CN114910230B - Use durability testing device of semiconductor device - Google Patents
Use durability testing device of semiconductor device Download PDFInfo
- Publication number
- CN114910230B CN114910230B CN202210487228.2A CN202210487228A CN114910230B CN 114910230 B CN114910230 B CN 114910230B CN 202210487228 A CN202210487228 A CN 202210487228A CN 114910230 B CN114910230 B CN 114910230B
- Authority
- CN
- China
- Prior art keywords
- rotating
- test
- rotating shaft
- gear
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
- G01M7/027—Specimen mounting arrangements, e.g. table head adapters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
Abstract
The invention discloses a using durability test device of a semiconductor device, belonging to the field of semiconductor test equipment; the device comprises a test panel, wherein a placing plate mounting groove is formed in the test panel, a test placing plate is movably mounted in the placing plate mounting groove, rotating plate mounting seats are arranged on four sides of the test panel, a rotating fixing plate is movably mounted on the rotating plate mounting seats, a contact block is mounted on the rotating fixing plate, bonding pads corresponding to the welding feet of an element to be tested are arranged on four sides of the placing plate mounting groove, the bonding pads are connected with a test circuit, and the test panel is mounted on a vibration test device; placing the element to be tested on a test placing plate, rotating the fixing plate to rotate and then pressing down the pin of the element to be tested by the abutting block to make the pin of the element to be tested closely contact with the pad of the test panel after the test placing plate moves downwards to be horizontal to the test panel; the mounting state of the element to be tested can be simulated, and the welding leg is fixed through the downward pressing of the contact block, so that the problem of application concentration caused by manual welding can be avoided.
Description
Technical Field
The disclosure belongs to the field of semiconductor test equipment, and particularly relates to a use durability test device for a semiconductor device.
Background
The semiconductor package is generally to place the bare chip on a substrate with a bearing function, then lead out the pins, and package the bare chip into a whole by using a plastic shell, so that a better working environment is conveniently provided for the semiconductor element, and the influence of external factors on the normal and stable work of the semiconductor element is avoided. Need test stitch intensity and radiating effect after the encapsulation after encapsulating semiconductor, whether the distance between each stitch satisfies is also confirmed simultaneously, still need to shake the fatigue strength test to using the product that has vibrating device simultaneously, current product is how much through welding test on PCB, but the uniformity can not lead to single leg stress concentration to welding difficult simultaneous welding of small batch volume, with leg soldering tin point size nonconformity, above-mentioned problem all can lead to shaking fatigue strength and insulation test's effect to have an error, a semiconductor device is proposed now
The use durability test device of (1).
Disclosure of Invention
Aiming at the defects in the prior art, the purpose of the present disclosure is to provide a use durability testing device for a semiconductor device, which solves the problem that the strength test of a semiconductor test pin in the prior art is difficult.
The purpose of the disclosure can be realized by the following technical scheme:
the utility model provides a semiconductor device's use durability test device, includes the test panel, the last board mounting groove of placing of having seted up of test panel, movable mounting has the test to place the board in placing the board mounting groove, and the four sides of test panel all is equipped with the rotor plate mount pad, and movable mounting has a rotating fixed plate on the rotor plate mount pad, installs the touch multitouch on the rotating fixed plate, and the four sides of placing the board mounting groove are equipped with the pad that corresponds with the component leg that awaits measuring, the pad is connected with test circuit, and the test panel is installed on vibrations testing arrangement.
