JP4028011B2 - Socket for electrical parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical component socket having contact pins that are electrically connected to an electrical component lead in an elastically pressed state.
[0002]
[Prior art]
As this type of conventional one, for example, there is one shown in FIG. 7 (see Japanese Patent Publication No. 6-32241). Reference numeral 1 in the figure denotes a so-called gull-wing type IC package as an “electrical component”, and the IC package 1 is formed with leads 2 protruding sideways from the peripheral edge. Reference numeral 3 in the figure denotes an IC socket 3 as an “electrical component socket” for holding the IC package 1 and inspecting the IC package 1 (for example, a heat resistance test called a burn-in test). The IC socket 3 is placed in a heating furnace to determine whether the IC package 1 is good or bad.
[0003]
In order to hold the IC package 1 in the IC socket 3, first, from the state shown in FIG. 7 (a), the presser cover 4 is pushed down by a robot or manually to rotate the rotating lever 5, As shown in FIG. 7B, the contact pin 6 is elastically deformed to retract the contact portion 6a. In this state, the IC package 1 is placed on the placement portion 7a of the socket body 7 from above. Thereafter, when the pressing force of the presser cover 4 is released, as shown in FIG. 7C, the cover 4 is lifted and the contact portion 6a of the contact pin 6 comes into contact with the upper surface of the lead 2 of the IC package 1. As a result, conduction is achieved.
[0004]
[Problems to be solved by the invention]
However, in such a conventional device, the contact pin 6 is brought into contact only with the upper surface of the lead 2 of the IC package 1, so that it is difficult to say that the electrical conductivity is better. Further, as shown in FIG. 7C, the lower surface of the lead 2 of the IC package 1 abuts on the socket body mounting portion 7a, and the dust on the mounting portion 7a adheres to the lower surface of the lead 2. When such an IC package 1 is surface-mounted, the lower surface of the lead 2 serves as a contact surface with the printed circuit board, which may adversely affect the continuity of the mounted state. .
[0005]
Accordingly, an object of the present invention is to provide an electrical component socket that improves the electrical conductivity and prevents adhesion of dust on the lower surface of the lead.
[0006]
[Means for Solving the Problems]
In order to achieve such a subject, the invention according to claim 1 is characterized in that a mounting portion on which an electrical component is placed is formed on the socket body, and from the peripheral portion of the placed electrical component to the side. A plurality of contact pins that protrude and come into contact with and come into contact with a lead whose upper surface portion and lower surface portion are parallel to each other are provided. Further, by moving the operation member, the contact pin is elastically deformed to be brought into contact with and separated from the lead. In the socket for electrical parts, the contact pin is formed with an upper contact piece that contacts the upper surface portion of the lead and a lower contact piece that contacts the lower surface portion of the lead on a portion that is elastically deformed. The upper contact piece and the lower contact piece are both elastically deformable and extend in the direction of the mounting portion. The two contact pieces are formed in a substantially U shape, and the lead is formed inside the substantially U shape. Is inserted Is urchin formed, so that the contact by the elastic force to the previous end of the upper contact piece and the leading end portion of the lower contact piece and the upper surface portion of each of the leads and the lower surface portion Komu adding the lead By lowering the operation member, the contact pin is pressed, the elastically deformed part is elastically deformed, and the upper contact piece and the lower contact piece are integrally displaced outward. The space between the two contact pieces is widened, and the upper contact piece and the lower contact piece are restored by the raising of the operation member, and the two contact pieces slide between the upper surface portion and the lower surface portion of the lead. It is characterized by being set to include .
[0007]
According to a second aspect of the present invention, in addition to the configuration of the first aspect, the leading end of the upper contact piece on the lead side is closer to the peripheral side of the electrical component than the leading end of the lower contact piece. It is characterized by protruding.
[0009]
In addition to the configuration according to claim 1 or 2 , the invention according to claim 3 is provided with a plurality of the contact pins, a connecting rod is stretched over each contact pin, and the operation member is moved, The two contact pieces of each contact pin are set so as to be displaced through the connecting rod.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0011]
Embodiment 1 of the Invention
1 to 4 show a first embodiment of the present invention.
[0012]
First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”. This IC socket 11 is used to perform a performance test of the IC package 1 that is an “electrical component”. Can be held.
