CN111367230A - Device and method for realizing real-time monitoring of optical power in laser chip aging process - Google Patents
Device and method for realizing real-time monitoring of optical power in laser chip aging process Download PDFInfo
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- CN111367230A CN111367230A CN202010363920.5A CN202010363920A CN111367230A CN 111367230 A CN111367230 A CN 111367230A CN 202010363920 A CN202010363920 A CN 202010363920A CN 111367230 A CN111367230 A CN 111367230A
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- optical power
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0428—Safety, monitoring
Abstract
The invention relates to the technical field of testing and aging equipment, in particular to a device and a method for monitoring the optical power of a laser chip in an aging process in real time. Compared with the prior art, the device and the method for monitoring the optical power of the laser chip in the aging process in real time do not need to carry an integrating sphere motion scanning mechanism, have simpler structural design and greatly reduced equipment volume, can realize the single-channel independent real-time acquisition of the optical power of the high-power laser chip in the aging process, reduce the relevance among channels and have higher channel density of the equipment.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of testing and aging equipment, in particular to a device and a method capable of realizing real-time monitoring of optical power in an aging process of a laser chip.
[ background of the invention ]
Because the optical power detector and the optical attenuation sheet can not bear the laser energy of the high-power chip, the optical power monitoring in the aging equipment is realized in a way that the linear motion device drives the integrating sphere to receive light, the laser is attenuated and input into the detector to read the optical power value after being uniformly reflected on the surface of the sphere, and the laser chips in the aging process need to be circularly scanned one by one. The integrating sphere moves and scans the mode, which causes the equipment mechanism to be complicated and the volume to be enlarged, the integrating sphere cannot monitor the light power change of each channel in real time, only periodic cyclic scanning can be realized, and the monitoring effect is poor.
[ summary of the invention ]
In order to overcome the above problems, the present invention provides an apparatus and a method capable of real-time monitoring the optical power of the laser chip in the aging process.
The invention provides a technical scheme for solving the technical problems, which comprises the following steps: the device comprises an optical power monitoring mechanism, wherein an aging constant-temperature platform is arranged on one side of the optical power monitoring mechanism, a plurality of chip clamps are fixed on the aging constant-temperature platform, and a laser chip is fixed on each chip clamp; the optical power monitoring mechanism, the aging constant-temperature platform and the chip clamp are all arranged in the test aging equipment, and the optical power monitoring mechanism is connected to an upper computer and used for collecting laser data generated by the laser chip in the aging process; the optical power monitoring mechanism comprises a monitoring base, an optical power detection PCB assembly is fixed on one side of the monitoring base, a cleaning air blowing strip is fixed on the other side of the monitoring base, the chip clamp abuts against the cleaning air blowing strip, and the optical power detection PCB assembly is connected to an upper computer; and a plurality of porous ceramic attenuation sheets are fixed inside the cleaning and blowing strip.
Preferably, the monitoring base comprises a fixed base and a supporting pedestal, the supporting pedestal is fixed above the fixed base, and the fixed base is fixed in the test aging equipment.
Preferably, the supporting pedestal is in a strip shape and is provided with a row of accommodating grooves, the optical power detection PCB assembly is provided with a row of PD detectors, and the PD detectors are arranged in the accommodating grooves.
Preferably, a plurality of attenuation grooves are formed in the cleaning air blowing strip, and the porous ceramic attenuation pieces are fixed in the attenuation grooves.
Preferably, the outer side of the cleaning and blowing strip is further provided with a plurality of light inlet holes, the light inlet holes are communicated with the attenuation grooves, and the positions of the light inlet holes correspond to the positions of the laser chips.
Preferably, the two ends of the cleaning and blowing strip are respectively provided with an air inlet hole and an air outlet hole, an air channel is arranged between the air inlet hole and the air outlet hole, and the air channel is communicated with the air inlet hole, the air outlet hole and the light inlet hole.
Preferably, an air tap is arranged at the outer side of the air inlet hole and connected with an air source device.
Preferably, the optical power detection PCB assembly comprises a PCB circuit board, the PCB circuit board comprises a main control MCU, a sampling channel, a power supply and an RS485 communication chip, the sampling channel, the power supply and the RS485 communication chip are respectively connected to the main control MCU, and the PD detector is connected to the sampling channel.
Preferably, the sampling channel includes a sampling IC chip, a first sampling resistor, a second sampling resistor, and a filter capacitor, and the first sampling resistor, the second sampling resistor, and the filter capacitor are respectively connected to the sampling IC chip.