Furthermore, a second rotating shaft is movably mounted in the rotating plate mounting seat, a second gear is arranged at one end of the second rotating shaft, an adjusting plate is arranged below the test panel, first racks are arranged on four sides of the adjusting plate, the first racks and the second gear are mutually meshed, a mounting through hole is formed in the rotating and fixing plate, one end of the second rotating shaft is located on one side in the mounting through hole, a fixing shaft is arranged on the rotating plate mounting seat, and the fixing shaft is mounted on the other side of the mounting through hole;
furthermore, a second rotating shaft is movably mounted in the rotating plate mounting seat, a first rotating shaft is movably mounted on the second rotating shaft, a second gear is mounted on the first rotating shaft, an adjusting plate is arranged below the test panel, first racks are arranged on four sides of the adjusting plate, and the first racks are meshed with the second gear; the first rotating shaft and the second rotating shaft are connected with each other through a connecting module, an installation through hole is formed in the rotating fixing plate, one end of the second rotating shaft is located on one side in the installation through hole, a fixing shaft is arranged on the rotating plate installation seat, and the fixing shaft is installed on the other side of the installation through hole;
the connecting module comprises a first rotating disc, a first bevel gear is arranged on the first rotating disc, one side, close to the first bevel gear, of the first rotating disc is provided with two movable mounting columns which are distributed circumferentially, a fourth rotating shaft is arranged on each movable mounting column, a second bevel gear is movably mounted on each fourth rotating shaft and is meshed with the first bevel gear, a third rotating shaft is arranged at one end, facing the first bevel gear, of the first rotating disc, a third bevel gear is arranged on the third rotating shaft and is meshed with the second bevel gear, the first rotating disc is mounted on the second rotating shaft, the third rotating shaft is mounted on the first rotating shaft, and the movable mounting columns are movably mounted on the first rotating disc.
Further, a first spring is arranged between the test panel and the adjusting plate.
Further, be equipped with conflict piece mounting groove on the rotating fixing plate, conflict piece movable mounting is equipped with the second spring between conflict piece and the conflict piece mounting groove in the conflict piece mounting groove.
Further, be equipped with the connecting axle mounting hole between installation through-hole and the conflict piece mounting groove, the one end of connecting axle mounting hole is equipped with the slider mounting groove, movable mounting has first connecting axle in the connecting axle mounting groove, first gear and first slider are installed respectively to first connecting axle both ends, first slider is located the slider mounting groove, first gear is located conflict piece mounting groove, be equipped with the second rack on the conflict piece, second rack and first gear intermeshing has been seted up on the conflict piece mounting groove, first gear and second gear intermeshing, first slider one end is contradicted the side of fixed axle.
Furthermore, a plurality of placing grooves are formed in the test placing plate.
Furthermore, a touch arc is arranged on the touch block, an elastic conductor ball is arranged in the touch arc, each welding spot of a welding disc on the test panel corresponds to one elastic conductor ball, a contact open slot is formed in the touch arc, and the side surface of each elastic conductor ball is exposed out of the surface of the touch arc through the contact open slot;
the elastic conductor ball is made of elastic rubber, an elastic conductive surface composite layer is wrapped outside the elastic conductor ball, and the elastic conductive surface composite layer comprises a conductive part and an elastic material layer; the conductive feature comprises a layer disposed within the elastomeric material layer; the conductive member is in the shape of a wire; the conductive parts are arranged in a three-dimensional spiral manner; the cross section of the conductive member comprises a straight line segment; the straight line segment is embedded in the surface of the elastic material layer.
Further, the specific working steps of the test device are as follows:
the method comprises the following steps: placing the element to be tested on a test placing plate, moving the test placing plate downwards to be horizontal to a test panel, moving an adjusting plate upwards to drive a second gear to rotate through a first rack, driving a second rotating shaft to rotate through a connecting module, driving a rotating fixing plate to rotate through the second rotating shaft, and pressing pins of the element to be tested downwards by a contact block to be in close contact with a pad of the test panel after the second rotating shaft rotates to drive the rotating fixing plate to rotate;
the method comprises the following steps: the pressing of the abutting block overcomes the upward movement of the second spring, the upward movement of the abutting block drives the first gear to rotate through the second rack, and the rotation of the first gear drives the first sliding block to move forwards to abut against the second rotating shaft so as to stop the movement of the rotating fixing plate;
the method comprises the following steps: after the adjusting plate moves in place, the elastic conductor balls are extruded and deformed, the distance between every two adjacent elastic conductor balls is changed, a test circuit connected with a pad of the test panel is connected, and the vibration test device is started to start testing.
