CN112197820A - Optical chip rapid crimping detection device - Google Patents
Optical chip rapid crimping detection device Download PDFInfo
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- CN112197820A CN112197820A CN202011414155.1A CN202011414155A CN112197820A CN 112197820 A CN112197820 A CN 112197820A CN 202011414155 A CN202011414155 A CN 202011414155A CN 112197820 A CN112197820 A CN 112197820A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
Abstract
The invention discloses a rapid crimping detection device for an optical chip, which comprises a lower PCB fixed in a lower shell; the chip carriers are arranged on the top surface of the lower shell and are uniformly provided with chips; the chip temperature control mechanism is arranged in the lower shell and is electrically connected with the lower PCB; the upper cover is arranged above the lower shell, one end of the upper cover is hinged with the lower shell, and a lock catch clamping mechanism is arranged between the upper cover and the lower shell; the floating positioning plate is arranged on the bottom surface of the upper cover, an upper PCB is fixed on the bottom surface, and a spring probe is arranged on the bottom surface; the optical power detection mechanism is arranged on the bottom surface of the upper PCB; the connector is arranged on one side of the lower shell and is electrically connected with the lower PCB. When the upper cover is closed, the chip is powered on, and meanwhile, the optical power detection mechanism detects the optical power of the chip, so that the test efficiency is improved, and the cost is reduced; the floating positioning plate is matched with different chips in a floating mode, and a spring probe is adopted, so that the chips are effectively guaranteed to be pressed, and poor contact and uneven heat dissipation are avoided; the chip can be pressed and electrified only by controlling the upper cover, and standardized detection is facilitated.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a rapid optical chip crimping detection device.
Background
After the optical chip is manufactured, a strict burn-in test and an optical power test are required. In the testing process, the connection stability of the chip needs to be ensured, and the testing temperature needs to be adjusted and maintained, so that the working states of the chip at different working temperatures can be measured. The existing chip testing device generally adopts the steps of placing a chip on a chip carrier, placing the chip carrier on a heat sink block for controlling the temperature, manually pressing a needle pressing block on the chip carrier to form a channel, and then carrying out an aging test and an optical power test. The existing chip testing device has the following problems in the working process:
1. due to the flatness problem of the chip carrier and the flatness problem caused by the matching of the chip carrier and the heat sink block, the poor contact phenomenon of the chip caused by the untight pressing easily exists between the chip carrier and the pin pressing block, and the untight connection between the chip carrier and the heat sink block is easily caused, so that the heat conduction of different positions of the chip carrier is influenced, and the heat uniformity of the chip is influenced;
2. the needle pressing block is manually controlled by an operator to be pressed to form a loop, so that the requirement on personal operation is high, errors are easy to occur, standardized detection cannot be realized, the labor cost is high, and the operation time is long;
3. the aging detection and the optical power detection need to be carried out twice, and the chip needs to be placed and compressed again twice, so that the test flow is increased, the test efficiency is influenced, and the operation cost is increased.
Disclosure of Invention
The invention aims to provide a device for detecting the rapid crimping of an optical chip, which aims to solve the technical problem.
In order to achieve the purpose, the technical scheme of the invention is as follows:
an optical chip rapid crimping detection device, comprising:
the lower shell is internally fixed with a lower PCB;
the chip carrier is arranged on the top surface of the lower shell, chips are uniformly placed on the chip carrier, and the chips are electrically connected with the lower PCB;
the chip temperature control mechanism is arranged in the lower shell and used for controlling the temperature of the chip carrier, and the chip temperature control mechanism is electrically connected with the lower PCB;
the upper cover is arranged above the lower shell, one end of the upper cover is hinged with the lower shell, and lock catch clamping mechanisms are arranged between two sides of the upper cover and the lower shell;
the floating positioning plate is installed on the bottom surface of the upper cover through an elastic installation mechanism, an upper PCB is fixed on the bottom surface of the floating positioning plate, the upper PCB is electrically connected with the lower PCB, and a spring probe matched with the chip is installed on the bottom surface of the upper PCB;
the optical power detection mechanism is arranged on the bottom surface of the upper PCB and used for monitoring the optical power of the chip in real time, and the optical power detection mechanism is electrically connected with the upper PCB;
and the joint is arranged on one side of the lower shell and is electrically connected with the lower PCB to form a power supply loop and conduct signals of the chip temperature control mechanism and the optical power detection mechanism.
