JP3044476B2 - socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for elastically pressing an electric component, particularly an IC package in which a semiconductor integrated circuit chip (hereinafter referred to as an IC chip) is molded and inserted. The present invention relates to a socket having contacts that can be electrically contacted with each other, for example, an IC chip test socket.

B. 2. Description of the Related Art In recent years, IC packages have become thinner and smaller, and their use for surface mounting has been increasing. However, on the other hand, the quality of the product becomes less stable as the thickness of the IC becomes thinner and smaller. Therefore, the step of performing inspection and removing a product having a defect or a component causing the defect has played an important role.

In particular, for the inspection of IC packages including such highly integrated ICs for surface mounting (for example, a heat resistance test called a burn-in test), put the IC package in a heating furnace and determine whether it is good or bad. Judgment has been made.

As a socket for mounting an IC package used in such a test, one shown in FIGS. 5 and 6 is used.

The socket base 1 shown in FIG. 5 has a large number of pin-shaped contacts (contacts) on a mounting portion 3 on which an IC package 2 is mounted.
The lead 4 of the IC package 2 is mounted on the contact 4a of the contact 4, and the cover member 6 is pressed from above to secure the contact pressure between the lead 5 and the contact 4. I have. In this case, although illustration is omitted,
The cover member 6 is pressed and held from above by a locking member called a latch. However, the method of pressing the IC lead 5 against the contact 4 as described above has the following disadvantages.

(1) It is difficult to apply a constant force to each IC lead by the cover member 6, which may cause the leads to be misaligned or bent. That is, the cover member 6
Can rotate about a fulcrum (not shown but exists on the left side of FIG. 5) as shown by a dashed line, and is turned to a solid line position and locked there. The second lead 5 is also provided at a left position (not shown) and is similarly pressed by the cover member 6, but at this time,
The pressing force on the side closer to the rotation fulcrum (left position) is inevitably greater than the pressing force at the solid line position (right position), and the pressing force itself of the cover member 6 varies between leads. . For this reason, the bending of the lead occurs at a portion where the pressing force is large, and the arrangement of the leads is uneven at a portion where the pressing force is small and uneven. In this case, not only a contact failure occurs, but also troubles such as the leads of the IC as a product are not soldered to the printed board.

(2) Since the lead 5 is pressed by the cover member 6, the IC cannot be removed without removing the cover member 6, that is, it is difficult to automate the IC.

(3) The cover member 6 increases the size of the socket,
At the same time as the mounting density does not increase, the temperature does not easily rise during the test because the cover member 6 covers the IC.

According to the socket of FIG. 6, the pressing member 9 is lowered to press the projecting portion 10 of the contact 4. As a result, the contact 4 is elastically deformed in the direction of arrow 11, and the contact 4a is opened outward. In this state, each lead 5 of the IC package 2 is connected to the base 1
Into the guide groove 8 from above and lower its slope,
After the IC package 2 is positioned by the protrusion 7 provided at the position shown in the drawing, the pressing force of the pressing member 9 is removed.
The contact 4 is elastically moved back to the original position, and the contact 4 a is pressed against the lead 5. However, this contact method cannot avoid the following disadvantages.

(1) The IC package 2 must be accurately positioned on the base 1. If the IC package 2 is misaligned, the contact pressure by the contact 4 becomes uneven, resulting in poor contact or excessive contact pressure. I will.

(2) Therefore, to obtain a predetermined contact pressure, the projection 7 and the contact
The distance from 4a must correspond to the length and shape of the lead 5, and only one type of IC package can be applied to one type of socket. Therefore, one kind of socket cannot cope with various changes in the lead length depending on the user's request.

C. An object of the present invention is to provide a socket capable of obtaining a stable and reliable electric connection with a sufficient and uniform contact pressure between a connection terminal portion of an electric component and a contact.

D. Configuration of the Invention That is, the present invention provides a socket body on which a predetermined electric component is mounted, a reciprocating member provided to be capable of reciprocating vertically with respect to the socket body, and a rotatable member mounted on the socket body. It is attached, and rotates from the original position to the retreat position in conjunction with the forward movement of the reciprocating member to allow the electric component to be inserted into the socket body, and interlocks with the reciprocation of the reciprocating member in the retreat position. A fixing member that turns to the original position to fix the electric component to the socket body, and is provided between the socket body and the fixing member, and the fixing member is moved to the original position. A spring member for biasing;
When the electric component is fixed to the socket body by the fixing member, the socket is provided on the socket body and is displaceable in conjunction with the reciprocating motion of the reciprocating member.
A contact that is pressed by a connection terminal portion of the electric component so as to be sandwiched between the electric component and the fixing member and that is electrically connected to the connection portion, and is connected to the connection terminal portion of the contact. The return of the fixing member to the original position is completed before the displacement of the socket is completed.