The beneficial effect of this disclosure:
placing the element to be tested on a test placing plate, rotating the fixing plate to rotate and then pressing down the pin of the element to be tested by the abutting block to make the pin of the element to be tested closely contact with the pad of the test panel after the test placing plate moves downwards to be horizontal to the test panel; through so design, can simulate the mounted state of the element that awaits measuring to pushing down through the touch multitouch fixes the leg and can avoid manual welding to lead to using the problem of concentrating, so guarantee the accuracy of test result, avoid welding repeatedly of soldering tin simultaneously to make the damage of leg influence equipment life on the test panel.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present disclosure, the drawings used in the embodiments or technical solutions of the present disclosure will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic overall structure diagram of an embodiment of the present disclosure;
FIG. 2 is a schematic view of the installation of a rotating fixed plate according to an embodiment of the disclosure;
FIG. 3 is a schematic structural diagram of a connection module according to an embodiment of the disclosure;
FIG. 4 is a schematic structural diagram of a rotating fixing plate according to an embodiment of the disclosure;
FIG. 5 is a schematic view of the internal structure of the rotating fixing plate according to the embodiment of the present disclosure;
FIG. 6 is a schematic diagram of a collision block according to an embodiment of the disclosure
FIG. 7 is a schematic structural diagram of a test placement board according to an embodiment of the present disclosure;
FIG. 8 is a schematic diagram of a partial structure of a collision block according to an embodiment of the disclosure;
fig. 9 is a schematic view of an internal structure of a collision block according to an embodiment of the disclosure.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
As shown in fig. 1-9, a device for testing durability of a semiconductor device includes a testing panel 1, and is characterized in that a mounting groove 11 is formed in the testing panel 1, a testing mounting plate 3 is movably mounted in the mounting groove 11, rotating plate mounting seats 12 are respectively disposed on four sides of the testing panel 1, a rotating fixing plate 4 is movably mounted on the rotating plate mounting seats 12, contact blocks 6 are mounted on the rotating fixing plate 4, pads corresponding to solder feet of an element to be tested are disposed on four sides of the mounting groove 11, the pads are connected to a testing circuit, and the testing panel 1 is mounted on a vibration testing device; placing the element to be tested on the test placing plate 3, moving the test placing plate 3 downwards to be horizontal to the test panel 1, and then pressing pins of the element to be tested by the abutting blocks 6 to make the pins of the element to be tested tightly contact with the bonding pad of the test panel 1 after the rotary fixing plate 4 rotates; through so design, can simulate the mounted state of the element that awaits measuring to pushing down through the contact block 6 fixes the leg and can avoiding manual welding to lead to using the problem of concentrating, so guarantee the accuracy of test result, avoid welding repeatedly of soldering tin to make the damage of leg influence equipment life on the test panel 1 simultaneously.
In some disclosures, a second rotating shaft 48 is movably mounted in the rotating plate mounting seat 12, a second gear 49 is arranged at one end of the second rotating shaft 48, an adjusting plate 2 is arranged below the test panel 1, first racks 21 are arranged on four sides of the adjusting plate 2, the first racks 21 and the second gear 49 are meshed with each other, a mounting through hole 41 is formed in the abutting block 6, and the mounting through hole 41 is movably mounted on the second rotating shaft 48; through such design, can be through the up-and-down motion of regulating plate 2, so can drive 4 rotary fixing plate's rotary motion simultaneously through first rack 21, can guarantee that 4 rotary fixing plate 4 are synchronous to the push down motion of the component that awaits measuring and guarantee that the pressure is the same, avoid appearing unilateral too big condition influence test result.