Preferably, the method for monitoring the optical power of the laser chip in the aging process in real time includes the following steps:
step S1, fixing the laser chip on the chip clamp, and placing the chip clamp on the aging constant-temperature platform;
step S2, the aging constant temperature platform provides a stable temperature environment, the chip clamp powers on the laser chip, and the air nozzle inputs dry and clean compressed air into the air inlet;
step S3, the laser chip is powered on to emit laser, the laser is injected from the light inlet hole of the clean air blowing strip and enters the PD detector in the containing groove after being attenuated by the porous ceramic attenuation piece;
and step S4, transmitting the laser data information acquired by the PD detector to the master control MCU through the sampling channel, and feeding back the laser data information to the upper computer through the RS485 communication chip after data processing by the master control MCU.
Compared with the prior art, the device and the method for monitoring the optical power of the laser chip in the aging process in real time have the following beneficial effects:
1. the porous ceramic attenuation sheet solves the problem that the traditional optical attenuation sheet cannot bear high-power laser energy, and the cost is far lower than that of the optical attenuation sheet;
2. an integrating sphere motion scanning mechanism is not required to be carried, the structural design is simpler, and the volume of the equipment is greatly reduced;
3. the optical power single channel independent real-time acquisition in the aging process of the high-power laser chip can be realized, the relevance between the channels is reduced, the channel density of the equipment is higher, the equipment is divided into a plurality of aging units through modular design, the units can work independently, the flexibility of the equipment is greatly improved, and the service efficiency of the equipment is higher.
[ description of the drawings ]
FIG. 1 is a general structural diagram of an apparatus for real-time monitoring of optical power during aging of a laser chip according to the present invention;
FIG. 2 is a diagram of the overall structure of the optical power monitoring mechanism of the apparatus for real-time monitoring the optical power of the laser chip during the aging process according to the present invention;
FIG. 3 is an exploded view of an optical power monitoring mechanism of the apparatus for real-time monitoring of optical power during the aging process of a laser chip according to the present invention;
FIG. 4 is a diagram of a cleaning blowing bar structure of the device for real-time monitoring of the optical power of the laser chip in the aging process;
FIG. 5 is a circuit diagram of an optical power detection PCB assembly of the apparatus for real-time monitoring of optical power during laser chip aging according to the present invention;
FIG. 6 is a circuit diagram of a sampling channel circuit of the apparatus for real-time monitoring of optical power during aging of a laser chip according to the present invention;
FIG. 7 is a diagram of the overall structure of the apparatus for real-time monitoring of the optical power of the laser chip during the aging process according to the present invention;
FIG. 8 is a first perspective view of the explosive structure of the chip holder of the apparatus for real-time monitoring of optical power during laser chip aging in accordance with the present invention;
FIG. 9 is a second perspective view of the explosive structure of the chip holder of the apparatus for real-time monitoring of optical power during laser chip aging in accordance with the present invention;
FIG. 10 is a first perspective view of a chip clamp temperature control circuit board of the apparatus for real-time monitoring of optical power during laser chip aging in accordance with the present invention;
FIG. 11 is a second perspective view of a chip clamp temperature control circuit board of the apparatus for real-time monitoring of optical power during laser chip aging in accordance with the present invention;
FIG. 12 is a first perspective view of a chip clamp power-up circuit board of the apparatus for real-time monitoring of optical power during laser chip aging in accordance with the present invention;
FIG. 13 is a second perspective view of a chip clamp power-up circuit board of the apparatus for real-time monitoring of optical power during laser chip aging in accordance with the present invention;
FIG. 14 is a first perspective view of a chip clamp and voltage block of the apparatus for real-time monitoring of optical power during laser chip aging in accordance with the present invention;
FIG. 15 is a second perspective view of a chip clamp and voltage block of the apparatus for real-time monitoring of optical power during laser chip aging in accordance with the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that all directional indications (such as up, down, left, right, front, and back … …) in the embodiments of the present invention are limited to relative positions on a given view, not absolute positions.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Referring to fig. 1 to 15, the apparatus for monitoring the optical power of the laser chip in real time during the aging process of the laser chip of the present invention includes an optical power monitoring mechanism 100, an aging constant temperature platform 200 is disposed on one side of the optical power monitoring mechanism 100, a plurality of chip clamps 300 are fixed on the aging constant temperature platform 200, and a laser chip 370 is fixed on each chip clamp 300. Optical power monitoring mechanism 100, ageing constant temperature platform 200, chip anchor clamps 300 all set up in testing ageing equipment, optical power monitoring mechanism 100 connects in the host computer for gather the laser data that laser chip 370 produced in the ageing process, feed back to the host computer after handling data, realize the optical power real time monitoring of laser chip 370 ageing process. The aging oven platform 200 is used to provide a relatively stable temperature environment to meet different aging conditions. The chip holder 300 is used for fixing the laser chip 370 and energizing the laser chip 370 to emit laser light.
