JPH07272810A - Movable contact pin device for ic socket - Google Patents

Abstract

PURPOSE:To provide a contact pin device for IC socket which is free from risk of breaking or damaging the contacting surface of each connection terminal installed on an IC package when it is subjected to an electric continuity test. CONSTITUTION:A movable contact pin device 21 is applied to an IC socket F for generating electric connection of an IC package A with an external circuit in various forms, and pins are resiliently contacted with the connection terminals 2 of the package for generating required electric continuity. A contacting member 25 to contact each terminal is provided separately from other constituent member 24 and fixed in such a condition as pressed elastically with mobility in the contacting direction relative to the other constituent member, and a sliding/rotating changing mechanism 20 is interposed between the members. When the terminals are put in pressure contact resiliently with the terminals by this changing mechanism, they can make contacted rotating while the condition and position with pressure contact resiliently are held unchanged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin device for an IC socket, and more particularly, it is applied to an IC socket for an electric current test for an IC package having a plurality of connection terminals on a connection surface side of a package body. The present invention relates to a contact pin device that is connected to each of the individual connection terminals.

[0002]

2. Description of the Related Art This type of IC socket is generally used for electrical connection between an IC package and an external circuit, and in particular, for conducting various kinds of electric current to a semiconductor integrated circuit or the like incorporated in the IC package. , Various types of connection parts in the IC package, that is, for example, BGA (Ball Grid Array) having substantially spherical connection terminal parts
Type IC package, flat type (hereinafter referred to as "Gullwyn type") IC package having galwin type connection terminals, and LGA (Lan) having pad type connection terminals
d Grid Array) type IC package and LCC (Leadles)
s Chip Carrier) type IC package, etc. I having respective contact pin configurations for connection corresponding to respective connection terminals
The C socket is frequently used.

Here, the BGA type IC package, which is one type of the IC package, uses a package body in which a required circuit structure is incorporated, and a large number of the package body is provided on the bottom surface of the package body as a connecting portion to an external circuit. It has a structure in which a large number of solder-made connecting terminals formed in a substantially spherical shape are arranged in a matrix, and when mounted on a mounting circuit board, the package body is mounted at a predetermined position on the surface of the circuit board. After being placed, the solder portions of the respective connection terminals are partially melted, so that the circuit terminals corresponding to the respective terminals are directly soldered and mounted.

As described above, in the BGA type IC package, since each connection terminal is directly soldered to each circuit terminal on the surface of the circuit board to be mounted, the spherical tip ends of all the connection terminals are equivalent. When the parts do not project downward in a uniform state, that is, for example, one of the spherical end parts is damaged or damaged, and even if there is a slight difference in height, there is a difference in height. Then, if the package body is simply placed at a predetermined position on the surface of the circuit board, a gap is created between the spherical end portion and the circuit terminal, and as a result, soldering connection becomes impossible or defective. There is a risk that it will not be possible to do so and will hinder the implementation work.

On the other hand, in this type of BGA type IC package, all the connection terminals are energized after the manufacture, just like the case of other types of IC packages, for example, a heat resistance test called burn-in test. It is designed to confirm whether or not the expected circuit operation is obtained by performing various performance evaluation tests such as
The test IC socket here is used.

Next, as described above, the BGA type I having the spherical connection terminals made of a plurality of solders and melting a part of the spherical connection terminals is directly mounted on the circuit board.
FIG. 11 shows a schematic structure of a general test IC socket applied to the C package, and FIG. 12 shows a detailed structure of the main part of the same.
, Respectively.

That is, in the device configuration shown in FIGS. 11 and 12, the BGA type IC package A is provided with a package body 1 in which a required circuit configuration is incorporated.
On the bottom surface 1a of the package body 1, a large number of connection terminals 2 made of solder and protruding in a substantially spherical shape are arranged in a matrix.

On the other hand, the test IC socket B for conducting the energization test of the IC package A has a socket body 51, and a concave portion 52 is formed at a predetermined position corresponding to the upper surface side of the socket body 51. At the same time, a floating plate 55, which is movably guided in the vertical direction by a guide pin 53 and is elastically pressed upward by a spring 54, is mounted in the recess 52.

Further, the floating plate 55 is formed with a positioning recess 56 for regulating and receiving the lower side of the package body 1 of the IC package A with respect to a predetermined position portion corresponding to the upper surface side. Space at each position corresponding to each connection terminal 2 of the package body 1 in the positioning recess 56, a tapered receiving guide portion 57a on the upper surface side, and a space acting as a required bending allowance space on the lower half portion. A contact pin introduction portion 57 is formed by forming each portion 57b.

The recess 5 of the socket body 51
In FIG. 2, each contact pin 61 has a contact portion 61a having a slightly larger diameter at its upper end portion at a position corresponding to each contact pin introduction portion 57 to give a required bending elasticity.
And each contact pin 61 is received from the space 57b into the contact pin introducing portion 57, and the contact portion 61a is maintained in the receiving guide portion 57a by a required amount.