In the above configuration, "in conjunction with" the "in conjunction with the reciprocation of the reciprocating member" means that the inversion is performed simultaneously with the fixing of the electric component, and after the incorporation, the restoration is continued. This also means that the action is performed.

E. Examples Hereinafter, examples of the present invention will be described.

1 to 4 show an IC chip test (burn-in test) socket according to the present embodiment.

That is, the contact 24 is entirely formed of a pin-shaped conductive material, and has a fixed end to the base 21 which is a socket body.
24b, a resilient bent portion 23 which is connected to the fixed end portion 24b and is sufficiently bent in an arc shape, and a sliding contact portion 20 which is connected to the bent end of the bent portion 23 and And a contact 24a.

A fixing member 40 for holding and fixing the lead 5 of the IC package 2 in which the IC chip is molded to the contact of the contact 24,
A substantially U-shaped fixing lever portion 41 (see FIG. 4) which stands upright from a fulcrum pin 43 (rotation center) fixed to the socket body 21, and extends in a direction perpendicular to the fixing lever portion 41. The connecting portion 44 is provided, and the projecting portion 42 projects upward from the connecting portion 44. The recess (not shown) formed in the socket body 21 has a coil spring (spring).
45 is provided, and the upper end of the spring 45 is in contact with the lower end of the continuous portion 44 of the fixing member 40. Further, the continuous portion 44 of the fixing member 40 is disposed in the groove 27 provided in the base 21.

The cover member (reciprocating member) 30 is a sliding contact portion 20 of the contact 24.
A groove 34 is provided for inserting a groove, and the groove 34 is provided with an inclined surface 32 (sliding contact surface of the sliding contact portion 20).

Next, an operation of mounting the IC package 2 on the socket body 21 will be described.

That is, as shown in FIG. 2, first, the cover member 30 attached to a predetermined position of the socket body 21 is indicated by an arrow 38 by an external force (for example, a force by a hand or a machine) from the position (normal state) of FIG. In the direction (forward movement). At this time, the sliding portion 20 of the contact 24 moves clockwise while sliding on the inclined surface 32. At the same time, the contact 24a moves in the same direction and separates from the lead 5 (contact open). At this time, a certain amount of force is required to elastically deform the contact 24, but not so large force is required due to the above shape. Further, when the cover member 30 is moved downward, the lower end of the cover member 30 comes into contact with the protrusion 42 of the fixing member 40. Then, by further moving the cover member 30 downward in the direction of arrow 38, the protruding portion 42 is pressed downward by the cover member 30, and the fixing lever is
The 41 (fixing member 40) rotates clockwise while resisting the spring force of the spring 45 (that is, the lever 41 is opened so that the IC package 2 can be inserted). Then, the cover member 30 is further pushed down until it comes into contact with the socket main body 21, so that the fixing member 40 (lever 41) is fully opened (full stroke) as shown in FIG.

Next, with the fixing member 40 (lever 41) fully opened as described above, the IC package 2 is inserted through the through hole 31 of the cover member 30 as shown in FIG. Insert the IC package 2 in the position. At this time,
The package 2 is positioned by the protrusion 7 provided on 21.

Thereafter, by releasing the force (external force) for pushing down the cover member 30, the fixing member 40, the contact 24, and the cover member 30 move in the direction opposite to the above-described direction (the direction in which the cover member 30 returns to the original position). I do. That is, the spring in the compressed state
The restoring force of 45 causes the fixing lever 41 to rotate counterclockwise and return to the original position, and the state shown in FIG.
40) and the contact
The elastic restoring force acting on the sliding portion 20 of the cover 24 also acts to cover 30
Is pushed back to the original position (returns). As a result, the contact 24 is also pushed back to the original position side following the fixing member 40, and the contact 24a comes into contact with the lead 5 already existing under the fixing member 40 from below, as shown in FIG. Then, the lead 5 is held between the fixing member 40 and the contact 24a.

In order to remove the IC package 2, an operation reverse to that described above may be performed. As described above, the socket according to the present embodiment has the following advantages.

(1) The contact 24 and the fixing member 40 are displaced from their original positions in conjunction with the downward movement (forward movement) of the cover member 30 due to the external force (pressing force) of the cover member 30 to move the IC package 2 to the socket body 21. After mounting, the fixing member 40 and the contact 24 are returned to their original positions, respectively, to fix the IC package 2 to the socket body 21 (specifically, to clamp the lead 5), and further, to cover the cover member 30.
Is moved to the home position side (return), so that the contact 24a rises by itself after the IC package 2 is fixed, instead of pressing the lead 5 against the contact 24a. 5 will be contacted from below. Therefore,
Since all the leads 5 come into contact with the same contact pressure, there is little variation in the contact pressure between the leads and a sufficient contact pressure can be obtained. Therefore, no bending or irregularity of the leads occurs.