[0013]
This IC package 1 is a so-called gull wing type, and a lead 2 is projected from the peripheral edge 1a toward the side. As shown in FIG. 4, the lead 2 is inclined at an angle θ so that the tip is lowered. In this lead 2, the upper surface portion 2b and the lower surface portion 2a are parallel to each other.
[0014]
Further, the IC socket 11 has a socket main body 12, and a mounting portion 12 a for mounting the IC package 1 is formed on the socket main body 12. In the state of being mounted on the mounting portion 12a, the peripheral wall 12b of the mounting portion 12a is abutted and positioned on the peripheral portion 1a of the IC package 1, while the lead 2 protrudes laterally from the peripheral wall 12b. It is like that.
[0015]
The socket body 12 is provided with a large number of contact pins 13 that are separated from and in contact with the leads 2 of the IC package 1, and the contact pins 13 are elastically deformed by moving the operation member 14, and the leads 2. It comes to be separated from.
[0016]
Specifically, the contact pin 13 is inserted by being inserted into the through hole 12c of the socket body 12, and the locking projection 13a is locked to the inner peripheral surface of the through hole 12c. The contact pin 13 is formed with a terminal portion 13b projecting downward from the socket body 12 at the lower portion, and in order toward the upper portion, a curved portion 13c, a lower contact piece 13d, and an upper contact portion as “parts to be elastically deformed” sequentially. A piece 13e and a pressed part 13f are formed.
[0017]
The curved portion 13c is substantially C-shaped and is elastically deformed. The contact pieces 13d and 13e are elastically deformable, the lower contact piece 13d is in contact with the lower surface portion 2a of the lead 2, and the upper contact piece 13e is in contact with the upper surface portion 2b of the lead 2. Thus, the contact pieces 13d and 13e are formed in a shape that holds the lead 2 by moving together. The tip end portion 13h of the upper contact piece 13e protrudes from the tip end portion 13g of the lower contact piece 13d so as to approach the peripheral edge portion 1a side of the IC package 1. Further, the pressed portion 13f protrudes upward, and is slid in contact with the cam portion 14a of the operation member 14.
[0018]
On the other hand, the operation member 14 is formed with a post portion 14b. By inserting the post portion 14b into the guide hole 12d of the socket body 12, the operation member 14 is guided to move up and down and is moved upward by a spring 15. Is being energized. At the center of the operation member 14, an opening 14 c sized to insert the IC package 1 is formed. By lowering the operation member 14, the pressed portion 13f of the contact pin 13 is pressed through the cam portion 14a, the bending portion 13c is elastically deformed, and the contact pieces 13d and 13e are slightly rotated upward. When the pressing force of the operating member 14 is released while moving the outer side while moving, the operating member 14 is lifted by the spring 15, the contact pieces 13 d and 13 e are restored, and both the contact pieces 13 e and 13 d are moved. The upper surface 2b and the lower surface 2a of the lead 2 are set so as to slide in order.
[0019]
Next, a method of using the IC socket 11 having such a configuration will be described.
[0020]
First, a plurality of IC sockets 11 are arranged on a printed wiring board by inserting and soldering the terminal portions 13b of the contact pins 13 of the IC socket 11 in advance through insertion holes of a printed wiring board (not shown). deep.
[0021]
Then, the IC package 1 is set in the IC socket 11 by, for example, an automatic machine and electrically connected.
[0022]
In other words, the operating member 14 is pressed downward by the automatic machine while holding the IC package 1 against the urging force of the spring 15. Then, as shown in FIG. 2, the pressed portion 13f of the contact pin 13 is pressed by the cam portion 14a of the operation member 14 and the curved portion 13c is elastically deformed, so that both contact pieces 13d and 13e are directed outward. The contact pieces 13d and 13e are retracted from the IC package 1 insertion range. In this state, the held IC package 1 is released from the automatic machine and placed on the placement portion 12a of the socket body 12, and the side edge portion 1a of the IC package 1 is the peripheral wall 12b of the socket body placement portion 12a. It is positioned in the state locked to.
[0023]
Thereafter, when the pressing force of the operation member 14 by the automatic machine is released, the operation member 14 is lifted by the urging force of the spring 15, the curved portion 13c of the contact pin 13 is restored by the elastic force, and both the contact pieces 13d and 13e are recovered. Return to the original position, and the lead 2 of the IC package 1 is inserted.
