CN103293346A - Contact apparatus for burn-in tester and burn-in tester - Google Patents
Contact apparatus for burn-in tester and burn-in tester Download PDFInfo
- Publication number
- CN103293346A CN103293346A CN2013100614047A CN201310061404A CN103293346A CN 103293346 A CN103293346 A CN 103293346A CN 2013100614047 A CN2013100614047 A CN 2013100614047A CN 201310061404 A CN201310061404 A CN 201310061404A CN 103293346 A CN103293346 A CN 103293346A
- Authority
- CN
- China
- Prior art keywords
- holding plate
- test board
- test
- rotary part
- testing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a buin-in tester. Technology is disclosed according to the present invention, that is a driving source is used for driving a test board to advance and retreat toward one side of a test base, thereby realizing synchronous advancement and retreat of both ends of the test board and preventing a connector on the test board from getting damaged.
Description
Technical field
The present invention relates to connect power supply and when making its work, be used for the measuring semiconductor element to the aging testing apparatus (Burn-In Tester) of the reliability of thermal stress at semiconductor encapsulated element.
Background technology
Can be when making its work to semiconductor element connection electric signal, to confirm semiconductor element can be resisted the test of thermal stress on which kind of degree about burn-in test of the present invention through various tests after semiconductor element is manufactured.And the device of implementing this burn-in test is aging testing apparatus.
Aging testing apparatus comprises the aging chamber of accommodating semiconductor element, the test chamber of accommodating test base, and wherein, after the semiconductor element that is housed in aging chamber was connected test signal, test base was used for reading the consequential signal of feedback (Feed back).
Generally, in order simultaneously a plurality of semiconductor elements to be tested, semiconductor element is accommodated under the state that is loaded into test board with the matrix form in the aging chamber, and in order further to improve the processing capacity, aging chamber has the structure of accommodating a plurality of test boards simultaneously.And, the a plurality of semiconductor elements that are loaded into test board are electrically connected with test base by the connector for substrate that test board has, this grade by Korea S publication 10-2008-0051762 number (denomination of invention: aging test board connecting equipment, the ageing tester with it and ageing test plate method of attachment claim " prior art " below) for the technology that solves the electrical connection between semiconductor element and the test base discloses.
In the past, in order to be electrically connected test board and test base, used cylinder as the drive source of mobile test plate, but as institute's announcement in the prior art, during the use cylinder can excessive contact impact take place in the part, may come in contact bad and coupling part breakage.
Therefore, as prior art, provide the technology of utilizing servomotor mobile test plate.
But, according to also using a plurality of servomotors to come the mobile test plate under the situation of prior art, therefore have the problem that need carry out high precision synchronousization and production cost rising.
Summary of the invention
The object of the present invention is to provide a kind of technology of utilizing a drive source test board can be shifted to test base one side.
Aforesaid aging testing apparatus contact device of the present invention comprises: holding plate, and can be to test base side direction advance and retreat, test board moved to test base one side or to make it to mobile in the other direction after keeping test board; First drive source is used for providing described holding plate advance and retreat required driving force; Power conversion transfer device, the driving force that described first drive source is provided pass to holding plate after being converted to the advance and retreat power of described holding plate; Second drive source is for the required driving force of maintenance action that described holding plate is provided.
Be formed with at least one link slot and a plurality of maintenance projection on the described holding plate, described link slot is used for connecting the connector of test board and the connector of test base side, described a plurality of maintenance groove that keeps projection to insert or break away from test board according to the jacking condition of holding plate, to keep test board or releasing to the maintenance of test board, the driving force that described second drive source provides is the lifting power that makes described holding plate lifting.
Described power conversion transfer device comprises: first rotary part is rotated for the turning axle direction with the horizontal direction by the described first drive source drives power; Second rotary part, the rotation of following described first rotary part are that turning axle is rotated with the vertical direction; First converter is converted to the revolving force of described first rotary part revolving force of described second rotary part; Second converter is converted to the revolving force of described second rotary part advance and retreat power of described holding plate; Transferring elements will be delivered to described holding plate by the displacing force that described second converter is converted to the advance and retreat power of described holding plate, and a side of described transferring elements is incorporated into described holding plate, and opposite side is incorporated into described second converter, one side.
Described second converter and described transferring elements vertically are separated from each other and arrange a plurality of respectively.
