JP2014086376A - Socket for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electronic component capable of reducing the contact resistance of a contact pin to a connection electrode to obtain good connection between them.SOLUTION: The socket comprises a socket pin 21 including: a cylindrical pin fixing part 22 having a cavity 22b inside it; a first end C1 and a second end C2 which are formed on the circumferential surface of the pin fixing part 22 and arranged in the axial direction of the pin fixing part 22; a curved groove 22a having a folded part C3 which is arranged to be away from the first end C1 and the second end C2 toward the one circumferential direction of the pin fixing part 22 in a region between the first end C1 and the second end C2; a contact pin 24 which is slidably inserted into the cavity 22b of the pin fixing part 22 and which has a tip projecting from the end of the pin fixing part 22; a projection 24a which is formed on the circumferential surface of the contact pin 24 and is slidably fitted into the groove 22a; and a spring 25 which biases the contact pin 24 from the back end to the tip inside the pin fixing part 22.

Description

  The present invention relates to an electronic component socket.

  An electronic component such as a semiconductor integrated circuit device (IC) is tested by a test apparatus, and then shipped and mounted on an electronic device. In a test apparatus or an electronic device, an electronic component may be detachably attached to a socket on a printed board. The electronic component also has lead terminals and solder bumps connected to socket pins in the socket.

  An IC socket to which a semiconductor integrated circuit device is attached has, for example, an elastic conductive pin connected to the lower surface of a lead terminal of the semiconductor integrated circuit device. In addition, a structure in which a pressing pad for pressing the lead terminal from above is formed on the upper cover of the IC socket is known. The lead terminal of the semiconductor integrated circuit device mounted on the IC socket having such a structure is fixed by being sandwiched from above and below by an elastic pin and a holding pad.

  Further, as an IC socket to which a semiconductor integrated circuit device having solder bumps or lead terminals is attached, a structure in which a conductive pin contact member (socket pin) that presses the solder bumps or lead terminals from below is attached is known. . Such a pin-like contact member has a structure that rotates only in one direction when pressed down by a solder bump or a REIT terminal.

JP-A-8-250249 JP 2003-86317 A JP 2003-86317 A

  In the structure in which the pin-shaped contact member presses the solder bump or the lead terminal from below while rotating in one direction as described above, the surface of the solder bump or the lead terminal is scraped during rotation to generate oxide film dust, It is easy to be sandwiched between the solder bump or lead terminal and the tip of the pin-like contact member. Since the dust of such an oxide film has high electric resistance, the contact resistance between the tip of the pin-like contact member and the solder bump or the lead terminal is increased.

  An object of the present invention is to provide a socket for an electronic component capable of reducing the contact resistance of a socket pin with respect to a connection electrode of the electronic component such as a bump or a lead and improving the electrical connection thereof. .

According to one aspect of the present embodiment, it has a main body on which an electronic component is placed and a socket pin connected to a connection electrode of the electronic component, and the socket pin is a cylindrical pin having a cavity inside The first end, the second end, the first end, and the second end that are formed on the peripheral surface of the fixing portion, the pin fixing portion, and are arranged in order from the end along the axial direction of the pin fixing portion. In a region between the first end and the bent end having a folded portion disposed away from the second end in one circumferential direction, and slidable in the cavity of the pin fixing portion A contact pin inserted and having a tip protruding from the end of the pin fixing portion; a first protrusion formed on an outer peripheral surface of the contact pin and slidably fitted in the first groove; and the pin fixing In the part, the contact pin faces the end part. Has a spring for energizing the electronic component socket is provided, characterized in that.
The objects and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the appended claims. It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention.

  According to this embodiment, the contact resistance of the contact pin with respect to the connection electrode such as the bump or the lead can be lowered to improve the electrical connection thereof.

FIG. 1 is a cross-sectional view showing an example of an electronic component socket according to the embodiment. FIG. 2 is a side view illustrating a socket pin applied to the electronic component socket according to the first embodiment. 3A and 3B are perspective views showing an example of the operation of the socket pin applied to the electronic component socket according to the first embodiment. 4A to 4C are cross-sectional views illustrating the operation of the connection portion between the socket pin and the lead terminal applied to the electronic component socket according to the first embodiment. 5A and 5B are front views showing another example of the cam groove of the socket pin applied to the electronic component socket according to the embodiment. FIG. 6 is a perspective view showing an example of a socket pin applied to the electronic component socket according to the second embodiment. FIGS. 7A and 7B are perspective views showing an example of the operation of the socket pin applied to the electronic component socket according to the second embodiment. FIGS. 8A to 8C are cross-sectional views showing the operation of the connection portion between the socket pin and the lead terminal applied to the electronic component socket according to the second embodiment.

