CN210982548U - Temperature control test fixture for multi-station packaging substrate - Google Patents
Temperature control test fixture for multi-station packaging substrate Download PDFInfo
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- CN210982548U CN210982548U CN202021025134.6U CN202021025134U CN210982548U CN 210982548 U CN210982548 U CN 210982548U CN 202021025134 U CN202021025134 U CN 202021025134U CN 210982548 U CN210982548 U CN 210982548U
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Abstract
The utility model relates to a temperature control test fixture for a multi-station packaging substrate, which comprises a packaging substrate; the packaging substrate is arranged on the temperature control device, and a pressing plate is arranged right above the packaging substrate; the pressing plate can move relative to the packaging substrate above the packaging substrate, a probe array comprising a plurality of probes and a plurality of light-emitting grooves penetrating through the pressing plate are arranged on the pressing plate, when the pressing plate is pressed on the packaging substrate, the light-emitting grooves on the pressing plate correspond to the packaging stations on the packaging substrate one by one, and the probe array on the pressing plate can be electrically connected with a substrate power-up area on the packaging substrate; after the probe array is electrically connected with the substrate power-on region of the packaging substrate, the probe in the probe array can load the required test current to the laser chip of the corresponding packaging station on the packaging substrate. The utility model discloses can effectively realize the test of a plurality of laser instrument chips, improve the reliability of efficiency of software testing and test.
Description
Technical Field
The utility model relates to a test fixture, especially a accuse temperature test fixture for multistation packaging substrate belongs to the technical field of semiconductor laser chip test.
Background
At present, in the field of aging test of semiconductor laser chips, in order to improve productivity and ensure heat dissipation, the laser chips need to be aged and tested after being packaged on a multi-station substrate, the multi-station package substrate usually adopts a mode of plugging and powering up with an edge connector, and the edge connector is easily damaged after being repeatedly plugged, so that the testing efficiency and the testing reliability are affected.
Disclosure of Invention
The utility model aims at overcoming the not enough of existence among the prior art, providing a accuse temperature test fixture for multistation packaging substrate, its test that can effectively realize a plurality of laser instrument chips improves the reliability of efficiency of software testing and test.
According to the technical scheme provided by the utility model, the temperature control test fixture for the multi-station packaging substrate comprises a packaging substrate with a plurality of packaging stations; the temperature control device can provide the temperature to be tested for the laser chip packaged in the packaging station, and the bottom plate can support the temperature control device; the pressing plate can move relative to the packaging substrate above the packaging substrate, so that the pressing plate can be pressed on the packaging substrate or separated from the packaging substrate;
the pressing plate is provided with a probe array comprising a plurality of probes and a plurality of light-emitting grooves penetrating through the pressing plate, when the pressing plate is pressed on the packaging substrate, the light-emitting grooves on the pressing plate correspond to the packaging stations on the packaging substrate one by one, and the probe array on the pressing plate can be electrically connected with a substrate power-up area on the packaging substrate; after the probe array is electrically connected with the substrate power-on region of the packaging substrate, the probe in the probe array can load the required test current to the laser chip of the corresponding packaging station on the packaging substrate.
The bottom plate is provided with a plurality of guide posts which can be in adaptive connection with the pressing plate, and the guide posts can guide the movement of the pressing plate above the packaging substrate.
The temperature control device comprises a TEC cold surface body capable of being supported on a bottom plate, a semiconductor refrigerator positioned on the TEC cold surface body and a TEC hot surface body positioned on the semiconductor refrigerator, and a packaging substrate is arranged on the TEC hot surface body.
The surface of one side of the pressing plate, which is adjacent to the packaging substrate, is provided with a plurality of pressing plate bulges, and when the pressing plate is pressed on the packaging substrate, the pressing plate is contacted with the packaging substrate through the pressing plate bulges.
Each packaging station on the packaging substrate can be electrically connected with a substrate power-up area on the packaging substrate through a station power supply connecting wire.