By adopting the scheme, when the upper cover is closed, the lower PCB, the chip, the spring probe and the upper PCB form a loop, meanwhile, the optical power detection mechanism carries out real-time optical power detection on the chip, and detection signals are output through the upper PCB, the lower PCB and the connector, so that the aging detection and the optical power detection are synchronously carried out, the test efficiency is improved, and the cost is reduced;
the floating positioning plate is installed through the elastic installation mechanism and can move in a certain range so as to be adaptive to chips with different thicknesses, and meanwhile, the spring probe is adopted, so that the chips are effectively guaranteed to be pressed, and poor contact and uneven heat dissipation are avoided;
the manual work only need cover the upper cover and can realize compressing tightly the circular telegram of chip, need not manual control and compress tightly, reduces the error, helps realizing standardized detection, the simplified operation.
On the basis of the technical scheme, the invention can be further improved as follows:
further, casing top surface is equipped with the baffle down, the PCB board is fixed down the baffle bottom surface, chip temperature control mechanism includes:
the heat sinking block penetrates through the middle part of the partition plate to be fixed, and the chip carrier is fixed on the top surface of the heat sinking block;
the temperature sensor is embedded in the middle of the heat sinking block and is electrically connected with the lower PCB to feed back a temperature signal;
the heating plate is arranged inside the heat sinking block;
the carrier radiating fin is fixed on the bottom surface of the heat sink block;
the fan set is arranged on one side of the inner part of the lower shell, faces the carrier radiating fins and is provided with a matched air outlet;
wherein the heating plate and the fan set are electrically connected with the lower PCB.
By adopting the scheme, the temperature sensor detects the temperature data of the heat sink block and feeds the data back to the host machine through the lower PCB and the joint, the host machine compares the temperature data with the preset temperature, and the heating sheet or the fan set is selectively controlled to work through the lower PCB, so that the temperature control of the chip is realized, and a stable test environment is given.
Furthermore, a reset plunger is arranged between the partition plate and the bottom surface of the upper cover, the reset plunger comprises a sleeve vertically fixed on the partition plate, a plunger is arranged in the sleeve, and a reset spring is arranged between the plunger and the bottom surface of the sleeve.
Through adopting above-mentioned scheme, after hasp chucking mechanism unblock, can lift up the upper cover fast under the plunger effect that resets, control chip and spring probe separation.
Furthermore, the elastic mounting mechanism comprises a floating pin, the floating positioning plate is mounted on the bottom surface of the upper cover through a plurality of floating pins, the floating positioning plate can slide up and down along the floating pin, and a plurality of compression springs are uniformly arranged between the floating positioning plate and the bottom surface of the upper cover; the top surface of the floating positioning plate is provided with an upper radiating fin which penetrates through the upper cover.
By adopting the scheme, the floating positioning plate can slide along the floating pin in a certain range, so that adaptation to different chips is ensured, meanwhile, the compression spring compresses the floating positioning plate downwards when the upper cover is closed, and the chips are tightly compressed and attached, so that poor contact and uneven heat dissipation of the chips are avoided; the upper radiating fin ensures the heat dissipation of the upper PCB and the optical power detection mechanism, and ensures the normal work of the optical power detection mechanism.
Further, the locating plate bottom surface that floats be equipped with the round pin ware that takes off that the chip carrier matches, it includes the depression bar to take off the round pin ware, the depression bar is vertical to be passed the locating plate setting that floats, and the depression bar top is equipped with the snap ring of interfering with the locating plate that floats, the depression bar bottom with it takes off the round pin spring to be equipped with between the locating plate bottom surface that floats.