In some disclosures, a second rotating shaft 48 is movably mounted in the rotating plate mounting seat 12, the second rotating shaft 48 is movably mounted with a first rotating shaft 13, a second gear 49 is mounted on the first rotating shaft 13, an adjusting plate 2 is arranged below the test panel 1, four surfaces of the adjusting plate 2 are provided with first racks 21, and the first racks 21 are meshed with the second gear 49; the first rotating shaft 13 and the second rotating shaft 48 are connected with each other through the connecting module 5, the abutting block 6 is provided with an installation through hole 41, and the installation through hole 41 is movably installed on the second rotating shaft 48;
the connecting module 5 comprises a first rotating disc 51, a first bevel gear 50 is arranged on the first rotating disc 51, two movable mounting columns 52 which are distributed circumferentially are arranged on one side of the first rotating disc 51 close to the first bevel gear 50, a fourth rotating shaft 53 is arranged on the movable mounting columns 52, a second bevel gear 54 is movably mounted on the fourth rotating shaft 53, the second bevel gear 54 is meshed with the first bevel gear 50, a third rotating shaft 55 is arranged at one end of the first rotating disc 51 facing the first bevel gear 50, a third bevel gear 56 is arranged on the third rotating shaft 55, the third bevel gear 56 is meshed with the second bevel gear 54, the first rotating disc 51 is mounted on the second rotating shaft 48, and the third rotating shaft 55 is mounted on the first rotating shaft 13; through the design, the up-and-down movement of the adjusting plate 2 can be realized, so that the 4 rotating fixing plates 4 can be driven to rotate simultaneously through the first rack 21, meanwhile, the third rotating shaft 55 and the first rotating disc 51 can be mutually linked through the rotation of the second bevel gear 54 on the fourth rotating shaft 53, the movable mounting columns 52 are movably mounted on the first rotating disc 51, when the resistance is applied to the second bevel gear 58, the movable mounting columns 52 rotate relative to the first rotating disc 51, the difference between the third rotating shaft 55 and the first rotating disc 51 can be ensured, so that the rotation of a single rotating fixing plate 4 in place cannot influence the rotation of the rest rotating fixing plates 4, each of the to-be-tested pins is ensured to be fixed, stable and firm, the synchronous guarantee of the same pressure of the 4 rotating fixing plates 4 to the downward movement of the to-be-tested elements is ensured, and the influence on the test result caused by the condition of overlarge unilateral pressure is avoided.
In some disclosures, a first spring 22 is provided between the test panel 1 and the adjustment plate 2; through such design, can carry out the return to regulating plate 2 fast, regulating plate 2 can drive through cylinder and lead screw, and first spring 22 can avoid regulating plate 2 rapid motion to lead to the collision of contact block 6 with the component stitch that awaits measuring simultaneously.
In some disclosures, a contact block mounting groove 42 is formed in the rotary fixing plate 4, the contact block 6 is movably mounted in the contact block mounting groove 42, and a second spring 62 is arranged between the contact block 6 and the contact block mounting groove 42; by such a design, the pressure of the contact block 6 on the pins of the component to be tested can be adjusted by the second spring 62.
In some publications, a connecting shaft mounting hole 43 is arranged between the mounting through hole 41 and the abutting block mounting groove 42, a slider mounting groove 44 is arranged at one end of the connecting shaft mounting hole 43, a first connecting shaft 45 is movably mounted in the connecting shaft mounting hole 43, a first gear 46 and a first slider 47 are respectively mounted at two ends of the first connecting shaft 45, the first slider 47 is located in the slider mounting groove 44, the first gear 46 is located in the abutting block mounting groove 42, a second rack 61 is arranged on the abutting block 6, the second rack 61 is meshed with the first gear 46, the first gear 46 is arranged on the abutting block mounting groove 42, the first gear 46 is meshed with the second rack 61, the mounting through hole 41 is arranged on the abutting block mounting groove 42, and one end of the first slider 47 abuts against the side surface of the fixed shaft; through the design, the second rack 61 can drive the first gear 46 to rotate, the first gear 46 rotates to drive the first slider 47 to move forward and abut against the fixed shaft, so that the resistance of the second rotating shaft 48 is increased, the movable mounting column 52 rotates relative to the first rotating disc 51, and a difference exists between the third rotating shaft 55 and the first rotating disc 51, so that the rotation fixing plate 4 stops rotating.
In some publications, the test placement board 3 is provided with a plurality of placement grooves 31; through the design, the element to be tested can be conveniently installed and placed.