(2) Basically, the IC package 2 can be fixed to the socket body 21 by a very simple operation of only the reciprocating movement (vertical movement in this example) of the cover member 30. Therefore, there is no need to perform complicated operations, and the IC package 2 can be easily detachably mounted and fixed to the socket body 21 even by an automatic machine or the like, which is very advantageous for promoting automation. In addition, since the lead is not fixed by the cover member as in the related art, the size of the socket can be easily reduced with automation.

(3) Since the lead 5 is held from above and below,
Even if the lead length changes or differs, only the lead extends outward when viewed from the holding position (when the lead length is large), and the lead can always be reliably held at a predetermined position. Therefore, the length (and shape) of the lead
Irrespective of the above, it is always possible to securely hold the product at a predetermined contact pressure, so that one type of socket can be used for multiple types of IC packages, and the shipping period to the user can be greatly reduced. .

As described above, the present invention has been exemplified, but the above-described embodiment can be further modified by the technical idea of the present invention.

For example, the shape, material, mounting position, and the like of the above-described contact and fixing member may be variously changed, and the shape, material, structure, and angle of the inclined surface of the cover member (reciprocating member) may also be changed. In addition, the material, shape, structure, and the like of the socket body may be appropriate. Alternatively, the IC package may be mounted on the socket with the IC package mounted on the carrier.

The timing of fixing the IC chip and the return of the cover member to the original position may be shifted, or may be simultaneous. Further, the shape, mounting method, type, etc. of the spring provided between the fixing member and the socket body may be changed.

The present invention can of course be applied to electric components other than the above-described IC chip.

F. As described above, in the socket of the present invention,
The electric component is inserted into the socket body by rotating the fixed member from the original position to the retracted position in conjunction with the forward movement of the reciprocating member, and the fixed member is moved to the retracted position in conjunction with the reciprocation of the reciprocating member. To the original position to fix the electric component to the socket body, and to contact the connection terminal portion of the electric component with the electric component inserted between the fixing member and the contact. Since the contacts are pressed and connected, a stable and reliable electrical connection can be obtained with a sufficient and uniform contact pressure between the connection terminal portion of the electric component and the contact. In addition, the operation of fixing electric parts can be easily performed only by a simple reciprocating motion without requiring a complicated operation, and automation by an automatic machine or the like becomes easy. Further, since the reciprocating structure is constituted by the reciprocating member, the size of the socket itself can be reduced.

Further, since the connection terminal portion is held, it is possible to always hold the connection terminal at a predetermined position even if its length is changed or different. Therefore, regardless of the length (and shape) of the connection terminal portion, it is always possible to reliably hold the connection terminal at a predetermined contact pressure, and one type of socket can be used for a plurality of types of electrical components.

[Brief description of the drawings]

1 to 4 show an embodiment of the present invention. FIG. 1 is a sectional view of a main part of a socket according to an embodiment of the present invention in a normal state, and FIG. FIG. 3 is a sectional view of a main part of the socket at full stroke, and FIG. 4 is an exploded perspective view of the socket. FIG. 5 and FIG. 6 are cross-sectional views of main parts of a conventional socket. In the reference numerals shown in the drawings, 2 ... IC package 5 ... Lead 20 ... Sliding portion 21 ... Socket body (base) 24 ... Contact 24a ... Contact 30 ... Cover member 40 ... Fixing member 42 Projection 43 Pin 45 A spring.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-288180 (JP, A) JP-A-63-299257 (JP, A) JP-A-63-307678 (JP, A) 93964 (JP, A) JP-A-4-154406 (JP, A) JP-A-3-103580 (JP, U) JP-A-2-148581 (JP, U) JP-A-2-111080 (JP, U) 62-59985 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 33/76 G01R 31/26

Claims (1)

(57) [Claims] A socket body on which a predetermined electrical component is mounted; a reciprocating member provided to be reciprocally movable in a vertical direction with respect to the socket body; The electrical component can be inserted into the socket body by rotating from the original position to the retracted position in conjunction with the forward movement of the reciprocating member, and the original position can be changed from the retracted position by interlocking with the reciprocation of the reciprocating member. A fixing member for rotating and fixing the electric component to the socket main body, and provided between the socket main body and the fixing member to urge the fixing member to the original position. When the electric component is fixed to the socket body by the fixing member, the spring member is provided on the socket body and can be displaced in conjunction with the reciprocating motion of the reciprocating member.
And a contact that is pressed by a connection terminal portion of the electric component and is electrically connected so as to sandwich the electric component between the fixing member and the fixing member, for connecting to the connection terminal portion of the contact. A socket in which the return of the fixing member to the original position is completed before the displacement of the fixing member is completed.