The optical power monitoring mechanism 100 comprises a monitoring base 110, an optical power detection PCB assembly 120 is fixed on one side of the monitoring base 110, a cleaning air blowing strip 130 is fixed on the other side of the monitoring base 110, the chip clamp 300 is close to the cleaning air blowing strip 130, and the optical power detection PCB assembly 120 is connected to an upper computer. The cleaning and blowing strip 130 is internally fixed with a plurality of porous ceramic attenuation pieces 150, laser emitted by the laser chip 370 is attenuated by the porous ceramic attenuation pieces 150 and then is projected to the optical power detection PCB assembly 120, and the optical power detection PCB assembly 120 is subjected to data processing and then is fed back to an upper computer.
The monitoring base 110 comprises a fixing base 111 and a supporting base 112, the supporting base 112 is fixed above the fixing base 111, the fixing base 111 is fixed in the test aging equipment, and heat generated in the laser attenuation process can be conducted to a water cooling system on the test aging equipment through the fixing base 111 to be taken away. The supporting pedestal 112 is strip-shaped and is provided with a row of accommodating grooves 113, the optical power detection PCB assembly 120 is provided with a row of PD detectors 122, the PD detectors 122 are arranged in the accommodating grooves 113, and each accommodating groove 113 is provided with one PD detector 122. A plurality of attenuation grooves 137 are formed in the cleaning and blowing bar 130, the porous ceramic attenuation pieces 150 are fixed in the attenuation grooves 137, and the positions of the attenuation grooves 137 correspond to the positions of the accommodating grooves 113 one by one. The outer side of the cleaning air blowing strip 130 is further provided with a plurality of light inlet holes 131, the light inlet holes 131 are communicated with the attenuation groove 137, the positions of the light inlet holes 131 correspond to the positions of the laser chips 370, laser emitted by the laser chips 370 enters the attenuation groove 137 from the light inlet holes 131, enters the PD detector 122 in the accommodating groove 113 after being attenuated by the porous ceramic attenuation sheet 150 in the attenuation groove 137, and the PD detector 122 collects laser for optical power detection, namely the PCB assembly 120 performs data processing and feeds the laser back to the upper computer.
An air inlet hole 133 and an air outlet hole 134 are respectively formed at two ends of the cleaning and blowing strip 130, an air channel 132 is arranged between the air inlet hole 133 and the air outlet hole 134, and the air channel 132 is communicated with the air inlet hole 133, the air outlet hole 134 and the light inlet hole 131. An air nozzle 123 is arranged outside the air inlet 133, and the air nozzle 123 is connected with an air source device. Because the laser chip 370 is aged for a long time, dry and clean compressed air is input from the air nozzle 123 in the aging process and distributed to the chip light-emitting end faces of the light inlet holes 131 through the air channel 132, so that the whole aging process is safer and more stable.
The optical power detection PCB assembly 120 includes a PCB circuit board 121, and the PD detectors 122 are disposed on the PCB circuit board 121. PCB circuit board 121 includes master control MCU, sampling channel, power supply and RS485 communication chip connect respectively in master control MCU, PD detector 122 connects in sampling channel. Laser data information collected by the PD detector 122 is transmitted to the main control MCU through the sampling channel, and the main control MCU is subjected to data processing and then fed back to an upper computer through the RS485 communication chip.
The sampling channel comprises a sampling IC chip, a first sampling resistor, a second sampling resistor and a filter capacitor, wherein the first sampling resistor, the second sampling resistor and the filter capacitor are respectively connected to the sampling IC chip.
A plurality of first screw holes 123 are formed in the PCB 121, and the PCB 121 is fixed to the monitoring base 110 through screws and the first screw holes 123. The supporting pedestal 112 is provided with a plurality of second screw holes 114, the cleaning and blowing bar 130 is provided with a plurality of screw grooves 135, the screw grooves 135 are provided with third screw holes 136, and the cleaning and blowing bar 130 is fixed to the supporting pedestal 112 through screws, the third screw holes 136 and the second screw holes 114.