  Embodiments will be described below with reference to the drawings. In the drawings, similar components are given the same reference numerals.

(First embodiment)
FIG. 1 is a cross-sectional view illustrating an example of an electronic component socket according to the embodiment, and FIG. 2 is a side view illustrating a socket pin in the electronic component socket illustrated in FIG.

  The electronic component socket 10 shown in FIG. 1 has a structure in which the semiconductor device 1 is attached as an electronic component. In the socket main body 11 on the lower side of the electronic component socket 10, a recess 12 is formed at the center of the upper surface, and a support plate 13 for supporting the package of the semiconductor device 1 is attached on the bottom surface of the recess 12. A lid 14 that can be opened and closed with respect to the upper surface of the socket body 11 is disposed on the socket body 11.

  At the rear ends of the lid body 14 and the socket body 11, a hinge portion 16 having a structure to be engaged with each other is formed. The hinge portion 16 has a lateral hole, and a first support pin 15 is inserted therein. Thereby, the lid body 14 has a structure that can be rotated by the hinge portion 16 with respect to the socket body 11. Further, in the hinge portion 16, a first coil spring 17 is attached around the first support pin 15, one end thereof is hung on the upper surface side of the socket body 11, and the other end is hung on the lower surface side of the lid body 14. It has been. As a result, the first coil spring 17 biases the lid body 14 in the opening direction with respect to the socket body 11.

  A latch 19 having a substantially Y-shaped cross section is rotatably attached to the front end of the lid body 14 via a second support pin 18. Further, a hook 19 a that is hooked on the groove 11 a at the tip of the socket body 11 is formed at the tip of the latch 19. A second coil spring 20 is attached to the second support pin 18 on the latch 19 side, and one end thereof is hung on the upper surface of the lid body 14 and the other end is hung on the latch 19. Thus, the coil spring 20 biases the tip of the latch 19 toward the lower surface of the lid body 14.

  On the lower surface of the lid body 14, a lead pressing portion 14 a that presses the lead terminal 2 of the semiconductor device 1 on the support plate 13 is formed. A socket pin 21 that contacts the lower surface of the lead terminal 2 is attached to the bottom of the recess 12 of the socket body 11. The lower end of the socket pin 21 is connected to, for example, the wiring or electrode pad of the printed circuit board 3 for a semiconductor test apparatus.

  As illustrated in FIG. 2, the socket pin 21 includes a pin fixing portion 22, a back cover 23, a contact pin 24, a spring 25, and a pin-like terminal 26, which are made of a conductive material, for example, metal.

  The pin fixing portion 22 is formed of a hollow cylindrical metal, and a contact pin 24 is fitted in a columnar space 22b inside the pin fixing portion 22 so as to be slidable in the vertical direction. A plurality of sharp protrusions 24 b are formed at the tip of the contact pin 24, and the length of the contact pin 24 is adjusted so that the tip protrudes from the upper end portion of the pin fixing portion 22.

  A cam projection 24 a is formed on the outer peripheral surface of the contact pin 24, and the cam projection 24 a is fitted from the inside into a cam groove 22 a formed on the peripheral surface of the pin fixing portion 22. The upper and lower end portions of the cam groove 22a are arranged vertically apart from the upper end portion of the cylindrical pin fixing portion 22 in the axial direction, and have a bent shape or a curved shape. That is, the region between the upper end portion and the lower end portion of the cam groove 22a has a folded portion that is separated from the end portions in one circumferential direction. There are various methods for inserting the cam protrusion 24a into the cam groove 22a, for example, inserting the cooled contact pin 24 and the cam protrusion 24a into the space 22b with the pin fixing portion 22 heated and expanded. It is not particularly limited. Note that the socket pin 21 cannot be removed from the pin fixing portion 22 by hooking the cam protrusion 24a on the inner periphery of the upper end portion of the cam groove 22a.

  In the pin fixing portion 22, a space formed between the bottom of the pin fixing portion 22 and the rear end of the contact pin 24 becomes a spring accommodating portion, and a spring 25 is inserted therein. In the present embodiment, a spring is used as the spring 25. A back cover 23 serving as an upper end of the pin-like terminal 26 is inserted into the opening at the lower end portion of the pin fixing portion 22, and a flange 27 of the pin-like terminal 26 is in contact with the lower end portion from below.

