CN210604883U

CN210604883U - SIP chip contact type test fixture

Info

Publication number: CN210604883U
Application number: CN201921411216.1U
Authority: CN
Inventors: 邓富涛; 孙海飙; 林峰
Original assignee: CHENGDU FOURIER ELECTRONIC TECHNOLOGY CO LTD
Current assignee: CHENGDU FOURIER ELECTRONIC TECHNOLOGY CO LTD
Priority date: 2019-08-28
Filing date: 2019-08-28
Publication date: 2020-05-22
Anticipated expiration: 2029-08-28

Abstract

The utility model discloses a SIP chip contact type test fixture, including the base and with the upper cover that the base lid closed and opened, be provided with the first recess that is used for placing the SIP chip on the base, be equipped with the thimble hole in the first recess, the thimble has been placed in the thimble hole, the both ends of thimble contact with the tin ball of SIP chip respectively and the pad that sets up on the survey test panel of base below, the upper cover is provided with and compresses tightly the part, it is used for compressing tightly the SIP chip when upper cover and base lid close to compress tightly the part. The utility model can be used for rapid and repeated testing without welding and mounting and damaging welding spots; due to the design of the push block radiating fin and the installation of the fan, the high-power-consumption SIP chip can be effectively radiated; the concave arc design of the upper end of the thimble increases the contact area with the SIP chip, and the spring structure design of the lower end of the thimble avoids the problem of poor contact between the pin of the SIP chip and the test board.

Description

SIP chip contact type test fixture

Technical Field

The utility model relates to a test fixture technical field, specific saying so, a SIP chip contact type test fixture.

Background

At present, with the rapid development of the electronic industry, people have more and more requirements on the functions of a single chip and higher and more requirements on the integration degree of the chip, so that the development and application of the SIP chip are more and more extensive. Due to the high integration degree and the multiple functionality of the SIP, the SIP chip is large in size, large in power consumption, large in research and development and production cost, and powerful in function, the complexity of testing in the early stage of chip research and development and various unpredictable problems are caused, so that the SIP chip can be repeatedly disassembled and assembled on a testing board in the testing process; in a conventional testing method, the SIP chip is directly soldered on the testing board through the solder joint on the substrate, but the solder joint is damaged by repeatedly dismounting the chip in the testing stage, and the whole SIP chip is required to be completely packaged and manufactured again when the solder joint is damaged, which brings huge time cost and production cost.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a SIP chip contact formula test fixture for solve among the prior art with the welding spot beading on the SIP chip passes through the base plate survey test panel, need relapse the problem that the dismouting chip can cause the solder joint to damage at the test stage.

The utility model discloses a following technical scheme solves above-mentioned problem:

the utility model provides a SIP chip contact type test fixture, including the base and with the upper cover that the base lid closed and opened, be provided with the first recess that is used for placing the SIP chip on the base, be equipped with the thimble hole in the first recess, the thimble has been placed in the thimble hole, the both ends of thimble contact with the tin ball of SIP chip and the pad that sets up on the survey test panel of base below respectively, the upper cover is provided with compresses tightly the part, compress tightly the part and be used for compressing tightly the SIP chip when upper cover and base lid close.

During testing, the base and the test board are fixed, the upper cover is opened, the SIP chip is placed into the first groove, two ends of the ejector pin are respectively contacted with a solder ball of the SIP chip and a pad on the test board, then the upper cover and the base are closed, and after the pressing part on the inner side of the upper cover presses the SIP chip tightly, the electrical connection is completed, and the testing can be started; and after the test is finished, the handle is rotated to open the upper cover, and the SIP chip is taken out to finish the test of the SIP chip. This scheme need not weld SIP chip and survey test panel, consequently need not return the dismouting chip, can not cause the chip solder joint to damage.

Further, the upper cover is rotatably connected with the base.

Furthermore, one end of the upper cover is connected with the base through a horizontal rotating shaft, and the upper cover can move upwards or downwards relative to the base by taking the horizontal rotating shaft as a shaft to open or close the base.

Furthermore, the other end of the upper cover, which is far away from the horizontal rotating shaft, is provided with a buckle, and the buckle is used for locking and opening the upper cover and the base.

When the upper cover closes with the base lid, in order to further increase stability, adopt the buckle with the two locking, prevent to remove, the dislocation in the test procedure.

Further, still be provided with the spring between buckle and the upper cover, the buckle can be guaranteed to block on the base reliably when testing the SIP chip, and anchor clamps pine takes off when avoiding testing.

Further, the compressing part comprises a handle, one end of the handle is fixedly connected with a first end of a screw rod, a second end of the screw rod penetrates through a threaded hole formed in the upper cover and is fixedly connected with a pushing block, a compressing block is arranged below the pushing block, the upper cover is fixedly connected with a guide column penetrating through the compressing block, and the compressing block can move upwards or downwards along the guide column under the action of external force.

When the upper cover is opened or closed, the pressing part and the pressing block are driven to move together. During the test, place the SIP chip in first recess, cover upper cover and base and close, lock with the buckle. Then the handle is twisted to drive the push block to move downwards, and the movement of the push block pushes the pressing block to move downwards to be pressed with the SIP chip. The guide post guarantees that the moving direction of the pressing block and the force acting on the SIP chip are uniform.