Through adopting above-mentioned scheme, when the upper cover lifted up, the depression bar still kept compressing tightly the state of chip carrier under the effect of taking off the round pin spring, lifted up to a take the altitude up to the upper cover, avoided the chip carrier to be taken up, ensured probe and chip quickly separating to produce the mar.
Furthermore, the bottom surface of the floating positioning plate is provided with a positioning pin, and the chip carrier is provided with a positioning hole matched with the positioning pin.
Further, the spring probe passes through the tucking piece to be fixed go up PCB board bottom surface, optical power detection mechanism is including seting up on the tucking piece with the light trap that the spring probe position matches, be equipped with decay piece and photoelectric detector in the light trap in proper order, photoelectric detector's output is connected with PD and detects the PCB board, PD detects the PCB board and installs go up on the PCB board and be connected output signal with last PCB electricity.
By adopting the above scheme, after the optical chip connects the electricity, the light signal gets into the light trap, hits the photoelectric detector after the decay piece on, photoelectric detector turns into the signal of telecommunication with the light signal to detect PCB board, go up PCB board and lower PCB board through PD and export the signal, realize the optical power real-time supervision to the chip.
Further, casing top bilateral symmetry is equipped with the mount pad down, the cooperation form between a pair of mount pad with the region that the upper cover matches, hasp chucking mechanism includes fixture block and dog, the fixture block symmetry is fixed upper cover bottom surface both sides, be equipped with in the mount pad with the horizontal spout that the dog matches, the dog is established horizontal slip in the horizontal spout, and the dog inner wears out the mount pad, the inner of dog with the fixture block bottom surface is equipped with the inclined plane of matching, the fixture block with be equipped with between the upper cover with the locking mouth that matches in the dog inner, the fixture block moves down the time drive the dog slides towards the outside, be equipped with in the horizontal spout and be used for the drive the dog is gliding locking spring towards the inboard.
By adopting the scheme, when the upper cover is closed, only the upper cover needs to be pressed down, the block drives the block to slide outwards to continue descending until the block slides into the locking port under the driving of the locking spring, and the locking of the upper cover is realized; when the upper cover needs to be opened, the stop block is shifted outwards to unlock the upper cover; is convenient and reliable.
Furthermore, both sides of one end of the upper cover are respectively hinged to the mounting seats on both sides, the mounting seats and the hinged ends of the upper cover are provided with vertical sliding grooves, sliding blocks are arranged in the vertical sliding grooves, adjusting springs are arranged between the sliding blocks and the bottoms of the vertical sliding grooves, both sides of the upper cover are respectively hinged to the sliding blocks in the mounting seats through connecting pins, and notches for lifting and lowering the connecting pins are formed in the mounting seats.
Through adopting above-mentioned scheme, can realize the ascending and descending of upper cover in the horizontal direction, the unblock and the locking control of the upper cover of being convenient for also help guaranteeing the chip to compress tightly and the location of chip carrier simultaneously.
Furthermore, a drawer panel is arranged on the other side of the lower shell, a handle is arranged on the drawer panel, and drawer guide rails are symmetrically arranged on two end faces of the lower shell.
By adopting the scheme, after the upper cover is installed in the detection process, the device is pushed into the electric box through the handle and the drawer guide rail to be internally connected with electricity.