Described second rotary part, described first spinner, described second spinner and described transferring elements are separated from each other in the horizontal direction and arrange in pairs.
And in order to achieve the above object, aging testing apparatus provided by the present invention comprises: plate is accommodated chamber, is used for accommodating at least one test board; At least one test base is used for testing being loaded in the semiconductor element that described plate accommodates on the test board that chamber accommodates; Substrate is accommodated chamber, is used for accommodating described at least one test base; As any described contact device in the claim 1 to 5, be contained in described plate and accommodate described at least one test base of at least one test board contact in the chamber by making, thereby a plurality of semiconductor elements that will be loaded at least one test board are electrically connected to described at least one test base.
According to aforesaid the present invention, owing to by a drive source test board is shifted to test base one side, therefore the movement of maintained all parts of test board can be carried out synchronously, thereby has the breakage that can reduce loose contact or coupling part, the effect that can save production cost.
Description of drawings
Fig. 1 is the stereographic map that briefly shows the aging testing apparatus usefulness contact device of one embodiment of the invention.
Fig. 2 and Fig. 3 provide the reference diagram of reference during with contact device for the aging testing apparatus of key diagram 1.
Fig. 4 a to Fig. 4 c is the active state figure that the aging testing apparatus of Fig. 1 is used contact device.
Fig. 5 briefly shows the stereographic map that the testing apparatus of having used Fig. 1 is used the aging testing apparatus of contact device.
Symbol description:
100 is aging testing apparatus, and 110 accommodate chamber for plate, and 120 is test base, 130 accommodate chamber for substrate, and 140 is contact device, and 141 is holding plate, 142 is first drive source, 143 is the power conversion transfer device, and 143a is first rotary part, and 143b is second rotary part, 143c is first converter, 143d is second converter, and 143e is transferring elements, and 144 is second drive source.
Embodiment
Below, with reference to accompanying drawing aforesaid the preferred embodiments of the present invention are described, but the terseness in order to illustrate is omitted as far as possible or the compression duplicate explanation.
＜about the explanation of contact device 〉
Fig. 1 is the aging testing apparatus that briefly shows one embodiment of the invention with the stereographic map of contact device 140 (below abbreviate " contact device " as).
The contact device 140 of present embodiment comprises holding plate 141, first drive source 142, power conversion transfer device 143 and second drive source 144 etc.
The driving force that power conversion transfer device 143 is used for first drive source 142 is provided is converted to the advance and retreat power of holding plate 141 and passes to holding plate 141, comprises the first rotary part 143a, the second rotary part 143b, the first converter 143c, the second converter 143d, transferring elements 143e etc.
The first rotary part 143a has the clavate shape that along continuous straight runs extends, and the driving force that provides by first drive source 142 is rotated for the turning axle direction with the horizontal direction.At this moment, if first drive source 142 is made of motor, then the driving force of motor is converted to the revolving force of the first rotary part 143a by band B.
The second rotary part 143b has the clavate shape that vertically extends, and follows the rotation of the first rotary part 143a to be rotated for the turning axle direction with the vertical direction.
The first converter 143c is used for the revolving force of the first rotary part 143a is converted to the revolving force of the second rotary part 143b, as shown in Figure 2, and can be by realizations such as bevel gear structures.Certainly, the first converter 143c can constitute a part of member (for example, a side gear) and be incorporated into the first rotary part 143a, and another part member (for example, opposite side gear) is incorporated into the form of the second rotary part 143b.
The second converter 143d is used for the revolving force of the second rotary part 143b is converted to the advance and retreat power of transferring elements 143e and holding plate 141, as shown in Figure 3, and can be by realizations such as rack-and-pinion structures.At this, similarly, the second converter 143d can constitute a part of member (for example, pinion wheel) and be incorporated into the second rotary part 143b, and another part member (for example, tooth bar) is incorporated into the form of transferring elements 143e.
And the first converter 143c and the second rotary part 143b are separated from each other in the horizontal direction and arrange in pairs, and the second converter 143d and transferring elements 143e vertically are separated from each other on each second rotary part 143b and are respectively equipped with two.Certainly, according to the needs of implementing, the second converter 143d and transferring elements 143e can arrange more than three at each second rotary part 143b.
The action of aforesaid contact device 140 then, is described.