  The semiconductor device 1 is mounted on the electronic component socket 10 having the above structure by the following operation.

  First, the lid 14 is opened so that the upper part of the socket body 11 is exposed. In this state, when the semiconductor device 1 is placed on the support plate 13 at the bottom of the recess 12 of the socket body 11, the lower surface of the lead terminal 2 of the semiconductor device 1 contacts the tip of the contact pin 24 of the socket pin 21. In this state, when the lid body 14 is rotated downward to approach the socket body 11, the lead holding portion 14 a on the lower surface of the lid body 14 shown in FIG. 1 contacts the upper surface of the lead terminal 2 of the semiconductor device 1. Further, the lead terminal 2 and the socket pin 21 are pressed.

  When the lead terminal 2 is pressed by the lead holding portion 14a, the contact pin 24 that contacts the lower surface of the lead terminal 2 sinks against the urging force of the spring 25 below, as shown in FIG. Go in. In the process of lowering the contact pin 24, the cam protrusion 24a on the outer peripheral surface of the contact pin 24 is guided by the cam groove 22a and moves downward from the upper end portion of the cam groove 22a. In the middle of such movement, the cam protrusion 24a moves to the folded portion diagonally downward to the right in FIG. 3A, and the contact pin 24 rotates in the right direction in the figure. For this reason, as shown in FIGS. 4A and 4B, the protrusion 24b at the tip of the contact pin 14 scrapes off the oxide film 2a and dust on the surface of the lead terminal 2 to expose a new metal surface. The oxide film 2 a and dust thus written adhere to the rotation direction side of the protrusion 24 b of the contact pin 24 and are easily sandwiched between the protrusion 24 b and the lead terminal 2.

  Further, as illustrated in FIG. 3B, when the contact pin 24 is pressed by the lead terminal 2 and sinks, the cam protrusion 24a is guided from the folded portion of the cam groove 22a to the lower end portion. Thus, when the cam protrusion 24a moves along the cam groove 22a in the diagonally downward left direction from the folded portion, the contact pin 24 is reversed in the circumferential direction and rotated leftward in the figure.

  Immediately before the rotation direction is changed, the protrusion 24b at the upper end of the contact pin 24 has an oxide film 2a and a lump of dust 2b scraped by movement on the lower surface of the lead terminal 2, as shown in FIG. 4B. You may get on. However, when the rotation direction of the contact pin 24 is reversed, as shown in FIG. 4C, the protrusion 24b is separated from the lump 2b and drops the lump 24b. Further, the protrusion 24b of the contact pin 24 that rotates in the opposite direction in the circumferential direction further scrapes off the new metal surface exposed by scraping and stops. The stopped contact pin 24 contacts the scraped area of the lower surface of the lead terminal 2. In this case, the protrusion 24b at the upper end of the contact pin 24 scrapes the metal on the surface scraped off in the first half of the movement in the opposite direction. However, since the metal is extremely oxidized, the protrusion 24b and the lead Even if sandwiched between the terminals 2, the electrical connection between them is good. The lead terminal 2 is made of, for example, aluminum.

  Therefore, the tip of the contact pin 24 biased upward by the spring 25 returns to and comes into contact with the scraped area of the lead terminal 2 while being pressed by the lead pressing portion 14a via the lead terminal 2. . Therefore, the contact pin 24 and the lead terminal 2 are electrically connected with a low resistance.

  Thereafter, when the latch 19 at the front end of the lid body 14 is engaged with the recess 11 a at the front end of the socket body 11 in a state where the lid body 14 is closed with respect to the upper surface of the socket body 11, the spring 25 biases upward. Thus, the electrical connection between the socket pin 21 and the lead terminal 2 is maintained well.

  According to the electronic component socket 10 described above, the cam groove 22a of the pin fixing portion 22 that guides the cam protrusion 24a on the outer peripheral surface of the contact pin 24 is in the middle of the path from the upper end to the lower end. A folded portion that is separated from the portion in one circumferential direction. Accordingly, the trajectory in which the cam protrusion 24a moves from the upper end to the lower end of the cam groove 22a reciprocates when paying attention to the lateral (circumferential) direction, and the contact pin 24 continuously rotates in the direction opposite to the one direction. become.

