transfer heat to the board substrate 15 through the heat sink plate 12 with high heat conductivity directly mounted with the heat generated from the light emitting element 11, and the board substrate 15 made of a metal plate. The heat can be quickly radiated from the outside to the outside. Further, the light emitting element storage package 10 has the heat sink plate 12 and the board substrate of the flexible wiring board 13 even if a temperature cycle of repeated heating due to light emission of the light emitting element 11 and cooling due to light extinction occurs. Since the joining to 15 is screwed joining, distortion due to the difference in thermal expansion coefficient between the joining members can be absorbed, and the occurrence of cracks in the joining portion that occurs during solder joining can be prevented.

本発明の発光素子収納用パッケージは、ＬＥＤ等の発光素子を搭載させて照明や、ディスプレイ等に用いることができる。   The light emitting element storage package of the present invention can be used for illumination, a display, or the like by mounting a light emitting element such as an LED.

（Ａ）〜（Ｃ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図、Ｂ−Ｂ’線縦断面図である。(A)-(C) are the top view, A-A 'line longitudinal cross-sectional view, and B-B' line longitudinal cross-sectional view of the light emitting element storage package which concerns on one embodiment of this invention, respectively. 従来の発光素子収納用パッケージの説明図である。It is explanatory drawing of the conventional package for light emitting element accommodation.

符号の説明Explanation of symbols

１０：発光素子収納用パッケージ、１１：発光素子、１２：ヒートシンク板、１３：フレキシブル配線基板、１４：貫通孔、１５：ボード基板、１６、１６ａ：ねじ、１７：反射体、１８：ボンディングワイヤ、１９：接続用パッド   10: Light-emitting element storage package, 11: Light-emitting element, 12: Heat sink plate, 13: Flexible wiring board, 14: Through hole, 15: Board substrate, 16, 16a: Screw, 17: Reflector, 18: Bonding wire, 19: Pad for connection

Claims (2)

発光素子からの発熱を放熱するための四角形状のヒートシンク板の中央部に前記発光素子が直接搭載される発光素子収納用パッケージであって、
前記発光素子を囲繞できる貫通孔を設け、該貫通孔の周辺部を前記ヒートシンク板の一方向の中央部で接合し、両端部側を前記ヒートシンク板から突出してクロス方向に延設するフレキシブル配線基板を有し、該フレキシブル配線基板が前記両端部側の前記ヒートシンク板と近接する部分で屈曲すると共に、前記ヒートシンク板を固定するボード基板にねじ止め固定、又は該ねじ止め固定と半田固定の併用で固定されることを特徴とする発光素子収納用パッケージ。 A light-emitting element storage package in which the light-emitting element is directly mounted on a central portion of a rectangular heat sink plate for radiating heat generated from the light-emitting element;
A flexible wiring board provided with a through hole capable of enclosing the light emitting element, joining a peripheral portion of the through hole at a central portion in one direction of the heat sink plate, and projecting both end portions from the heat sink plate to extend in a cross direction The flexible wiring board is bent at a portion close to the heat sink plate on both ends, and is fixed to the board substrate for fixing the heat sink plate by screwing, or the screw fixing and solder fixing are combined. A package for storing a light emitting element, which is fixed. 請求項１記載の発光素子収納用パッケージにおいて、前記ヒートシンク板が前記ボード基板にねじ止め固定されることを特徴とする発光素子収納用パッケージ。   2. The light emitting element storage package according to claim 1, wherein the heat sink plate is screwed and fixed to the board substrate.
JP2007071695A 2007-03-20 2007-03-20 Light-emitting element storage package Pending JP2008235493A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2302985A1 (en) * 2009-09-28 2011-03-30 Huan-Chang Huang LED assembly
KR101059118B1 (en) * 2009-01-22 2011-08-25 임경호 Fastening method of circuit board and heat sink with excellent mounting efficiency and light efficiency
JP2013124691A (en) * 2011-12-13 2013-06-24 Panasonic Corp Spacer for fastener, and led unit using the same
CN104221484A (en) * 2012-04-19 2014-12-17 皇家飞利浦有限公司 A led grid device and a method of manufacturing a led grid device
CN110402012A (en) * 2018-04-25 2019-11-01 株式会社东芝 Electronic equipment

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101059118B1 (en) * 2009-01-22 2011-08-25 임경호 Fastening method of circuit board and heat sink with excellent mounting efficiency and light efficiency
EP2302985A1 (en) * 2009-09-28 2011-03-30 Huan-Chang Huang LED assembly
JP2013124691A (en) * 2011-12-13 2013-06-24 Panasonic Corp Spacer for fastener, and led unit using the same
CN104221484A (en) * 2012-04-19 2014-12-17 皇家飞利浦有限公司 A led grid device and a method of manufacturing a led grid device
JP2015509667A (en) * 2012-04-19 2015-03-30 コーニンクレッカ フィリップス エヌ ヴェ LED grid device and method of manufacturing LED grid device
CN104221484B (en) * 2012-04-19 2017-07-14 飞利浦灯具控股公司 The manufacture method of LED mesh devices and LED mesh devices
US9841170B2 (en) 2012-04-19 2017-12-12 Philips Lighting Holding B.V. LED grid device and a method of manufacturing a LED grid device
CN110402012A (en) * 2018-04-25 2019-11-01 株式会社东芝 Electronic equipment
CN110402012B (en) * 2018-04-25 2022-08-09 株式会社东芝 Electronic device

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