[0024]
In this way, the leads 2 of the IC package 1 are held between the contact pieces 13d and 13e of the large number of contact pins 13, whereby the leads 2 and the contact pins 13 are electrically connected. In this state, the test of the IC package 1 is performed.
[0025]
When the lead 2 is held, the tip 13h of the upper contact piece 13e protrudes from the tip 13g of the lower contact piece 13d, so that the tip 13h of the upper contact piece 13e is first of the lead 2 of the IC package 1. It contacts the upper surface part 2b. Thereafter, the lower contact piece 13 d comes into contact with the lower surface portion 2 a of the lead 2. Since the upper contact piece 13e contacts the upper surface portion 2b of the lead 2 of the IC package 1 in this way, the lead of the IC package 1 from the contact pin 13 side when the lead 2 is held by the contact pieces 13d and 13e. Even if a force acts on 2, the IC package 1 does not float up.
[0026]
Further, at the time of holding, since both the contact pieces 13d and 13e slide on the upper and lower surface portions 2b and 2a of the lead 2, a so-called wiping effect is exhibited. In particular, in the past, dust adhered to the lower surface portion 2a of the lead 2. However, in this invention, the lower surface portion 2a of the lead does not contact the socket body mounting portion 12a, and the lower surface portion 2a of the lead 2 is Since the lower contact piece 13d of the contact pin 13 slides, adhesion of dust to the lower surface portion 2a is prevented. Therefore, there is no adverse effect such as poor conduction when the IC package 1 that has been tested is surface-mounted.
[0027]
Further, it is necessary to adjust the movable direction of the contact pieces 13d and 13e so that the lead 2 can be held by the contact pieces 13d and 13e in accordance with the inclination angle θ of the lead 2.
[0028]
[Embodiment 2 of the Invention]
FIG. 5 shows a second embodiment of the invention.
[0029]
In the second embodiment, since the connecting portion 13i between the contact pieces 13d and 13e of the contact pin 13 is formed thin, the operating member 14 is lowered and the pressed portion 13f is pressed by the cam portion 14a. When this is done, the space between the contact pieces 13d and 13e expands somewhat, so that it can move.
[0030]
As described above, if the space between the contact pieces 13d and 13e is widened, it is easier to sandwich the lead 2 from both sides.
[0031]
Of course, in this case as well, the contact pieces 13d and 13e slide on the upper and lower surfaces 2b and 2a of the lead 2 until the lead 2 is completely sandwiched between the contact pieces 13d and 13e. It is supposed to be.
[0032]
Other configurations and operations are the same as those in the first embodiment.
[0033]
Embodiment 3 of the Invention
FIG. 6 shows a third embodiment of the invention.
[0034]
In the third embodiment, the structure and the like of the contact pin 23 are different from those of the above-described embodiments.
[0035]
That is, the contact pin 23 is formed with a linear deformed portion 23a as an “elastically deformed portion”, and a lower contact piece 23b is connected to the upper side of the deformed portion 23a. An upper contact piece 23d is formed on the upper side of the piece 23b via a C-shaped connecting portion 23c.
[0036]
And the connecting rod 24 is penetrated so that the inner side of the connection part 23c of these some contact pin 23 installed side by side.
[0037]
When the operating member 14 is lowered, the connecting rod 24 is pushed by the cam portion 14a, whereby the deforming portion 23a is elastically deformed via the rod 24, and both contact pieces 23b and 23d are displaced outward. .
[0038]
In this way, the connecting rods 24 straddling the plurality of contact pins 23 are pushed to displace the contact pins 23. Therefore, unlike the case where each contact pin 23 is pushed directly as in the above embodiments, the operation member 14 The number of cam portions 14a can be reduced, and variation in the displacement amount of both contact pieces 23b and 23d of each contact pin 23 can be suppressed.
[0039]
In each of the above embodiments, the operation pins 14 are moved up and down to displace the contact pins 13 and 23. However, the present invention is not limited to this. For example, a rotation as shown in the conventional example of FIG. The moving lever 5 and the presser cover 4 can be used, and the contact pins 13 and 23 can be displaced using only the rotating lever 5. Although the present invention is applied to the IC socket 11, the present invention is not limited to this, and the present invention can be applied to other devices as long as it is intended to be electrically connected to a lead projecting to the side of the electrical component. Of course.