  For this reason, the protrusion 24b of the contact pin 24 reciprocally slides in the same area on the lower surface of the lead terminal 2, and after removing the oxide and dust on the surface of the sliding area to expose a new metal surface, The tip of the contact pin 24 returns to contact with a new metal surface. Thereby, the electrical connection between the socket pin 21 and the lead terminal 2 becomes good, and the electrical continuity between the semiconductor device 1 and the outside becomes good. For this reason, in the semiconductor device test apparatus using the electronic component socket 10, a test error due to a contact failure between the socket pin 21 and the lead terminal 2 is less likely to occur.

  By the way, the shape of the cam groove 22a formed in the cylindrical pin fixing portion 22 of the socket pin 21 is substantially “U” shape (horizontal U shape) as shown in FIG. As shown in a), the shape may be substantially “<”. Further, as shown in FIG. 5B, the cam groove 22a is preferably arranged in the order of the upper end portion C1, the lower end portion C2, and the folded portion C3 in one lateral (circumferential) direction. In such an arrangement order, the protrusion 24b of the contact pin 24 does not scrape the oxide film 2a anew after passing through the already scraped area after rotating in the reverse direction at the folded portion. The contact with the lead terminal 2 becomes good.

(Second Embodiment)
FIG. 6 is a perspective view showing a socket pin of the electronic component socket according to the second embodiment. In FIG. 6, the same reference numerals as those in FIG. 2 denote the same elements.

  A socket pin 31 shown in FIG. 6 is attached to the bottom of the socket body 11 of the electronic component socket 10 illustrated in FIG. 1, and includes a pin fixing portion 32, a back cover 33, a contact pin 34, a spring 35 and a pin-like terminal 36. And they are made of a conductive material, for example a metal. The pin fixing portion 32 is formed of a hollow rectangular tube-shaped metal, and the space f inside thereof is formed larger than the rectangular pillar-shaped contact pin 34, and the contact pin 34 can slide in the vertical direction in the space. It is inserted. A sharp protrusion 34 c is formed at the tip of the contact pin 34, and the length of the contact pin 34 is adjusted so that the tip protrudes from the tip of the pin fixing portion 32.

  A first cam protrusion 34a and a second cam protrusion 34b are formed on one surface of the outer periphery of the contact pin 34 in the axial direction, that is, in the vertical direction, in order from the upper end. The first and second cam protrusions 34a and 34b are fitted in first and second cam grooves 32a and 32b formed on the body of the pin fixing portion 32, respectively. The first and second cam grooves 32a and 32b are formed at positions where the first and second cam protrusions 34a and 34b can simultaneously move in the vertical direction. For example, the shape in which the second cam projection 34b is located near the upper end or the lower end of the second cam groove 32b in a state where the first cam projection 34a is located near the upper end or the lower end of the first cam groove 32a. Is formed.

  The first cam groove 32 a is formed linearly along the axial direction (vertical direction) of the pin fixing portion 32. The second cam groove 32b has a bent shape or a curved shape having an upper end portion and a lower end portion that are sequentially arranged in the axial direction from the upper end portion of the pin fixing portion 32. That is, the second cam groove 32b has a folded portion that is separated in one lateral (circumferential) direction from the end portion in a region in the middle between the upper end portion and the lower end portion.

  In this case, the lateral movement of the second cam protrusion 34 b is ensured by adjusting the width of the gap formed between the inner surface of the cavity 32 c in the pin fixing portion 32 and the side surface of the contact pin 34. . In the gap, when the second cam protrusion 34b moves laterally in the second cam groove 32b, the first cam protrusion 34a serves as a fulcrum and the second cam protrusion 34b moves obliquely. . For this reason, when the second cam projection 234b reaches the most lateral position of the second cam groove 32b, the above-mentioned width is set so that the lower end of the contact pin 34 does not hit the inner wall of the pin fixing portion 32. The gap is adjusted. Accordingly, the width of the cavity 32 c in the pin fixing portion 32 is larger than that obtained by adding such a gap to both sides of the width of the contact pin 34.

  As a method of inserting the first and second cam protrusions 34a and 34b into the first and second cam grooves 32a and 32b, for example, the contact pin 34 is inserted in a state where the pin fixing portion 32 is heated and expanded. There are various methods such as these, and there is no particular limitation. Note that the socket pin 31 cannot be removed from the pin fixing portion 32 by hooking the cam protrusions 34a, 34b on the inner periphery of the upper end portions of the cam grooves 32a, 32b.

  Further, a space formed between the lower end portion of the contact pin 34 and the bottom of the pin fixing portion 32 around the contact pin 34 is used as a spring accommodating portion into which the spring 35 is inserted. In the present embodiment, a spring is used as the spring 35. A back cover 33 at the upper end of the pin-like terminal 36 is inserted into the opening at the bottom of the pin fixing portion 32, and a flange 36 is formed around the lower portion of the back cover 33. Touched.