Further, for the socket body 51,
In this case, although not shown in detail for details, the package body 1 is pivotally supported at one end side so as to be openable and closable and can be appropriately moored and held at the other end side so that the package body 1 can be equally distributed from the upper surface side. Cover pressing plate 58 that can be pressed
Is provided.

Therefore, in the conventional test IC socket B of the IC package A having the above-mentioned structure, first, the cover pressing plate 58 with respect to the socket body 51 is left open, and is placed in the positioning recess 56 of the floating plate 55. The lower side of the package body 1 is provisionally positioned and mounted, and subsequently, the cover pressing plate 58 is appropriately held in a closed state.

That is, by the above operation, the floating plate 55 is pressed down against the elastic force of the spring 54 due to the pressing force applied to the package body 1 by the cover pressing plate 58, and the contact portion of each contact pin 61 is pressed. 61a is brought into contact with each of the corresponding connection terminals 2 and, as indicated by the dotted line in FIG.
1 is bent in the space 57b against its own elasticity to give a required contact pressure, and in this way, the test contact I
The setting of IC package A to C socket B is completed,
After that, the performance evaluation test is performed on the IC package A as expected.

When the connection terminal 2 is connected to the contact portion 61a of this type of contact pin 61, an oxide film or the like is usually formed on the contact portion 61a and / or the surface portion of the connection terminal 2. In some cases, or dust or the like is attached, these interpositions may prevent good electrical connection between the two.

Therefore, the test I shown in FIGS.
In the case of the C socket B, the elastic force applied to the contact pin 61 is strengthened, and at the time of connection, the contact portion 61a of the contact pin 61 strongly presses the surface portion of the connection terminal 2 to form an oxide film. Etc. are destroyed or dust or the like is pushed away to ensure reliable electrical connection.

On the other hand, in the case of an IC package having a so-called gull wing type connection terminal, in addition to the form in which the contact portion 61a of the contact pin 61 is strongly pressed against the surface portion of the connection terminal 2 as described above, the connection is made. I for testing, in which the contact part is strongly rubbed against the surface of the terminal, that is, it is wiped to make an accurate electrical connection.
A C socket has also been proposed, and a schematic configuration of the test IC socket is shown in FIG.

In the device configuration shown in FIG. 13, an IC package C having gull-wing type connection terminals is provided with respective connection terminals 4 which are bent and extended outward and downward from both opposite sides of the package body 3. Further, the test IC socket D for conducting the energization test of the IC package C has a socket body 71, and a recessed portion 72 is provided at a predetermined position corresponding to the upper surface side of the socket body 71. In addition, the floating plate 75 in the recess 72 is movably guided in the vertical direction by the guide pin 73, and the spring 74 constantly presses the floating plate 75 upward. The lateral U is formed on both side edges of the recessed portion 72 of the socket body 71 facing each other.
Each contact pin 81 having a contact portion 82 supported by the character-shaped spring portion 83 provided on the upper end portion is planted.

Further, on the floating plate 75, each connection terminal 4 is provided at a predetermined position corresponding to the upper surface side.
Of the IC package C, the positioning recess 76 for position-regulating and receiving the lower side of the package body 3 is formed, and in the state where the package body 3 is received in the positioning recess 76, each connection terminal 4 has It is adapted to correspond to the contact portion 82 of the contact pin 81, and further, in this case, with respect to the socket body 71,
A cover pressing plate 77 is provided which allows the package body 71 to be pressed from the upper surface side as evenly as possible and which can be moored and held in the pressed state.

Therefore, the test IC of the IC package C having the conventional gull-wing type connection terminal having the above-mentioned structure.
In the socket D, first, with the cover pressing plate 77 open to the socket body 71, the lower side of the package body 3 is positioned and mounted in the positioning recess 76 of the floating plate 75, and subsequently, The cover pressing plate 77 is held in a properly closed state.

That is, by the above operation, the pressing force applied to each connecting terminal 4 by the cover pressing plate 77 causes each connecting terminal 4 to press-contact with the contact portion 82 of each contact pin 81.

In this case, when the connecting terminals 4 are pressed against the contact portions 82, the horizontal U-shaped spring portion 83 is used.
Is pressed and urged to rub each contact portion 82 against the contact surface of each connection terminal 4, and
In other words, due to the wiping effect, the oxide film and the like in each of the connection terminals 4 and each of the contact portions 82 as described above are destroyed or dust and the like are excluded, and a reliable electrical connection including application of the required contact pressure is performed. Also in this case, the setting of the IC package C in the test IC socket D is completed in this manner, and thereafter, the performance evaluation test is performed on the IC package C as intended.