The chip clamp 300 comprises a heat dissipation base 310, wherein a positioning sheet 320 is fixed on the heat dissipation base 310, and a laser chip 370 is placed on the positioning sheet 320. The heat dissipation base 310 is further provided with a temperature control circuit board 330 for monitoring temperature changes of the heat dissipation base 310. And a power-up circuit board 340 is arranged above the temperature control circuit board 330, the power-up circuit board 340 is electrically connected with the laser chip 370, and the power-up circuit board 340 is connected with a power supply in the burn-in test equipment and used for powering up the laser chip 370. A voltage-applying block 350 is disposed above the voltage-applying circuit board 340 for pressing the voltage-applying circuit board 340 to maintain close contact with the laser chip 370 to ensure good electrical connection. The temperature control circuit board 330, the power-on circuit board 340 and the power-on pressing block 350 are fixed on the heat dissipation base 310 through the set screws 360. The laser chip 370 is held within the spacer 320 by the piezoelectric block 350.
The positioning plate 320 is provided with a positioning groove 321, and the laser chip 370 is positioned in the positioning groove 321. The power-up circuit board 340 is provided with a power-up electrode 342 at one end, and the power-up electrode 342 is electrically connected with the laser chip 370.
The heat dissipation base 310 is provided with a resistor packaging groove 3121, the temperature control circuit board 330 is provided with a thermistor 332, and the thermistor 332 is packaged in the resistor packaging groove 3121.
During operation, heat dissipation base 310 and ageing constant temperature platform 200 are laminated tightly, guarantee good laminating heat conduction between laser chip 370 and the ageing constant temperature platform 200, temperature control circuit board 330 electricity is connected in the temperature controller in the ageing equipment of test, the semiconductor cooler in the ageing equipment of test is connected to the temperature controller, semiconductor cooler elevating temperature, thermistor 332 gathers after heat dissipation base 310 temperature and feeds back to the temperature controller through temperature control circuit board 330, the temperature controller control semiconductor cooler elevating temperature, thereby heat dissipation base 310 guarantees through good heat conduction that laser chip 370 is in the temperature environment of ideal and carries out the test ageing process. In addition, for the product with the thermistor 332 on the laser chip 370, the power-up electrode 342 on the power-up circuit board 340 can also be communicated with the thermistor 332 on the laser chip 370, so as to monitor the actual temperature of the laser chip 370 in real time, and compare the actual temperature with the temperature control temperature of the clamp, thereby achieving the effect of high-precision and stable temperature control.
The heat dissipation base 310 further includes a second supporting surface 312, and the temperature control circuit board 330 is fixed to the second supporting surface 312. The second supporting surface 312 is provided with a second positioning column 3122, the temperature control circuit board 330, the power-on circuit board 340, and the power-on pressing block 350 are respectively provided with a second positioning hole 333, a third positioning hole 344, and a fourth positioning hole 352, which are matched with the second positioning column 3122, and the second positioning column 3122 is sequentially inserted into the second positioning hole 333, the third positioning hole 344, and the fourth positioning hole 352 to achieve positioning connection of the temperature control circuit board 330, the power-on circuit board 340, and the power-on pressing block 350. The second supporting surface 312 is further provided with a lock screw hole 3123, and the set screw 360 is fixed in the lock screw hole 3123. The temperature control circuit board 330, the power-up circuit board 340 and the power-up pressing block 350 are respectively provided with a first screw hole 334, a second screw hole 345 and a third screw hole 351, and the fastening screw 360 sequentially penetrates through the third screw hole 351, the second screw hole 345 and the first screw hole 334 to be fixed in the lock screw hole 3123. The resistor encapsulation groove 3121 opens into the second support surface 312. First holding surface 311 and second holding surface 312 are parallel planes, and the height of second holding surface 312 is less than the height of first holding surface 311, do benefit to shorten and add the laminating distance of power-on circuit board 340 and laser chip 370, guarantee better contact, also provide the setting space for accuse temperature circuit board 330 simultaneously. The heat dissipation base 310 is made of copper material plated with gold, and has good heat conduction performance. The positioning sheet 320 is made of stainless steel, has good heat-conducting property, is not easy to deform and has a good positioning effect.