  The semiconductor device 1 is mounted on the electronic component socket 10 having the above structure by the following operation.

  First, when the lid 14 of the electronic component socket 10 is opened from the socket body 11 and the semiconductor device 1 is placed on the central support plate 13, the lower surface of the lead terminal 2 of the semiconductor device 1 is connected to the contact pin 34 of the socket pin 31. Abuts the upper end. In this state, when the lid body 14 is rotated toward the socket body 11, the lead holding portion 14 a on the lower surface of the lid body 14 comes into contact with the upper surface of the lead terminal 2 of the semiconductor device 1 and further presses the lead terminal 2 from above. To do.

  When the lead terminal 2 is pressed by the lead holding portion 14a, the socket pin 31 that contacts the lower surface of the lead terminal 2 sinks against the urging force of the spring 35 as shown in FIG. . In the process, the first and second cam protrusions 34a and 34b of the contact pin 34 move while being guided by the first and second cam grooves 32a and 23b.

  In the middle of the movement, first, the second cam protrusion 34b moves from the upper end of the second cam groove 32b to the folded portion in the diagonally lower right direction in the drawing. As a result, the entire contact pin 34 tilts sideways. At the same time, the first cam protrusion 32a is guided by the first cam groove 32a and moves from the top to the bottom, and in the middle of the movement, the second cam protrusion 34b is inclined downward with respect to the circumferential (lateral) direction. It becomes a fulcrum of movement.

  Therefore, as shown in FIG. 7A, the protrusion 34c formed at the upper end of the contact pin 34 moves in the lateral direction opposite to the second cam protrusion 34b with the first cam protrusion 34a as a fulcrum. To do. Thereby, as shown in FIGS. 8A and 8B, the protrusion 34c scrapes the oxide film 2a and dust on the lower surface of the lead terminal 2 to expose a new metal surface. The oxide film 2a and dust thus scraped off adhere to the movement direction side of the protrusion 34c and are easily sandwiched between the protrusion 34c and the lead terminal 2.

  Further, as shown in FIG. 7B, when the contact pin 34 is further pressed downward by the pin pressing portion 14a, the first and second cam protrusions 34a and 34b are moved to the first and second cam grooves. It sinks to the lower end of 32a, 32b. In the middle of the movement, the second contact pin 34b is guided diagonally downward to the left in the drawing by the second cam groove 32b. Thereby, the second cam protrusion 34b changes the movement in the lateral direction in the reverse direction, and moves from the turning point to the lower end in the diagonally lower left direction in the figure.

  For this reason, as shown in FIGS. 8B and 8C, the protrusion 34c at the upper end of the contact pin 34 whose lateral moving direction is reversed is the oxide film 2a or dust lump scraped off in the first half of the movement. Leave 2b. In this case, the lump 2b is attached to the lower surface of the lead terminal 2 or falls. Further, in the latter half of the movement of the protrusion 34c, the newly exposed metal surface of the lead terminal 2 is further scraped off and stopped.

  The stopped tip of the contact pin 34 comes into contact with the newly exposed metal surface of the lead terminal 2 and maintains this state. In this case, the protrusion 34c at the tip of the contact pin 34 further scrapes off the newly exposed metal surface, but the metal is very little oxidized. Therefore, even if the metal is sandwiched between the contact pin 34 and the lead terminal 2, the electrical connection between them is good. The lead terminal 2 is made of, for example, aluminum.

  The contact pin 34 is pressed from the bottom toward the lower surface of the lead terminal 2 by the urging force of the spring 35, and maintains a state in which the contact pin 34 is in contact with the newly exposed metal region of the lead terminal 2. Therefore, it will be connected with low resistance.

  Thereafter, as in the first embodiment, when the latch 19 at the front end of the lid 14 shown in FIG. 1 is engaged with the recess 11a at the front end of the socket body 11 and closed, the electrical connection between the socket pin 31 and the lead terminal 2 is achieved. The connection is well maintained.