The material of the packaging substrate comprises copper, aluminum or aluminum nitride.
The material of the TEC thermohedron comprises copper or diamond.
The probe array on the pressure plate can be electrically connected with a test power supply through a switch card.
The utility model has the advantages that: can encapsulate a plurality of laser instrument chips on packaging substrate, packaging substrate supports on temperature regulating device, can provide the test temperature regulation of laser instrument chip on packaging substrate through temperature regulating device, the clamp plate moves in packaging substrate top, utilize the probe on the clamp plate to connect the back electricity with the base plate with the district contact, thereby can realize the laser instrument chip loading test current to difference on the packaging substrate, utilize the contact electricity of probe and base plate with the district to be connected, can improve stability and the reliability of power-on in the testing process, improve efficiency of software testing.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a top view of the present invention.
Fig. 3 is a cross-sectional view of B-B in fig. 2.
Fig. 4 is a schematic view of the pressing plate of the present invention.
Fig. 5 is a schematic view of the package substrate of the present invention.
Fig. 6 is an enlarged view of the area a in fig. 5.
Description of reference numerals: the device comprises a base plate 1, a guide column 2, a packaging substrate 3, a probe 4, a pressing plate 5, a TEC cold surface body 6, a TEC hot surface body 7, a light emergent groove 8, a semiconductor refrigerator 9, a pressing plate bulge 10, a guide column hole 11, a substrate charging area 12, a packaging area 13, a station power supply connecting line 14, a chip positioning area 15, a packaging station 16 and a probe hole 17.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1 to 6: in order to effectively realize the test of a plurality of laser chips and improve the test efficiency and the test reliability, the utility model comprises a packaging substrate 3 with a plurality of packaging stations 16; the temperature control device can provide the temperature required by the test of the laser chip packaged in the packaging station 16, and the bottom plate 1 can support the temperature control device, the packaging substrate 3 is arranged on the temperature control device, and a pressing plate 5 is arranged right above the packaging substrate 3; the pressing plate 5 can move relative to the package substrate 3 above the package substrate 3, so that the pressing plate 5 can press on the package substrate 3 or the pressing plate 5 is separated from the package substrate 3;
the pressing plate 5 is provided with a probe array comprising a plurality of probes 4 and a plurality of light-emitting grooves 8 penetrating through the pressing plate 5, when the pressing plate 5 is pressed on the packaging substrate 3, the light-emitting grooves 8 on the pressing plate 5 correspond to the packaging stations 16 on the packaging substrate 3 one by one, and the probe array on the pressing plate 5 can be electrically connected with the substrate power-on area 12 on the packaging substrate 3; after the probe array is electrically connected with the substrate power-adding area 12 of the package substrate 3, the probe 4 in the probe array can load the required test current to the laser chip of the corresponding package station 16 on the package substrate 3.
Specifically, the material of the package substrate 3 includes copper, aluminum or aluminum nitride, and the specific material type of the package substrate 3 may be selected according to actual needs, which is known to those skilled in the art, and is not described herein again. As shown in fig. 5 and 6, the package substrate 3 has a substrate charging area 12 and a package area 13, a plurality of package stations 16 are disposed in the package area 13, and the package of the laser chip on the package substrate 3 can be realized by the package stations 16 in the package area 13. The laser chip packaging structure is characterized in that a chip positioning area 15 is arranged in a packaging station 16, a laser chip is packaged in the chip positioning area 15, welding points are arranged on two sides of the chip positioning area 15, the laser chip packaged in the chip positioning area 15 is in wire bonding with the welding points, and then the laser chip is electrically connected with a substrate power supply area 12 through a station power supply connecting wire 14 of the packaging station 16.