Compared with the prior art, the invention has the beneficial effects that:
1. when the upper cover is closed, the lower PCB, the chip, the spring probe and the upper PCB form a loop, meanwhile, the optical power detection mechanism carries out real-time optical power detection on the chip, and detection signals are output through the upper PCB, the lower PCB and the connector, so that the aging detection and the optical power detection are synchronously carried out, the test efficiency is improved, and the cost is reduced;
2. the floating positioning plate is installed through the elastic installation mechanism and can move in a certain range, so that the floating positioning plate is adaptive to chips with different thicknesses, and meanwhile, the spring probes are adopted, so that the chips are effectively guaranteed to be pressed, and poor contact and uneven heat dissipation are avoided;
3. the invention can realize the compaction and electrification of the chip only by covering the upper cover, does not need manual control for compaction, reduces errors, is beneficial to realizing standardized detection and simplifies operation;
4. the chip temperature control mechanism detects the temperature data of the heat sinking block through the temperature sensor and feeds the temperature data back to the host through the lower PCB and the joint, the host compares the temperature data with the preset temperature, and the lower PCB selectively controls the heating sheet or the fan set to work, thereby realizing the temperature control of the chip and giving a stable test environment;
5. according to the invention, the pin release device and the positioning pin are arranged on the bottom surface of the floating positioning plate, and the plunger is arranged between the lower shell partition plate and the bottom surface of the upper cover, so that the upper cover can be opened and the chip can be separated quickly when the lock catch clamping mechanism is unlocked, the chip is prevented from being pulled by a belt body, and normal detection is ensured;
6. the sliding block at the hinge point of the upper cover and the mounting seat is arranged in a lifting manner, so that the upper cover can be lifted in the horizontal direction, the unlocking and locking control of the upper cover is facilitated, and meanwhile, the chip pressing and the positioning of a chip carrier are also facilitated to be ensured;
7. when the upper cover is closed, the upper cover only needs to be pressed down, the block drives the block to slide outwards to continue descending until the block slides into the locking port under the driving of the locking spring, and the upper cover is locked; when the upper cover needs to be opened, the stop block is shifted outwards to unlock the upper cover; is convenient and reliable.
Drawings
In order to more clearly illustrate the detailed description of the invention or the technical solutions in the prior art, the drawings that are needed in the detailed description of the invention or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic diagram of an explosive structure of an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of an upper cover according to an embodiment of the present invention.
Fig. 4 is a schematic sectional view of the plane a-a in fig. 3.
Fig. 5 is a schematic sectional view of the plane B-B in fig. 3.
Fig. 6 is a schematic structural diagram of a chip carrier according to an embodiment of the invention.
Fig. 7 is a schematic structural view of a lower case of an embodiment of the present invention.
Fig. 8 is a schematic sectional view of the plane C-C in fig. 7.
Fig. 9 is a schematic cross-sectional view of the plane D-D in fig. 7.
Fig. 10 is a schematic sectional view of plane E-E in fig. 7.
Shown in the figure:
1. a lower housing; 101. a partition plate; 102. an air outlet; 103. a drawer panel; 104. a drawer guide rail; 105. a handle;
2. a lower PCB board;
3. a chip carrier; 301. positioning holes;
4. a chip;
5. a chip temperature control mechanism; 501. heat sinking the block; 502. a temperature sensor; 503. a heating plate; 504. a carrier heat sink; 505. a fan set;
6. an upper cover; 601. a connecting pin;
7. a locking and clamping mechanism; 701. a clamping block; 702. a stopper; 703. an inclined surface; 704. a locking port; 705. a locking spring;
8. a floating positioning plate; 801. an upper heat sink; 802. a pin remover; 803. a pressure lever; 804. a snap ring; 805. a pin release spring; 806. positioning pins;
9. an elastic mounting mechanism; 901. a floating pin; 902. a compression spring;
10. an upper PCB board;
11. a spring probe;
12. an optical power detection mechanism; 1201. an attenuation sheet; 1202. a photodetector; 1203. PD detecting the PCB;
13. a joint;
14. resetting the plunger; 1401. a sleeve; 1402. a plunger; 1403. a return spring;
15. pressing the needle block; 1501. a light-transmitting hole;
16. a mounting seat; 1601. a transverse chute; 1602. a vertical chute; 1603. a slider; 1604. adjusting the spring; 1605. a notch.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the invention pertains.
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations and positional relationships based on those shown in the drawings, are merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 to 10, the present embodiment provides an optical chip rapid crimping detection apparatus, which includes a lower housing 1, a chip carrier 3, a chip temperature control mechanism 5, an upper cover 6, a floating positioning plate 8, an optical power detection mechanism 12 and a joint 13.