On the other hand, as shown in FIG. 14, the wiping action between each connection terminal 4 and each contact portion 82 is on the same plane as the lower surface of the IC package body 5 and is, for example, a pad shape. IC with each connection terminal 6
Also in the case of the package E, since the shape of the contact pin used is required to correspond to the pad-shaped connection terminal 6, it is completely different from that shown in FIG.
Also in this case, it can be easily applied, and the same action and effect can be obtained.

[0023]

However, in the case of the above-mentioned conventional test IC socket B, when the contact portion 61a of the contact pin 61 strongly presses the surface portion of the connection terminal 2, the connection terminal 2 The surface of 2 is dented,
In addition to the disadvantage of being damaged, it also reduces the product value.

Further, when the connection terminal 2 is a member formed of solder, that is, a so-called solder ball, when the connection pin 2 is connected to the contact pin 61, for example, when a burn-in test for heat resistance is performed, the connection is performed. The solder component forming the terminal 2 may be slightly softened due to the heat applied, and the portion pressed by the contact portion 61a is deformed, and the deformed portion is hardened after the test is completed. The phenomenon was seen.

When each of the connection terminals 2 is a solder ball, the mounting on the mounting circuit board is carried out by surrounding the solder ball closely attached to the circuit terminal on the board, as described above. Part is melted and soldered and connected,
At the time of this soldering, the hardened part may be difficult to be melted, and in addition to the solder balls, the connection terminals are formed of a material having a relatively low melting point, for example, lead, zinc, aluminum, gold, silver or the like. In the case where the lower portion of the connection terminal 2 is deformed or damaged as described above, the circuit board for mounting the IC package, particularly the BGA type IC package, is produced. However, the electrical connection of the connection terminal to the circuit terminal is not accurately made when the device is mounted on the.

Further, also in the case of the IC package C having the conventional gull-wing type connection terminal and the IC package E having the pad-shaped connection terminal, the contact portion of the contact pin with respect to the connection terminal has a spring biasing force. Since it slides linearly on the contact pin, the wiping amount is uniquely determined by the area of the contact pin contactable portion of the connection terminal. When the area is relatively small, the oxide film may be destroyed or dust may not be completely removed as expected, and in the case of gull-wing type connection terminals, the connection terminals themselves may be deformed. .

Even if the contact area of the contact portion of the contact pin with respect to the connection terminal is relatively large, for example, in the case of the contact pin 81 as shown in FIG. 13, the horizontal U-shaped spring portion is used. The movable distance of the contact portion 82 is determined by the size of the contact portion 82, and the same problem occurs when the lateral U-shaped spring portion 83 is the contact pin 81 which is relatively small.

If the horizontal U-shaped spring portion 83 of the contact pin 81 is to be made larger,
Now, the size in the width direction of the socket body 71 in which the contact pin 81 is implanted must be increased, and when the body width is increased, one test circuit board of the same size is obtained. The number of IC sockets that can be mounted on the IC is relatively reduced, which leads to the inefficiency of the IC package test.

The present invention has been made to solve the above-mentioned conventional problems, and its purpose is to:
It is an object of the present invention to provide a contact pin device for an IC socket, which is not likely to damage or damage the contact surface of each connection terminal in the IC package.

[0030]

In order to achieve the above-mentioned object, a contact pin device for an IC socket according to the present invention has a contact part structure in the contact pin device, wherein the contact part is pressed so that a shaft is provided. When moving in the direction, the structure is such that it can move while rotating.

That is, the first aspect of the present invention is an IC for electrically connecting an IC package and an external circuit.
A movable contact pin device which is applied to a socket and is elastically contacted individually with each connection terminal of the IC package to obtain a required electrical conduction, and a contact member for contacting the connection terminal is provided. A movable contact pin device for an IC socket, wherein the movable contact pin device is configured so as to be capable of contact rotation while being elastically contacted with the connection terminal and in the position.

The second invention according to the present invention is applied to an IC socket for electrically connecting an IC package and an external circuit, and is individually elastically contacted with each connection terminal of the IC package. A movable contact pin device for obtaining a required electrical continuity, wherein a contact member for contacting the connection terminal is provided separately from other constituent members, and the contact member is It is connected to other components in a state of being elastically pressed so as to be movable in the contact direction, and a slide / rotation conversion mechanism is interposed between these two members to form the slide / rotation conversion. A movable contact pin device for an IC socket, characterized in that, when the contact member is elastically contacted with the connection terminal by a mechanism, the contact can be rotated while maintaining the elastically contacted state and position. is there.

[0033]

Therefore, in the first and second aspects of the present invention, when the contact member comes into contact with and is pressed by the connection terminal of the IC socket, the contact portion or the contact member comes into elastic contact with the connection terminal. As it is, it is rotated and rubbed without changing its contact position, and the required wiping action is obtained by the rotative rubbing. As a result, the effect of these connection terminals and the contact member is obtained. And reliable electrical connection is made.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, different embodiments of the contact pin for an IC socket according to the present invention will be described in detail with reference to FIGS.