Further, the fan is installed to the upper cover, the fan is located the top of compact heap when the upper cover with the base lid closes, the compact heap is the radiating fin structure.

The heat dissipation fin structure of fan and compact heap can be for the SIP chip heat dissipation, avoids the SIP chip to lead to the chip to damage because overheated.

Furthermore, a limiting component is arranged between the upper cover and the handle and used for limiting the rotation angle of the handle. The handle is avoided rotating the ejector pad when rotating, and the compact heap moves down the too much crushing SIP chip of displacement.

Furthermore, the limiting component comprises a limiting nail arranged on the upper cover and a limiting groove arranged on the handle.

Furthermore, the upper end of the thimble is of an inwards concave arc structure matched with the SIP chip solder ball, so that the thimble is ensured to be in large-area contact with the SIP chip, and the contact is good; the lower extreme of thimble is the shell fragment structure, and in the test process, the elastic deformation of shell fragment is a fluctuation range, has avoided because survey test panel integrated circuit board unevenness and SIP chip pin too much lead to some pin contact failure's problem.

Compared with the prior art, the utility model, following advantage and beneficial effect have:

(1) the utility model discloses when the test to jumbo size, high-power consumption SIP chip, can exempt from to weld and install and not damage under the condition of solder joint and can test repeatedly fast.

(2) The utility model discloses well ejector pad radiating fin's design and installation fan can effectively dispel the heat to high-power consumption SIP chip, and the fan installation position of reserving more can guarantee that the high power consumption chip can not lead to the chip to become invalid or damage because of the high temperature problem.

(3) The utility model discloses in set up the compact heap, can compress tightly the chip in the test, and the design of the indent circular arc of thimble upper end, increased with the area of contact of SIP chip, the spring structure design of thimble lower extreme has avoided because of surveying the SIP chip pin that the board unevenness leads to and survey the problem of survey the bad contact.

Drawings

Fig. 1 is a schematic structural view of the open state of the present invention;

FIG. 2 is a cross-sectional view of FIG. 1;

FIG. 3 is a half sectional view of the structure of the cover of the present invention;

FIG. 4 is a half sectional view of the left side view of FIG. 3;

FIG. 5 is an enlarged view of portion B of FIG. 3;

FIG. 6 is a six-sided projection view of the covered state of the present invention;

wherein, 1-buckling; 2-a handle; 3-tin ball; 4-a first groove; 5-a base; 6-a pad; 7-test board; 8-buckling a rotating shaft; 9-a spring; 10-upper cover; 11-a push block; 12-mounting a platform; 13-a compression block; 14-a limit pin; 15-horizontal rotating shaft; 16-SIP chip; 17-a thimble; 18-limiting groove.

Detailed Description

The present invention will be described in further detail with reference to examples, but the present invention is not limited thereto.

Example 1:

referring to fig. 1, 2 and 6, a contact type test fixture for an SIP chip includes a base 5 and an upper cover 10 covering and uncovering the base 5, wherein a first groove 4 for placing an SIP chip 16 is formed in the base 5, a thimble hole is formed in the first groove 4, a thimble 17 is placed in the thimble hole, two ends of the thimble 17 are respectively contacted with a solder ball 3 of the SIP chip 16 and a pad 6 on a test board 7 arranged below the base 5, and the upper cover 10 is provided with a pressing member for pressing the SIP chip 16 when the upper cover 10 is covered with the base 5. Fig. 6(c) is a front view of the upper cover 10 and the base 5 in a closed state, fig. 6(b) is a left side view, and fig. 6(a) is a bottom view; fig. 6(d) is a plan view, and fig. 6(e) is a right side view.

During testing, the base 5 and the test board 7 are fixed, the upper cover 10 is opened, the SIP chip 16 is placed into the first groove 4, two ends of the thimble 17 are respectively contacted with the solder ball 3 of the SIP chip 16 and the pad 6 on the test board 7, then the upper cover 10 and the base 5 are closed, and after the pressing part on the inner side of the upper cover 10 presses the SIP chip 16, the electrical connection is completed, and the testing can be started; after the test is finished, the handle 2 is rotated to open the upper cover 10, the SIP chip 16 is taken out, and the SIP chip test is finished.

Example 2:

on the basis of embodiment 1, as shown in fig. 1 and fig. 2, the upper cover 10 is rotatably connected with the base 5.

Furthermore, one end of the upper cover 10 is connected with the base 5 through a horizontal rotating shaft 15, and the upper cover 10 can move upwards or downwards relative to the base 5 by taking the horizontal rotating shaft 5 as an axis to open or close the base 5.

Further, the other end of the upper cover 10, which is far away from the horizontal rotating shaft 15, is provided with a buckle 1, the buckle 1 is provided with a buckle rotating shaft 8, and the buckle 1 rotates around the buckle rotating shaft 8 to lock and unlock the upper cover 10 and the base 5.

When the upper cover 10 and the base 5 are closed, the buckle 1 is adopted to lock the upper cover and the base for further increasing stability, and movement and dislocation in the test process are prevented.