As shown in fig. 2, 7 to 10, a partition plate 101 is disposed on the top surface of the lower housing 1, and a lower PCB 2 is fixed to the bottom surface of the partition plate 101; the joint 13 is arranged on one side of the lower shell 1, and the joint 13 is electrically connected with the lower PCB 2 and used for forming a power supply loop and conducting signals of the chip temperature control mechanism 5 and the optical power detection mechanism 12.
The other side of the lower shell 1 is provided with a drawer panel 103, the drawer panel 103 is provided with a handle 105, two end faces of the lower shell 1 are symmetrically provided with drawer guide rails 104, and after the upper cover 6 is mounted in the detection process, the device is pushed into an electric box through the handle 105 and the drawer guide rails 104 to be connected with electricity.
The chip carrier 3 is arranged on the top surface of the lower shell 1, the chips 4 are uniformly placed on the chip carrier 3, and the chips 4 are electrically connected with the lower PCB 2; the chip temperature control mechanism 5 is arranged in the lower shell 1 and used for controlling the temperature of the chip carrier 3, and the chip temperature control mechanism 5 is electrically connected with the lower PCB 2.
The chip temperature control mechanism 5 includes a heat sink 501, a temperature sensor 502, a heater plate 503, a carrier heat sink 504 and a fan set 505.
The heat sink block 501 penetrates through the middle of the partition 101 to be fixed, and the chip carrier 3 is fixed on the top surface of the heat sink block 501. The temperature sensor 502 is embedded in the middle of the heat sink block 501, and the temperature sensor 502 is electrically connected with the lower PCB 2 to feed back a temperature signal; the heating sheet 503 is disposed inside the heat sink block 501; the carrier heat sink 504 is fixed on the bottom of the heat sink 501; the fan set 505 is disposed at one side of the interior of the lower casing 1, the fan set 505 is disposed toward the carrier heat sink 504, and the other side of the lower casing 1 is disposed with the matching air outlet 102.
Wherein the heating plate 503 and the fan assembly 505 are electrically connected to the lower PCB 2.
The temperature sensor 502 detects the temperature data of the heat sink block 501 and feeds the temperature data back to the host machine through the lower PCB 2 and the connector 13, the host machine compares the temperature data with the preset temperature, and the lower PCB 2 selectively controls the heating plate 503 or the fan set 505 to work, so that the temperature control of the chip 4 is realized, and a stable test environment is given.
As shown in fig. 2 to 5, the upper cover 6 is disposed above the lower housing 1, one end of the upper cover 6 is hinged to the lower housing 1, and a locking mechanism 7 is disposed between two sides of the upper cover 6 and the lower housing 1.
The floating positioning plate 8 is installed on the bottom surface of the upper cover 6 through an elastic installation mechanism 9, an upper PCB 10 is fixed on the bottom surface of the floating positioning plate 8, the upper PCB 10 is electrically connected with a lower PCB, and a spring probe 11 matched with the chip 4 is installed on the bottom surface of the upper PCB 10.
A reset plunger 14 is arranged between the partition plate 101 and the bottom surface of the upper cover 6, the reset plunger 14 comprises a sleeve 1401 vertically fixed on the partition plate 101, a plunger 1402 is arranged in the sleeve 1401, and a reset spring 1403 is arranged between the plunger 1402 and the bottom surface of the sleeve 1401.
After the lock catch clamping mechanism 7 is unlocked, the upper cover 6 can be quickly lifted under the action of the reset plunger 14, and the control chip 4 is separated from the spring probe 11.
The mounting seats 16 are symmetrically arranged on two sides of the top of the lower shell 1, an area matched with the upper cover 6 is formed between the pair of mounting seats 16 in a matched mode, the lock catch clamping mechanism 7 comprises a clamping block 701 and a stop block 702, the clamping block 701 is symmetrically fixed on two sides of the bottom surface of the upper cover 6, a transverse sliding groove 1601 matched with the stop block 702 is arranged in each mounting seat 16, the stop block 702 is arranged in the transverse sliding groove 1601 in a transverse sliding mode, the inner end of the stop block 702 penetrates out of the mounting seats 16, a matched inclined plane 703 is arranged between the inner end of the stop block 702 and the bottom surface of the clamping block 701, a locking port 704 matched with the inner end of the stop block 702 is arranged between the clamping block 701 and the upper cover 6, the stop block 702 is.