First Embodiment. FIG. 1 is a vertical sectional front view schematically showing a schematic configuration of a BGA type IC package mounted on an IC socket to which a contact pin device according to a first embodiment of the present invention is applied, and FIG. ), (b) is
FIG. 3 is a partial vertical cross-sectional view schematically showing an enlarged connection state of a connection terminal of an IC package and a contact member of a contact pin device according to the first embodiment, and a partial horizontal cross-sectional view of a sliding engagement portion.

In the device configuration according to the first embodiment shown in FIGS. 1 and 2, the BGA type IC package A has the package body 1 in which the required circuit configuration is incorporated, as described above. On the bottom surface 1a of the package body 1, a large number of connecting terminals 2 made of solder and formed in a substantially spherical shape are arranged in a matrix.

The test IC socket F for the BGA type IC package A has a recessed portion 12 formed inside the upper surface of the socket body 11, and in this recessed portion 12, in this case, the upper and lower sides. A floating plate 14 is movably guided in the direction, and is constantly elastically pressed upward by a spring 13.

On the other hand, the floating plate 14 has a plurality of peripheral portions corresponding to the upper surface side, in this case, four corner portions, for receiving and positioning the bottom surface portion 1a side of the package body 1 of the IC package A. On the plate surface where the positioning pieces 15 of FIG. 3 are projected and the positioning pieces 15 are arranged at the four corners, portions corresponding to respective positions corresponding to the connection terminals 2 of the package body 1 are provided. On the other hand, each contact member introducing opening 16 for receiving the contact member 25 of each contact pin device 21 described below is provided.

Thus, each of the contact pin devices 21
Is a base terminal lower take-out terminal 22, which is positioned and implanted and fixed in the recess 12 of the socket body 11, and a fixed brim 23, and is mounted on the fixed brim 23, and the upper end side is within a predetermined range. With respect to the twisted lead piece 24a of the twisted lead plate 24, which is a twisted lead piece 24a for generating a sliding turning force by twisting the lead wire over a required lead angle. And a rectangular lead hole portion 25a is slidably inserted in a vertically slidable manner and slidably engaged, and an upper diameter large portion contact surface other than the end portion contact surface 2a of the connection terminal 2 is formed on the inner peripheral surface of the opened upper end portion. The inner peripheral tapered contact surface 25b for receiving the 2b is formed, and the outer peripheral portion 25c is further provided with an abutting step portion 25d for preventing the outer peripheral portion 25c from being inserted into the contact member introducing opening 16. And the abutting step 25d The contact member 25 is provided between the upper surface of the fixed flange 23 and the lower surface of the contact member 25 so that the contact member 25 faces the lower surface of the peripheral edge of the mouth portion 16 and faces the lower surface of the contact member 25. And a holding coil spring 26 that elastically presses each other. That is, the rectangular lead hole portion 25a for the twisted lead piece portion 24a here is formed.
The sliding engagement of (1) constitutes the sliding / rotating conversion mechanism 20.

Further, with respect to the socket body 11,
On one side, in this case, on the right side, a cover plate 17 is provided which is hinged openably and closably by a pivot pin 17a and is always urged in the opening direction (open position side) by a spring 17b.
Similarly, on the left-hand side, a pivot pin 18a is used to hinge it so that it can be raised and lowered, and a spring 18b constantly raises it (in the locking position side).
In addition to providing the locking lever 18 biased to the above, a locking groove 17d is formed on the upper surface of the tip of the former cover plate 17 via the guide slope 17c, and the right side of the latter locking lever 18 is With the cover plate 17 closed, a downward engaging jaw 18c is projected for engaging with the engaging groove 17d while being guided by the guide slope 17c.

Therefore, in the test IC socket F of the BGA type IC package A according to the first embodiment having the above-described structure, first, the locking lever 18 of the socket body 11 is released against the spring 18b. The cover plate 17 is kept open by the spring 17b. In this state, when the package body 1 is put into the space between the positioning pieces 15 on the floating plate 14, the package body 1 falls between the positioning pieces 15 and the positioning regulation is automatically performed. To be done.

Next, by pressing the cover plate 17 in the open state against the spring 17b, the cover plate 17 causes the package body 1 whose positioning is restricted between the positioning pieces 15 from above. In order to press uniformly, the floating plate 14 is lowered against the spring 13, and by this operation, the tapered contact of the inner periphery of the upper end portion of each contact member 25 protruding through the inside of each contact member introduction opening 16 is made. The connection terminals 2 of the package body 1 are brought into contact with the surface 25b, and the locking jaws of the locking lever 18 are fitted into the locking grooves 17d of the cover plate 17 while the package body 1 is pressed in this manner. 1
8c is locked, and thus the setting of the BGA type IC package A in the test IC socket B is completed.