In some disclosures, the abutting block 6 is provided with an abutting arc 63, an elastic conductor ball 632 is arranged in the abutting arc 63, each welding point of the pad on the test panel 1 corresponds to one elastic conductor ball 632, a contact open slot 631 is formed in the abutting arc 63, and the side surface of the elastic conductor ball 632 is exposed out of the surface of the abutting arc 63 through the contact open slot 631;
the elastic conductor ball 632 is made of elastic rubber, an elastic conductive surface composite layer is wrapped outside the elastic conductor ball 632, and the elastic conductive surface composite layer comprises a conductive part and an elastic material layer; the conductive component is arranged in the elastic material layer; the conductive member is in the shape of a wire; the conductive parts are arranged in a three-dimensional spiral manner; the cross section of the conductive member comprises a straight line segment; the straight line section is embedded on the surface of the elastic material layer; through such design, can conflict the component stitch that awaits measuring through conflict circular arc 63, can make elastic conductor ball 632 deformation when conflicting the component stitch that awaits measuring through conflict circular arc 63, elastic conductor ball 632 passes through contact open slot 631 and the component stitch contact intercommunication that awaits measuring, so can simulate different welding state through elastic conductor ball 632 deformation, come the insulation and the compressive strength of two adjacent stitches different distances.
Further, be equipped with rack groove 40 of stepping down in the contact piece mounting groove 42, rack groove 40 of stepping down can play the direction and function of stepping down.
In some disclosures, the specific working steps of the test device are as follows:
step 1: placing a to-be-tested element on a test placing plate 3, moving the test placing plate 3 downwards to be horizontal to a test panel 1, moving an adjusting plate 2 upwards to drive a second gear 49 to rotate through a first rack 21, driving a second rotating shaft 48 to rotate through a connecting module 5 when the second gear 49 rotates, and driving a rotating fixing plate 4 to rotate by the second rotating shaft 48, and then pressing a pin of the to-be-tested element downwards through a contact block 6 to enable the pin to be in close contact with a bonding pad of the test panel 1;
step 2: the contact block 6 is pressed downwards to overcome the upward movement of the second spring 62, the contact block 6 moves upwards to drive the first gear 46 to rotate through the second rack 61, the first gear 46 rotates to drive the first sliding block 47 to move forwards, and then the contact block abuts against the second rotating shaft 48 to stop the movement of the rotating fixing plate 4;
and step 3: after the adjusting plate 2 moves to the right position, the elastic conductor balls 632 are extruded and deformed, the distance between two adjacent elastic conductor balls 632 is changed, a test circuit connected with a pad of the test panel 1 is connected, and the vibration test device is started to start testing.
The working principle is as follows:
placing the element to be tested on the test placing plate 3, moving the test placing plate 3 downwards to be horizontal to the test panel 1, and then pressing pins of the element to be tested by the abutting blocks 6 to make the pins of the element to be tested tightly contact with the bonding pad of the test panel 1 after the rotary fixing plate 4 rotates; through such design, can simulate the mounted state of the element that awaits measuring to pushing down through the contact block 6 fixes the leg and can avoiding manual welding to lead to using the problem of concentrating, so guarantee the accuracy of test result, avoid welding repeatedly of soldering tin simultaneously to make the damage of leg influence equipment life on the test panel 1.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (5)
1. The using durability testing device for the semiconductor device comprises a testing panel (1) and is characterized in that a placing plate mounting groove (11) is formed in the testing panel (1), a testing placing plate (3) is movably mounted in the placing plate mounting groove (11), rotating plate mounting seats (12) are arranged on four sides of the testing panel (1), rotating fixing plates (4) are movably mounted on the rotating plate mounting seats (12), contact abutting blocks (6) are mounted on the rotating fixing plates (4), bonding pads corresponding to bonding feet of an element to be tested are arranged on four sides of the placing plate mounting groove (11), the bonding pads are connected with a testing circuit, and the testing panel (1) is mounted on a vibration testing device;