Further, still be provided with spring 9 between buckle 1 and the upper cover 10, can guarantee buckle 1 can block on base 5 reliably when testing SIP chip 16, the anchor clamps pine takes off when avoiding testing.

Example 3:

on the basis of

embodiment

1 or 2, as shown in fig. 1 to 4, the pressing component includes a handle 2, one end of the handle 2 is fixedly connected with a first end of a screw rod, a second end of the screw rod passes through a threaded hole formed in the upper cover 10 and is fixedly connected with a push block 11, a pressing block 13 is arranged below the push block 11, the upper cover 10 is fixedly connected with a guide post passing through the pressing block 13, and the pressing block 13 can move upwards or downwards along the guide post under the action of external force. As shown in fig. 4, the region a is a threaded connection between the push block 11 and the upper cover 10.

When the upper cover 10 is opened or closed, the pressing part and the pressing block 13 are driven to move together. During testing, the SIP chip 16 is placed in the first groove 4, the upper cover 10 and the base 5 are covered, and the locking is realized by the buckle 1. Then, the handle 2 is screwed to drive the push block 11 to move downwards, and the movement of the push block 11 pushes the pressing block 13 to move downwards to be pressed with the SIP chip 16. The guide posts ensure that the direction of movement of the hold down 13 and the force on the SIP chip 16 are uniform.

Further, the upper cover 10 is provided with a mounting platform 12, a fan is mounted on the mounting platform 12, the fan is located above the pressing block 13 when the upper cover 10 and the base 5 are covered, and the pressing block 13 is of a heat dissipation fin structure.

The heat dissipation fin structure of fan and compact heap 13 can be for SIP chip 16 heat dissipation, avoids SIP chip 16 to lead to the chip to damage because of overheated.

Further, a limiting component is arranged between the upper cover 10 and the handle 2, and is used for limiting the rotation angle of the handle 2. The handle 2 is prevented from rotating the push block 11 too much when rotating, and the pressing block 13 moves downwards and displaces too much to crush the SIP chip 16.

Further, the position limiting part comprises a position limiting nail 14 arranged on the upper cover 10 and a position limiting groove 18 arranged on the handle 2.

Example 4:

on the basis of embodiment 1, as shown in fig. 3 and 5, the upper end of the thimble 17 is an inward concave arc structure matched with the solder ball 3 of the SIP chip 16, so that the thimble 17 is ensured to be in contact with the SIP chip 16 in a larger area, and the contact is good; the lower extreme of thimble 17 is the shell fragment structure, and in the test process, the elastic deformation of shell fragment is a fluctuation range, has avoided leading to some pin contact failure's problem because survey test panel 7 integrated circuit board unevenness and SIP chip 16 pin are too much.

Although the present invention has been described herein with reference to the illustrated embodiments thereof, which are merely preferred embodiments of the present invention, it is to be understood that the present invention is not limited thereto, and that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure.

Claims

1. The utility model provides a SIP chip contact type test fixture which characterized in that, including the base and with the upper cover that the base lid closed and opened, be provided with the first recess that is used for placing the SIP chip on the base, be equipped with the thimble hole in the first recess, the thimble has been placed in the thimble hole, the both ends of thimble contact with the tin ball of SIP chip and the pad that sets up on the survey test panel of base below respectively, the upper cover is provided with compresses tightly the part, compress tightly the part and be used for compressing tightly the SIP chip when upper cover and base lid close.

2. The SIP chip contact test fixture of claim 1, wherein the top cover is pivotally connected to the base.

3. The SIP chip contact test fixture of claim 2, wherein one end of the upper cover is connected to the base via a horizontal shaft, and the upper cover can move upwards or downwards relative to the base about the horizontal shaft to open or close the base.

4. The SIP chip contact type test fixture of claim 3, wherein the other end of the upper cover away from the horizontal rotation shaft is provided with a buckle, and the buckle is used for locking and unlocking the upper cover and the base.

5. The SIP chip contact test fixture of claim 4, wherein a spring is further disposed between the latch and the top cover.

6. The SIP chip contact test fixture of claim 1, wherein the pressing member comprises a handle, one end of the handle is fixedly connected with a first end of a screw, a second end of the screw passes through a threaded hole formed in the upper cover and is fixedly connected with a pushing block, a pressing block is arranged below the pushing block, a guide post passing through the pressing block is fixedly connected to the upper cover, and the pressing block can move up or down along the guide post under an external force.

7. The SIP chip contact test fixture of claim 6, wherein the upper cover is mounted with a fan, the fan is located above the pressing block when the upper cover and the base cover are closed, and the pressing block is a heat dissipation fin structure.

8. The SIP chip contact test fixture of claim 6, wherein a limiting component is disposed between the upper cover and the handle for limiting a rotation angle of the handle.

9. The SIP chip contact test fixture of claim 8, wherein the limiting member comprises a limiting pin disposed on the upper cover and a limiting groove disposed on the handle.

10. The SIP chip contact test fixture of claim 1, wherein the top of the thimble is a concave arc structure matching with the SIP chip solder ball, and the bottom of the thimble is a spring structure.