The embodiment of the utility model provides an in, can encapsulate the laser instrument chip of multiple difference simultaneously (including but not limited to difference such as shape, size, power) in packaging substrate 3, the laser instrument chip encapsulation is behind corresponding encapsulation station 16, through corresponding station power connecting wire 14 with the base plate district 12 electricity that adds is connected. As shown in fig. 5, the substrate charging region 12 is located at a side edge of the package substrate 3, and in specific implementation, the substrate charging region 12 may also be located at a central region of the package substrate 3, and a position relationship between the substrate charging region 12 and the package region 13 may be selected according to actual needs, which is not described herein again. No matter the position relation between the substrate power-adding area 12 and the packaging area 13, the laser chip packaged in the packaging area 13 can be electrically connected with the substrate power-adding area 12 through the corresponding station power supply connecting wire 14, so that the test current can be loaded subsequently. The package region 13 of the package substrate 3 can package different laser chips at the same time, and the electrical connection between the laser chip packaged at the package station 16 and the substrate charging region 12 can be realized by the conventional and common technical means, which is well known to those skilled in the art and will not be described herein again.
In specific implementation, according to a specific electrical connection form between the package station 16 and the substrate power applying region 12, it is possible to load a test current to the laser chip in one or more package stations 16 in the package region 13, that is, it is possible to selectively load a test current to the laser chips in different package stations 16 on the package substrate 3 for testing, and specifically select a condition of loading a current to the different package stations 16, so that the station power supply connection line 14 of the package station 16 is related to the substrate power applying region 12, and is specifically selected and determined according to needs in an actual test, which is not described herein again.
The embodiment of the utility model provides an in, provide packaging substrate 3's required test temperature through temperature regulating device, and then realize providing packaging substrate 3 and go up the required test temperature of the laser chip of encapsulation on encapsulation station 16 to satisfy the temperature condition of laser chip in the testing process. The temperature control device is arranged on the bottom plate 1, and the packaging substrate 3 is arranged on the temperature control device to realize temperature transmission.
In order to satisfy the current loading in the test, further, a pressing plate 5 is arranged right above the package substrate 3, the pressing plate 5 can move above the package substrate 3, and the pressing plate 5 is pressed on the package substrate 3 or the pressing plate 5 is separated from the package substrate 3 through the movement of the pressing plate 5 relative to the package substrate 3. Specifically, a probe array is arranged on the pressure plate 5, and a plurality of probes 4 are arranged in the probe array; meanwhile, the pressing plate 5 is also provided with a light-emitting groove 8, and the light-emitting groove 8 penetrates through the pressing plate 5. When the pressing plate 5 is located on the package substrate 3, the light-emitting grooves 8 correspond to the package stations 16 on the package substrate 3 one by one, so that the light of the laser chip in the package station 16 is emitted through the light-emitting grooves 8. The probes 4 of the probe array correspond to the substrate charging areas 12 one by one, so that the probes 4 in the probe array can be electrically connected with the substrate charging areas 12 after being contacted. As can be seen from the above description between the substrate charging area 12 and the package station 16 in the package area 13, after the probes 4 of the probe array are electrically connected to the substrate charging area 12 in a contact manner, the probes 4 of the probe array can load the laser chips on the package substrate 3 at the corresponding package station 16 with the required test current.
Furthermore, a plurality of guide posts 2 which can be in adaptive connection with the pressing plate 5 are arranged on the bottom plate 1, and the movement of the pressing plate 5 above the packaging substrate 3 is guided through the guide posts 2.
The embodiment of the utility model provides an in, set up four guide posts 2 that distribute perpendicularly on bottom plate 1, guide post 2 can pass clamp plate 5, and clamp plate 5 can 2 movements of relative guide post, can lead the motion of clamp plate 5 in packaging substrate 3 top through guide post 2. During specific implementation, when the pressing plate 5 moves above the package substrate 3, a pressing plate driving mechanism matched with the pressing plate 5 needs to be used, the pressing plate driving mechanism can drive the pressing plate 5 to move relative to the package substrate 3, the pressing plate driving mechanism can be an air cylinder or other mechanisms capable of realizing the reciprocating motion of the pressing plate 5 above the package substrate 3, and specifically, the selection can be carried out as required, and the description is omitted. When the pressing plate driving mechanism drives the pressing plate 5 to be separated from the packaging substrate 3, the replacement of different packaging substrates 3 can be realized, and the preparation is carried out for subsequent tests.