At first, shown in Fig. 4 a, when the test board TB that is mounted with semiconductor element is positioned at the plate host cavity when indoor, second drive source, 144 work and promote holding plate 141.Thereupon, holding plate 141 rises, and the protruding 141b of a plurality of maintenances will be inserted among the maintenance groove S of test board TB, shown in Fig. 4 b.Then, 142 work of first drive source are shifted to test base 120 1 sides with test board TB, test board TB can be electrically connected, with test base 120 shown in Fig. 4 c.And, can remove being electrically connected of test board TB and test base 120 according to the order opposite with above-mentioned sequence of movement.
＜about the explanation of aging testing apparatus 〉
Fig. 5 is the structural drawing of aging testing apparatus 100 that briefly shows one embodiment of the present of invention of the contact device 140 of having used Fig. 1.
As shown in Figure 5, the aging testing apparatus 100 that provides of present embodiment comprises plate and accommodates chamber 110 (identical with the aging chamber that illustrates in the background technology), test base 120, substrate and accommodate contact device 140 of chamber 130 and aforesaid Fig. 1 etc.
Plate is accommodated chamber 110 and is used for accommodating test board TB.
Substrate is accommodated chamber 130 and is used for accommodating a plurality of test bases 120.
And contact device 140 is used for making and is contained in plate and accommodates a plurality of test board TB contacts of chamber 110 and be contained in substrate and accommodate test base 120 in the chamber 130, thereby finally makes a plurality of semiconductor elements be electrically connected on test base 120.Certainly, preferably use the contact device 140 of the structure of Fig. 1 as the aforementioned in the aging testing apparatus 100 of present embodiment.
As mentioned above, though the embodiment by the reference accompanying drawing has carried out specifying of the present invention, but the above embodiments only are the descriptions to the preferred embodiments of the present invention, therefore will be appreciated that, the present invention is not limited to above-described embodiment, and interest field of the present invention should be determined by claims described later and equivalents thereof.
Claims (6)
1. an aging testing apparatus contact device is characterized in that, comprises:
Holding plate, test base is advanced and retreat relatively after keeping test board, test board moved to test base one side or to make it to mobile in the other direction;
First drive source is used for providing described holding plate advance and retreat required driving force;
Power conversion transfer device, the driving force that described first drive source is provided pass to holding plate after being converted to the advance and retreat power of described holding plate; And
Second drive source is for the required driving force of maintenance action that described holding plate is provided.
2. aging testing apparatus contact device according to claim 1 is characterized in that,
Be formed with at least one link slot and a plurality of maintenance projection on the described holding plate, described at least one link slot is used for connecting the connector of test board and the connector of test base side, described a plurality of maintenance groove that keeps projection to insert or break away from test board according to the jacking condition of holding plate, to keep test board or releasing to the maintenance of test board
The driving force that described second drive source provides is the lifting power that makes described holding plate lifting.
3. aging testing apparatus contact device according to claim 1 is characterized in that, described power conversion transfer device comprises:
First rotary part is rotated for the turning axle direction with the horizontal direction by the described first drive source drives power;
Second rotary part, the rotation of following described first rotary part are that turning axle is rotated with the vertical direction;
First converter is converted to the revolving force of described first rotary part revolving force of described second rotary part;
Second converter is converted to the revolving force of described second rotary part advance and retreat power of described holding plate;
Transferring elements will be delivered to described holding plate by the displacing force that described second converter is converted to the advance and retreat power of described holding plate,
One side of described transferring elements is incorporated into described holding plate, and opposite side is incorporated into described second converter, one side.
4. aging testing apparatus contact device according to claim 3 is characterized in that, described second converter and described transferring elements vertically are separated from each other and arrange a plurality of respectively.
5. aging testing apparatus contact device according to claim 3 is characterized in that, described second rotary part, described first spinner, described second spinner and described transferring elements are separated from each other in the horizontal direction and arrange in pairs.