When the upper cover 6 is closed, only the upper cover 6 needs to be pressed down, the block 701 drives the block 702 to slide towards the outside and continue to descend until the block 702 slides into the locking port 704 under the driving of the locking spring 705, and the upper cover 6 is locked; when the upper cover 6 needs to be opened, the stop block 702 is shifted outwards to unlock the upper cover 6, and the upper cover 6 automatically bounces under the action of the reset plunger 14, so that the device is convenient and fast.
6 one end both sides of upper cover are articulated with the mount pad 16 of both sides respectively, vertical spout 1602 has been seted up with the hinged end of upper cover 6 to mount pad 16, be equipped with slider 1603 in the vertical spout 1602, be equipped with adjustment spring 1604 between slider 1603 and the vertical spout 1602 bottom, 6 both sides of upper cover are passed through connecting pin 601 and are articulated the setting with the slider 1603 in the mount pad 16 of both sides respectively, and set up the notch 1605 that supplies connecting pin 601 lift action on the mount pad 16, can realize the ascending and descending of upper cover 6 on the horizontal direction, be convenient for the unblock and the locking control of upper cover 6, also help guaranteeing chip 4 to compress tightly the location with chip carrier 3 simultaneously, avoid chip 4 to shift.
The elastic mounting mechanism 9 comprises a floating pin 901, the floating positioning plate 8 is mounted on the bottom surface of the upper cover 6 through a plurality of floating pins 901, the floating positioning plate 8 can slide up and down along the floating pin 901, and a plurality of compression springs 902 are uniformly arranged between the floating positioning plate 8 and the bottom surface of the upper cover 6; the top surface of the floating positioning plate 8 is provided with an upper heat radiating fin 801, and the upper heat radiating fin 801 penetrates through the upper cover 6.
The floating positioning plate 8 can slide along the floating pin 901 to a certain extent, so that the different chips 4 can be matched, meanwhile, when the upper cover 6 is closed, the pressing spring 902 presses the floating positioning plate 8 downwards, so that the chips 4 are tightly pressed and attached, and the poor contact and uneven heat dissipation of the chips 4 are avoided; the upper heat sink 801 ensures heat dissipation of the upper PCB 10 and the optical power detection mechanism 12, and ensures normal operation of the optical power detection mechanism 12.
The bottom surface of the floating positioning plate 8 is provided with a pin remover 802 matched with the chip carrier 3, the pin remover 802 comprises a pressure lever 803, the pressure lever 803 vertically penetrates through the floating positioning plate 8, the top end of the pressure lever 803 is provided with a snap ring 804 interfering with the floating positioning plate 8, and a pin removing spring 805 is arranged between the bottom end of the pressure lever 803 and the bottom surface of the floating positioning plate 8.
When the upper cover 6 is lifted, the pressing rod 803 still keeps the state of pressing the chip carrier 3 under the action of the pin-releasing spring 805 until the upper cover 6 is lifted to a certain height, so as to avoid the chip carrier 3 from being taken up, and ensure that the probe is quickly separated from the chip 4 so as to avoid generating scratches.
The bottom surface of the floating positioning plate 8 is provided with a positioning pin 806, and the chip carrier 3 is provided with a positioning hole 301 matched with the positioning pin 806.
The optical power detection mechanism 12 is mounted on the bottom surface of the upper PCB 10 for monitoring the optical power of the chip 4 in real time, and the optical power detection mechanism 12 is electrically connected with the upper PCB 10.
The photodetector 1202 is specifically model TO 46-1.
When the chip 4 is connected with electricity, an optical signal enters the light hole 1501, passes through the attenuator 1201 and then hits the photoelectric detector 1202, the photoelectric detector 1202 converts the optical signal into an electric signal, and the signal is output through the PD detection PCB, the upper PCB 10 and the lower PCB 2, so that the optical power of the chip 4 is monitored in real time.