a second rotating shaft (48) is movably mounted in the rotating plate mounting seat (12), a first rotating shaft (13) is movably mounted on the second rotating shaft (48), a second gear (49) is mounted on the first rotating shaft (13), an adjusting plate (2) is arranged below the test panel (1), first racks (21) are arranged on four sides of the adjusting plate (2), and the first racks (21) are meshed with the second gear (49); the first rotating shaft (13) and the second rotating shaft (48) are connected with each other through the connecting module (5), the rotating fixing plate (4) is provided with a mounting through hole (41), one end of the second rotating shaft (48) is positioned at one side in the mounting through hole (41), the rotating plate mounting seat (12) is provided with a fixing shaft, and the fixing shaft is mounted at the other side of the mounting through hole (41);
the connecting module (5) comprises a first rotating disc (51), a first bevel gear (50) is arranged on the first rotating disc (51), two movable mounting columns (52) distributed circumferentially are arranged on one side, close to the first bevel gear (50), of the first rotating disc (51), a fourth rotating shaft (53) is arranged on each movable mounting column (52), a second bevel gear (54) is movably mounted on each fourth rotating shaft (53), the second bevel gears (54) are meshed with the first bevel gear (50), a third rotating shaft (55) is arranged at one end, facing the first bevel gear (50), of the first rotating disc (51), a third bevel gear (56) is arranged on each third rotating shaft (55), the third bevel gears (56) and the second bevel gears (54) are meshed with each other, the first rotating disc (51) is mounted on the second rotating shaft (48), the third rotating shaft (55) is mounted on the first rotating shaft (13), and the movable mounting columns (52) are movably mounted on the first rotating disc (51);
a contact block mounting groove (42) is formed in the rotary fixing plate (4), the contact block (6) is movably mounted in the contact block mounting groove (42), and a second spring (62) is arranged between the contact block (6) and the contact block mounting groove (42);
a connecting shaft mounting hole (43) is formed between the mounting through hole (41) and the abutting block mounting groove (42), a slider mounting groove (44) is formed in one end of the connecting shaft mounting hole (43), a first connecting shaft (45) is movably mounted in the connecting shaft mounting hole (43), a first gear (46) and a first slider (47) are mounted at two ends of the first connecting shaft (45) respectively, the first slider (47) is located in the slider mounting groove (44), the first gear (46) is located in the abutting block mounting groove (42), a second rack (61) is arranged on the abutting block (6), the second rack (61) is meshed with the first gear (46), the first gear (46) is arranged on the abutting block mounting groove (42), the first gear (46) is meshed with the second rack (61), and one end of the first slider (47) abuts against the side face of the fixed shaft;
be equipped with conflict circular arc (63) on conflict piece (6), be equipped with elastic conductor ball (632) in conflict circular arc (63), every solder joint of test panel (1) goes up pad corresponds an elastic conductor ball (632), has seted up contact open slot (631) on conflict circular arc (63), and the side of elastic conductor ball (632) exposes conflict circular arc (63) surface through contact open slot (631), can simulate different welding state through elastic conductor ball (632) deformation.
2. The apparatus for testing durability in use of a semiconductor device according to claim 1, wherein a first spring (22) is provided between the test panel (1) and the adjustment plate (2).
3. The apparatus for testing durability in use of a semiconductor device according to claim 1, wherein a plurality of placing recesses (31) are provided on the test placing board (3).
4. The device for testing the durability of a semiconductor device according to claim 3, wherein the elastic conductor ball (632) is made of elastic rubber, and the elastic conductor ball (632) is wrapped with an elastic conductive surface composite layer, and the elastic conductive surface composite layer comprises a conductive component and an elastic material layer.