Then, when each connection terminal 2 of the package body 1 is brought into contact with the contact member 25 of each contact pin device 21, each contact member 25 to each connection terminal 2 is contacted.
The wiping action by is executed as follows.

That is, in a state where the connection terminal 2 is in contact with the inner peripheral tapered contact surface 25b of the contact member 25,
When the connection terminal 2 further presses the contact member 25, the rectangular lead hole portion 25 a of the contact member 25 is bent to the twisted lead plate 24.
By being guided by the twisted lead piece portion 24a, a turning force is applied in accordance with the lead angle, and as a result, the inner peripheral tapered contact surface 25b becomes an upper diameter large portion contact surface of the connection terminal 2. Effectively rubbing the corresponding spherical surface portion other than the end contact surface 2a of the connection terminal 2 by the applied turning force at the contact position with respect to 2b, that is, the wiping action by the required rotation is effective. In this case, the oxide film is destroyed as expected and / or dust is removed as expected, so that a reliable electrical connection is made and the end contact surface of the connection terminal 2 is made. The fear of damaging or damaging 2a is completely eliminated. After that, the performance evaluation test for the BGA type IC package A as intended may be performed, and the original state is restored when the pressing force is released. To do.

The rubbing range for obtaining the effective wiping action is generally 0.25 mm to 0.3 m.
It may be about m. That is, in view of the size of the spherical connection terminal 2 in a normal BGA type IC package, the rotational sliding frictional action is exerted on the upper large-diameter contact surface 2b of the spherical connection terminal 2, that is, the lower side portion having the largest diameter. Since it is done, it is sufficient to rotate the contact member 25 of the contact pin device 21 from about 40 ° to 45 °.

In the structure of the first embodiment, the twisted lead piece portion 24 serves as an indirect fixed support side for obtaining an electrical connection with respect to the connection terminal 2.
The contact pin device 21 is configured by providing a twisted lead plate 24 having a, and associating the contact member 25 having the rectangular lead hole portion 25a as the movable contact side which is directly touched. However, this correspondence is only an example, and if the configuration of the peripheral-related mechanism is devised based on the technical idea of the present invention, the structure corresponding to the lead hole portion on the fixed support side and the twisted lead piece on the movable contact side are provided. It is appropriate to consider that the structures and the structures of these two parts are in a relative relationship because the same action and effect can be obtained by giving the structures corresponding to the parts respectively. The same applies to each of the embodiments described below.

Second embodiment. FIG. 3 is a front view schematically showing a schematic configuration of a contact pin device to which the second embodiment of the present invention is applied, and FIG. 4 is an exploded perspective view of the contact pin device according to the second embodiment.

In the device configuration according to the second embodiment shown in FIGS. 3 and 4, the contact pin device 2 is used.
The sliding / rotating conversion mechanism 20 of No. 1 is configured as follows.

That is, in the case of the second embodiment, the first
Twisted lead plate 2 having twisted lead piece 24a of the embodiment
As the one corresponding to No. 4, lead rods 27 provided with protruding sliding cam pins 28 at the respective required locations on the upper peripheral surface portion are provided.
Further, as a member corresponding to the contact member 25 having the rectangular lead hole portion 25a, it is slidably fitted into the upper end portion of the lead rod 27, and the sliding cam pin 28 is slid on the peripheral surface portion. An inclined cam surface for dynamic engagement, here, a contact member 29 having an inner peripheral tapered contact surface 29a in which an inclined cam groove 30 having a required lead angle is bored is provided.
Here, the holding coil spring 26 is similarly interposed between both of them.

Therefore, even in the device of the second embodiment having the above construction, the inner peripheral tapered contact surface 2 of the contact member 29 is formed.
When the connection terminal 2 further presses the contact member 29 while the connection terminal 2 is in contact with 9a, the contact member 29
The inclined cam groove 30 of the slide cam pin 28 of the lead rod 27.
And a required turning force is applied in correspondence with the lead angle, and as a result, the inner peripheral tapered contact surface 2 is also returned as a result.
9a remains in the contact position with respect to the upper large-diameter portion contact surface 2b of the connection terminal 2 by the applied turning force,
The spherical surface portion other than the end contact surface 2a of the above is effectively rubbed to effectively perform the wiping action by the required rotation, and again, the oxide film is destroyed as expected and / or the dust is excluded. Etc. are effectively performed and reliable electrical connection is made, and the end contact surface 2a of the connection terminal 2 is damaged,
The fear of breakage is completely eliminated, and the original state is restored when the pressing force is released.

Third Embodiment. FIG. 5 is a perspective view schematically showing a schematic configuration of a contact pin device to which the third embodiment of the present invention is applied, and FIG. 6 is a front view showing a notched part of a contact pin device according to the third embodiment. FIG. 7 (a),
(b) And (c) is an operation explanatory view for sequentially explaining the sliding rotation operation of the third embodiment step by step.