The specific working process of this embodiment is as follows:
1. opening the upper cover 6 to fix the chip 4 on the chip carrier 3;
2. closing the upper cover 6 to a horizontal position, pressing the upper cover 6 downwards, driving the fixture block 701 to drive the stop block 702 to slide towards the outer side until the stop block 702 is inserted into the locking port 704 under the driving of the locking spring 705, and realizing the locking of the upper cover 6;
3. the device is pushed into an electrical box through a drawer guide rail 104 and a handle 105, an interface is connected with electricity to form a loop, and detection is started: the temperature sensor 502 monitors the temperature of the heat sink block 501 in real time and feeds the temperature back to the host through the lower PCB 2 and the interface, and the host selectively controls the heating plate 503 or the fan set 505 to work by comparing the detected temperature with the real-time temperature, so as to ensure that the chip 4 detects the temperature; light emitted by the chip 4 enters the light hole 1501, and passes through the attenuation sheet 1201 and strikes the photoelectric detector 1202, the photoelectric detector 1202 converts an optical signal into an electric signal, and the PD detects the signal output by the PCB, the upper PCB 10 and the lower PCB 2, so that the real-time monitoring of the optical power of the chip 4 is realized.
In this embodiment, when the upper cover 6 is closed, the lower PCB 2, the chip 4, the spring probe 11, and the upper PCB 10 form a loop, and the optical power detection mechanism 12 performs real-time optical power detection on the chip 4, and a detection signal is output through the upper PCB 10, the lower PCB 2, and the connector 13, so that the aging detection and the optical power detection are performed synchronously, the test efficiency is improved, and the cost is reduced;
the floating positioning plate 8 is installed through the elastic installation mechanism 9 and can move within a certain range, so that the floating positioning plate is adaptive to chips 4 with different thicknesses, and meanwhile, the spring probes 11 are adopted, so that the chips 4 are effectively guaranteed to be pressed, and poor contact and uneven heat dissipation are avoided;
the manual work of this embodiment only need cover upper cover 6 and can realize the circular telegram that compresses tightly of chip 4, and upper cover 6 convenient operation, reliable need not manual control and compresses tightly, reduce the error, help realizing standardized detection, simplified operation.
In the description of the present invention, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (10)
1. The utility model provides a quick crimping detection device of optical chip which characterized in that includes:
the lower shell is internally fixed with a lower PCB;
the chip carrier is arranged on the top surface of the lower shell, chips are uniformly placed on the chip carrier, and the chips are electrically connected with the lower PCB;
the chip temperature control mechanism is arranged in the lower shell and used for controlling the temperature of the chip carrier, and the chip temperature control mechanism is electrically connected with the lower PCB;
the upper cover is arranged above the lower shell, one end of the upper cover is hinged with the lower shell, and lock catch clamping mechanisms are arranged between two sides of the upper cover and the lower shell;
the floating positioning plate is installed on the bottom surface of the upper cover through an elastic installation mechanism, an upper PCB is fixed on the bottom surface of the floating positioning plate, the upper PCB is electrically connected with the lower PCB, and a spring probe matched with the chip is installed on the bottom surface of the upper PCB;
the optical power detection mechanism is arranged on the bottom surface of the upper PCB and used for monitoring the optical power of the chip in real time, and the optical power detection mechanism is electrically connected with the upper PCB;
and the joint is arranged on one side of the lower shell and is electrically connected with the lower PCB to form a power supply loop and conduct signals of the chip temperature control mechanism and the optical power detection mechanism.
2. The optical chip rapid crimping detection device according to claim 1, wherein a partition is disposed on a top surface of the lower housing, the lower PCB is fixed to a bottom surface of the partition, and the chip temperature control mechanism includes:
the heat sinking block penetrates through the middle part of the partition plate to be fixed, and the chip carrier is fixed on the top surface of the heat sinking block;
the temperature sensor is embedded in the middle of the heat sinking block and is electrically connected with the lower PCB to feed back a temperature signal;
the heating plate is arranged inside the heat sinking block;
the carrier radiating fin is fixed on the bottom surface of the heat sink block;
the fan set is arranged on one side of the inner part of the lower shell, faces the carrier radiating fins and is provided with a matched air outlet;
wherein the heating plate and the fan set are electrically connected with the lower PCB.