6. an aging testing apparatus is characterized in that, comprises:
Plate is accommodated chamber, is used for accommodating at least one test board;
At least one test base is used for testing being loaded in the semiconductor element that described plate accommodates on the test board that chamber accommodates;
Substrate is accommodated chamber, is used for accommodating described at least one test base;
As any described contact device in the claim 1 to 5, be contained in described plate and accommodate described at least one test base of at least one test board contact in the chamber by making, thereby a plurality of semiconductor elements that will be loaded at least one test board are electrically connected to described at least one test base.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120020852A KR101164115B1 (en) | 2012-02-29 | 2012-02-29 | Contact apparatus for burn-in tester and burn-in tester |
| KR10-2012-0020852 | 2012-02-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103293346A true CN103293346A (en) | 2013-09-11 |
| CN103293346B CN103293346B (en) | 2016-12-28 |
Family
ID=46716520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310061404.7A Active CN103293346B (en) | 2012-02-29 | 2013-02-27 | Aging testing apparatus contact device and aging testing apparatus |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101164115B1 (en) |
| CN (1) | CN103293346B (en) |
| TW (1) | TWI485412B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114910230A (en) * | 2022-05-06 | 2022-08-16 | 嘉兴市扬佳科技合伙企业(有限合伙) | Use durability testing device of semiconductor device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101249011B1 (en) * | 2012-08-21 | 2013-04-02 | (주)디지털프론티어 | Board removable apparatus of burn-in tester |
| KR101676774B1 (en) * | 2016-04-15 | 2016-11-17 | 주식회사 유니테스트 | Burn-In Tester |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10128453A (en) * | 1996-08-05 | 1998-05-19 | Amada Co Ltd | Back gage device |
| JPH10232261A (en) * | 1997-02-19 | 1998-09-02 | Chuo Riken:Kk | Automatically inserting and stripping mechanism for burn-in board |
| US6323669B1 (en) * | 1999-02-02 | 2001-11-27 | Samsung Electronics Co., Ltd. | Apparatus and method for a contact test between an integrated circuit device an a socket |
| CN1808262A (en) * | 2005-01-21 | 2006-07-26 | 翁家铎 | Three-dimensional stereo object photographing support |
| TWM350921U (en) * | 2008-05-09 | 2009-02-11 | Tyc Brother Ind Co Ltd | Motor seat structure of electrically-driven adjustment set |
| KR20110015968A (en) * | 2009-08-10 | 2011-02-17 | (주)테크윙 | Test handler and carrier board conveyance system for test handler |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622176A (en) | 1985-06-28 | 1987-01-08 | Yashima Seisakusho:Kk | Burn-in instrument |
| EP0919301B1 (en) * | 1996-08-05 | 2003-06-18 | Amada Company Limited | Back gauge device |
| TWM345305U (en) * | 2008-07-04 | 2008-11-21 | De-An Wang | Board assembly kit for dynamic model |
-
2012
- 2012-02-29 KR KR1020120020852A patent/KR101164115B1/en active IP Right Grant
-
2013
- 2013-02-27 CN CN201310061404.7A patent/CN103293346B/en active Active
- 2013-02-27 TW TW102107000A patent/TWI485412B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10128453A (en) * | 1996-08-05 | 1998-05-19 | Amada Co Ltd | Back gage device |
| JPH10232261A (en) * | 1997-02-19 | 1998-09-02 | Chuo Riken:Kk | Automatically inserting and stripping mechanism for burn-in board |
| US6323669B1 (en) * | 1999-02-02 | 2001-11-27 | Samsung Electronics Co., Ltd. | Apparatus and method for a contact test between an integrated circuit device an a socket |
| CN1808262A (en) * | 2005-01-21 | 2006-07-26 | 翁家铎 | Three-dimensional stereo object photographing support |
| TWM350921U (en) * | 2008-05-09 | 2009-02-11 | Tyc Brother Ind Co Ltd | Motor seat structure of electrically-driven adjustment set |
| KR20110015968A (en) * | 2009-08-10 | 2011-02-17 | (주)테크윙 | Test handler and carrier board conveyance system for test handler |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114910230A (en) * | 2022-05-06 | 2022-08-16 | 嘉兴市扬佳科技合伙企业(有限合伙) | Use durability testing device of semiconductor device |
| CN114910230B (en) * | 2022-05-06 | 2023-01-17 | 嘉兴市扬佳科技合伙企业(有限合伙) | Use durability testing device of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103293346B (en) | 2016-12-28 |
| TWI485412B (en) | 2015-05-21 |
| KR101164115B1 (en) | 2012-07-12 |
| TW201337286A (en) | 2013-09-16 |
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