In addition, a plurality of pressing plate protrusions 10 are arranged on one side surface of the pressing plate 5 adjacent to the package substrate 3, and when the pressing plate 5 presses on the package substrate 3, the pressing plate 5 is in contact with the package substrate 3 through the pressing plate protrusions 10, so that a reasonable interval is kept between the pressing plate 5 and the package substrate 3. The embodiment of the utility model provides an in, the protruding 10 protrusion of clamp plate in clamp plate 5 for packaging substrate 3's surface, clamp plate arch 10 can be array distribution, perhaps with other arbitrary required forms of arranging, specifically can select as required, no longer gives unnecessary details here. When the pressing plate 5 is pressed on the packaging substrate 3, the probes 4 on the pressing plate 5 are in contact with the substrate power applying area 12, and meanwhile, the pressing plate 5 presses the packaging substrate 3 by utilizing the pressing plate protrusions 10, so that good contact between the packaging substrate 3 and the temperature control device can be ensured, incomplete compression of the probes 4 can be ensured, and a limiting effect is achieved.
In specific implementation, guide post holes 11 are formed in four ends of the pressing plate 5, the guide post holes 11 are matched with the guide posts 2, and the pressing plate 5 can be sleeved on the guide posts 2 through the guide posts 11. A probe hole 17 is also provided on the platen 5, and the probe 4 is fitted to the platen 5 through the probe hole 17. The probe 4 is in a conventional form, and is electrically connected with the substrate power-on region 12 of the package substrate 3 after being contacted with the probe 4, so that when the probe 4 is powered on, the reliability of a testing process can be improved, and the testing efficiency can be improved.
Further, the temperature control device comprises a TEC cold surface body 6 capable of being supported on the bottom plate 1, a semiconductor refrigerator 9 positioned on the TEC cold surface body 6, and a TEC hot surface body 7 positioned on the semiconductor refrigerator 9, and the package substrate 3 is disposed on the TEC hot surface body 7.
In the embodiment of the present invention, the package substrate 3 contacts with the TEC heat surface body 7, and in this embodiment, the TEC heat surface body 7 is made of copper, which not only has good heat conductivity, but also has good conductivity, and thus can be used as a power-on cathode; in some embodiments, the TEC thermal face body 7 may also be made of a high thermal conductivity insulating material, such as cvd (chemical vapor deposition) diamond, etc., which is used only for temperature control.
In specific implementation, the TEC (thermo Electric cooler) cold surface body 6, the TEC hot surface body 7, and the semiconductor refrigerator 9 may all be implemented by conventional and common technical means, and the specific work is consistent with the prior art, and the process of forming the temperature control device by using the TEC cold surface body 6, the TEC hot surface body 7, and the semiconductor refrigerator 9 and implementing the temperature condition required for loading the package substrate 3 is consistent with the prior art, which is known to those skilled in the art and will not be described herein again.
In specific implementation, the probe array on the pressure plate 5 is electrically connected with a test power supply through a switch card. The switch card can adopt the existing common form, after being connected with a test power supply, the switch card can switch the electric connection state of different probes 4 and the test power supply, thereby realizing the loading of test current on laser chips in different packaging stations 16 in the packaging area 13 through the probes 4 and realizing the power-on test of the selected laser chips. Of course, when the laser chip on the package substrate 3 is electrically tested, the temperature control device is required to provide the test temperature required by the laser chip on the package substrate 3.