In the device configuration according to the third embodiment shown in FIGS. 5 and 6, the contact pin device 2 is used.
The sliding / rotating conversion mechanism 20 of No. 1 is configured as follows.

That is, in the case of the third embodiment, the first
Twisted lead plate 2 having twisted lead piece 24a of the embodiment
As the one corresponding to 4, a lead rod 31 having a sliding cam pin 32 projecting from each of the required locations on the upper peripheral surface is provided.
Further, as a member corresponding to the contact member 25 having the rectangular lead hole portion 25a, the sliding cam pin 32 is slidably fitted into the upper end portion of the lead rod 31 and the sliding cam pin 32 is slid on the peripheral surface portion. An actuating cam portion for dynamic engagement, here an inclined cam surface 34a having a required lead angle on the lower surface side and a vertical cam connected to the end portion of the inclined cam surface 34a by being formed in a substantially triangular shape on the front surface. A contact member 33 having an inner peripheral tapered contact surface 33a having actuating cam portions 34 each having a surface 34b is provided, and a holding coil spring 35 having both ends fixed is interposed between the both. Constitute.

Therefore, in the device of the third embodiment having the above construction, the inner peripheral tapered contact surface 3 of the contact member 33 is formed.
When the connection terminal 2 further presses the contact member 33 in a state where the connection terminal 2 is in contact with 3a, first, the pressing action works along the vertical cam surface 34b of the contact member 33 (FIG. 7 ( By referring to (a) to (b)), a contact pressure to some extent between the connection terminal 2 and the contact member 33 can be obtained, and subsequently,
This time, the inclined cam surface 34a is guided by the sliding cam pin 32 of the lead rod 31 (see FIG. 7 (c)), and the turning force is applied corresponding to the lead angle, and at the same time, it is held along with the turning. The coil spring 35 is twisted and biased, and the desired destruction of the oxide film and / or wiping action such as dust repulsion under the relatively strong pressure contact between the connection terminal 2 and the contact member 33 is effective. In this case, unlike the sliding rotation under the relatively weak pressure contact, a more effective and reliable electrical connection is made.

Fourth Embodiment. 8 (a), (b), (c) and (d)
FIG. 9 is an operation explanatory view for sequentially explaining stepwise sliding rotation operation in the contact pin device to which the fourth embodiment of the present invention is applied.

In the device construction according to the fourth embodiment shown in FIG. 8, the sliding / rotating conversion mechanism 20 of the contact pin device 21 is constructed as follows.

That is, in the case of the fourth embodiment, the relative form in which the second and third embodiments are combined is adopted, and the sliding cam pin 37 is provided at each required position on the intermediate peripheral surface portion. And an inner peripheral tapered contact surface 36a which contacts the large diameter contact surface 2b of the connection terminal 2 and an inner lower part of the inner peripheral tapered contact surface 36a. , A rod-shaped contact member 36 having a series of recesses 36b which are non-contact portions with respect to the end contact surface 2a of the connection terminal 2.
Is provided, and is a hollow pipe so as to receive the contact member 36, and an operating cam portion for slidingly engaging the sliding cam pin 37 to the corresponding upper peripheral surface portion, here substantially parallel to the front surface. By piercing in a quadrilateral shape, an operating cam portion 39 having at least a lower surface side, an inclined cam surface 39a having a required lead angle, and a vertical cam surface 39b connected to an end portion of the inclined cam surface 39a is formed. The lead rod 38 is provided, and the holding coil spring 26 is interposed between both of them.

Therefore, in the device of the fourth embodiment having the above-mentioned structure, the combined operation of the second and third embodiments,
And the effect is obtained.

Fifth embodiment. FIG. 9 shows a gull wing type IC for a contact pin device according to a fifth embodiment of the present invention.
It is a longitudinal cross-sectional view which expands and shows the principal part structure in the state which the connection terminal of the package was pressure-connected.

In the case of the device to which the fifth embodiment shown in FIG. 9 is applied, the contact pin device 2 according to the first embodiment is used.
In the configuration of the sliding / rotating conversion mechanism 20 of No. 1, the contact member 40 in place of the contact member 25 is configured as follows to correspond to the connection terminal 4 of the gull wing type IC package C. .

That is, the contact member 40 used in the fifth embodiment.
In the case of, the twisted lead piece 2 of the twisted lead plate 24
4a, a rectangular lead hole 40a is vertically slidably fitted and slidably engaged, and the IC package C is provided in the positioning recess 76 of the floating plate 75 on the upper end surface. When it is received, it is pressed into contact with the lower surface side contact surface 4a of the connection terminal 4 through the contact member introduction opening 75a formed in the floating plate 75, so that a predetermined rotation is performed as described above. An end contact surface 40b that forms a sliding contact is formed, and an abutment step 40d for preventing slipping is further provided on the outer peripheral portion 40c so that the outer peripheral portion 40c can be inserted into the contact member introduction opening 75a. Moreover, the butting step portion 40d can be made to face the lower surface of the peripheral edge of the opening 75a.