3. The optical chip rapid crimping detection device according to claim 2, wherein a reset plunger is arranged between the partition plate and the bottom surface of the upper cover, the reset plunger comprises a sleeve vertically fixed on the partition plate, a plunger is arranged in the sleeve, and a reset spring is arranged between the plunger and the bottom surface of the sleeve.
4. The optical chip rapid crimping detection device according to claim 1, wherein the elastic mounting mechanism includes a floating pin, the floating positioning plate is mounted on the bottom surface of the upper cover through a plurality of the floating pins, the floating positioning plate can slide along the floating pin and down, and a plurality of compression springs are uniformly arranged between the floating positioning plate and the bottom surface of the upper cover; the top surface of the floating positioning plate is provided with an upper radiating fin which penetrates through the upper cover.
5. The optical chip rapid crimping detection device according to claim 1, wherein the bottom surface of the floating positioning plate is provided with a pin remover matching with the chip carrier, the pin remover comprises a pressure rod vertically passing through the floating positioning plate, a top end of the pressure rod is provided with a snap ring interfering with the floating positioning plate, and a pin removing spring is arranged between a bottom end of the pressure rod and the bottom surface of the floating positioning plate.
6. The optical chip rapid crimping detection device according to claim 1, wherein a positioning pin is disposed on a bottom surface of the floating positioning plate, and a positioning hole matched with the positioning pin is disposed on the chip carrier.
7. The optical chip rapid crimping detection device according to claim 1, wherein the spring probe is fixed on the bottom surface of the upper PCB by a pin pressing block, the optical power detection mechanism includes a light hole formed on the pin pressing block and matched with the position of the spring probe, an attenuation sheet and a photodetector are sequentially disposed in the light hole, an output end of the photodetector is connected with a PD detection PCB, and the PD detection PCB is mounted on the upper PCB and electrically connected with the upper PCB to output signals.
8. The optical chip rapid crimping detection device according to claim 1, wherein mounting seats are symmetrically arranged on two sides of the top of the lower housing, a region matched with the upper cover is formed between a pair of the mounting seats in a matched manner, the locking mechanism comprises a clamping block and a stop block, the clamping block is symmetrically fixed on two sides of the bottom surface of the upper cover, a transverse sliding groove matched with the stop block is formed in the mounting seats, the stop block is arranged in the transverse sliding groove and transversely slides, the inner end of the stop block penetrates out of the mounting seats, a matched inclined plane is arranged between the inner end of the stop block and the bottom surface of the clamping block, a locking port matched with the inner end of the stop block is formed between the clamping block and the upper cover, the stop block is driven to slide towards the outer side when moving downwards, and a locking spring used for driving the stop block to slide towards.
9. The optical chip rapid crimping detection device according to claim 8, wherein two sides of one end of the upper cover are respectively hinged to the mounting seats on two sides, a vertical sliding groove is formed in the hinged end of the mounting seat and the upper cover, a sliding block is arranged in the vertical sliding groove, an adjusting spring is arranged between the sliding block and the bottom of the vertical sliding groove, two sides of the upper cover are respectively hinged to the sliding blocks in the mounting seats on two sides through connecting pins, and a notch for lifting the connecting pins is formed in the mounting seats.
10. The optical chip rapid crimping detection device according to any one of claims 1 to 9, wherein a drawer panel is disposed on the other side of the lower housing, a handle is disposed on the drawer panel, and drawer guide rails are symmetrically disposed on two end faces of the lower housing.
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| CN202011414155.1A CN112197820B (en) | 2020-12-07 | 2020-12-07 | Optical chip rapid crimping detection device |
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| CN202011414155.1A CN112197820B (en) | 2020-12-07 | 2020-12-07 | Optical chip rapid crimping detection device |
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