  According to the socket pin 31 of the electronic component socket 10 as described above, the cam grooves 32 a and 32 b of the pin fixing portion 32 have a shape that allows the cam protrusions 34 a and 34 b to be folded back in the lateral (circumferential) direction of the pin fixing portion 34. Have. For this reason, the protrusion 34c of the contact pin 34 reciprocally slides in the same area on the lower surface of the lead terminal 2, and after a new metal surface is exposed after the oxide and dust on the surface of the sliding area are removed, a new metal surface is exposed. The tip of the contact pin 34 returns to contact with a metal surface. As a result, the electrical connection between the socket pin 31 and the lead terminal 2 becomes good, the contact failure in the electronic component socket 10 hardly occurs, and the electrical continuity between the semiconductor device 1 and the outside becomes good. For this reason, in the semiconductor device test apparatus using the electronic component socket 10, a test error due to a contact failure between the socket pin 21 and the lead terminal 2 is less likely to occur.

  By the way, the shape of the second cam groove 32b formed in the pin fixing portion 32 of the socket pin 31 is substantially “く” as in the first embodiment, in addition to the substantially “U” shape as shown in FIG. It may be a letter shape. Similarly to the first embodiment, the second cam groove 32b has an upper end C1, a lower end C2, and a folded portion along one lateral (circumferential) direction, as shown in FIG. 5B. You may arrange | position in order of C3.

  In the above embodiment, the structure in which the socket pins 21 and 31 are connected to the lead terminal 2 of the semiconductor device 1 has been described. However, another connection electrode formed on the lower surface of the semiconductor device 1, such as a solder bump (not shown). It may be connected to. Further, in the socket pins 21 and 31, the diameters of the cavities 22b and 32c in the pin fixing portions 22 and 32 are narrowed only at the upper end, and furthermore, the upper ends of the contact pins 24 and 34 are made into an inverted T-shape, thereby making contact. The pins 24 and 34 may be prevented from coming out upward from the pin fixing portions 22 and 34. Moreover, although the example which formed the pin fixing | fixed part 22 and 32 about the said cam grooves 22a and 32b was shown, you may form only in the inner surface. In the above embodiment, the cam grooves 22a and 32b are illustrated so as to move the cam protrusions 24a, 34a, and 34b to the right side in the circumferential direction, but may be configured to move to the left side.

  All examples and conditional expressions given here are intended to help the reader understand the inventions and concepts that have contributed to the promotion of technology, such examples and It is interpreted without being limited to the conditions, and the organization of such examples in the specification is not related to showing the superiority or inferiority of the present invention. While embodiments of the present invention have been described in detail, it will be understood that various changes, substitutions and variations can be made thereto without departing from the spirit and scope of the invention.

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Lead terminal 10 Socket for electronic components 11 Socket main body 12 Recess 13 Support plate 14 Cover 14a Lead holding part 21, 31 Socket pin 22, 32 Pin fixing part 22a, 32a, 32b Cam projection 23, 33 Back cover 24 34 Contact pins 24a, 34a, 34b Cam grooves 24b, 34c Projections
24b, 34c Cavity 25, 35 Spring 26, 36 Pin-shaped terminal 27, 37 Flange

Claims (5)

A main body on which the electronic component is placed, and a socket pin connected to the connection electrode of the electronic component;
The socket pin is
A cylindrical pin fixing part having a cavity inside;
A first end, a second end, and a region between the first end and the second end, which are formed on the peripheral surface of the pin fixing portion and are arranged in order from the end portion along the axial direction of the pin fixing portion. A bent first groove having a folded portion disposed away from the first end and the second end in one circumferential direction;
A contact pin that is slidably inserted into the cavity of the pin fixing portion and has a tip protruding from the end portion of the pin fixing portion;
A first protrusion formed on the outer peripheral surface of the contact pin and slidably fitted in the first groove;
A spring for biasing the contact pin toward the end portion in the pin fixing portion,
A socket for electronic parts characterized by the above.   The electronic component socket according to claim 1, wherein a second protrusion is formed at the tip of the contact pin.   3. The electronic component socket according to claim 1, wherein the cavity of the pin fixing portion has a cylindrical shape, and a portion of the contact pin that is inserted into the cavity has a columnar shape. 4.   The cavity of the pin fixing part is a square cylinder, and a portion of the contact pin that is inserted into the cavity is a square pillar, and the end of the pin fixing part and the first groove are between the first groove and the first groove. A second groove is formed along the axial direction of the pin fixing portion, and a third protrusion is formed on the outer periphery of the contact pin so as to be slidably fitted in the second groove. The electronic component socket according to claim 1 or 2. The said 1st groove | channel WHEREIN: The said 1st end, the said 2nd end, and the said folding | returning part are arrange | positioned in order in said one circumferential direction, The Claim 1 thru | or 4 characterized by the above-mentioned. Socket for electronic components.

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