A clearance groove 353 is formed in one end of the voltage applying pressing block 350, the position of the clearance groove 353 corresponds to the position of the laser chip 370, heat dissipation of the laser chip 370 is facilitated, materials used for the voltage applying pressing block 350 are saved, and cost is saved. Two sides of the bottom of the clearance groove 353 are provided with first pressing protrusions 354, and the positions of the first pressing protrusions 354 correspond to the position of the powered electrode 342, so that the powered electrode 342 is pressed to be in tight contact with the laser chip 370. The bottom of the other end of the energizing block 350 is provided with a second pressing protrusion 355, and the position of the second pressing protrusion 355 corresponds to the energizing circuit board 340, so as to facilitate pressing and fixing the energizing circuit board 340 and the temperature control circuit board 330 below the energizing circuit board 340.
The temperature control circuit board 330 includes a temperature control substrate 331, and the second positioning hole 333 and the first screw hole 334 are both disposed on the temperature control substrate 331. Thermistor 332 sets up in temperature control base plate 331 lower surface one end, and temperature control base plate 331 upper surface is provided with first PCB lead wire 335, and first PCB lead wire 335 one end is connected with thermistor 332 electricity, and the PAD position to temperature control circuit board 330 is drawn forth to the other end, and the during operation contacts with the probe in the test ageing equipment, realizes being connected of thermistor 332 and temperature controller to the realization is to the temperature acquisition and the control of anchor clamps.
The power-up circuit board 340 includes a power-up substrate 341, and the third positioning holes 344 and the second screw holes 345 are all opened on the power-up substrate 341. The power-up electrode 342 is disposed at one end of the power-up substrate 341, and a shorting pin 343 is disposed at the other end of the power-up substrate, and the shorting pin 343 is used to short-circuit the anode and the cathode of the laser chip 370 with a shorting cap during transportation, so as to prevent electrostatic damage to the laser chip 370. One side of the power-up substrate 341 is provided with a second PCB lead 346, one end of the second PCB lead 346 is electrically connected with the power-up electrode 342, and the other end is led out to the PAD position of the power-up circuit board 340, and when the power-up circuit board 340 is in operation, the second PCB lead 346 is in contact with a probe in the test aging equipment, so that the power-up circuit board 340 is connected with a power supply to power up the laser chip 370.
The method for monitoring the optical power of the laser chip in the aging process in real time comprises the following steps:
step S1, fixing the laser chip 370 on the chip clamp 300, and placing the chip clamp 300 on the aging constant temperature platform 200;
step S2, the aging constant temperature platform 200 provides a stable temperature environment, the chip clamp 300 powers on the laser chip 370, and the air nozzle 123 inputs dry and clean compressed air into the air inlet 133;
step S3, the laser chip 370 is powered on to emit laser, the laser is injected from the light inlet 131 of the clean air blowing strip 130, and enters the PD detector 122 in the accommodating groove 113 after being attenuated by the porous ceramic attenuation piece 150;
and step S4, transmitting the laser data information acquired by the PD detector 122 to the master control MCU through the sampling channel, and feeding the laser data information back to the upper computer through the RS485 communication chip after data processing by the master control MCU.
Compared with the prior art, the device and the method for monitoring the optical power of the laser chip in the aging process in real time have the following beneficial effects:
1. the porous ceramic attenuation sheet 150 is adopted to solve the problem that the traditional optical attenuation sheet cannot bear high-power laser energy, and the cost is far lower than that of the optical attenuation sheet;
2. an integrating sphere motion scanning mechanism is not required to be carried, the structural design is simpler, and the volume of the equipment is greatly reduced;
3. the optical power single channel independent real-time acquisition in the aging process of the high-power laser chip 370 can be realized, the relevance between the channels is reduced, the channel density of the equipment is higher, the equipment is divided into a plurality of aging units through modular design, the units can work independently, the flexibility of the equipment is greatly improved, and the service efficiency of the equipment is higher.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and any modifications, equivalents, improvements, etc. made within the spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. The device capable of realizing real-time monitoring of the optical power of the laser chip in the aging process is characterized by comprising an optical power monitoring mechanism, wherein an aging constant-temperature platform is arranged on one side of the optical power monitoring mechanism, a plurality of chip clamps are fixed on the aging constant-temperature platform, and a laser chip is fixed on each chip clamp;
the optical power monitoring mechanism, the aging constant-temperature platform and the chip clamp are all arranged in the test aging equipment, and the optical power monitoring mechanism is connected to an upper computer and used for collecting laser data generated by the laser chip in the aging process;
the optical power monitoring mechanism comprises a monitoring base, an optical power detection PCB assembly is fixed on one side of the monitoring base, a cleaning air blowing strip is fixed on the other side of the monitoring base, the chip clamp abuts against the cleaning air blowing strip, and the optical power detection PCB assembly is connected to an upper computer;
and a plurality of porous ceramic attenuation sheets are fixed inside the cleaning and blowing strip.
