CN103302465A - 散热器模组及其制造方法 - Google Patents
散热器模组及其制造方法 Download PDFInfo
- Publication number
- CN103302465A CN103302465A CN2012100648246A CN201210064824A CN103302465A CN 103302465 A CN103302465 A CN 103302465A CN 2012100648246 A CN2012100648246 A CN 2012100648246A CN 201210064824 A CN201210064824 A CN 201210064824A CN 103302465 A CN103302465 A CN 103302465A
- Authority
- CN
- China
- Prior art keywords
- contact jaw
- kink
- radiating fin
- raised line
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 26
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 42
- 238000004080 punching Methods 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 4
- 238000003860 storage Methods 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/12—Fastening; Joining by methods involving deformation of the elements
- F28F2275/122—Fastening; Joining by methods involving deformation of the elements by crimping, caulking or clinching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
基座 | 10 |
上表面 | 11 |
下表面 | 12 |
凸条 | 13 |
压块 | 13a |
容置槽 | 14 |
平坦区 | 15 |
凸台 | 16 |
散热鳍片 | 20 |
接触端 | 21 |
第一弯折部 | 211 |
第二弯折部 | 212 |
缺口 | 23 |
卡口 | 24 |
条形槽 | 25 |
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012100648246A CN103302465A (zh) | 2012-03-13 | 2012-03-13 | 散热器模组及其制造方法 |
US13/650,499 US9138840B2 (en) | 2012-03-13 | 2012-10-12 | Method for manufacturing a heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012100648246A CN103302465A (zh) | 2012-03-13 | 2012-03-13 | 散热器模组及其制造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103302465A true CN103302465A (zh) | 2013-09-18 |
Family
ID=49128420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012100648246A Pending CN103302465A (zh) | 2012-03-13 | 2012-03-13 | 散热器模组及其制造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9138840B2 (zh) |
CN (1) | CN103302465A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104684335A (zh) * | 2013-11-26 | 2015-06-03 | 讯强电子(惠州)有限公司 | 散热装置及其制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5014776A (en) * | 1988-04-27 | 1991-05-14 | Joachim Hess | Heat emitting unit in form of a heater or cooler |
CN1270303A (zh) * | 1999-04-08 | 2000-10-18 | 富准精密工业(深圳)有限公司 | 散热装置及其制造方法 |
JP2002043477A (ja) * | 2000-07-25 | 2002-02-08 | Teijin Seiki Precision Kk | ヒートシンク及びその製造方法 |
CN1512570A (zh) * | 2002-12-27 | 2004-07-14 | 宝陆科技有限公司 | 散热器及其制造成型方法 |
CN1959967A (zh) * | 2005-11-04 | 2007-05-09 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及其制备方法 |
CN102348361A (zh) * | 2010-08-06 | 2012-02-08 | 陈世明 | 散热器及其制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI221081B (en) * | 2003-07-04 | 2004-09-11 | Delta Electronics Inc | Heat dissipating fins of heat sink and manufacturing method thereof |
US20050150633A1 (en) * | 2004-01-09 | 2005-07-14 | Advanced Thermal Technologies | Heat sink and method for manufacturing the same |
US20070029068A1 (en) * | 2005-08-03 | 2007-02-08 | Ming-Jen Cheng | Heat sink |
US20080060793A1 (en) * | 2006-09-08 | 2008-03-13 | Tsung-Hsien Huang | Cooler device |
US20090050308A1 (en) * | 2007-08-20 | 2009-02-26 | Kuo Yung-Pin | Base Structure for a Heat Sink |
TW200825356A (en) * | 2008-02-04 | 2008-06-16 | chong-xian Huang | Improvement on heat exchanger having a heat pipe |
TWM363192U (en) * | 2009-04-17 | 2009-08-11 | chong-xian Huang | Heat dissipating device |
US8413713B2 (en) * | 2010-05-27 | 2013-04-09 | Tsung-Hsien Huang | Heat sink module with fins having Z shaped foot portions |
-
2012
- 2012-03-13 CN CN2012100648246A patent/CN103302465A/zh active Pending
- 2012-10-12 US US13/650,499 patent/US9138840B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5014776A (en) * | 1988-04-27 | 1991-05-14 | Joachim Hess | Heat emitting unit in form of a heater or cooler |
CN1270303A (zh) * | 1999-04-08 | 2000-10-18 | 富准精密工业(深圳)有限公司 | 散热装置及其制造方法 |
JP2002043477A (ja) * | 2000-07-25 | 2002-02-08 | Teijin Seiki Precision Kk | ヒートシンク及びその製造方法 |
CN1512570A (zh) * | 2002-12-27 | 2004-07-14 | 宝陆科技有限公司 | 散热器及其制造成型方法 |
CN1959967A (zh) * | 2005-11-04 | 2007-05-09 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及其制备方法 |
CN102348361A (zh) * | 2010-08-06 | 2012-02-08 | 陈世明 | 散热器及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20130240190A1 (en) | 2013-09-19 |
US9138840B2 (en) | 2015-09-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170420 Address after: Guangdong, Chancheng Province West Industrial Zone, 35 North Road, Warburg, No. Applicant after: Quanyida Technology (Foshan) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. Applicant before: Foxconn Precision Industry Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130918 |
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RJ01 | Rejection of invention patent application after publication |