[0040]
【The invention's effect】
As described above, according to the first aspect of the present invention, since the upper and lower contact pieces of the contact pins are in contact with the upper and lower face portions of the lead of the electrical component, the conductivity is improved and both the contact pieces are provided. Are displaced together and slide so as to hold the upper and lower surfaces of the lead, so that a wiping effect can be obtained. In addition, by wiping the lower surface portion of the lead, the adhesion of dust can be suppressed, and even when the electrical component is surface-mounted, there is no adverse effect.
[0041]
According to the second aspect of the present invention, in addition to the effect of the first aspect, the leading end of the upper contact piece on the lead side is closer to the peripheral portion of the electrical component than the leading end of the lower contact piece. By projecting the lead, when the lead is held, first, the tip of the upper contact piece contacts the upper surface of the lead of the electrical component, and then the lower contact piece contacts the lower surface of the lead. Even when a force is applied to the lead of the electrical component from the contact pin side when the lead is held by this, the electrical component will not be lifted.
[0043]
According to the invention described in claim 3 , in addition to the effect of claim 1 or 2 , a plurality of the contact pins are provided side by side, a connecting rod is stretched over each contact pin, and the operating member is moved, Since both contact pieces of the contact pin are set to be displaced via the connecting rod, the number of cam portions of the operation member can be reduced and each contact can be reduced, unlike when each contact pin is pressed directly. Variations in the amount of displacement of both contact pieces of the pin can be suppressed.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a state before lowering of an operation member of an IC socket according to Embodiment 1 of the present invention.
FIG. 2 is a cross-sectional view showing a state where an operation member of the IC socket according to the first embodiment is lowered.
3 is a cross-sectional view corresponding to FIG. 1 showing a state in which the lead of the IC package is held by the contact pin of the IC socket according to Embodiment 1. FIG.
4 is an enlarged view showing leads of the IC package according to Embodiment 1. FIG.
FIG. 5 is a view showing a contact pin and the like according to Embodiment 2 of the present invention.
FIG. 6 is a view showing a contact pin and the like according to a third embodiment of the present invention.
7A and 7B are cross-sectional views of an IC socket showing a conventional example, in which FIG. 7A shows a state in which a presser cover is raised, FIG. 7B shows a state in which a contact pin is elastically deformed, and FIG. Indicates the state.
[Explanation of symbols]
1 IC package (electrical parts)
1a Edge 2 Lead
11 IC socket (socket for electrical parts)
12 Socket body
12a Mounting part
13,23 Contact pin
13d, 23b Bottom contact piece
13e, 23d Upper contact piece
13g.13h Tip
24 Connecting rod

Claims (3)

A mounting portion on which an electrical component is placed is formed on the socket body, and a lead that protrudes laterally from a peripheral portion of the placed electrical component and that has an upper surface portion and a lower surface portion that are parallel to each other. In the electrical component socket, wherein a plurality of contact pins to be separated from each other are provided, and further, the operation member is moved, so that the contact pins are elastically deformed and separated from the leads.
The contact pin includes an upper contact piece that is in contact with the upper surface portion of the lead and a lower contact piece that is in contact with the lower surface portion of the lead on a portion that is elastically deformed. Both contact pieces are elastically deformable and extend in the direction of the mounting portion. The contact pieces are formed in a substantially U-shape with the contact pieces, and the leads are inserted inside the substantially U-shape. the a-edge portion of the upper contact piece and the leading end portion of the lower contact piece are formed so as to adding the lead in contact by an elastic force to said upper surface portion of each of said leads and said lower surface portion,
By lowering the operation member, the contact pin is pressed, the elastically deformed portion is elastically deformed, and the upper contact piece and the lower contact piece are integrally displaced and moved outward. The upper contact piece and the lower contact piece are restored by the ascent of the operation member, and the two contact pieces slide between the upper surface portion and the lower surface portion of the lead. socket for electrical parts, characterized in that it is set to.   2. The electrical component socket according to claim 1, wherein a leading end portion on the lead side of the upper contact piece protrudes from a distal end portion of the lower contact piece so as to approach the peripheral edge side of the electrical component. A plurality of contact pins are provided side by side, a connecting rod is stretched over each contact pin, and the operation member is moved so that both contact pieces of the contact pins are displaced via the connecting rod. socket for electrical parts according to claim 1 or 2, characterized in that it is.

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