5. The device for testing the durability of a semiconductor device according to claim 3, wherein the device comprises the following steps:
step 1: placing an element to be tested on a test placing plate (3), moving the test placing plate (3) downwards to be horizontal to a test panel (1), moving an adjusting plate (2) upwards to drive a second gear (49) to rotate through a first rack (21), driving a second rotating shaft (48) to rotate through a connecting module (5) by rotating the second gear (49), and driving a rotating fixing plate (4) to rotate by rotating the second rotating shaft (48) and then pressing down pins of the element to be tested by a butting block (6) to enable the pins to be in close contact with bonding pads of the test panel (1);
step 2: the downward pressing of the contact block (6) overcomes the upward movement of a second spring (62), the upward movement of the contact block (6) drives a first gear (46) to rotate through a second rack (61), the rotation of the first gear (46) drives a first sliding block (47) to move forward, and then the first sliding block abuts against a second rotating shaft (48) to stop the movement of the rotary fixing plate (4);
and 3, step 3: after the adjusting plate (2) moves in place, the elastic conductor balls (632) are extruded and deformed, the distance between two adjacent elastic conductor balls (632) is changed, a test circuit connected with a pad of the test panel (1) is connected, and the vibration test device is started to start testing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210487228.2A CN114910230B (en) | 2022-05-06 | 2022-05-06 | Use durability testing device of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210487228.2A CN114910230B (en) | 2022-05-06 | 2022-05-06 | Use durability testing device of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114910230A CN114910230A (en) | 2022-08-16 |
| CN114910230B true CN114910230B (en) | 2023-01-17 |
Family
ID=82766228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210487228.2A Active CN114910230B (en) | 2022-05-06 | 2022-05-06 | Use durability testing device of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114910230B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116008597B (en) * | 2023-03-24 | 2023-06-13 | 昆山佰易仪器设备有限公司 | Testing device for semiconductor element |
| CN117289094B (en) * | 2023-09-27 | 2024-04-19 | 江苏卓玉智能科技有限公司 | Insulation testing device for semiconductor components |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6218202B1 (en) * | 1998-10-06 | 2001-04-17 | Texas Instruments Incorporated | Semiconductor device testing and burn-in methodology |
| CN103293346A (en) * | 2012-02-29 | 2013-09-11 | 韩商联测股份有限公司 | Contact apparatus for burn-in tester and burn-in tester |
| CN105158525A (en) * | 2015-08-25 | 2015-12-16 | 贵州航天计量测试技术研究所 | Test bench for microwave power divider |
| CN205193228U (en) * | 2015-11-05 | 2016-04-27 | 深圳市斯纳达科技有限公司 | Integrated circuit test fixture and integrated circuit testing arrangement |
| CN207488443U (en) * | 2017-10-10 | 2018-06-12 | 西安微电子技术研究所 | A kind of direct press type RF IC measurement jig |
| CN210604883U (en) * | 2019-08-28 | 2020-05-22 | 成都傅立叶电子科技有限公司 | SIP chip contact type test fixture |
| CN211043573U (en) * | 2019-09-05 | 2020-07-17 | 国科光芯(海宁)科技股份有限公司 | Chip testing device |
| KR102171508B1 (en) * | 2019-08-27 | 2020-10-29 | 주식회사 엘비엘 | Socket for testing both sides of semiconductor chips |
| CN212483762U (en) * | 2020-04-28 | 2021-02-05 | 遂宁合芯半导体有限公司 | Packaged chip testing device |
| CN112881895A (en) * | 2021-02-07 | 2021-06-01 | 荀露 | Conductive assembly and testing device |
| CN214539890U (en) * | 2020-12-28 | 2021-10-29 | 南京斐立芯微电子科技有限公司 | Clamp for detecting chip |
| CN113791244A (en) * | 2021-08-12 | 2021-12-14 | 晟光科技股份有限公司 | Side fingerprint module testing arrangement |
-
2022
- 2022-05-06 CN CN202210487228.2A patent/CN114910230B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6218202B1 (en) * | 1998-10-06 | 2001-04-17 | Texas Instruments Incorporated | Semiconductor device testing and burn-in methodology |