Therefore, even in the device of the fifth embodiment having the above-mentioned structure, the IC package C is received in the positioning recess 76 of the floating plate 75, and the cover pressing plate 77 is closed to connect the connection terminal 4 to the connection terminal 4.
As in the case of the first embodiment, the contact pin device 21 and thus the contact member 40 are actuated by pushing down, and the end contact surface 40b of the contact member 40 becomes the lower contact surface of the connection terminal 4. 4a is rotated and rubbed in a state of being pressedly contacted, and the wiping action as intended is also effectively performed here, and the destruction of the oxide film and / or the repulsion of dust are effectively performed to ensure a reliable electric The physical connection is obtained.

Sixth Embodiment. FIG. 10 is a vertical cross-sectional view schematically showing an enlarged view of a main part configuration of a contact pin device according to a sixth embodiment of the present invention in which a connection terminal of an IC package having pad-shaped terminals is press-connected. Is.

In the case of the device to which the sixth embodiment shown in FIG. 10 is applied, the contact member 25 is replaced with the sliding / rotating conversion mechanism 20 of the contact pin device 21 according to the first embodiment. By configuring the contact member 41 as follows, it corresponds to the IC package E including the pad-shaped connection terminal 6.

That is, the contact member 41 used in the sixth embodiment.
In the case of, the twisted lead piece 2 of the twisted lead plate 24
4a, a rectangular lead hole portion 41a is vertically slidably fitted in and slidably engaged, and the IC is mounted on the floating plate 55 on the upper end surface.
When the package E is received, it is pressed into contact with the lower surface side contact surface 6a of the connection terminal 6 through the inside of the contact member introduction opening 55a formed in the floating plate 55, so that a predetermined amount is obtained as described above. An end contact surface 41b that makes a rotational sliding contact is formed, and an outer peripheral portion 41c is provided with an abutting step 41d for preventing slipping out, and the outer peripheral portion 41c can be inserted into the contact member introduction opening 55a. In addition, the butting step portion 41d can be made to face the lower surface of the peripheral edge of the opening 55a.

Therefore, even in the sixth embodiment having the above structure, the cover pressing plate 58 is closed and the IC is closed.
By depressing the package E and, by extension, its connection terminal 4, the contact pin device 21 is likewise here again.
Contact member 41 of the contact member 41 is actuated, and the end contact surface 41b of the contact member 41 is rotationally rubbed while being pressed against the lower surface side contact surface 6a of the connection terminal 6, and again, the wiping is performed as expected. The action is effectively performed and a reliable electrical connection is obtained.

[0067]

As described above in detail with reference to each embodiment, according to the present invention, the present invention is applied to an IC socket for electrically connecting an IC package and an external circuit.
In the contact pin that is elastically contacted with the connection terminal of the C package, the contact member that obtains the contact action with respect to the connection terminal is configured to be rotatable in response to the elastic force while being in contact with the connection terminal. The contact member to be obtained is configured separately from the other constituent members, and the contact member is elastically supported and configured to be movable in the contact direction with respect to the other constituent member to achieve the contact action. Since the contact member to be obtained is rotated while being in contact with the connection terminal to provide a rotating contact pin device so as to obtain a required wiping action,
When the contact member comes into contact with the connection terminal of the socket and is pressed, the contact member remains in contact with the connection terminal and is rotatably rubbed without changing the contact position to perform the required wiping. Means that an effective, reliable and good electrical connection between these connection terminals and the contact member can be made.
Despite its relatively simple structure, its effect is extremely large.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional front view schematically showing a schematic configuration of a BGA type IC package mounted on an IC socket to which a contact pin device according to a first embodiment of the present invention is applied.

2 (a) and 2 (b) are partial vertical cross-sectional views schematically and enlargedly showing a connection state between a connection terminal of an IC package and a contact member of a contact pin device according to the first embodiment. It is a partial cross-sectional view of a dynamic engagement part.

FIG. 3 is a front view schematically showing a partial cutaway of a main part configuration of a contact pin device to which a second embodiment of the present invention is applied.

FIG. 4 is an exploded perspective view of a contact pin device according to the second embodiment.

FIG. 5 is a perspective view schematically showing a schematic configuration of a contact pin device to which a third embodiment of the present invention is applied.

FIG. 6 is a front view showing a notched essential structure of a contact pin device according to the third embodiment.

7 (a), (b) and (c) are operation explanatory views for sequentially and stepwisely explaining the sliding rotation operation of the third embodiment.

8 (a), (b), (c) and (d) are operation explanatory views for sequentially explaining stepwise sliding rotation operation in the contact pin device to which the fourth embodiment of the present invention is applied. Is.