2. The apparatus for real-time monitoring of optical power during laser chip burn-in as claimed in claim 1, wherein the monitoring base comprises a fixing base and a supporting base, the supporting base is fixed above the fixing base, and the fixing base is fixed in the test burn-in device.
3. The apparatus as claimed in claim 2, wherein the support pedestal is an elongated strip having a row of receiving slots, and the optical power detection PCB assembly has a row of PD detectors disposed therein.
4. The device for real-time monitoring of optical power of the laser chip aging process as claimed in claim 1, wherein a plurality of attenuation slots are disposed in the cleaning blowing bar, and the porous ceramic attenuation plates are fixed in the attenuation slots.
5. The apparatus according to claim 4, wherein the cleaning blowing bar has a plurality of light holes formed on an outer side thereof, the light holes are connected to the attenuating grooves, and the light holes are located at positions corresponding to the laser chip.
6. The apparatus according to claim 5, wherein the cleaning blowing bar has an air inlet hole and an air outlet hole at two ends thereof, and an air channel is disposed between the air inlet hole and the air outlet hole and communicates with the air inlet hole, the air outlet hole and the light inlet hole.
7. The apparatus for real-time monitoring of optical power during aging of laser chip as claimed in claim 6, wherein an air nozzle is disposed outside the air inlet hole, and the air nozzle is connected to the air source device.
8. The device for real-time monitoring of optical power during laser chip aging process as claimed in claim 1, wherein the optical power detection PCB assembly comprises a PCB circuit board, the PCB circuit board comprises a main control MCU, a sampling channel, a power supply and an RS485 communication chip, the sampling channel, the power supply and the RS485 communication chip are respectively connected to the main control MCU, and the PD detector is connected to the sampling channel.
9. The apparatus for real-time monitoring of optical power during laser chip aging according to claim 8, wherein the sampling channel includes a sampling IC chip, a first sampling resistor, a second sampling resistor, and a filter capacitor, and the first sampling resistor, the second sampling resistor, and the filter capacitor are respectively connected to the sampling IC chip.
10. The method for monitoring the optical power of the laser chip in the aging process in real time is characterized by comprising the following steps of:
step S1, fixing the laser chip on the chip clamp, and placing the chip clamp on the aging constant-temperature platform;
step S2, the aging constant temperature platform provides a stable temperature environment, the chip clamp powers on the laser chip, and the air nozzle inputs dry and clean compressed air into the air inlet;
step S3, the laser chip is powered on to emit laser, the laser is injected from the light inlet hole of the clean air blowing strip and enters the PD detector in the containing groove after being attenuated by the porous ceramic attenuation piece;
and step S4, transmitting the laser data information acquired by the PD detector to the master control MCU through the sampling channel, and feeding back the laser data information to the upper computer through the RS485 communication chip after data processing by the master control MCU.
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| CN202010363920.5A CN111367230A (en) | 2020-04-30 | 2020-04-30 | Device and method for realizing real-time monitoring of optical power in laser chip aging process |
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| CN202010363920.5A CN111367230A (en) | 2020-04-30 | 2020-04-30 | Device and method for realizing real-time monitoring of optical power in laser chip aging process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112197820A (en) * | 2020-12-07 | 2021-01-08 | 上海菲莱测试技术有限公司 | Optical chip rapid crimping detection device |
| CN113109026A (en) * | 2021-03-26 | 2021-07-13 | 武汉锐科光纤激光技术股份有限公司 | COS aging testing device |
-
2020
- 2020-04-30 CN CN202010363920.5A patent/CN111367230A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112197820A (en) * | 2020-12-07 | 2021-01-08 | 上海菲莱测试技术有限公司 | Optical chip rapid crimping detection device |
| CN112197820B (en) * | 2020-12-07 | 2021-03-02 | 上海菲莱测试技术有限公司 | Optical chip rapid crimping detection device |
| CN113109026A (en) * | 2021-03-26 | 2021-07-13 | 武汉锐科光纤激光技术股份有限公司 | COS aging testing device |
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