The selected embodiments of the present invention disclosed above are merely provided to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. A temperature-controlled test fixture for multi-station package substrates comprises a package substrate (3) having a plurality of package stations (16); the method is characterized in that: the temperature control device can provide the temperature to be tested for the laser chip packaged in the packaging station (16), and the bottom plate (1) can support the temperature control device, the packaging substrate (3) is arranged on the temperature control device, and a pressing plate (5) is arranged right above the packaging substrate (3); the pressing plate (5) can move relative to the packaging substrate (3) above the packaging substrate (3) so that the pressing plate (5) can press on the packaging substrate (3) or the pressing plate (5) is separated from the packaging substrate (3);
the packaging structure is characterized in that a probe array comprising a plurality of probes (4) and a plurality of light-emitting grooves (8) penetrating through the pressing plate (5) are arranged on the pressing plate (5), when the pressing plate (5) is pressed on the packaging substrate (3), the light-emitting grooves (8) on the pressing plate (5) correspond to packaging stations (16) on the packaging substrate (3) one by one, and the probe array on the pressing plate (5) can be electrically connected with a substrate power-on area (12) on the packaging substrate (3); after the probe array is electrically connected with the substrate power-adding area (12) of the packaging substrate (3), the required test current can be loaded on the laser chip of the corresponding packaging station (16) on the packaging substrate (3) through the probe (4) in the probe array.
2. The temperature-controlled test fixture for multi-station package substrates as claimed in claim 1, wherein: the packaging substrate is characterized in that a plurality of guide posts (2) which can be in adaptive connection with the pressing plate (5) are arranged on the bottom plate (1), and the pressing plate (5) can be guided to move above the packaging substrate (3) through the guide posts (2).
3. The temperature-controlled test fixture for multi-station package substrates as claimed in claim 1, wherein: the temperature control device comprises a TEC cold surface body (6) capable of being supported on a bottom plate (1), a semiconductor refrigerator (9) located on the TEC cold surface body (6) and a TEC hot surface body (7) located on the semiconductor refrigerator (9), and a packaging substrate (3) is arranged on the TEC hot surface body (7).
4. The temperature-controlled test fixture for multi-station package substrates according to claim 1, 2 or 3, wherein: a plurality of pressing plate protrusions (10) are arranged on the surface of one side, close to the packaging substrate (3), of the pressing plate (5), and when the pressing plate (5) presses on the packaging substrate (3), the pressing plate (5) is in contact with the packaging substrate (3) through the pressing plate protrusions (10).
5. The temperature-controlled test fixture for multi-station package substrates as claimed in claim 1, wherein: each packaging station (16) on the packaging substrate (3) can be electrically connected with the substrate power supply area (12) on the packaging substrate (3) through a station power supply connecting wire (14).
6. The temperature-controlled test fixture for multi-station package substrates as claimed in claim 1, wherein: the material of the packaging substrate (3) comprises copper, aluminum or aluminum nitride.
7. The temperature-controlled test fixture for multi-station package substrates as claimed in claim 3, wherein: the material of the TEC thermohedron (7) comprises copper or diamond.
8. The temperature-controlled test fixture for multi-station package substrates as claimed in claim 1, wherein: the probe array on the pressure plate (5) can be electrically connected with a test power supply through a switch card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021025134.6U CN210982548U (en) | 2020-06-08 | 2020-06-08 | Temperature control test fixture for multi-station packaging substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021025134.6U CN210982548U (en) | 2020-06-08 | 2020-06-08 | Temperature control test fixture for multi-station packaging substrate |
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| CN210982548U true CN210982548U (en) | 2020-07-10 |
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| CN202021025134.6U Active CN210982548U (en) | 2020-06-08 | 2020-06-08 | Temperature control test fixture for multi-station packaging substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115684675A (en) * | 2022-11-17 | 2023-02-03 | 镭神技术（深圳）有限公司 | Miniature semiconductor refrigerating sheet aging clamp and power-on and temperature acquisition method |
-
2020
- 2020-06-08 CN CN202021025134.6U patent/CN210982548U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115684675A (en) * | 2022-11-17 | 2023-02-03 | 镭神技术（深圳）有限公司 | Miniature semiconductor refrigerating sheet aging clamp and power-on and temperature acquisition method |
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