FIG. 9 is a longitudinal cross-sectional view schematically showing an enlarged view of a main part configuration of a contact pin device according to a fifth embodiment of the present invention in which a connection terminal of a gull wing type IC package is press-connected.

FIG. 10 is a vertical cross-sectional view schematically showing an enlarged view of a main part configuration of a contact pin device according to a sixth embodiment of the present invention in which a connection terminal of an IC package having a pad-shaped terminal is press-connected. Is.

FIG. 11: I applied to a conventional BGA type IC package
It is a longitudinal cross-sectional view which shows typically the principal part structure of C socket.

FIG. 12 is a partial vertical sectional view schematically showing a detailed structure of an IC socket applied to the same BGA type IC package.

FIG. 13 is a vertical cross-sectional view schematically showing a main part configuration of an IC socket applied to a conventional gull wing type IC package.

FIG. 14 is a rear perspective view schematically showing an external configuration of an IC package including a conventional pad-shaped terminal.

[Explanation of symbols]

 A BGA type IC package 1 Package body 1a Bottom part 2 Connection terminal 2a Large diameter surface 2b End surface C Gull wing type IC package 3 Package body 4 Connection terminal 4a Contact surface E IC package with pad type connection terminal 5 Package body 6 Connection terminal 6a Contact surface F IC socket for IC test of BGA type IC package 11 Socket body 12 Recessed portion 13 Spring 14 Floating plate 15 Positioning piece 16 Contact member introduction opening 17 Pressing plate 17a Pivot pin 17b Spring 17c Guide slope 17d Locking groove 18 Locking lever 18a Pivot pin 18b Spring 18c Locking jaw 20 Sliding / rotating conversion mechanism 21 Contact pin device 22 Extraction terminal 23 Fixed brim 24 Bending lead plate 24a Bending lead piece 25 Contact member 25a Lead hole 25b Inner circumference taper contact surface 25c Outer circumference part 25d Butting step part 26 Holding coil spring 27 Lead rod 28 Sliding cam pin 29 Contact member 29a Inner circumference tapered contact surface 30 Inclined cam groove 31 Lead rod 32 Sliding cam pin 33 Contact member 34 Actuating cam portion 34a Inclined cam surface 34b Vertical cam surface 35 Holding coil spring 36 Contact member 36a Inner peripheral tapered contact surface 36b Recessed portion (non-contact portion) 37 Sliding cam pin 38 Lead rod 39 Operating cam portion 39a Inclined cam surface 39b Vertical cam surface 40 contact member 40a lead hole portion 40b end contact surface 40c outer peripheral portion 40d abutting step portion 41 contact member 41a lead hole portion 41b end contact surface 41c outer peripheral portion 41d abutting step portion

Claims (6)

[Claims] 1. An IC socket for electrical connection between an IC package and an external circuit, which is elastically contacted with each connection terminal of the IC package so as to obtain a required electrical continuity. A contact pin device, wherein a contact member that obtains a contact action with respect to the connection terminal is configured to be contact-rotatable in a state where the connection terminal is elastically contacted with the connection terminal and in a position. Movable contact pin device for sockets. 2. The contact / rotating action of the contact member is performed by a sliding / rotating conversion mechanism interposed between the contact member and another component. Movable contact pin device for IC socket. 3. A movable body for applying to an IC socket for electrically connecting an IC package and an external circuit, which is elastically contacted with each connection terminal of the IC package to obtain a required electrical conduction. In the contact pin device, a contact member that obtains a contact action with respect to the connection terminal is provided separately from other constituent members, and the contact member is in a contact direction with respect to the other constituent member. The sliding / rotating conversion mechanism is interposed between the two members, and the contact member is connected to the connection terminal by the sliding / rotating conversion mechanism. A movable contact pin device for an IC socket, characterized in that, when the elastic contact is made, the contact contact can be rotated while the elastic contact is maintained. 4. The IC socket according to claim 1, wherein the elastic force acting on the contact member in the contact direction is given by a coil spring incorporated inside the mechanism. Movable contact pin device. 5. The slide / rotation conversion mechanism is provided with a lead hole formed in either one of the contact member and the other component, and a slide engaging member provided in the other and provided in the lead hole. A twisted lead piece to be fitted, or a combination of a sliding cam pin provided on either one and an inclined cam surface formed on the other for slidably engaging the sliding cam pin,
The contact pivoting action of the contact member with respect to the connection terminal is caused by sliding associated with movement of the connection terminal and the contact member in the relative contact direction.
Or a movable contact pin device for an IC socket according to any one of 4). 6. A non-contact portion that does not come into contact with an end surface of the connection terminal is formed on at least a part of a contact portion of a contact member that obtains a contact action with respect to the connection terminal. A contact pin device for an IC socket according to claim 1.