| CN103293346A (en) * | 2012-02-29 | 2013-09-11 | 韩商联测股份有限公司 | Contact apparatus for burn-in tester and burn-in tester |
| CN105158525A (en) * | 2015-08-25 | 2015-12-16 | 贵州航天计量测试技术研究所 | Test bench for microwave power divider |
| CN205193228U (en) * | 2015-11-05 | 2016-04-27 | 深圳市斯纳达科技有限公司 | Integrated circuit test fixture and integrated circuit testing arrangement |
| CN207488443U (en) * | 2017-10-10 | 2018-06-12 | 西安微电子技术研究所 | A kind of direct press type RF IC measurement jig |
| KR102171508B1 (en) * | 2019-08-27 | 2020-10-29 | 주식회사 엘비엘 | Socket for testing both sides of semiconductor chips |
| CN210604883U (en) * | 2019-08-28 | 2020-05-22 | 成都傅立叶电子科技有限公司 | SIP chip contact type test fixture |
| CN211043573U (en) * | 2019-09-05 | 2020-07-17 | 国科光芯(海宁)科技股份有限公司 | Chip testing device |
| CN212483762U (en) * | 2020-04-28 | 2021-02-05 | 遂宁合芯半导体有限公司 | Packaged chip testing device |
| CN214539890U (en) * | 2020-12-28 | 2021-10-29 | 南京斐立芯微电子科技有限公司 | Clamp for detecting chip |
| CN112881895A (en) * | 2021-02-07 | 2021-06-01 | 荀露 | Conductive assembly and testing device |
| CN113791244A (en) * | 2021-08-12 | 2021-12-14 | 晟光科技股份有限公司 | Side fingerprint module testing arrangement |
Non-Patent Citations (1)
| Title |
|---|
| 中国集成电路封测产业现状与创新平台;于燮康;《集成电路应用》;20180331;第1-4页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114910230A (en) | 2022-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114910230B (en) | Use durability testing device of semiconductor device | |
| KR100370308B1 (en) | Test Method of Semiconductor Wafer | |
| TWI517326B (en) | Substrate having leads | |
| KR20010085477A (en) | IC socket for surface-mounting semiconductor device | |
| KR102007268B1 (en) | By-directional electrically conductive module | |
| KR101737047B1 (en) | Wire bonding structure using metal core solder ball and method for manufacturing the same and test socket having the same | |
| CN111856252B (en) | Single-datum positioning full-floating PCB function test structure | |
| JP7247177B2 (en) | Balance Matching Force Mechanism of Work Press Inspection System for Integrated Circuit Packages | |
| KR101110002B1 (en) | Elastic contactor for test of semiconductor device and meathod for manufacturing the same | |
| KR20050019831A (en) | Contact,socket,socket board,and electoronic component test apparatus | |
| KR102145182B1 (en) | Camera Module Automatic TestSocket | |
| US6703851B1 (en) | Test socket interposer | |
| JPH0536457A (en) | Electronic part, its application device, and manufacture thereof | |
| JP2017517863A (en) | Bidirectional conductive socket for high-frequency device test, bidirectional conductive module for high-frequency device test, and manufacturing method thereof | |
| CN209417078U (en) | A kind of quick telecontrol equipment of flying probe tester | |
| KR200313240Y1 (en) | Test socket for ball grid array package | |
| JP3610919B2 (en) | Circuit board inspection jig, inspection method, and manufacturing method | |
| CN2831124Y (en) | Testing tools | |
| TWM487434U (en) | Testing motherboard for embedded elastic conductive elements and wafer testing interface assembly | |
| CN111403307B (en) | Integrated circuit test module and preparation method thereof | |
| CN1421911A (en) | Improved structure of integrated circuit test bench | |
| CN116520123B (en) | Wafer testing equipment and wafer testing method | |
| CN219357040U (en) | Test fixture of integrated circuit test sorting machine | |
| CN217931349U (en) | Mobile phone circuit board quality detection device | |
| KR200496146Y1 (en) | Alignment Platform and Electronic Component Transmission Apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230721 Address after: 314513 floor 2, building 2, 1383 Xiangxi Avenue, zhouquan Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: Zhejiang ruizhaoxin Semiconductor Technology Co.,Ltd. Address before: 314513 room 1, floor 2, building 2, No. 1383, Xiangxi Avenue, zhouquan Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: Jiaxing Yangjia technology partnership (L.P.) |